JPS6352574B2 - - Google Patents
Info
- Publication number
- JPS6352574B2 JPS6352574B2 JP15519480A JP15519480A JPS6352574B2 JP S6352574 B2 JPS6352574 B2 JP S6352574B2 JP 15519480 A JP15519480 A JP 15519480A JP 15519480 A JP15519480 A JP 15519480A JP S6352574 B2 JPS6352574 B2 JP S6352574B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- tension
- printed wiring
- copper
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 65
- 239000011889 copper foil Substances 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000002985 plastic film Substances 0.000 claims description 11
- 229920006255 plastic film Polymers 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本発明はフレキシブル印刷配線用銅張板の製造
方法に関し、さらに詳しくは特殊な巻取り法を行
うことによつてカールの小さいフレキシブル印刷
配線用銅張板の製造方法に関する。
従来より、フレキシブル印刷配線用銅張板の製
造方法にはプレス方式とラミネータ方式がある。
プレス方式は一般の硬質銅張積層板と同様に、プ
ラスチツクフイルムと銅箔とを接着剤を介して重
合し、熱プレス機によつて加熱加圧して一体化す
る方法である。またラミネータ方式はロール状プ
ラスチツクフイルムとロール状銅箔とを接着剤を
介して加熱ロールにより連続的に張合せた後加熱
硬化させる方法である。プレス方式の場合は通常
高圧、長時間の加熱を必要とするため、プラスチ
ツクフイルムと銅箔のように熱膨張係数の差や熱
収縮率の差の大きいもの同士の張合せを行うと出
来上つた銅張板はカールが大きい。またラミネー
タ方式の場合は通常、加熱ロールでは低圧、短時
間で加熱が終るので、この段階ではカールの発生
は小さいが、これをロール状に巻取つてから加熱
硬化させる工程でカールが大きくなる。すなわち
加熱ロールで張合せた後、銅箔面を外側にして巻
取つてから加熱硬化させると、プラスチツクフイ
ルムと銅箔との熱収縮率の差によるカールに巻き
ぐせカールが加味されて銅箔面を外側としたカー
ル（以下（＋）カールと称する）が大となる。
（第１図参照）一方加熱ロールで張合せた後、銅
箔面を内側に巻取つてから加熱硬化させると、プ
ラスチツクフイルムと銅箔との熱収縮率の差によ
るカールは消えて、逆に巻きぐせカールが出て銅
箔面を内側としたカール（以下（−）カールと称
する）となる。（第２図参照）
本発明の目的は上記従来方法によるフレキシブ
ル印刷配線用銅張板製造方法の欠点を解決し、カ
ールの小さいフレキシブル印刷配線用銅張板を連
続的に製造する方法を提供するにある。本発明者
らはこの目的を達成するために鋭意検討した結
果、接着剤を介してプラスチツクフイルムと銅箔
を加熱ロールによつて連続的に張合せた後、張力
0.03〜0.20Kg／mm2で銅箔面を内側にして巻取つて
から加熱硬化を行い、次いで張力0.03〜0.20Kg／
mm2で銅箔面を外側にして巻直すことによつてカー
ルの小さいフレキシブル印刷配線用銅張板を連続
的に製造できることを見出し本発明を完成した。
本発明は接着剤を介してプラスチツクフイルム
と銅箔とを加熱ロールによつて連続的に張合せた
後、張力0.03〜0.20Kg／mm2で銅箔面を内側にして
巻取つてから加熱硬化を行うことによつて熱収縮
による（＋）カールが防止でき、若干の巻きぐせ
による（−）カールとなつたものを、張力0.03〜
0.20Kg／mm2で銅箔面を外側にして巻直すことによ
つてカールの小さいフレキシブル印刷配線用銅張
板が得られることになる。
本発明に用いられるプラスチツクフイルムとし
ては、ポリイミド、ポリアミドイミド、ポリパラ
バン酸、ポリエチレンテレフタレート、フツ素樹
脂等のフイルムが挙げられ、必要に応じて表面処
理を施すこともある。
本発明に用いられる接着剤として種々のものが
使用可能であり、特に限定されない。
本発明に用いられる銅箔としては電解銅箔また
は圧延銅箔があり、厚さは通常0.015〜0.105mm
で、必要に応じて表面処理を施すこともある。
本発明に用いられる加熱ロールとしては通常市
