JPS6351454A - Polyamide composition - Google Patents
Polyamide compositionInfo
- Publication number
- JPS6351454A JPS6351454A JP19640986A JP19640986A JPS6351454A JP S6351454 A JPS6351454 A JP S6351454A JP 19640986 A JP19640986 A JP 19640986A JP 19640986 A JP19640986 A JP 19640986A JP S6351454 A JPS6351454 A JP S6351454A
- Authority
- JP
- Japan
- Prior art keywords
- block copolymer
- formula
- group
- ether block
- polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 11
- 239000004952 Polyamide Substances 0.000 title claims abstract description 6
- 229920002647 polyamide Polymers 0.000 title claims abstract description 6
- 229920000728 polyester Polymers 0.000 claims abstract description 19
- 229920001400 block copolymer Polymers 0.000 claims abstract description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract description 12
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract description 3
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 abstract description 2
- 125000005647 linker group Chemical group 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- -1 polytetramethylene Polymers 0.000 description 9
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- XDOLZJYETYVRKV-UHFFFAOYSA-N 7-Aminoheptanoic acid Chemical compound NCCCCCCC(O)=O XDOLZJYETYVRKV-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 206010011224 Cough Diseases 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Natural products OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 1
- 239000007977 PBT buffer Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- 150000001555 benzenes Chemical group 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野コ 本発明は成形用のポリアミド組成物に関する。[Detailed description of the invention] [Industrial application fields] The present invention relates to polyamide compositions for molding.
[従来の技術・発明が解決しようとする問題点]ポリア
ミド樹脂は優れた機械強度を有するため、エンジニアリ
ングプラスチックとして各分野において広く利用されて
いる。[Prior Art/Problems to be Solved by the Invention] Polyamide resins have excellent mechanical strength and are therefore widely used as engineering plastics in various fields.
しかしながら、使用条件によっては、引張伸度が小さく
なるという欠点を有している。However, it has the disadvantage that the tensile elongation becomes small depending on the conditions of use.
この欠点を解決する方法として、ポリアルキレングリコ
ールを共重合させて引張伸度を改良する方法があるが、
この方法では引張強度および耐熱性が低下する。One way to solve this drawback is to copolymerize polyalkylene glycol to improve the tensile elongation.
This method reduces tensile strength and heat resistance.
本発明は、引張強度、熱安定性、衝撃強度を低下させる
ことなく、優れた引張伸度の成形品を与える組成物をつ
るためになされたものである。The present invention was made in order to create a composition that provides molded articles with excellent tensile elongation without reducing tensile strength, thermal stability, or impact strength.
[問題点を解決するための手段]
本発明は、
(1)ポリアミド樹脂100部(重量部、以下同様)に
対し
くi)(ωポリエステルセグメント45〜90%(1二
%、以下同様)と
山)平均分子量400〜3000のポリアルキレングリ
コールセグメント10〜55%
とからなるポリエステルエーテルブロック共重合体2〜
35部
を含有してなるポリアミド組成物に関する。[Means for Solving the Problems] The present invention provides: (1) i) (45 to 90% (12%, same below) of ω polyester segment to 100 parts (parts by weight, same below) of polyamide resin) 2) Polyester ether block copolymer consisting of 10-55% of polyalkylene glycol segments with an average molecular weight of 400-3000
35 parts of the polyamide composition.
[実施例コ
本発明に用いるポリアミド樹脂としては、ε−カプロラ
クタム、6−アミノカプロン酸、ω−エナントラクタム
、7−アミノヘプタン酸、11−アミノウンデカン酸、
9−アミノノナン酸、α −ピロリドン、α −ピペリ
ドンなどからの重合体、ヘキサメチレンジアミン、ノナ
メチレンジアミン、ウンデカメチレンジアミン、ドデカ
メチレンジアミン、メタキシリレンジアミンなどのジア
ミンとテレフタル酸、イソフタル酸、アジピン酸、セバ
シン酸などのジカルボン酸とを重縮合させてえられる重
合体、上記モノマーからの共重合体などを使用すること
ができる。[Example] Polyamide resins used in the present invention include ε-caprolactam, 6-aminocaproic acid, ω-enantholactam, 7-aminoheptanoic acid, 11-aminoundecanoic acid,
Polymers from 9-aminononanoic acid, α-pyrrolidone, α-piperidone, etc., diamines such as hexamethylene diamine, nonamethylene diamine, undecamethylene diamine, dodecamethylene diamine, metaxylylene diamine, and terephthalic acid, isophthalic acid, adipine. Polymers obtained by polycondensing acids, dicarboxylic acids such as sebacic acid, copolymers of the above monomers, and the like can be used.
