JPS6348440B2 - - Google Patents
Info
- Publication number
- JPS6348440B2 JPS6348440B2 JP57096539A JP9653982A JPS6348440B2 JP S6348440 B2 JPS6348440 B2 JP S6348440B2 JP 57096539 A JP57096539 A JP 57096539A JP 9653982 A JP9653982 A JP 9653982A JP S6348440 B2 JPS6348440 B2 JP S6348440B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- head
- printed circuit
- circuit board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
() 従来技術とその課題
(1) 近時、自動チツプマウント機を使用して、抵
抗器、コンデンサー等の筒形（円筒形、円柱形
等）乃至板形（角板形、円板形等）の小型電子
部品（以下単にチツプと略記する。）を自動的
にプリント基板上に正確に配置（マウント）
し、該状態のままチツプをプリント基板上に適
宜結着（例、ハンダ付け）することが行われて
いる。[Detailed description of the invention] () Prior art and its problems (1) Recently, automatic chip mount machines have been used to mount resistors, capacitors, etc. from cylindrical shapes (cylindrical shapes, cylindrical shapes, etc.) to plate shapes (square shapes). Automatically and accurately place (mount) small electronic components (hereinafter simply referred to as chips) (plate-shaped, disc-shaped, etc.) on printed circuit boards.
However, in this state, the chip is appropriately bonded (for example, soldered) onto a printed circuit board.
而して、上記自動チツプマウント工程におい
て、プリント基板上にマウントされたチツプ
を、次段の結着工程（例、ハンダ付け）に先だ
つて、基板面上の設定位置に保持するために、
接着剤によつて接着保持することが行われてい
る。 Therefore, in the automatic chip mounting process, in order to hold the chip mounted on the printed circuit board at a set position on the board surface prior to the next step of bonding (e.g., soldering),
Bonding and holding is performed using an adhesive.
該接着剤保持工程は、チツプのプリント基板
へのマウントに際し、前もつて該基板面上のチ
ツプ装着パターン（種々のプリント基板毎の部
品装着位置の相違により、種々変化するが、同
一種類基板では全て同一である。）と同じ位置
に適宜接着剤を塗布しておき、この塗布接着剤
位置に自動チツプマウント機によつて自動的に
チツプを送給マウントして接着し、次に接着剤
を乾燥（例えば、UV樹脂接着剤を高圧紫外線
照射によつてキユアー乾燥）して、このチツプ
を接着したプリント基板を、例えば上下反転し
てハンダ槽中を浸漬通過せしめてハンダ付けし
て、チツプのプリント基板に対する結着を完了
するものである。 The adhesive holding process is performed when mounting a chip on a printed circuit board.The chip mounting pattern on the board surface (varies depending on the difference in component mounting positions for various printed circuit boards, but for the same type of board) ), the chip is automatically fed and mounted using an automatic chip mount machine, and then the adhesive is applied. After drying (for example, curing the UV resin adhesive by irradiating high-pressure ultraviolet rays), the printed circuit board to which the chip has been bonded is soldered by, for example, turning it upside down and dipping it through a soldering bath. This completes the bonding to the printed circuit board.
(2) 而して、上記プリント基板に対する接着剤の
塗布方式として、従来、スクリーン印刷方式、
デイスペンサー方式及びピン式接着剤転写ヘツ
ド方式がある。(2) Therefore, conventional methods for applying adhesive to the printed circuit board include screen printing,
There are two types: dispenser type and pin type adhesive transfer head type.
