JPS6342561Y2 - - Google Patents
Info
- Publication number
- JPS6342561Y2 JPS6342561Y2 JP1982087255U JP8725582U JPS6342561Y2 JP S6342561 Y2 JPS6342561 Y2 JP S6342561Y2 JP 1982087255 U JP1982087255 U JP 1982087255U JP 8725582 U JP8725582 U JP 8725582U JP S6342561 Y2 JPS6342561 Y2 JP S6342561Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal piece
- circuit
- stripline
- circuit board
- stub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案は高周波回路調整器具、特に数百メガヘ
ルツ以上の高周波回路のインピーダンス整合用調
整器具に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a high frequency circuit adjustment device, particularly to a high frequency circuit adjustment device for impedance matching of high frequency circuits of several hundred megahertz or more.
従来、数百メガヘルツから10ギガヘルツまでの
動作領域でストリツプラインを用いた高周波回路
のインピーダンス整合を行う場合、回路基板上の
ストリツプラインにオープンスタブを形成して等
価的にスタブとアース部との間に静電容量を設
け、これによつて回路のインピーダンス整合を行
うことは周知の通りである。しかしこのように基
板上にストリツプラインおよびスタブを形成する
場合、両者はメタライズ技術とエツチング技術と
を用いて同時に形成されている。従つて、回路調
整に融通性をもたせるためには工程が複雑であつ
てもスタブはストリツプラインを形成した後に形
成し、回路調整時にピンセツト等の治工具で金属
片をストリツプラインに電気的に接続することに
よつてインピーダンス整合を行なつている。この
方法だと形状の異なる多数の金属片をあらかじめ
用意しなければならず、又ストリツプラインと金
属片との電気的接触がうまくいかず半田付けする
方法しかなかつた。このため多大な時間がかかる
わりには回路のインピーダンス整合が不正確であ
るという欠点があつた。 Conventionally, when performing impedance matching of high-frequency circuits using striplines in the operating range from several hundred megahertz to 10 gigahertz, an open stub is formed on the stripline on the circuit board, and the stub and the ground section are equivalently connected. It is well known that a capacitance is provided between the two and the impedance of the circuit is matched using this capacitance. However, when forming striplines and stubs on a substrate in this way, both are formed simultaneously using metallization technology and etching technology. Therefore, in order to provide flexibility in circuit adjustment, the stub should be formed after the stripline is formed, even if the process is complicated, and the metal piece should be electrically connected to the stripline using a jig such as tweezers during circuit adjustment. Impedance matching is performed by connecting the With this method, a large number of metal pieces of different shapes had to be prepared in advance, and the electrical contact between the stripline and the metal pieces was not good, so soldering was the only method available. This has the drawback that it takes a lot of time and impedance matching of the circuit is inaccurate.
本考案の目的は簡単な作業で正確なインピーダ
ンスが行なう治具を提供することにあり、スタブ
用の金属片と絶縁体より成る棒とを電気的絶縁体
であつて弾力性に富んだ材料（例えばゴム）を介
して接着材等の接続手段を用いて機械的に接続し
た構造の器具を用いて回路整合を容易にかつ迅速
に行うようにしたものである。 The purpose of the present invention is to provide a jig that allows accurate impedance measurement with simple work.The metal piece for the stub and the rod made of an insulator are made of a material that is an electrical insulator and has high elasticity ( For example, circuit matching can be easily and quickly performed using devices that are mechanically connected using a connecting means such as an adhesive material (for example, rubber).
本考案によれば大きさの異なる数種の金属片を
用いた高周波回路調整器具を作つておいて、回路
基板上のストリツプラインに金属片を押しあてて
電気的に接続することにより容易に回路基板上に
スタブが形成でき、かつ容易にスタブの位置を変
化させることもでき、又容量の値も変化させるこ
とができる。更に金属片と棒との間に弾力性のあ
る材料を用いているため金属片と棒とは常に直角
の以置に保つ必要はなく、棒と金属片との取付け
角度が自在に変化でき、それによつて金属片とス
トリツプラインとを最適の角度で接触することが
できる。 According to the present invention, a high frequency circuit adjustment device is made using several types of metal pieces of different sizes, and electrical connection can be easily made by pressing the metal pieces against the stripline on the circuit board. A stub can be formed on the circuit board, and the position of the stub can be easily changed, and the value of the capacitance can also be changed. Furthermore, since an elastic material is used between the metal piece and the rod, there is no need to always keep the metal piece and the rod at right angles, and the attachment angle between the rod and the metal piece can be changed freely. This allows contact between the metal piece and the stripline at an optimal angle.