本発明に用いるポリエステルエーテルブロック共重合体
はポリエステルとポリアルキレングリコールとからなる
ブロック共重合体である。The polyester ether block copolymer used in the present invention is a block copolymer consisting of polyester and polyalkylene glycol.
前λ己ポリエステルとしては、たとえばテレフタル酸と
炭素数2〜4のグリコールとからなるポリエステルがあ
げられ、炭素数2〜4のグリコールの例としては、エチ
レングリコール、プロピレングリコール、ブタンジオー
ルがあげられる。Examples of the pre-λ polyester include polyesters made of terephthalic acid and glycols having 2 to 4 carbon atoms, and examples of glycols having 2 to 4 carbon atoms include ethylene glycol, propylene glycol, and butanediol.
前記ポリエステルを構成するグリコールおよびテレフタ
ル酸は、それぞれ10モル%以下の範囲で他のグリコー
ル(たとえばヘキサンジオール、シクロヘキサンジメタ
ツールなど)および他のジカルボン酸(たとえばイソフ
タル酸、ナフタレンジカルボン酸など)を含んでいても
よい。The glycol and terephthalic acid constituting the polyester each contain other glycols (for example, hexanediol, cyclohexane dimetatool, etc.) and other dicarboxylic acids (for example, isophthalic acid, naphthalene dicarboxylic acid, etc.) within a range of 10 mol% or less. It's okay to stay.
前記ポリアルキレングリコールとしては、−般式fl)
または(I[)で表わされる分子2400〜3000、
好ましくは500〜2000のポリアルキレングリコー
ルセグメントを与えるポリアルキレングリコールが使用
されうる。The polyalkylene glycol has the general formula fl)
or molecules 2400 to 3000 represented by (I[),
Preferably polyalkylene glycols giving 500 to 2000 polyalkylene glycol segments may be used.
−(HR−0→「(I)
(式中、RはC2−C4の炭化水素基、ρは10〜40
の整数を表わす。)
(式中、Rは02〜C4の炭化水素基、Xは2価の結合
基または直接結合を表わし、0およびnはそれぞれ5〜
20の整数を表わす。)
上記一般式(1)で示されるものの具体例としては、ポ
リエチレングリコール、ポリプロピレングリコール、ポ
リテトラメチレングリコールなどからのセグメントがあ
げられる。-(HR-0 → "(I) (wherein, R is a C2-C4 hydrocarbon group, ρ is 10-40
represents an integer. ) (In the formula, R represents a 02-C4 hydrocarbon group, X represents a divalent bonding group or a direct bond, and 0 and n each represent 5-4.
Represents an integer of 20. ) Specific examples of those represented by the above general formula (1) include segments from polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and the like.
上記一般式tU)で示されるものの具体例としては、た
とえばRがエチレン基、プロピレン基、テトラメチレン
基などのC2〜C4の炭化水素基、Xf)<−C−1−
C)12CH2−などの2価の炭化水前栽、−s−、−
o−、−3O2−、−co−1−NY−(式中、Yは水
素原子、CI −csの置換または無置換アルキル基)
などの結合基または直接結合であり、mおよびnがそれ
ぞれ5〜20の整数のものなどがあげられる。なお、X
が −〇−(式中、Yは上記と同じ)、−〇−または−
502−であるものは、とくに成形性の面から望ましい
。またベンゼン核がメチル基、エチル基などのアルキル
基やハロゲン原子などで置換されたものも使用すること
ができる。Specific examples of those represented by the above general formula tU) include, for example, R is a C2-C4 hydrocarbon group such as an ethylene group, a propylene group, a tetramethylene group, Xf)<-C-1-
C) Divalent hydrocarbon preplants such as 12CH2-, -s-, -
o-, -3O2-, -co-1-NY- (wherein, Y is a hydrogen atom, a substituted or unsubstituted alkyl group of CI -cs)
or a direct bond, such as those in which m and n are each an integer of 5 to 20. In addition, X
is −〇− (in the formula, Y is the same as above), −〇− or −
502- is particularly desirable from the viewpoint of moldability. Furthermore, those in which the benzene nucleus is substituted with an alkyl group such as a methyl group or an ethyl group, or a halogen atom can also be used.
