JPS634314B2 - - Google Patents
Info
- Publication number
- JPS634314B2 JPS634314B2 JP54158930A JP15893079A JPS634314B2 JP S634314 B2 JPS634314 B2 JP S634314B2 JP 54158930 A JP54158930 A JP 54158930A JP 15893079 A JP15893079 A JP 15893079A JP S634314 B2 JPS634314 B2 JP S634314B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- conductor
- injected
- molding method
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
【発明の詳細な説明】
本発明は、例えばゴムプラスチツク絶縁ケーブ
ルをモールド接続する場合に好適する注入樹脂の
モールド方法に係り、特に導体が適度に予熱され
た状態で樹脂を注入できるようになした注入樹脂
のモールド方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molding method for injecting resin, which is suitable for, for example, molding and connecting rubber-plastic insulated cables, and in particular, it is possible to inject the resin while the conductor is appropriately preheated. This invention relates to a molding method for injected resin.
一般に、架橋ポリエチレン絶縁ビニルシースケ
ーブル（以下CVケーブルという）の直線接続を
形成するに際しては、第１図に示されるように導
体接続部１外周を包被する注型用金型２内に押出
機３より絶縁組成物４を注入成型するいわゆるイ
ンジエクシヨンモールド方法が多用されている。
このインジエクシヨンモールド方法は、短時間で
モールド作業を行うことができ、また異物混入も
少ないため電気的に安定したモールド接続部を得
る工法として注目され、特に66kV級以上のモー
ルド接続工法としてその実用化が検討されてい
る。 Generally, when forming a straight connection of a cross-linked polyethylene insulated vinyl sheathed cable (hereinafter referred to as CV cable), an extruder 3 is placed in a casting mold 2 that covers the outer periphery of a conductor connection part 1, as shown in FIG. A so-called injection molding method in which the insulating composition 4 is injection molded is more frequently used.
This injection molding method is attracting attention as a method for obtaining electrically stable mold connections because it can perform molding work in a short time and has little foreign matter contamination, and is particularly popular as a mold connection method for 66kV class or higher. Practical application is being considered.
一方、インジエクシヨンモールド工法において
は、注入樹脂の流れを円滑化し、また金型内の
隅々にまで注入樹脂を密に充填させるようにする
ため、金型および接続すべき導体を予熱すること
が望まれ、樹脂注入が完了するまで樹脂温が低下
しないように配慮されることが望ましい。 On the other hand, in the injection molding method, the mold and the conductor to be connected must be preheated in order to smooth the flow of the injected resin and to ensure that the injected resin is densely filled into every corner of the mold. It is desirable that care be taken to prevent the resin temperature from decreasing until the resin injection is completed.
しかしながら、このようなインジエクシヨンモ
ールド工法においては、金型を予熱することは全
く問題ないが、導体を予熱することは電力ケーブ
ルの導体サイズが大きくなればなるほど、空気の
熱抵抗が高くなるので、極めて困難となり、もつ
てモールド成形に多くの時間を費やす不都合があ
る。さりながら、金型の温度を上げて導体を予熱
することは、ケーブルコア５，５′と金型２間の
樹脂をフローさせる部分の温度を過度に上昇さ
せ、ケーブルコアーの変形を招く恐れがある。 However, in this type of injection molding method, there is no problem in preheating the mold, but preheating the conductor is not recommended because the larger the conductor size of the power cable, the higher the thermal resistance of the air becomes. This is extremely difficult and requires a lot of time for molding. However, raising the temperature of the mold to preheat the conductor may excessively raise the temperature of the part where the resin flows between the cable cores 5, 5' and the mold 2, leading to deformation of the cable core. be.
本発明はこのような難点を解消すべくなされた
もので、電力ケーブルのサイズに関係なく、導体
接続部を短時間に予熱し金型内の隅々にまで注入
樹脂を充填し得るゴム、プラスチツク絶縁ケーブ
ルの接続方法を提供せんとするものである。 The present invention was made to solve these difficulties, and it is a rubber or plastic material that can preheat the conductor connection part in a short time and fill every corner of the mold with injection resin, regardless of the size of the power cable. The purpose is to provide a method for connecting insulated cables.
以下、本発明を一実施例の図面に基づいて説明
する。第１図と同一部分には同一番号を付した第
２，３図において、接続すべき一対のケーブル導
体６，６′をスリーブ７によつて圧縮接続した導
体接続部１は、例えば２分割の注型用金型２，
２′によつて包被され、該金型内には、押出機３
によつてエチレンプロピレンゴムやポリエチレン
等からなるポリオレフイン系の絶縁組成物４が注
入されるようにされている。 Hereinafter, the present invention will be explained based on the drawings of one embodiment. In FIGS. 2 and 3, in which the same parts as in FIG. Casting mold 2,
2', and within the mold there is an extruder 3
A polyolefin-based insulating composition 4 made of ethylene propylene rubber, polyethylene, etc. is injected by this method.