本考案の器具を使つてインピーダンス整合の適
正点を見い出した後に同一形状の金属片に置きか
えればよいのでインピーダンス整合も容易に行な
うことができる。 Impedance matching can be easily accomplished by finding the appropriate point for impedance matching using the device of the present invention and then replacing it with a metal piece of the same shape.
以下図面に基づき本考案の一実施例を説明す
る。第１図は従来のオープンスタブを用いた回路
の構造図であり、回路基板１０３と該回路基板１
０３上に電気的良導体例えば銅箔により形成され
たストリツプライン１０２から成る高周波回路の
インピーダンス整合を行う場合、オープンスタブ
用の金属片１０１をピンセツト等の器具を使いス
トリツプライン１０２に電気的に接触させながら
回路基板上１０３を移動させ、整合条件に最適の
位置を見つけた後、金属片１０１と同形状の電気
的良導体と置きかえて半田付けをするという作業
を何回か行いながら回路を調整していた。このた
め金属片１０１の位置決めの際の移動の時間がか
かつたり、又ストリツプライン１０２上に金属片
１０１をのせるだけであるため電気的接触不良を
起こしていたりして調整に多大な時間がかかつて
いた。 An embodiment of the present invention will be described below based on the drawings. FIG. 1 is a structural diagram of a circuit using a conventional open stub, in which a circuit board 103 and a circuit board 1
When performing impedance matching of a high frequency circuit consisting of a stripline 102 formed of a good electrical conductor such as copper foil on the stripline 102, a metal piece 101 for an open stub is electrically connected to the stripline 102 using a tool such as tweezers. After moving the circuit board 103 while making contact and finding the optimal position for matching conditions, adjust the circuit by replacing it with a good electrical conductor of the same shape as the metal piece 101 and soldering it several times. Was. For this reason, it takes time to move the metal piece 101 when positioning it, and since the metal piece 101 is simply placed on the stripline 102, electrical contact may occur, resulting in a large amount of time for adjustment. He was stiff.
第２図は本考案による高周波回路調整器具を用
いた回路の構造図である。回路基板２０３と該回
路基板２０３上に電気的良導体例えば銅箔により
形成されたストリツプライン２０２から成る高周
波回路のインピーダンス整合を行なう場合、オー
プンスタブ用の金属片２０１と電気的に低誘電
率、低損失である程度の機械的強度をもつた絶縁
材料から成る金属片移動用支持棒２０４（例えば
竹串等）とを弾力性のある絶縁材料（例えばゴム
等）の仲介支持物２０５によつて機械的に接着固
定する。該金属片移動用支持棒２０４を手で自由
に移動してやることにより金属片２０１を回路基
板２０３上のストリツプライン２０２に確実に接
触しつつ回路調整を行なう。この結果、金属片移
動用支持棒２０４により金属片２０１をストリツ
プライン２０２上に押しあてることにより仲介支
持物２０５の弾性力により支持棒２０４が常に回
路基板２０３と直角状態を保たなくとも最適の角
度で確実に電気的接触を保つことができる。更に
作業は簡単で、最適整合位置を見つけた後金属片
２０１と同一形状の電気的良導体と置き換えて半
田付けを行なえば極めて案に完全な整合をとるこ
とができる。 FIG. 2 is a structural diagram of a circuit using the high frequency circuit adjustment device according to the present invention. When performing impedance matching of a high frequency circuit consisting of a circuit board 203 and a strip line 202 formed on the circuit board 203 using an electrically conductive material such as copper foil, a metal piece 201 for an open stub and a strip line 202 having a low dielectric constant, A metal piece moving support rod 204 (for example, a bamboo skewer, etc.) made of an insulating material with low loss and a certain degree of mechanical strength is mechanically moved by an intermediary support 205 made of an elastic insulating material (for example, rubber, etc.). Glue and fix. By freely moving the metal piece moving support rod 204 by hand, the metal piece 201 is brought into reliable contact with the strip line 202 on the circuit board 203 while circuit adjustment is performed. As a result, by pressing the metal piece 201 onto the stripline 202 using the support rod 204 for moving the metal piece, the elastic force of the intermediary support 205 allows the support rod 204 to be optimized even if it does not always remain perpendicular to the circuit board 203. Electrical contact can be maintained reliably at this angle. Further, the work is simple, and after finding the optimum matching position, replacing the metal piece 201 with a good electrical conductor of the same shape and soldering it can achieve perfect matching.
