JPS6344442U - - Google Patents

Info

Publication number
JPS6344442U
JPS6344442U JP1986137691U JP13769186U JPS6344442U JP S6344442 U JPS6344442 U JP S6344442U JP 1986137691 U JP1986137691 U JP 1986137691U JP 13769186 U JP13769186 U JP 13769186U JP S6344442 U JPS6344442 U JP S6344442U
Authority
JP
Japan
Prior art keywords
wire
rod
repair
spring
correction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986137691U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986137691U priority Critical patent/JPS6344442U/ja
Publication of JPS6344442U publication Critical patent/JPS6344442U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例１を示す縦断面図、第
２図は第１図のペレツト、ペレツト取付台、内部
リード、上板を取り除いた場合の平面図、第３図
ａ，ｂはワイヤーの横方向の修正方法を示す図、
第４図は本考案の実施例２の上下機構部を示す縦
断面図、第５図は同平面図、第６図は従来のワイ
ヤー修正装置のワイヤー支持部の斜視図である。 １……ペレツト、２……ペレツト取付台、３…
…ボンデイングワイヤー、４……内部リード、５
……修正桿、６，１０……ローラー、７……上板
、８……三角台、９……スライド棒、１１……基
台、１２，１５……調節ナツト、１３，１４……
バネ、１６……押し棒、１７……アーム、１８，
２６……取手、１９……支点、２０……球、２１
……円錐台、２２……スライド棒、２３……ジヨ
イント、２４……溝、２５……アーム。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤーボンデイング済半導体装置のボンデイ
    ングワイヤーを修正するワイヤー修正装置におい
    て、ボンデイングワイヤーを受け入れる溝を備え
    た修正桿と、該修正桿を必要な高さ位置に押し上
    げる上下機構と、該上下機構を修正桿の押し上げ
    方向に付勢するバネ機構と、該バネ機構のばね力
    を調整する機構とを有することを特徴とするワイ
    ヤー修正装置。
JP1986137691U 1986-09-08 1986-09-08 Pending JPS6344442U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986137691U JPS6344442U (ja) 1986-09-08 1986-09-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986137691U JPS6344442U (ja) 1986-09-08 1986-09-08

Publications (1)

Publication Number Publication Date
JPS6344442U true JPS6344442U (ja) 1988-03-25

Family

ID=31041983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986137691U Pending JPS6344442U (ja) 1986-09-08 1986-09-08

Country Status (1)

Country Link
JP (1) JPS6344442U (ja)

Similar Documents

Publication Publication Date Title
JPS6344442U (ja)
JPS63144464U (ja)
JPH0336393U (ja)
JPH01121699U (ja)
JPH0292929U (ja)
JPS6247664U (ja)
JPH0270777U (ja)
JPS60142558U (ja) Ｔｖセツトの上下移動装置
JPH02140849U (ja)
JPS6239421U (ja)
JPS623650U (ja)
JPS61102316U (ja)
JPS6329632U (ja)
JPH0369299U (ja)
JPH0369235U (ja)
JPS595960U (ja) ゴルフクラブの角度修正器
JPS6436459U (ja)
JPS6418417U (ja)
JPH0393403U (ja)
JPH0443246U (ja)
JPS5958586U (ja) 薄板プレス成形品の位置決め支持装置
JPH0449912U (ja)
JPH01150647U (ja)
JPH0295243U (ja)
JPS6349235U (ja)