JPS6345917U - - Google Patents

Info

Publication number
JPS6345917U
JPS6345917U JP11283087U JP11283087U JPS6345917U JP S6345917 U JPS6345917 U JP S6345917U JP 11283087 U JP11283087 U JP 11283087U JP 11283087 U JP11283087 U JP 11283087U JP S6345917 U JPS6345917 U JP S6345917U
Authority
JP
Japan
Prior art keywords
high dielectric
solder
laminated
dielectric chips
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11283087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11283087U priority Critical patent/JPS6345917U/ja
Publication of JPS6345917U publication Critical patent/JPS6345917U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Conductors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に従つたコンデンサ
内蔵型積層母線の概念的な一部切欠拡大平面図、
第2図は第1図のX―X線拡大断面図である。 1,2:帯状導体、3:セラミツク板、4:絶
縁性スペーサ、5:半田または半田クリーム、8
:絶縁性コーテイング層。
FIG. 1 is a conceptual partially cutaway enlarged plan view of a laminated bus bar with a built-in capacitor according to an embodiment of the present invention;
FIG. 2 is an enlarged sectional view taken along the line X--X of FIG. 1. 1, 2: Band-shaped conductor, 3: Ceramic plate, 4: Insulating spacer, 5: Solder or solder cream, 8
: Insulating coating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] それぞれ端子を突出形成した複数の帯状導体相
互間を絶縁して積層し、この積層体の外周を上記
端子を除いて絶縁被覆成形するようにした回路基
板用積層母線において、上記帯状導体相互間の絶
縁材としてセラミツク板からなる高誘電体チツプ
を多数個直接的に介装し、これら各高誘電体チツ
プと上記帯状導体相互間を半田又は半田クリーム
からなる導電部材で接合するように構成したこと
を特徴とするコンデンサ内蔵型積層母線。
In a laminated busbar for a circuit board, in which a plurality of band-shaped conductors each having a protruding terminal are insulated and laminated, and the outer periphery of the laminate is coated with insulation except for the terminals, A large number of high dielectric chips made of ceramic plates are directly interposed as an insulating material, and each of these high dielectric chips and the strip-shaped conductor are connected with a conductive member made of solder or solder cream. A multilayer bus bar with a built-in capacitor.
JP11283087U 1987-07-23 1987-07-23 Pending JPS6345917U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11283087U JPS6345917U (en) 1987-07-23 1987-07-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11283087U JPS6345917U (en) 1987-07-23 1987-07-23

Publications (1)

Publication Number Publication Date
JPS6345917U true JPS6345917U (en) 1988-03-28

Family

ID=30994073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11283087U Pending JPS6345917U (en) 1987-07-23 1987-07-23

Country Status (1)

Country Link
JP (1) JPS6345917U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096272A (en) * 2005-09-02 2007-04-12 Sanyo Electric Co Ltd Electric device and electric circuit
US8027146B2 (en) 2005-12-26 2011-09-27 Sanyo Electric Co., Ltd. Electric circuit device enabling impedance reduction

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096272A (en) * 2005-09-02 2007-04-12 Sanyo Electric Co Ltd Electric device and electric circuit
US8027146B2 (en) 2005-12-26 2011-09-27 Sanyo Electric Co., Ltd. Electric circuit device enabling impedance reduction

Similar Documents

Publication Publication Date Title
JPS6021451B2 (en) Laminated busbar with built-in capacitor
GB2142467A (en) High capacitance laminated bus and method of manufacture
JPS6345917U (en)
JPH0754874B2 (en) Multilayer printed wiring board
JPS6345916U (en)
JPS587609Y2 (en) laminated transformer
JPS59127311A (en) Condenser containing laminated bus
JPS6270473U (en)
JPS5924082Y2 (en) Insulated conductor for signal current
JPS5878315A (en) Condenser built-in type laminated bus
JPH031607U (en)
JPS642516U (en)
JPS5878317A (en) Laminated condenser built-in type laminated bus
JPS624125U (en)
JPS5878318A (en) Laminated condenser built-in type laminated bus
JPS5856415U (en) chip inductor
JPH0737206Y2 (en) Projection terminal type laminated bus bar
JPS6052664U (en) Power supply busbar for circuit board
JPH0189774U (en)
JPS61107611A (en) High electrostatic capacitance laminated bus
JPH0330315U (en)
JPS5878316A (en) Laminated condenser built-in type laminated bus
JPS63152223U (en)
JPS61119408U (en)
JPS6116413A (en) High capacitance laminated bus