該ピン式接着剤転写ヘツドによる接着剤の塗
布は、例えば、ヘツド本体の下面板の設定位
置、即ち、プリント基板におけるチツプの装着
パターンと対称の位置に、複数本のピンを垂直
に設置して構成したピン式接着剤転写ヘツドの
各ピン先端を、接着剤トレー等に形成した接窒
剤層に浸漬して定量の接着剤を付着せしめたの
ち、該ヘツドを上昇しプリント基板直上に移行
し、下降して、各ピン先端をプリント基板の設
定位置（チツプ装着位置）に接触せしめて、ピ
ン先端に付着した定量の接着剤を該基板に転写
塗布して行うものである。 Applying adhesive using the pin-type adhesive transfer head can be done, for example, by installing a plurality of pins vertically at a set position on the bottom plate of the head body, that is, at a position symmetrical to the chip mounting pattern on the printed circuit board. The tip of each pin of the configured pin-type adhesive transfer head is dipped into a nitriding agent layer formed on an adhesive tray or the like to deposit a certain amount of adhesive, and then the head is raised and moved directly above the printed circuit board. Then, the tip of each pin is brought into contact with a set position (chip mounting position) on a printed circuit board, and a certain amount of adhesive attached to the tip of the pin is transferred and coated onto the board.
(3) 上記接着剤の塗布は、プリント基板のチツプ
装着位置毎に、均等な塗布形状、面積及び量に
塗布することが要求される。よつて、各ピン頭
部が夫々均等な接触圧でプリント基板に接触す
ることが必要である。(3) The adhesive described above must be applied in a uniform shape, area, and amount at each chip mounting position on the printed circuit board. Therefore, it is necessary for each pin head to contact the printed circuit board with equal contact pressure.
ところが、従来のピン式接着剤転写ヘツド
（例、ヨーロツパ特許出願公開昭第49451号）に
おいては、ばねで支持した１枚のプレートに全
部のピンの基部を接触して設置したものである
ため、該ヘツドをプリント基板へ下降したとき
に、全部のピンが均等圧で一率に接触すること
となり、よつて、
(i) プリント基板面が正確な平面であればよい
が、少しでも凹凸や歪みがあると、各ピンの
接触圧に強弱のムラを生じ、均等な接着剤転
写塗布が行われない。 However, in conventional pin-type adhesive transfer heads (e.g., European Patent Application Publication No. 49451), the bases of all the pins are installed in contact with one plate supported by a spring. When the head is lowered onto the printed circuit board, all the pins come into contact with each other with equal pressure, so (i) The surface of the printed circuit board only needs to be exactly flat, but there should be no irregularities or distortions. If this occurs, the contact pressure of each pin will be uneven in strength and adhesive transfer will not be applied evenly.
(ii) 特に、ヘツドの下降時に、プリント基板の
局部的な凸部等に、その対称位置のピンがさ
きに当つてしまうので、そのピンの接触圧の
みが異常に強くなつてプリント基板やピンを
損傷する恐れがあると同時に、他のピンは浮
いてしまつて接触圧が得られない恐れがあ
り、従つて有効な接着剤転写塗布が行われな
い、等の欠点があり、その解決が強く望まれ
てきたものである。 (ii) In particular, when the head is lowered, the pin at the symmetrical position hits a localized protrusion on the printed circuit board first, so the contact pressure of that pin becomes abnormally strong, causing the printed circuit board and pins to become abnormally strong. There is a risk of damaging the other pins, and at the same time, there is a risk that the other pins will float and no contact pressure can be obtained, and therefore, effective adhesive transfer application will not be possible. It has been desired.
() 本発明の構成
本発明は上記従来の課題を解決すべくなされた
ものである。() Structure of the present invention The present invention has been made to solve the above-mentioned conventional problems.
(1) 即ち、本発明は、ヘツド本体下面の設定位
置、即ち、プリント基板におけるチツプの装着
パターンと対称の位置に、複数本のピンを垂直
に設定してなる既存のピン式接着剤転写ヘツド
において、
ヘツド本体下面の設定位置に設置した複数本
のピンを、各ピン毎に設けたばねで夫々が弾力
的かつ上下摺動自在に設置したことを特徴とす
る、プリント基板のピン式接着剤転写ヘツドで
ある。(1) That is, the present invention is an existing pin-type adhesive transfer head in which a plurality of pins are vertically set on the lower surface of the head body, that is, at positions symmetrical to the chip mounting pattern on the printed circuit board. , a pin-type adhesive transfer of a printed circuit board, characterized in that a plurality of pins are installed at set positions on the bottom surface of the head body, and each pin is installed elastically and vertically slidably by a spring provided for each pin. It's a head.
