JPS6352999B2 - - Google Patents

Info

Publication number
JPS6352999B2
JPS6352999B2 JP58247242A JP24724283A JPS6352999B2 JP S6352999 B2 JPS6352999 B2 JP S6352999B2 JP 58247242 A JP58247242 A JP 58247242A JP 24724283 A JP24724283 A JP 24724283A JP S6352999 B2 JPS6352999 B2 JP S6352999B2
Authority
JP
Japan
Prior art keywords
hole
plate
molten metal
gas
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58247242A
Other languages
Japanese (ja)
Other versions
JPS60141391A (en
Inventor
Kuniaki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP58247242A priority Critical patent/JPS60141391A/en
Priority to US06/640,810 priority patent/US4650619A/en
Priority to GB08421359A priority patent/GB2151978B/en
Priority to DE3431230A priority patent/DE3431230A1/en
Priority to FR848413202A priority patent/FR2557487B1/en
Publication of JPS60141391A publication Critical patent/JPS60141391A/en
Publication of JPS6352999B2 publication Critical patent/JPS6352999B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D41/00Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
    • B22D41/14Closures
    • B22D41/22Closures sliding-gate type, i.e. having a fixed plate and a movable plate in sliding contact with each other for selective registry of their openings
    • B22D41/42Features relating to gas injection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は溶融金属を鋳造する際に取鍋あるいは
タンデイツシユの底部に取付けられる溶融金属排
出用プレートの加工方法に関するものである。 従来連続鋳造法により溶鋼を鋳造する場合、溶
鋼を収容する取鍋あるいはタンデイツシユ底部の
ノズルに固定プレートと摺動プレートとからなる
溶融金属排出装置を取付け、摺動プレートを固定
プレートに対して摺動させることにより溶鋼の通
過孔を開通し、溶鋼の流量を調整するようにして
いる。上述した溶融金属排出装置においては、溶
鋼の通過孔が溶鋼の凝固やAl、Ti、Ca、Cr、Ni
等の金属の酸化物の付着により閉塞するのを防止
するために固定プレートあるいは摺動プレートに
Ar等の不活性ガスを供給することが行なわれて
いる。 不活性ガスの供給は、多孔質耐火物からなるガ
ス供給体、直径0.1〜1.0mmの小孔を複数個設けた
ガス供給体あるいは複数個のスリツトを設けたガ
ス供給体をプレートの所定位置に設けて行なわれ
ている。ここで小孔あるいはスリツトを加工する
場合、成型時に坏土中に硬質紙あるいはビニール
線を所定位置に埋込んでおき、焼成工程で該硬質
紙あるいはビニール線を焼失させることにより小
孔あるいはスリツトを設けたり、焼成後ドリルで
加工して小孔あるいはスリツトを設けていた。し
かしながら、硬質紙あるいはビニール線を用いて
小孔あるいはスリツトを加工する場合は、完全に
貫通しなかつたり、各孔径が不均一となつてガス
供給が片寄つたり、作業上の手間がかかる等の欠
点があつた。また、ドリルを使用して加工する場
合は厚物の加工が極めて困難であると共に作業に
手間がかかり、高価なものとなる等の問題点があ
つた。 本発明は上記の実情に鑑みてなされたものであ
り、プレートに嵌着するガス供給体あるいはプレ
ートに直接小孔あるいはスリツトを設ける場合、
成型焼成後にレーザ加工によつて小孔あるいはス
リツトを設けることを特徴とする溶融金属排出用
プレートの加工方法である。 本発明によれば、0.2〜1.0mm程度の孔径の小孔
または幅の狭いスリツトを迅速にかつ均一に加工
できるものである。またレーザにより開孔する際
には、溶融飛散によつて開孔するため、加工面す
なわち孔の内面及び孔表面周辺部は溶融された状
態にあるので溶鋼との接触による耐蝕性が従来の
ものに比べて向上するものである。以下、本発明
に使用するレーザ装置および溶融金属排出用プレ
ートについて説明する。 第1図および第2図は本発明に使用するレーザ
装置を示すもので、1はレーザ光であり、レンズ
2の焦点3に集光される。焦点3のある所には加
工物4がある。加工物4は本発明のプレートで小
孔あるいはスリツトを加工するものである。焦点
3と加工物4の表面との距離を焦点深さHとする
と、焦点深さHは加工物4の表面から0〜10mmが
好ましく加工物4から焦点3が離れると孔径が大
きくなる。また10mmを越えると開孔に長時間を要
するとともに孔径も大きくなる。 また、加工物4(溶融金属排出用プレート)に
は、耐用性向上を目的としてタール類が含浸され
ているが、レーザ加工の際には未含浸品よりも含
浸品の方がレーザ吸収能が優れているため、能率
的に小孔を開孔することができる。 レンズ2はノズル5に取付けられていて、ノズ
ル5にはレンズの保護及び溶融物の飛散のための
補助ガス流通孔6が設けられている。補助ガスと
してはN2、O2、空気等があるが、N2、空気が好
ましく流量は30〜150/minが好ましい。これ
は30/minより少ないと溶融物の飛散が少なく
開孔率が悪くなり、150/minを越えると飛散
が厳しくなりすぎるため孔径が大きくなるという
欠点がある。 また、本発明に使用にするレーザ光は平均出力
が200W以上のもので、これ以下では加工に要す
る時間が長くなり好ましくない。最大出力は
1kW以上であることが好ましく、周波数および
パルス幅は周波数が50〜150Hz、パルス幅3〜10
mmsecが好ましく、この範囲外では加工面の温度
が適当でなく、開孔に長時間を要するとともに開
孔率も悪くなる。 レンズ2の焦点距離は5〜15インチが好ましい
もので、5インチより短かいとデフオーカスによ
り開孔率が低下すると共に、開孔径のコントロー
ルが困難になる。15インチを越えるとレーザ光1
の密度が小さく開孔に長時間を要するという欠点
がある。 加工物4の表面とノズル5との間隔は接近すれ
ばするほど好ましいが、2mmより短かくすると溶
融飛散物でレンズ2が汚染され、またノズル5が
つまるため、2mm〜15mmが好ましい。また15mmを
越えると溶融物の飛散が少なくなり開孔率が悪く
なる。 レーザ1のモードにはシングルモードとマルチ
モードがあるが、小孔の開孔に当つてはシングル
モードが好ましいものである。 第1図は加工後プレートに嵌着するガス供給体
にあるいは摺動面に加工する場合であるが、プレ
ート流通孔内から直接小孔あるいはスリツトを穿
孔する場合は第2図に示すように加工物(プレー
ト)4の溶融金属排出孔7にプリズム8を挿入
し、該プリズム8を用いてレーザ1を反射させ、
角度を変化させて小孔9あるいはスリツト9を穿
孔すればよい。なお、10はガス均圧帯で11は
ガス導入孔である。 第3図〜第6図は溶融金属排出用プレートにつ
いて示すもので、第3図はガス供給体12を固定
プレート13に嵌着するもので、ガス供給体12
は通常はモルタル等で固定プレート13に固定さ
れている。 また、第4図に示すようにガス供給体12がな
く、固定プレート13にガス均圧帯10を設け、
溶融金属の排出口とガス均圧帯10との間に小孔
9を設けたものでもよく、第5図に示すように小
孔の代わりにスリツトを設けてもよい。第6図は
摺動プレート14にガス供給部を設けたものであ
り、13は上固定プレート、15は下固定プレー
トで、摺動プレート14にはガス導入孔16が設
けられ、その先端部にはガス均圧部17が設けて
あり、ガス噴出小孔18が複数個設けられる。そ
して摺動プレート14で溶融金属排出口を閉鎖し
たとき、排出口の底部に位置し、溶鋼中に小孔9
と同じようにガスを吹き出す。 次に本発明の実施例について説明する。 実施例 1 高アルミナ質の焼成したリング状ガス供給体
(厚さ15mm)に外面より、平均出力500W、周波数
100Hz、パルス幅5mmsecのCO2レーザをレンズの
焦点距離10インチ、焦点の深さ(加工表面からの
深さ)5mm、加工表面とノズル先端の距離5mmと
し、補助ガスとして圧力3Kg/cm2のN2ガスを70
