JPS6347644A - 水分センサー - Google Patents

水分センサー

Info

Publication number
JPS6347644A
JPS6347644A JP61189582A JP18958286A JPS6347644A JP S6347644 A JPS6347644 A JP S6347644A JP 61189582 A JP61189582 A JP 61189582A JP 18958286 A JP18958286 A JP 18958286A JP S6347644 A JPS6347644 A JP S6347644A
Authority
JP
Japan
Prior art keywords
sensor
heater
heat
temperature sensor
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61189582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523710B2 (enExample
Inventor
Hozumi Nita
二田　穂積
Satoru Mokude
杢出　悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP61189582A priority Critical patent/JPS6347644A/ja
Publication of JPS6347644A publication Critical patent/JPS6347644A/ja
Publication of JPH0523710B2 publication Critical patent/JPH0523710B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP61189582A 1986-08-14 1986-08-14 水分センサー Granted JPS6347644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61189582A JPS6347644A (ja) 1986-08-14 1986-08-14 水分センサー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61189582A JPS6347644A (ja) 1986-08-14 1986-08-14 水分センサー

Publications (2)

Publication Number Publication Date
JPS6347644A true JPS6347644A (ja) 1988-02-29
JPH0523710B2 JPH0523710B2 (enExample) 1993-04-05

Family

ID=16243738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61189582A Granted JPS6347644A (ja) 1986-08-14 1986-08-14 水分センサー

Country Status (1)

Country Link
JP (1) JPS6347644A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01142852U (enExample) * 1988-03-25 1989-09-29
JPH0214060U (enExample) * 1988-07-13 1990-01-29
US5142901A (en) * 1989-10-25 1992-09-01 Yazaki Corporation Specific heat based moisture sensor
US7465087B2 (en) * 2005-12-02 2008-12-16 Mamac Systems, Inc. Armoured flexible averaging temperature sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3497989B2 (ja) * 1998-04-16 2004-02-16 財団法人河川情報センター 湿潤度分布測定方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5017419U (enExample) * 1973-06-15 1975-02-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5017419U (enExample) * 1973-06-15 1975-02-25

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01142852U (enExample) * 1988-03-25 1989-09-29
JPH0214060U (enExample) * 1988-07-13 1990-01-29
US5142901A (en) * 1989-10-25 1992-09-01 Yazaki Corporation Specific heat based moisture sensor
US7465087B2 (en) * 2005-12-02 2008-12-16 Mamac Systems, Inc. Armoured flexible averaging temperature sensor

Also Published As

Publication number Publication date
JPH0523710B2 (enExample) 1993-04-05

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