JPS6350129U - - Google Patents

Info

Publication number
JPS6350129U
JPS6350129U JP1986144644U JP14464486U JPS6350129U JP S6350129 U JPS6350129 U JP S6350129U JP 1986144644 U JP1986144644 U JP 1986144644U JP 14464486 U JP14464486 U JP 14464486U JP S6350129 U JPS6350129 U JP S6350129U
Authority
JP
Japan
Prior art keywords
spool
metal wire
wire
paid out
adjustment means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986144644U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0333060Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986144644U priority Critical patent/JPH0333060Y2/ja
Publication of JPS6350129U publication Critical patent/JPS6350129U/ja
Application granted granted Critical
Publication of JPH0333060Y2 publication Critical patent/JPH0333060Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Tension Adjustment In Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1986144644U 1986-09-19 1986-09-19 Expired JPH0333060Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986144644U JPH0333060Y2 (en:Method) 1986-09-19 1986-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986144644U JPH0333060Y2 (en:Method) 1986-09-19 1986-09-19

Publications (2)

Publication Number Publication Date
JPS6350129U true JPS6350129U (en:Method) 1988-04-05
JPH0333060Y2 JPH0333060Y2 (en:Method) 1991-07-12

Family

ID=31055439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986144644U Expired JPH0333060Y2 (en:Method) 1986-09-19 1986-09-19

Country Status (1)

Country Link
JP (1) JPH0333060Y2 (en:Method)

Also Published As

Publication number Publication date
JPH0333060Y2 (en:Method) 1991-07-12

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