(2) 次に、本発明の実施例を図面につき説明する
と、中空扁平箱状体３の下面にピン支持板４を
固着してヘツド本体１を形成し、該ピン支持板
４の各ピン挿通孔５（前記設定位置に各穿孔し
た）に、各ピン２の頭部６を上下摺動自在に挿
通して一定寸法垂下突出すると共に、該垂設状
態を基部７で支持し、また、各ピン２を各ピン
２毎に設けたばねＳ、例えば各ピン２の基部７
とヘツド本体１の天板８間に張設したばね９
（第１図示）、若しくは基部７に一体的に形成し
たばね１０（第２図）によつて、夫々が独立的
に、弾力的かつ上下摺動自在に設置して、ピン
式接着剤転写ヘツドＡを構成したものである。(2) Next, an embodiment of the present invention will be described with reference to the drawings. A pin support plate 4 is fixed to the lower surface of the hollow flat box-shaped body 3 to form the head body 1, and each pin of the pin support plate 4 is inserted through the pin support plate 4. The head 6 of each pin 2 is inserted into the hole 5 (each drilled at the set position) so as to be vertically slidable so that it hangs down by a certain length, and the hanging state is supported by the base 7. A spring S with a pin 2 for each pin 2, for example the base 7 of each pin 2
and a spring 9 stretched between the top plate 8 of the head body 1.
(as shown in Figure 1), or each can be installed independently, elastically and slidably up and down by means of a spring 10 (Figure 2) integrally formed with the base 7, and can be used as a pin-type adhesive transfer head. This is a configuration of A.
() 作用
以下、本発明ピン式接着剤転写ヘツドＡを用い
た、プリント基板Ａに対する接着剤の転写作用に
つき設明すると（第３図のイ〜ヘ参照）、
例えば、平板状の接着剤トレー１２に定量の接
着剤１３を注入し、該接着剤１３を適宜のスキイ
ジー１５で設定層厚（チツプの種類等によつて厚
さを調節）の接着剤層１４に掻き馴らし、この層
厚の特定した接着剤層１４の上方から、本発明転
写ヘツドＡを下降して、その下面に突出した各ピ
ン２の頭部６先端を該層１４に浸漬したのち、転
写ヘツドＡを上昇して、各ピン２先端に定量（層
厚を均等とすることによつて可能）の接着剤を付
着せしめ、この転写ヘツドＡをプリント基板Ｐの
直上に適宜手段にて移行し、続いて垂直下降し
て、プリント基板Ｐの設定位置に各ピン２先端を
弾力的に接触させて、該先端に付着した定量の接
着剤１３を基板Ｐに転写塗布するものである。ま
た、該転写ヘツドＡは再び上昇して原位置に復帰
する。() Function The following explains the adhesive transfer function for the printed circuit board A using the pin-type adhesive transfer head A of the present invention (see Fig. 3, A to F). A certain amount of adhesive 13 is injected into the adhesive 12, and the adhesive 13 is rubbed into the adhesive layer 14 of a set layer thickness (the thickness is adjusted depending on the type of chip, etc.) using an appropriate squeegee 15. The transfer head A of the present invention is lowered from above the identified adhesive layer 14, and the tip of the head 6 of each pin 2 protruding from the lower surface thereof is immersed in the layer 14, and then the transfer head A is raised. A fixed amount of adhesive (possible by making the layer thickness uniform) is applied to the tip of each pin 2, and this transfer head A is moved directly above the printed circuit board P by appropriate means, and then vertically lowered. , the tip of each pin 2 is brought into elastic contact with a set position on the printed circuit board P, and a fixed amount of the adhesive 13 attached to the tip is transferred and coated onto the substrate P. Further, the transfer head A rises again and returns to its original position.