ポリアルキレングリコールの重合度は、熱安定性および
耐溶剤性の観点から、ρは40以下、■およびnはそれ
ぞれ20以下が好ましく、結晶化特性、耐衝撃性の観点
から、gは10以上、mおよびnはそれぞれ5以上が好
ましい。Regarding the degree of polymerization of the polyalkylene glycol, from the viewpoint of thermal stability and solvent resistance, ρ is preferably 40 or less, ■ and n are each preferably 20 or less, and from the viewpoint of crystallization properties and impact resistance, g is 10 or more, Each of m and n is preferably 5 or more.
本発明の好ましい実施態様はポリエステルセグメントが
ポリエチレンテレフタレートセグメントであり、ポリア
ルキレングリコールセグメントが一般式(If)で表わ
されるセグメントであるばあいであり、とくに好ましい
実施態様は、−般式fit)のXがイソプロピリデン基
でmおよびnがそれぞれ5〜10のばあいである。In a preferred embodiment of the present invention, the polyester segment is a polyethylene terephthalate segment, and the polyalkylene glycol segment is a segment represented by the general formula (If).A particularly preferred embodiment is the case where the polyester segment is a polyethylene terephthalate segment and the polyalkylene glycol segment is a segment represented by the general formula (If). is an isopropylidene group, and m and n are each from 5 to 10.
ポリエステルエーテルブロック共重合体中のポリアルキ
レングリコールセグメントの割合は10〜55%、好ま
しくは15〜50%である。咳量が10%未満のばあい
には、えられる成形品の引張伸度を改良することはでき
ず、55%をこえるばあいには、成形品の熱変形温度、
引張強度が低下する。The proportion of polyalkylene glycol segments in the polyester ether block copolymer is 10-55%, preferably 15-50%. If the cough volume is less than 10%, it is not possible to improve the tensile elongation of the molded product, and if it exceeds 55%, the heat distortion temperature,
Tensile strength decreases.
ポリエステルエーテルブロック共重合体の対数粘度(I
V)はフェノール/テトラクロルエタン−50150(
重量比)の混合溶媒中、25℃で濃度0.5g /dN
において0.5〜1.4の範囲が好ましい。IVが0.
5未満では引張強度が低下し、またIVが1.4をこえ
るとブレンド時に相分離が生じる傾向にある。さらに好
ましいIVは0.6〜1.2、とくに好ましイI Vハ
0.7〜1.0である。Logarithmic viscosity (I
V) is phenol/tetrachloroethane-50150 (
Weight ratio) in a mixed solvent with a concentration of 0.5 g/dN at 25°C.
The range of 0.5 to 1.4 is preferable. IV is 0.
When the IV is less than 5, the tensile strength decreases, and when the IV exceeds 1.4, phase separation tends to occur during blending. A more preferable IV is 0.6 to 1.2, particularly preferably 0.7 to 1.0.
ポリアミド樹脂 100部に対するポリエステルエーテ
ルブロック共重合体の添加量は2〜35部、好ましくは
5〜30部である。数量が2部未満のばあいには引張
伸度の改良は見られず、35部をこえるばあいには引張
強度および熱変形温度が低下する。The amount of the polyester ether block copolymer added to 100 parts of the polyamide resin is 2 to 35 parts, preferably 5 to 30 parts. If the amount is less than 2 parts, no improvement in tensile elongation will be observed, and if it exceeds 35 parts, the tensile strength and heat distortion temperature will decrease.
ポリエステルエーテルブロック共重合体をポリアミドに
配合する方法にはとくに制限はないが、通常、押出機を
用いてポリアミド樹脂およびポリエステルエーテルブロ
ック共重合体を溶融混練する方法が一般的である。Although there are no particular restrictions on the method of blending the polyester ether block copolymer with the polyamide, a common method is to melt-knead the polyamide resin and the polyester ether block copolymer using an extruder.