/minで流しながら小孔の加工を行なつた。 50個の加工を行なつたところ開孔に要する時間
は平均1sec/1個で平均孔径0.3mmの小孔が50個
全て開孔していた。 実施例 2 実施例1で使用した高アルミナ質の焼成したリ
ング状ガス供給体(厚さ15mm)を平均出力、周波
数、レンズの焦点距離、焦点の深さ、ノズル先端
の距離、補助ガスの流量、照射時間を次表の如く
種々変化させて行つた。
The present invention relates to a method for processing a molten metal discharge plate that is attached to the bottom of a ladle or tundish when molten metal is cast. Conventionally, when casting molten steel using the continuous casting method, a molten metal discharge device consisting of a fixed plate and a sliding plate is attached to the nozzle at the bottom of the ladle or tundish containing the molten steel, and the sliding plate is slid against the fixed plate. By doing so, a passage hole for molten steel is opened and the flow rate of molten steel is adjusted. In the above-mentioned molten metal discharge device, the molten steel passage hole is used to solidify the molten steel and remove Al, Ti, Ca, Cr, and Ni.
on the fixed plate or sliding plate to prevent blockage due to adhesion of metal oxides such as
Inert gas such as Ar is supplied. To supply inert gas, use a gas supply body made of porous refractory material, a gas supply body with multiple small holes with a diameter of 0.1 to 1.0 mm, or a gas supply body with multiple slits placed at a predetermined position on the plate. It is set up and carried out. When forming small holes or slits here, hard paper or vinyl wire is embedded in the clay at a predetermined position during molding, and the small holes or slits are formed by burning out the hard paper or vinyl wire during the firing process. A small hole or slit was formed by drilling or drilling after firing. However, when machining small holes or slits using hard paper or vinyl wire, it may not penetrate completely, the diameter of each hole may become uneven, the gas supply may be uneven, and the work is laborious. There were flaws. Further, when processing using a drill, there are problems such as it is extremely difficult to process thick materials, and the work is time-consuming and expensive. The present invention has been made in view of the above circumstances, and when a small hole or slit is provided directly in the gas supply body fitted to the plate or in the plate,
This method of processing a plate for discharging molten metal is characterized by forming small holes or slits by laser processing after molding and firing. According to the present invention, small holes or narrow slits with a diameter of about 0.2 to 1.0 mm can be processed quickly and uniformly. In addition, when drilling holes with a laser, the holes are opened by melt scattering, so the processed surface, that is, the inner surface of the hole and the surrounding area of the hole surface, are in a molten state, so the corrosion resistance due to contact with molten steel is less than that of conventional methods. This is an improvement compared to . The laser device and molten metal discharge plate used in the present invention will be explained below. 1 and 2 show a laser device used in the present invention. Reference numeral 1 indicates a laser beam, which is focused on a focal point 3 of a lens 2. FIG. A workpiece 4 is located where the focal point 3 is. The workpiece 4 is a plate of the present invention in which a small hole or slit is to be machined. Assuming that the distance between the focal point 3 and the surface of the workpiece 4 is the focal depth H, the focal depth H is preferably 0 to 10 mm from the surface of the workpiece 4, and the farther the focal point 3 is from the workpiece 4, the larger the hole diameter becomes. Moreover, if it exceeds 10 mm, it will take a long time to open the hole and the hole diameter will also become large. In addition, the workpiece 4 (molten metal discharge plate) is impregnated with tar for the purpose of improving durability, but during laser processing, the impregnated product has a better laser absorption ability than the unimpregnated product. Because of its excellent properties, small holes can be opened efficiently. The lens 2 is attached to a nozzle 5, and the nozzle 5 is provided with auxiliary gas flow holes 6 for protecting the lens and scattering melted material. Examples of the auxiliary gas include N 2 , O 2 , and air, but N 2 and air are preferred, and the flow rate is preferably 30 to 150/min. If it is less than 30/min, there is less scattering of the melt and the pore area ratio becomes poor, and if it exceeds 150/min, the scattering becomes too severe and the pore diameter becomes large. Further, the laser beam used in the present invention has an average output of 200 W or more, and if it is less than this, the time required for processing becomes longer, which is not preferable. The maximum output is