上記作業によつて、プリント基板Ｐには目的と
する位置に接着剤が適正塗布されたので、自動チ
ツプマウント機から各塗布位置（装着パターン）
にチツプＣを送給して接着保持し、それを乾燥処
理し、事後前述のハンダ付け等を行つてチツプを
結着することとなるものである。 Through the above operations, the adhesive has been properly applied to the desired position on the printed circuit board P, so the automatic chip mount machine applies the adhesive to each application position (installation pattern).
The chips C are fed and held together, dried, and then soldered as described above to bind the chips.
() 効果
上記の如く、本発明は従来構成のピン式接着剤
転写ヘツドにおいて、ヘツド本体下面の設定位置
に設置した複数本のピンを、各ピン毎に設けたば
ねで夫々が、独立的に、弾力的かつ上下摺動自在
に設置したので、
転写ヘツドを下降して各ピンの頭部をプリント
基板に接触するとき、個々のピンが夫々のばね力
で夫々の接触面に対応して個別に上下摺動するこ
ととなり、
よつて、プリント基板面に凹凸や歪み等があつ
ても、各ピンの頭部がそれに馴んで均等な接触圧
で接触し、従つて、均等な塗布形状、面積及び転
写塗布し得る優れた特長がある。() Effects As described above, the present invention provides a pin-type adhesive transfer head with a conventional configuration, in which a plurality of pins installed at set positions on the bottom surface of the head body are independently activated by a spring provided for each pin. Since it is installed so that it can be elastically slid up and down, when the transfer head is lowered and the head of each pin comes into contact with the printed circuit board, each pin is individually moved by the spring force corresponding to each contact surface. It slides up and down, so even if there are irregularities or distortions on the printed circuit board surface, the head of each pin adjusts to it and contacts with equal contact pressure, resulting in uniform application shape, area, and It has the excellent feature of being transfer coatable.
第１図は本発明の転写ヘツドの一実施例の縦断
正面図及び下面図、第２図はピンに弾性部を一体
に形成した実施例図、第３図のイ〜ヘは本発明の
作用を示す説明図で、イは転写ヘツドを接着剤ト
レーに下降上昇してピン先端に接着剤を付着する
図、ロは転写ヘツドをプリント基板上に移行し下
降上昇して該基板に接着剤を転写塗布する図、ハ
は基板に接着剤を転写した図、ニは該接着剤にチ
ツプをマウントし接着した基板を乾燥炉に通し接
着剤を乾燥する図、ホは乾燥したものを上下反転
してハンダ槽中を通過しハンダ付けする図、ヘは
ハンダ付けした完成品の図である。
付号、Ａ……本発明ピン式接着剤転写ヘツド、
Ｐ……プリント基板、Ｃ……チツプ、Ｓ……ば
ね、１……ヘツド本体、２……ピン、３……扁平
箱状体、４……ピン支持板、５……ピン挿通孔、
６……頭部、７……基部、８……天板、９……ば
ね、１０……ばね、１２……接着剤トレー、１３
……接着剤、１４……接着剤層、１５……スキイ
ジー、１６……乾燥炉、１７……ハンダ槽、１８
……既装電子部品。
Fig. 1 is a longitudinal sectional front view and a bottom view of an embodiment of a transfer head of the present invention, Fig. 2 is an embodiment in which a pin is integrally formed with an elastic portion, and Fig. 3 A to F show the effects of the present invention. In this explanatory diagram, (a) shows how the transfer head is lowered and raised to the adhesive tray to apply adhesive to the tip of the pin, and (b) is a diagram where the transfer head is moved onto a printed circuit board and then lowered and raised to apply adhesive to the board. The image showing the transfer coating, C shows the adhesive transferred to the substrate, D shows the chip mounted on the adhesive and the bonded substrate is passed through a drying oven to dry the adhesive, E shows the dried one turned upside down. Figure 1 shows the product passing through a soldering bath and being soldered. Number, A...Pin type adhesive transfer head of the present invention,
P... Printed circuit board, C... Chip, S... Spring, 1... Head body, 2... Pin, 3... Flat box-shaped body, 4... Pin support plate, 5... Pin insertion hole,
6... Head, 7... Base, 8... Top plate, 9... Spring, 10... Spring, 12... Adhesive tray, 13
...Adhesive, 14...Adhesive layer, 15...Squeegee, 16...Drying oven, 17...Solder bath, 18
... Ready-made electronic parts.