販のゴム／ゴム、ゴム／金属、金属／金属等の組
合せで加圧機構を備えたものであればよい。
本発明において、加熱ロールによる張合せ後、
巻取るときの張力は0.03〜0.20Kg／mm2、好ましく
は0.05〜0.15Kg／mm2である。張力が0.03Kg／mm2未
満では蛇行して巻取られるため、シワ等の変形が
生じやすく、また0.20Kg／mm2を越えれば巻きぐせ
のためのカールや変形が強く出るので好ましくな
い。また加熱硬化後の巻直しのときの張力は0.03
〜0.20Kg／mm2であり、好ましくは0.05〜0.15Kg／
mm2である。0.03Kg／mm2未満では蛇行しやすく、ま
た巻直し前のカールが解消出来ず、0.20Kg／mm2を
越えれば新たな巻きぐせが付きやすいので好まし
くない。
本発明における加熱硬化条件は特に限定なく、
使用する接着剤に合せて適宜設定すればよい。
次に実施例および比較例を挙げて本発明を説明
する。
実施例 １
接着面に表面処理を施した厚さ0.035mmの圧延
銅箔と厚さ0.025mmのポリパラバン酸フイルムと
をエポキシ系接着剤を介して加熱ロールで連続的
に張合せた後、銅箔面を内側にして張力0.12Kg／
mm2で巻取つてから乾燥機中で140℃、10時間加熱
硬化し、冷却してから、銅箔面を外側にして張力
0.08Kg／mm2で巻直してポリパラバン酸ベースフレ
キシブル印刷配線用銅張板を得た。
実施例 ２
接着面に表面処理を施した厚さ0.035mmの電解
銅箔と厚さ0.050mmのポリイミドフイルムとをエ
ポキシ系接着剤を介して加熱ロールで連続的に張
合せた後、銅箔面を内側にして張力0.08Kg／mm2で
巻取つてから乾燥機中で140℃、10時間加熱硬化
し冷却してから、銅箔面を外側にして張力0.10
Kg／mm2で巻直してポリイミドベースフレキシブル
印刷配線用銅張板を得た。
実施例 ３
接着面に表面処理を施した厚さ0.035mmの電解
銅箔と厚さ0.075mmのポリエチレンテレフタレー
トフイルムとをエポキシ系接着剤を介して加熱ロ
ールで連続的に張合せた後、銅箔面を内側にして
張力0.08Kg／mm2で巻取つてから乾燥機中で140℃、
10時間加熱硬化し冷却してから、銅箔面を外側に
して張力0.12Kg／mm2で巻直してポリエステルベー
スフレキシブル印刷配線用銅張板を得た。
比較例 １
接着面に表面処理を施した厚さ0.035mmの圧延
銅箔と厚さ0.025mmのポリパラバン酸フイルムを
エポキシ系接着剤を介して加熱ロールで連続的に
張合せた後、銅箔面を外側にして張力0.10Kg／mm2
で巻取つてから乾燥機中で140℃、10時間加熱硬
化し冷却してポリパラバン酸ベースフレキシブル
印刷配線用銅張板を得た。
比較例 ２
接着面に表面処理を施した厚さ0.035mmの電解
銅箔と厚さ0.050mmのポリイミドフイルムとをエ
ポキシ系接着剤を介して加熱ロールで連続的に張
合せた後、銅箔面を外側にして張力0.30Kg／mm2で
巻取つてから乾燥機中で140℃、10時間加熱硬化
し冷却してから、銅箔面を内側にして張力0.30
Kg／mm2で巻直してポリイミドベースフレキシブル
印刷配線用銅張板を得た。
比較例 ３
接着面に表面処理を施した厚さ0.035mmの電解
銅箔と厚さ0.075mmのポリエチレンテレフタレー
トフイルムとをエポキシ系接着剤を介して加熱ロ
ールで連続的に張合せた後、銅箔面を内側にして
張力0.10Kg／mm2で巻取つてから乾燥機中で140℃、
10時間加熱硬化し冷却してポリエステルベースフ
レキシブル印刷配線用銅張板を得た。
以上の実施例および比較例で得られたフレキシ
ブル印刷配線用銅張板のカールの状況は下表の如
くであつた。
ここでカールは200×200mmの試験片を20℃65％
湿度の雰囲気中で定盤の上に第３図のように凹面
が上向きになるように静置して四角のうちの最大
浮き上りをハイトゲージにてmm単位で測定した。
The present invention relates to a method of manufacturing a copper clad board for flexible printed wiring, and more particularly to a method of manufacturing a copper clad board for flexible printed wiring with small curl by performing a special winding method. Conventionally, methods for manufacturing copper clad boards for flexible printed wiring include a press method and a laminator method.