分割された金型２，２′の合わせ目には絶縁ス
ペーサー８，８′が介挿される。この絶縁スペー
サー８，８′は、後述するコイルに高周波電流を
流すことによつて金型自体が渦電流により発熱し
ないように、また、導体接続部１を磁気シールド
することがないようにするために設けられるもの
である。 Insulating spacers 8, 8' are inserted between the divided molds 2, 2'. These insulating spacers 8, 8' are used to prevent the mold itself from generating heat due to eddy current when a high frequency current is passed through the coil, which will be described later, and to prevent the conductor connection part 1 from being magnetically shielded. It is provided in
金型２，２′の外周には、コイル９が配設され、
この両端には高周波電源１０が接続される。コイ
ル９は金型自身に埋設させてもよい。 A coil 9 is arranged around the outer periphery of the molds 2 and 2'.
A high frequency power source 10 is connected to both ends of this. The coil 9 may be embedded in the mold itself.
本発明によれば、高周波磁界によつて導体接続
部に渦電流が流れるのでこれによつて前記導体接
続部が短時間に加熱される。一方、金型は絶縁ス
ペーサーを介して磁束を囲んでいるため渦電流が
流れず、従つて発熱することがなくまた内部導体
を磁気シールドすることもない。 According to the present invention, since an eddy current flows through the conductor connection portion due to the high frequency magnetic field, the conductor connection portion is heated in a short time. On the other hand, since the mold surrounds the magnetic flux via an insulating spacer, no eddy current flows, so no heat is generated, and the internal conductor is not magnetically shielded.
なお、金型は他の外部熱源を用いて独立に加熱
してもよい。 Note that the mold may be independently heated using another external heat source.
以上述べた本発明においては、導体サイズとは
無関係に、導体接続部を内外から適度に予熱した
状態で樹脂を円滑に注入でき、またコアーと金型
間シール部が過度に加熱する懸念もない。 In the present invention described above, the resin can be smoothly injected while the conductor connection part is appropriately preheated from the inside and outside, regardless of the conductor size, and there is no fear of excessive heating of the sealing part between the core and the mold. .
なお、前述の実施例においては、ケーブルの直
接線続部のモールド形成方法について述べてある
が、本発明はこれに限定されず、例えば、Ｙ字状
の丸棒導体上に絶縁体をモールド成形するいわゆ
るＹ分岐ユニツトやストツプ（油止め）ユニツト
等の各種モールドユニツトの製作に適用してもよ
い。 In addition, in the above-mentioned embodiment, a method of molding a direct connection part of a cable is described, but the present invention is not limited to this. For example, an insulator may be molded on a Y-shaped round bar conductor. The present invention may be applied to the production of various mold units such as so-called Y branch units and stop (oil stop) units.
第１図は従来におけるケーブル接続部のモール
ド形成方法を示す説明図、第２図は本発明におけ
るケーブル接続部のモールド形成方法を示す説明
図、第３図は本発明において使用する金型の横断
面図である。
１……導体接続部、２，２′……金型、４……
絶縁組成物、８，８′……絶縁スペーサー、９…
…コイル。
Fig. 1 is an explanatory diagram showing a conventional mold forming method for a cable connection part, Fig. 2 is an explanatory diagram showing a mold forming method for a cable connection part in the present invention, and Fig. 3 is a cross section of a mold used in the present invention. It is a front view. 1... Conductor connection part, 2, 2'... Mold, 4...
Insulating composition, 8, 8'... Insulating spacer, 9...
…coil.
Claims (1)
金型内に絶縁組成物を注入し、この絶縁組成物を
加熱成形する注入樹脂のモールド方法において、
前記の分割された金型の合わせ目間に絶縁スペー
サーが介挿され、該金型の外周に配設されたコイ
ルもしくは金型自身に埋設されたコイルに高周波
電流を通じることによつて前記導体を発熱させる
ことを特徴とする注入樹脂のモールド方法。 ２ 導体が、接続すべき一対の導体を圧縮接続し
た導体接続部である特許請求の範囲第１項記載の
注入樹脂のモールド方法。[Scope of Claims] 1. An injected resin molding method in which a conductor is covered with a mold divided in the axial direction, an insulating composition is injected into the mold, and the insulating composition is heated and molded,
An insulating spacer is inserted between the joints of the divided molds, and the conductor is heated by passing a high-frequency current through a coil arranged around the outer periphery of the mold or a coil embedded in the mold itself. A molding method for injected resin characterized by generating heat. 2. The method for molding an injected resin according to claim 1, wherein the conductor is a conductor connection portion in which a pair of conductors to be connected are compressed and connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15893079A JPS5682593A (en) | 1979-12-07 | 1979-12-07 | Method of molding filling resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15893079A JPS5682593A (en) | 1979-12-07 | 1979-12-07 | Method of molding filling resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5682593A JPS5682593A (en) | 1981-07-06 |
| JPS634314B2 true JPS634314B2 (en) | 1988-01-28 |
Family
ID=15682441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15893079A Granted JPS5682593A (en) | 1979-12-07 | 1979-12-07 | Method of molding filling resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5682593A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4920363B2 (en) * | 2006-10-12 | 2012-04-18 | 内浜化成株式会社 | Manufacturing method of insert molded product |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079770A (en) * | 1973-11-20 | 1975-06-28 |
-
1979
- 1979-12-07 JP JP15893079A patent/JPS5682593A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079770A (en) * | 1973-11-20 | 1975-06-28 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5682593A (en) | 1981-07-06 |
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