Claims (1)
基板におけるチツプの装着パターンと対称の位置
に、複数本のピンを垂直に設置してなる既存のピ
ン式接着剤転写ヘツドにおいて、 ヘツド本体下面の設定位置に設置した複数本の
ピンを、各ピン毎に設けたばねで夫々が弾力的か
つ上下摺動自在に設置したことを特徴とする、 プリント基板のピン式接着剤転写ヘツド。 ２ 中空扁平箱状体の下面にピン支持板を固着し
てヘツド本体を形成し、ピン支持板の設定位置に
穿孔した各ピン挿通孔に、各ピンの頭部を上下摺
動自在に挿通して一定寸法垂下突出すると共に、
該垂下状態を基部で支持し、また、各ピンを各ピ
ン毎に設けたばね、例えば各ピンの基部と天板間
に張設したばね若しくは基部に一体的に形成した
ばねによつて、夫々が独立的に、弾力的かつ上下
摺動自在に設置して構成した、特許請求の範囲第
１項記載のプリント基板のピン式接着剤転写ヘツ
ド。[Claims] 1. In an existing pin-type adhesive transfer head in which a plurality of pins are installed vertically at a set position on the lower surface of the head main body, that is, at a position symmetrical to the chip mounting pattern on the printed circuit board, A pin-type adhesive transfer head for a printed circuit board, characterized in that a plurality of pins are installed at set positions on the underside of the head body, and each pin is installed so that it can elastically and freely slide up and down using a spring provided for each pin. 2 A pin support plate is fixed to the lower surface of the hollow flat box-like body to form a head body, and the head of each pin is inserted into each pin insertion hole drilled at a set position on the pin support plate so as to be able to slide vertically. At the same time as protruding by a certain amount,
The hanging state is supported by the base, and each pin is supported by a spring provided for each pin, for example, a spring stretched between the base of each pin and the top plate, or a spring formed integrally with the base. 2. A pin-type adhesive transfer head for a printed circuit board according to claim 1, which is configured to be installed independently and resiliently and slidably up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9653982A JPS58213494A (en) | 1982-06-05 | 1982-06-05 | Pin adhesive transfer head for printed circuit board and method of transferring adhesive via same head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9653982A JPS58213494A (en) | 1982-06-05 | 1982-06-05 | Pin adhesive transfer head for printed circuit board and method of transferring adhesive via same head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58213494A JPS58213494A (en) | 1983-12-12 |
| JPS6348440B2 true JPS6348440B2 (en) | 1988-09-29 |
Family
ID=14167909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9653982A Granted JPS58213494A (en) | 1982-06-05 | 1982-06-05 | Pin adhesive transfer head for printed circuit board and method of transferring adhesive via same head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58213494A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285792A (en) * | 1985-06-12 | 1986-12-16 | ティーディーケイ株式会社 | Adhesive coating by pin transfer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5712783B2 (en) * | 1973-12-27 | 1982-03-12 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615828Y2 (en) * | 1980-06-26 | 1986-02-21 |
-
1982
- 1982-06-05 JP JP9653982A patent/JPS58213494A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5712783B2 (en) * | 1973-12-27 | 1982-03-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58213494A (en) | 1983-12-12 |
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