JPS6343426U - - Google Patents
Info
- Publication number
- JPS6343426U JPS6343426U JP13451186U JP13451186U JPS6343426U JP S6343426 U JPS6343426 U JP S6343426U JP 13451186 U JP13451186 U JP 13451186U JP 13451186 U JP13451186 U JP 13451186U JP S6343426 U JPS6343426 U JP S6343426U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- opposing plate
- semiconductor manufacturing
- opposing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Description
第１図は本考案装置の１実施例の概略構成図で
ある。
２……ウエハ、１……ウエハ支持手段、３……
対向板、４……間隔制御手段、５……超音波発生
手段、６……貫流手段、７……液体供給手段。
FIG. 1 is a schematic diagram of one embodiment of the device of the present invention. 2...Wafer, 1...Wafer support means, 3...
Opposing plate, 4... Spacing control means, 5... Ultrasonic generation means, 6... Through-flow means, 7... Liquid supply means.
Claims (1)
持するウエハ支持手段と、該ウエハ支持手段に支
持されたウエハの他面に対向配置される該ウエハ
の他面全面を覆う対向面を有する対向板と、該対
向板の対向面と前記ウエハの他面との間隔を制御
するため前記ウエハ支持手段及び若しくは前記対
向板に関係付けられている間隔制御手段とを備え
てなる半導体製造装置。 (2) 前記対向板は超音波発生手段に機械的に結
合されていることを特徴とする実用新案登録請求
の範囲第(1)項記載の半導体製造装置。 (3) 前記超音波発生手段は温調水の貫流手段を
備えており該貫流手段は前記対向板を温度制御す
るように構成されていることを特徴とする実用新
案登録請求の範囲第(2)項記載の半導体製造装置
。 (4) 前記対向板は少なくとも１つの貫通孔を備
えており、該貫通孔には前記間隔内に流体を供給
する流体供給手段が関係付けられていることを特
徴とする実用新案登録請求の範囲第(1)項〜第(3)
項記載の半導体製造装置。[Claims for Utility Model Registration] (1) Wafer support means arranged opposite to one surface of the wafer and supporting the wafer, and the other surface of the wafer arranged opposite to the other surface of the wafer supported by the wafer support means. an opposing plate having an opposing surface covering the entire surface; and a spacing control means associated with the wafer support means and/or the opposing plate for controlling the distance between the opposing surface of the opposing plate and the other surface of the wafer. Semiconductor manufacturing equipment. (2) The semiconductor manufacturing apparatus according to claim (1), wherein the opposing plate is mechanically coupled to ultrasonic generating means. (3) Utility model registration claim No. 2, characterized in that the ultrasonic wave generating means is equipped with a temperature-controlled water flow-through means, and the flow-through means is configured to control the temperature of the opposing plate. ) The semiconductor manufacturing apparatus described in item 2. (4) The utility model registration claim characterized in that the opposing plate is provided with at least one through hole, and the through hole is associated with a fluid supply means for supplying fluid within the interval. Paragraphs (1) to (3)
Semiconductor manufacturing equipment as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13451186U JPS6343426U (en) | 1986-09-02 | 1986-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13451186U JPS6343426U (en) | 1986-09-02 | 1986-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343426U true JPS6343426U (en) | 1988-03-23 |
Family
ID=31035816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13451186U Pending JPS6343426U (en) | 1986-09-02 | 1986-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343426U (en) |
-
1986
- 1986-09-02 JP JP13451186U patent/JPS6343426U/ja active Pending
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