It is preferably 1 kW or more, and the frequency and pulse width are 50 to 150 Hz and 3 to 10 Hz.
mmsec is preferable; outside this range, the temperature of the machined surface will not be appropriate, it will take a long time to open the hole, and the hole opening rate will be poor. The focal length of the lens 2 is preferably 5 to 15 inches; if it is shorter than 5 inches, the aperture ratio decreases due to defocus and it becomes difficult to control the aperture diameter. Laser light 1 if over 15 inches
The disadvantage is that the density is low and it takes a long time to open the holes. The closer the distance between the surface of the workpiece 4 and the nozzle 5 is, the more preferable it is, but if it is shorter than 2 mm, the lens 2 will be contaminated with melted debris and the nozzle 5 will be clogged, so a distance of 2 mm to 15 mm is preferable. Moreover, if it exceeds 15 mm, scattering of the melt will be reduced and the porosity will be poor. The laser 1 has a single mode and a multimode mode, and the single mode is preferable for opening small holes. Figure 1 shows the case where the gas supply body fitted into the plate after machining or the sliding surface is machined, but when a small hole or slit is directly drilled from inside the plate circulation hole, the process is as shown in Figure 2. A prism 8 is inserted into the molten metal discharge hole 7 of the object (plate) 4, and the laser 1 is reflected using the prism 8.
The small holes 9 or slits 9 may be bored by changing the angle. Note that 10 is a gas equalization zone and 11 is a gas introduction hole. 3 to 6 show the plate for discharging molten metal, and FIG. 3 shows the gas supply body 12 fitted to the fixed plate 13.
is usually fixed to the fixed plate 13 with mortar or the like. In addition, as shown in FIG. 4, there is no gas supply body 12, and a gas pressure equalization zone 10 is provided on the fixed plate 13.
A small hole 9 may be provided between the molten metal outlet and the gas equalization zone 10, or a slit may be provided instead of the small hole as shown in FIG. Fig. 6 shows a sliding plate 14 provided with a gas supply section, 13 is an upper fixed plate, 15 is a lower fixed plate, and the sliding plate 14 is provided with a gas introduction hole 16 at its tip. A gas pressure equalizing section 17 is provided, and a plurality of small gas ejection holes 18 are provided. When the molten metal discharge port is closed with the sliding plate 14, the small hole 9 located at the bottom of the discharge port is inserted into the molten metal.
Blow out the gas in the same way. Next, examples of the present invention will be described. Example 1 An average output of 500 W and a frequency of
A CO 2 laser with a pulse width of 100 Hz and a pulse width of 5 mm sec was used with a lens focal length of 10 inches, a focal depth (depth from the processing surface) of 5 mm, a distance between the processing surface and the nozzle tip of 5 mm, and a pressure of 3 Kg/cm 2 as an auxiliary gas. N2 gas 70
The small hole was machined while flowing at a speed of /min. When 50 holes were processed, the average time required to open each hole was 1 sec/hole, and all 50 small holes with an average diameter of 0.3 mm were opened. Example 2 The high alumina fired ring-shaped gas supply body (thickness 15 mm) used in Example 1 was used to determine the average output, frequency, focal length of the lens, depth of focus, distance of the nozzle tip, and flow rate of the auxiliary gas. The irradiation time was varied as shown in the table below.