本発明の組成物には、要すれば公知の他の樹脂、たとえ
ばポリエチレン、ポリプロピレン、EPゴム、エチレン
−酢酸ビニル共重合体、アイオノマー、ABS樹脂、ナ
イロン、PBT樹脂、PET樹脂などの樹脂を配合して
別の特性を付与してもよく、また、ガラス繊維、ガラス
ピーズ、炭素繊維、スチールファイバー、タルク、クレ
ー、炭酸カルシウム、硫酸カルシウム、マイカなどのフ
ィラー、炭素粉末、酸化亜鉛、酸化チタンなどの顔料、
染料、酸化防止剤、紫外線吸収剤、難燃化剤などを配合
してもよい。If necessary, the composition of the present invention may contain other known resins such as polyethylene, polypropylene, EP rubber, ethylene-vinyl acetate copolymer, ionomer, ABS resin, nylon, PBT resin, and PET resin. In addition, fillers such as glass fiber, glass peas, carbon fiber, steel fiber, talc, clay, calcium carbonate, calcium sulfate, mica, carbon powder, zinc oxide, titanium oxide, etc. pigment,
Dyes, antioxidants, ultraviolet absorbers, flame retardants, etc. may be added.
以下、実施例をあげて本発明の詳細な説明するが、本発
明はこれらに限定されるものではない。Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited thereto.
なお、実施例中の試験片の引張強度、引張伸度、引張弾
性率はASTM−D638 、熱変形温度(4,6kg
/c+J加重)はASTM−DB4g 、ノツチ付アイ
ゾツト衝撃強度はASTM−D25Bに学拠して測定し
た。In addition, the tensile strength, tensile elongation, and tensile modulus of the test pieces in the examples are ASTM-D638, heat distortion temperature (4.6 kg
/c+J weight) was measured based on ASTM-DB4g, and notched Izot impact strength was measured based on ASTM-D25B.
また熱安定性は、射出成形機に260℃で5分間滞留時
の樹脂の着色で判定し、全く着色のないばあいを◎、や
や着色したものを○とした。Thermal stability was determined by the coloration of the resin when it remained in an injection molding machine at 260° C. for 5 minutes. No coloration at all was evaluated as ◎, and slight coloration was evaluated as ◎.
実施例1〜3および比較例1〜2
ナイロン6100部とビスフェノールAのエチレンオキ
シド付加体(数平均分子ff1looO) 30%を使
用してえられるポリエチレンテレフタレートブロック共
重合体(IV−0,80)とを、第1表に示す割合でト
ライブレンドしたのち、二軸押出機にて押出してペレッ
ト化し、射出成形により試験片を作製し、機械強度の試
験を行なった。Examples 1 to 3 and Comparative Examples 1 to 2 A polyethylene terephthalate block copolymer (IV-0,80) obtained using 6100 parts of nylon and 30% of an ethylene oxide adduct of bisphenol A (number average molecule ff1looO) was used. After tri-blending in the proportions shown in Table 1, the mixtures were extruded using a twin-screw extruder to form pellets, and test pieces were prepared by injection molding and tested for mechanical strength.
結果を第1表に示す。The results are shown in Table 1.
比較例1として上記ポリエステルエーテルブロック共重
合体を含まないもの、比較例2として40部配合したも
のを同様にして試験した。結果を第1表に示す。A sample containing no polyester ether block copolymer as Comparative Example 1 and a sample containing 40 parts of the polyester ether block copolymer as Comparative Example 2 were similarly tested. The results are shown in Table 1.
実施例4
ナイロン6100部とポリエチレングリコール(数平均
分子H800) 30%を使用してえられるポリエチレ
ンテレフタレートブロック共重合体(IV−0,8)
10部とをトライブレンドしたのちは、実施例1と同様
にして試験した。結果を第1表に示す。Example 4 Polyethylene terephthalate block copolymer (IV-0,8) obtained using 6100 parts of nylon and 30% of polyethylene glycol (number average molecule H800)
After triblending with 10 parts, the test was carried out in the same manner as in Example 1. The results are shown in Table 1.