The pressing method is similar to general hard copper-clad laminates, in which a plastic film and a copper foil are polymerized via an adhesive, and then heated and pressed using a hot press machine to integrate them. The laminator method is a method in which a roll of plastic film and a roll of copper foil are continuously laminated together with an adhesive using a heated roll, and then heated and cured. Pressing methods usually require high pressure and long heating times, so it is possible to create a product by laminating materials with large differences in thermal expansion coefficient and thermal contraction rate, such as plastic film and copper foil. Copper clad boards have large curls. In addition, in the case of a laminator method, heating is normally completed in a short time using a heating roll at low pressure, so curling is small at this stage, but curling becomes larger in the step of winding it into a roll and heating and curing it. In other words, if the plastic film is pasted with a heating roll, then rolled up with the copper foil side facing outward, and then heated and cured, the curl due to the difference in thermal shrinkage between the plastic film and the copper foil will be added to the curl caused by the copper foil side. The curl with the outer side (hereinafter referred to as (+) curl) is large.
(See Figure 1) On the other hand, after laminating with a heated roll, if the copper foil side is rolled up inside and heated to harden, the curl caused by the difference in thermal shrinkage rate between the plastic film and the copper foil will disappear, and on the contrary, A curl appears and the copper foil surface becomes a curl (hereinafter referred to as a (-) curl). (See Figure 2) The purpose of the present invention is to solve the drawbacks of the above-mentioned conventional method for producing copper clad boards for flexible printed wiring, and to provide a method for continuously producing copper clad boards for flexible printed wiring with small curls. It is in. As a result of intensive studies to achieve this objective, the inventors of the present invention found that after continuously bonding plastic film and copper foil with an adhesive using a heated roll, the tension
After winding with the copper foil side inside at a tension of 0.03 to 0.20Kg/ mm2 , heat curing is performed, and then the tension is 0.03 to 0.20Kg/mm2.
The inventors discovered that it is possible to continuously produce a copper clad board for flexible printed wiring with minimal curl by rewinding the copper foil with the copper foil side facing outward, thereby completing the present invention. In the present invention, a plastic film and a copper foil are continuously pasted together using an adhesive using a heated roll, and then wound up with the copper foil side inside at a tension of 0.03 to 0.20 kg/mm 2 and then heated and cured. By doing this, you can prevent (+) curls due to heat shrinkage, and (-) curls due to slight curling can be prevented by applying a tension of 0.03~
By rewinding at 0.20 Kg/mm 2 with the copper foil side facing outward, a copper clad board for flexible printed wiring with less curl can be obtained. Examples of the plastic film used in the present invention include films made of polyimide, polyamideimide, polyparabanic acid, polyethylene terephthalate, fluororesin, etc., and may be surface-treated if necessary. Various adhesives can be used in the present invention, and there are no particular limitations. The copper foil used in the present invention includes electrolytic copper foil or rolled copper foil, and the thickness is usually 0.015 to 0.105 mm.
