JPS6350654U - - Google Patents
Info
- Publication number
- JPS6350654U JPS6350654U JP1986143708U JP14370886U JPS6350654U JP S6350654 U JPS6350654 U JP S6350654U JP 1986143708 U JP1986143708 U JP 1986143708U JP 14370886 U JP14370886 U JP 14370886U JP S6350654 U JPS6350654 U JP S6350654U
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- wafer
- carrier
- upper inner
- upper outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は本考案による一実施例の研磨装置を示
す図、第２図は従来の研磨装置を示す図、である
。
図において、１ａは上部内定盤、１ｂは上部外
定盤、２は下部定盤、３は上部歯車、４は下部歯
車、５はキヤリア、５ａは回転軸、６はウエーハ
、７はモータ、８はカプリング、９はピニオンプ
レート、１０はピニオン、１１は固定板、を示す
。
FIG. 1 is a diagram showing an embodiment of a polishing apparatus according to the present invention, and FIG. 2 is a diagram showing a conventional polishing apparatus. In the figure, 1a is an upper inner surface plate, 1b is an upper outer surface plate, 2 is a lower surface plate, 3 is an upper gear, 4 is a lower gear, 5 is a carrier, 5a is a rotating shaft, 6 is a wafer, 7 is a motor, 8 9 is a coupling, 9 is a pinion plate, 10 is a pinion, and 11 is a fixing plate.
Claims (1)
回転する定盤１，２の間に挟んで研磨する研磨装
置であつて、 上部定盤を上部内定盤１ａと上部外定盤１ｂに
分割し、その間隙にウエーハ６を保持するキヤリ
ア５の回転軸５ａと前記回転軸５ａと結合する回
転駆動用のモータ７のカプリング８を設け、 さらに、前記上部内定盤１ａの回転力を前記上
部外定盤１ｂに伝導するピニオン１０を、前記上
部内定盤１ａと前記上部外定盤１ｂの間に設けた
ことを特徴とする研磨装置。[Claims for Utility Model Registration] The wafer 6 held by the carrier 5,
This is a polishing device that performs polishing by being sandwiched between rotating surface plates 1 and 2, in which the upper surface plate is divided into an upper inner surface plate 1a and an upper outer surface plate 1b, and a carrier 5 that holds a wafer 6 in the gap is rotated. A coupling 8 for a rotary drive motor 7 coupled to the shaft 5a and the rotating shaft 5a is provided, and a pinion 10 for transmitting the rotational force of the upper inner surface plate 1a to the upper outer surface plate 1b is connected to the upper inner surface plate. 1a and the upper outer surface plate 1b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986143708U JPS6350654U (en) | 1986-09-18 | 1986-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986143708U JPS6350654U (en) | 1986-09-18 | 1986-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6350654U true JPS6350654U (en) | 1988-04-06 |
Family
ID=31053637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986143708U Pending JPS6350654U (en) | 1986-09-18 | 1986-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350654U (en) |
-
1986
- 1986-09-18 JP JP1986143708U patent/JPS6350654U/ja active Pending
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