【表】 上記表より解るように、本発明によれば0.2〜
1.0mm程度の孔径の小孔または幅の狭いスリツト
を迅速にかつ均一に加工(数秒)できる利点があ
る。 また本発明で加工したプレートを使用して溶融
金属の鋳造を行なつたが、ガス供給量も十分であ
り、溶融による小孔の浸蝕あるいは閉鎖はほとん
ど起らずに従来の加工品に比べて優れたものであ
つた。
[Table] As can be seen from the above table, according to the present invention, 0.2~
It has the advantage of being able to process small holes with a diameter of about 1.0 mm or narrow slits quickly and uniformly (in a few seconds). Molten metal was also cast using the plate processed by the present invention, and the gas supply was sufficient, and the small holes were hardly eroded or closed due to melting, compared to conventionally processed products. It was excellent.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はレーザ装置の説明図、第2図は他の実
施例のレーザ装置の説明図、第3図は溶融金属排
出プレートの断面図、第4図は他の実施例の溶融
金属排出プレートの断面図、第5図は他の実施例
の溶融金属排出プレートの断面図、第6図は他の
実施例の溶融金属排出プレートの断面図である。 1……レーザ、2……レンズ、5……ノズル、
6……補助ガス流通孔、8……プリズム、9……
小孔(スリツト)、10……ガス均圧帯、11…
…ガス導入孔。
Fig. 1 is an explanatory diagram of a laser device, Fig. 2 is an explanatory diagram of a laser device of another embodiment, Fig. 3 is a sectional view of a molten metal discharge plate, and Fig. 4 is a molten metal discharge plate of another embodiment. FIG. 5 is a sectional view of a molten metal discharge plate of another embodiment, and FIG. 6 is a sectional view of a molten metal discharge plate of another embodiment. 1... Laser, 2... Lens, 5... Nozzle,
6... Auxiliary gas flow hole, 8... Prism, 9...
Small hole (slit), 10...Gas equalization zone, 11...
...Gas introduction hole.