Surface treatment may also be applied if necessary. The heating roll used in the present invention may be a commonly available combination of rubber/rubber, rubber/metal, metal/metal, etc. and provided with a pressure mechanism. In the present invention, after lamination using a heating roll,
The tension during winding is 0.03 to 0.20 Kg/mm 2 , preferably 0.05 to 0.15 Kg/mm 2 . If the tension is less than 0.03 Kg/mm 2 , the material is wound in a meandering manner, which tends to cause deformations such as wrinkles, and if it exceeds 0.20 Kg/mm 2 , the material is undesirably curled and deformed due to curling. Also, the tension when rewinding after heat curing is 0.03
~0.20Kg/ mm2 , preferably 0.05~0.15Kg/
mm2 . If it is less than 0.03 Kg/mm 2 , it tends to meander and curls before rewinding cannot be eliminated, and if it exceeds 0.20 Kg/mm 2 , new curls tend to form, which is not preferable. The heat curing conditions in the present invention are not particularly limited.
It may be set appropriately according to the adhesive used. Next, the present invention will be explained with reference to Examples and Comparative Examples. Example 1 A rolled copper foil with a thickness of 0.035 mm and a polyparabanic acid film with a thickness of 0.025 mm, which had been surface-treated on the adhesive side, were laminated continuously using a heated roll via an epoxy adhesive, and then the copper foil was Tension 0.12Kg/with the surface inside
After winding it to a size of mm 2 , heat it in a dryer at 140℃ for 10 hours to harden it, cool it, and then put it under tension with the copper foil side outside.
It was re-wound at 0.08 Kg/mm 2 to obtain a polyparabanic acid-based copper clad board for flexible printed wiring. Example 2 Electrolytic copper foil with a thickness of 0.035 mm and polyimide film with a thickness of 0.050 mm, which had been surface-treated on the adhesive side, were laminated continuously using a heated roll via an epoxy adhesive, and then the copper foil surface was Wind it up with the copper foil side on the inside at a tension of 0.08Kg/mm 2 , heat harden it in a dryer at 140℃ for 10 hours, cool it, and then turn it with the copper foil side outside at a tension of 0.10.
It was re-wound at kg/mm 2 to obtain a copper clad board for polyimide-based flexible printed wiring. Example 3 An electrolytic copper foil with a thickness of 0.035 mm and a polyethylene terephthalate film with a thickness of 0.075 mm, which had been surface-treated on the adhesive side, were laminated continuously using a heated roll via an epoxy adhesive, and then the copper foil was Roll it up with the surface inside at a tension of 0.08Kg/ mm2 , then dry it in a dryer at 140℃.
After heating and curing for 10 hours and cooling, the material was re-wound with the copper foil side facing outward at a tension of 0.12 Kg/mm 2 to obtain a polyester-based copper clad board for flexible printed wiring. Comparative Example 1 A rolled copper foil with a thickness of 0.035 mm and a polyparabanic acid film with a thickness of 0.025 mm, which had been surface-treated on the adhesive side, were laminated continuously using a heated roll via an epoxy adhesive, and then the copper foil surface Tension is 0.10Kg/mm 2 with
After winding it up, it was cured by heating at 140°C for 10 hours in a dryer and cooled to obtain a polyparabanic acid-based copper clad board for flexible printed wiring. Comparative Example 2 Electrolytic copper foil with a thickness of 0.035 mm and polyimide film with a thickness of 0.050 mm, which had been surface-treated on the adhesive side, were laminated continuously with a heated roll via an epoxy adhesive, and then the copper foil surface Wind it up with the copper foil side on the outside at a tension of 0.30Kg/mm 2 , heat harden it in a dryer at 140℃ for 10 hours, cool it, and then turn it with the copper foil side inside at a tension of 0.30Kg/mm2.
It was re-wound at kg/mm 2 to obtain a copper clad board for polyimide-based flexible printed wiring. Comparative Example 3 An electrolytic copper foil with a thickness of 0.035 mm and a polyethylene terephthalate film with a thickness of 0.075 mm, which had been surface-treated on the adhesive side, were laminated continuously with a heated roll via an epoxy adhesive, and then the copper foil was Roll it up with the surface inside at a tension of 0.10Kg/ mm2 , then dry it in a dryer at 140℃.