第１図は、従来のオープンスタブ用金属片を用
いた回路の構造図、第２図は本考案による器具を
用いた一実施例を示す回路の構造図である。
１０１，２０１……金属片、１０２，２０２…
…ストリツプライン、１０３，２０３……回路基
板、２０４……金属片移動用支持棒、２０５……
仲介支持物。
FIG. 1 is a structural diagram of a circuit using a conventional open stub metal piece, and FIG. 2 is a structural diagram of a circuit showing an embodiment using a device according to the present invention. 101,201...metal piece, 102,202...
...Stripline, 103, 203...Circuit board, 204...Support rod for moving metal piece, 205...
Intermediate support.
Claims (1)
なる仲介支持物を介して接続し、前記金属片がス
トリツプ線路上をスタブとして移動可能なように
したことを特徴とする高周波回路調整器具。 A high frequency circuit adjustment device characterized in that an insulating rod and a metal piece are connected via an intermediary support made of an elastic insulating material, and the metal piece is movable as a stub on a strip line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8725582U JPS58189603U (en) | 1982-06-11 | 1982-06-11 | High frequency circuit adjustment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8725582U JPS58189603U (en) | 1982-06-11 | 1982-06-11 | High frequency circuit adjustment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58189603U JPS58189603U (en) | 1983-12-16 |
| JPS6342561Y2 true JPS6342561Y2 (en) | 1988-11-08 |
Family
ID=30095981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8725582U Granted JPS58189603U (en) | 1982-06-11 | 1982-06-11 | High frequency circuit adjustment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189603U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07114322B2 (en) * | 1987-02-04 | 1995-12-06 | 株式会社村田製作所 | Circuit pattern determination method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5020403A (en) * | 1973-06-26 | 1975-03-04 |
-
1982
- 1982-06-11 JP JP8725582U patent/JPS58189603U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5020403A (en) * | 1973-06-26 | 1975-03-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58189603U (en) | 1983-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4266206A (en) | Stripline filter device | |
| AU6035186A (en) | Apparatus for making scribed circuit boards and circuit board modifications | |
| JP3279589B2 (en) | Printed wiring board | |
| US4686463A (en) | Microwave probe fixture | |
| JPS6342561Y2 (en) | ||
| USRE31470E (en) | Stripline filter device | |
| US3468018A (en) | Production of circuits | |
| US4837524A (en) | Lower-noise microwave amplifying circuit | |
| US4897601A (en) | Test fixture for integrated circuit chips | |
| WO1988008660A1 (en) | Power circuit board and manufacturing method | |
| JPH0547453Y2 (en) | ||
| JPH07326909A (en) | Microwave matching circuit | |
| JPS59117801A (en) | Microstrip circuit | |
| JP2003294793A (en) | Inductor measuring tool for electronic part and its method | |
| JP3008520U (en) | Antenna unit | |
| JPH0536772A (en) | Jig for high-frequency characteristic measuring | |
| JPS5941602Y2 (en) | microstrip circuit | |
| JPH0726863Y2 (en) | Hybrid integrated circuit | |
| JPS622819Y2 (en) | ||
| KR820002288B1 (en) | Printed circuit and method their manufacture | |
| JPH06268416A (en) | Impedance adjusting circuit | |
| JP2561473Y2 (en) | Dielectric resonator | |
| JPS61109302A (en) | Adjusting method of microstrip line | |
| JPH07176403A (en) | Thick film circuit and manufacture therefor | |
| JPS6083401A (en) | Microwave circuit |