Claims (1)

【特許請求の範囲】[Claims] 1 溶融金属中にガスを供給する小孔またはスリ
ツトを有する溶融金属排出用摺動プレートあるい
は固定プレートにおいて、該小孔またはスリツト
をレーザによつて加工することを特徴とする溶融
金属排出用プレートの加工方法。
1. A sliding plate or fixed plate for discharging molten metal having small holes or slits for supplying gas into molten metal, wherein the small holes or slits are processed by laser. Processing method.
JP58247242A 1983-12-29 1983-12-29 Working method of plate for discharging molten metal Granted JPS60141391A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58247242A JPS60141391A (en) 1983-12-29 1983-12-29 Working method of plate for discharging molten metal
US06/640,810 US4650619A (en) 1983-12-29 1984-08-15 Method of machining a ceramic member
GB08421359A GB2151978B (en) 1983-12-29 1984-08-22 Method of and apparatus for machining a ceramic member
DE3431230A DE3431230A1 (en) 1983-12-29 1984-08-24 METHOD AND DEVICE FOR PROCESSING A CERAMIC ELEMENT
FR848413202A FR2557487B1 (en) 1983-12-29 1984-08-24 METHOD AND APPARATUS FOR MACHINING CERAMIC PARTS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58247242A JPS60141391A (en) 1983-12-29 1983-12-29 Working method of plate for discharging molten metal

Publications (2)

Publication Number Publication Date
JPS60141391A JPS60141391A (en) 1985-07-26
JPS6352999B2 true JPS6352999B2 (en) 1988-10-20

Family

ID=17160564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58247242A Granted JPS60141391A (en) 1983-12-29 1983-12-29 Working method of plate for discharging molten metal

Country Status (1)

Country Link
JP (1) JPS60141391A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH674813A5 (en) * 1987-07-31 1990-07-31 Stopinc Ag
JPH0539755U (en) * 1991-09-20 1993-05-28 品川白煉瓦株式会社 Gas blowing structure of molten metal flow controller
JP4547085B2 (en) * 2000-11-30 2010-09-22 本田技研工業株式会社 Processing method of weakened wire for airbag deployment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099461A (en) * 1983-11-02 1985-06-03 Toshiba Ceramics Co Ltd Device for discharging molten metal
JPS6099460A (en) * 1983-11-02 1985-06-03 Toshiba Ceramics Co Ltd Device for discharging molten metal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099461A (en) * 1983-11-02 1985-06-03 Toshiba Ceramics Co Ltd Device for discharging molten metal
JPS6099460A (en) * 1983-11-02 1985-06-03 Toshiba Ceramics Co Ltd Device for discharging molten metal

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JPS60141391A (en) 1985-07-26

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