It was cured by heating for 10 hours and cooled to obtain a polyester-based copper clad board for flexible printed wiring. The curling conditions of the copper clad boards for flexible printed wiring obtained in the above Examples and Comparative Examples were as shown in the table below. Here, curl is a 200 x 200 mm test piece at 20℃65%.
It was placed on a surface plate in a humid atmosphere with the concave side facing upward as shown in Figure 3, and the maximum elevation of the squares was measured in mm using a height gauge.
【表】
以上のように本発明の実施例１〜３で得られた
フレキシブル印刷配線用銅張板はいずれもカール
が小さいことがわかる。[Table] As described above, it can be seen that the copper clad boards for flexible printed wiring obtained in Examples 1 to 3 of the present invention all have small curls.
第１図はフレキシブル銅張板のカールのうち銅
箔面を外側としたカール、すなわち（＋）カール
の場合、第２図はカールのうち銅箔面を内側とし
たカール、すなわち（−）カールの場合の各断面
図を示す。第３図はフレキシブル銅張板のカール
測定方法を示す。
１……銅箔、２……接着剤、３……プラスチツ
クフイルム、４……定盤、５……ハイトゲージ、
６……フレキシブル銅張板試験片。
Figure 1 shows the curl of a flexible copper clad board with the copper foil side outside, i.e. (+) curl, and Figure 2 shows the curl with the copper foil side inside, i.e. (-) curl. Each cross-sectional view is shown in the case of . FIG. 3 shows a method for measuring curl of a flexible copper clad board. 1... Copper foil, 2... Adhesive, 3... Plastic film, 4... Surface plate, 5... Height gauge,
6...Flexible copper clad plate test piece.
Claims (1)
を加熱ロールによつて連続的に張合せた後、加熱
硬化させるフレキシブル印刷配線用銅張板の製造
方法において、加熱ロールによる張合せの後、張
力0.03〜0.20Kg／mm2で銅箔面を内側にして巻取つ
てから加熱硬化を行い、次いで張力0.03〜0.20
Kg／mm2で銅箔面を外側にして巻直すことを特徴と
するフレキシブル印刷配線用銅張板の製造方法。1 In a method for manufacturing a copper clad board for flexible printed wiring, in which a plastic film and a copper foil are continuously laminated with an adhesive using a heating roll and then cured by heating, the tension is 0.03 after lamination with the heating roll. ~0.20Kg/mm 2 is rolled up with the copper foil side inside, then heated and hardened, then the tension is 0.03~0.20.
A method for manufacturing a copper clad board for flexible printed wiring, characterized by rewinding the copper clad board with the copper foil side facing outward at a weight of Kg/mm 2 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15519480A JPS5779694A (en) | 1980-11-06 | 1980-11-06 | Method of producing copper-coated board for flexible printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15519480A JPS5779694A (en) | 1980-11-06 | 1980-11-06 | Method of producing copper-coated board for flexible printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5779694A JPS5779694A (en) | 1982-05-18 |
| JPS6352574B2 true JPS6352574B2 (en) | 1988-10-19 |
Family
ID=15600541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15519480A Granted JPS5779694A (en) | 1980-11-06 | 1980-11-06 | Method of producing copper-coated board for flexible printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5779694A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6353015A (en) * | 1986-08-22 | 1988-03-07 | Mitsubishi Plastics Ind Ltd | Preparation of single-sided copper-clad plastic film |
| JP2010030756A (en) * | 2008-07-30 | 2010-02-12 | Nippon Shokubai Co Ltd | Optical film roll manufacturing method |
| JP5704450B2 (en) * | 2011-04-13 | 2015-04-22 | 大日本印刷株式会社 | Manufacturing method of color filter |
| JP6039867B1 (en) * | 2015-03-06 | 2016-12-07 | 京セラ株式会社 | Winding body and substrate sheet |
-
1980
- 1980-11-06 JP JP15519480A patent/JPS5779694A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5779694A (en) | 1982-05-18 |
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