JPS6351544B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device in which a plurality of semiconductor elements sealed with resin molds or the like are connected and fixed by a frame.

[Technical background of the invention]

In general, semiconductor elements that make up integrated circuits, etc.
It is packaged for reasons such as protection from the external environment. This packaging conventionally involves connecting and fixing a plurality of semiconductor elements 11 to a metal frame 12, as shown in FIG.
These are each sealed with a resin mold or the like.
Further, lead pins 13, which are connected to the semiconductor element 11 by bonding wires (not shown), are connected and fixed to the frame 12.

[Problems with background technology]

Before the semiconductor elements 11 packaged as described above are separated from the frame 12 and shipped as a product, various measurements are usually performed for electrical testing of each semiconductor element 11. However, in the state where the semiconductor element 11 is connected and fixed to the frame 12 as described above, measurement cannot be performed as is. Therefore, it is necessary to separate the semiconductor elements 11 individually from the frame 12 or to measure only the lead pins 13 after each semiconductor element 11 is separated. Incidentally, as semiconductor integrated circuits are required to be more and more compact in recent years, the spacing between the lead pins 13 tends to become very narrow, for example, 0.05 inch. If the spacing between the lead pins 13 is narrow in this way, when each lead pin 13 is separated into each semiconductor element 11 for measurement, the mechanical strength of the lead pins 13 is weakened, resulting in a situation such as bending. Therefore, there is a drawback that it is very difficult to electrically measure the semiconductor element 11 by inputting and outputting measurement signals via the lead pins 13.

[Purpose of the invention]

This invention was made in view of the above circumstances, and it improves the mechanical strength of the lead pins of each semiconductor element for a plurality of semiconductor elements connected and fixed to a frame, and inputs measurement signals through the lead pins. It is an object of the present invention to provide a semiconductor device that can easily and reliably perform electrical measurements by outputting data.

[Summary of the invention]

In order to achieve the above object, in the present invention, in a plurality of molded semiconductor elements connected and fixed to a frame, the tip of each lead pin between adjacent semiconductor elements is covered with a molded insulator such as molded resin. By connecting and fixing,
This improves the mechanical strength of the lead pin.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 shows the configuration of a semiconductor device according to the present invention, in which a plurality of semiconductor elements 11 sealed with a resin mold or the like are connected and fixed to a metal frame 12. Each semiconductor element 11
A lead pin 13 is provided to be connected with a bonding wire (not shown) or the like. Then, the tips of each lead pin 13 between adjacent semiconductor elements 11 are commonly connected and fixed using a mold insulator 21 such as a resin mold.

To manufacture a semiconductor device constructed in this manner, first, portions corresponding to both the lead pins 13 and the bed (not shown) are formed in the frame 12. A semiconductor element is mounted on the bed, and the semiconductor element and lead pins 13 are connected with bonding wires (not shown). In this case, each lead pin 13 is commonly connected by an extension 22 of the frame 12 or the like. The extension portion 22 is cut off, and the tip of the lead pin 13 as described above is molded with a resin mold or the like together with the semiconductor element 11 in a molding process. Therefore, the semiconductor element 11 is sealed, and each lead pin 13 is commonly connected and fixed to the frame 12 as shown in FIG.

When electrically testing each semiconductor element 11 of such a semiconductor device, measurement signals are input and output via each lead pin 13.
In this case, since the lead pins 13 are commonly connected by the mold insulator 21 and fixed to the frame 12 as described above, the mechanical strength of the lead pins 13 is increased and no bending or the like occurs. Therefore, when inputting and outputting measurement signals from the measuring device to and from the lead pins 13, this can be done extremely easily and reliably. moreover,
Although the individual semiconductor elements 11 are connected via the lead pins 13 and the mold insulator 21, they are electrically insulated, so that there is no adverse effect on the above measurements.

〔Effect of the invention〕

As detailed above, according to the present invention, in a semiconductor device in which a plurality of semiconductor elements are connected and fixed to a frame, the lead pins of each semiconductor element are fixed to the frame with a molded insulator, thereby increasing the mechanical strength of the lead pins. In addition, electrical insulation can be maintained between each semiconductor element. Therefore, it is possible to easily and reliably perform electrical measurements on each semiconductor element by inputting and outputting measurement signals via the lead pins.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a conventional semiconductor device, and FIG. 2 is a block diagram of a semiconductor device according to an embodiment of the present invention. 11...Semiconductor element, 12...Frame, 13
...Lead pin, 21...Mold insulator.

Claims (1)

[Claims] 1 A frame for connecting and fixing a plurality of molded semiconductor elements in a row, lead pins connected to each of the semiconductor elements, and a common connection between the tips of the lead pins between the adjacent semiconductor elements. A semiconductor device comprising a molded insulator fixed to the frame.