実施例5
ナイロン6100部とポリテトラメチレングリコール(
数平均分子ff11300) 30%を使用してえられ
るポリブチレンテレフタレートブロック共重合体(IV
−1,1) 10部とをトライブレンドしたのちは、実
施例1と同様にして試験した。結果を第1表に示す。Example 5 6100 parts of nylon and polytetramethylene glycol (
polybutylene terephthalate block copolymer (IV
-1,1) After triblending 10 parts, the test was carried out in the same manner as in Example 1. The results are shown in Table 1.
[以下余白]
第1表の結果から、本発明の組成物を用いるとえられる
成形品の引張伸度が大きく改良され、引張強度、熱変形
温度、ノッ・チ付アイゾツト衝撃強度が低下しないこと
がわかる。[Margins below] From the results in Table 1, it can be seen that the tensile elongation of molded products using the composition of the present invention is greatly improved, and the tensile strength, heat distortion temperature, and notched Izot impact strength do not decrease. I understand.
[発明効果]
本発明の組成物を用いて成形品を製造すると、ポリアミ
ド樹脂成形品の引張強度、熱安定性、衝撃強度を低下さ
せることなく、引張伸度の大きい成形品かえられる。[Effects of the Invention] When a molded article is manufactured using the composition of the present invention, a molded article having a large tensile elongation can be obtained without reducing the tensile strength, thermal stability, and impact strength of the polyamide resin molded article.
Claims (1)
)(a)ポリエステルセグメント45〜90重量%と(
b)平均分子量400〜3000のポリアルキレングリ
コールセグメント10〜55重量% とからなるポリエステルエーテルブロック 共重合体2〜35重量部 を含有してなるポリアミド組成物。[Claims] 1(i) 100 parts by weight of polyamide resin, (ii)
) (a) 45 to 90% by weight of polyester segments and (
b) A polyamide composition containing 2 to 35 parts by weight of a polyester ether block copolymer comprising 10 to 55% by weight of polyalkylene glycol segments having an average molecular weight of 400 to 3,000.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61196409A JPH0649823B2 (en) | 1986-08-21 | 1986-08-21 | Polyamide composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61196409A JPH0649823B2 (en) | 1986-08-21 | 1986-08-21 | Polyamide composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6351454A true JPS6351454A (en) | 1988-03-04 |
JPH0649823B2 JPH0649823B2 (en) | 1994-06-29 |
Family
ID=16357379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61196409A Expired - Lifetime JPH0649823B2 (en) | 1986-08-21 | 1986-08-21 | Polyamide composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0649823B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01256565A (en) * | 1988-02-27 | 1989-10-13 | Basf Ag | Thermoplastic molding material based on polyamide and ethylene copolymer |
JPH04186752A (en) * | 1990-11-21 | 1992-07-03 | Hitachi Ltd | Mounting structure of heat sink in electronic device |
US5529827A (en) * | 1993-08-26 | 1996-06-25 | Aglis Co., Ltd. | Self-adhesive film |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123567A (en) * | 1974-08-21 | 1976-02-25 | Toray Industries | KUTSUKYOKUHIROSEINOKAIRYOSARETA HORIAMIDOSOSEIBUTSU |
JPS5441955A (en) * | 1977-09-08 | 1979-04-03 | Toray Ind Inc | Impact-resistant resin composition |
-
1986
- 1986-08-21 JP JP61196409A patent/JPH0649823B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123567A (en) * | 1974-08-21 | 1976-02-25 | Toray Industries | KUTSUKYOKUHIROSEINOKAIRYOSARETA HORIAMIDOSOSEIBUTSU |
JPS5441955A (en) * | 1977-09-08 | 1979-04-03 | Toray Ind Inc | Impact-resistant resin composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01256565A (en) * | 1988-02-27 | 1989-10-13 | Basf Ag | Thermoplastic molding material based on polyamide and ethylene copolymer |
JPH04186752A (en) * | 1990-11-21 | 1992-07-03 | Hitachi Ltd | Mounting structure of heat sink in electronic device |
US5529827A (en) * | 1993-08-26 | 1996-06-25 | Aglis Co., Ltd. | Self-adhesive film |
Also Published As
Publication number | Publication date |
---|---|
JPH0649823B2 (en) | 1994-06-29 |
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