JPS633915A - Manufacture of terminal base - Google Patents
Manufacture of terminal baseInfo
- Publication number
- JPS633915A JPS633915A JP14773686A JP14773686A JPS633915A JP S633915 A JPS633915 A JP S633915A JP 14773686 A JP14773686 A JP 14773686A JP 14773686 A JP14773686 A JP 14773686A JP S633915 A JPS633915 A JP S633915A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- base
- resin base
- insert
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims abstract description 9
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 5
- 239000000057 synthetic resin Substances 0.000 claims abstract description 5
- 238000009832 plasma treatment Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000003851 corona treatment Methods 0.000 abstract description 4
- 230000004907 flux Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 208000028659 discharge Diseases 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
- B29C2045/14885—Pretreatment of the insert, e.g. etching, cleaning by plasma treatment
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の分野］
この発明は、端子を合成樹脂製ベースにインサート成形
する端子ベースの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a method of manufacturing a terminal base by insert molding a terminal into a synthetic resin base.
［従来技術とその問題点］
従来、金属製端子は金型のキャビティ内に固定した状態
で、溶融樹脂を射出し、端子を樹脂製ベースにインサー
ト成形していた。[Prior Art and its Problems] Conventionally, metal terminals were fixed in a mold cavity, and then molten resin was injected to insert mold the terminals into a resin base.
しかし、このような従来の端子ベースの製造方法によれ
ば、成形後に金属と樹脂との熱収縮差、インサートされ
た端子の曲げ、切断加工等によって、端子とベースとの
接合面に微少な隙間が生じていた。However, according to such conventional terminal base manufacturing methods, minute gaps may be created at the bonding surface between the terminal and the base due to differences in thermal shrinkage between the metal and resin, bending of the inserted terminal, cutting process, etc. after molding. was occurring.
そのため、端子の半田付は時に発生するフラックスなど
の腐食性溶剤が上記の隙間からベースの内側に浸入して
、接点機構に付着し、接点の腐食や接触抵抗の増加など
を招く欠点があった。また、製品の洗浄時に、その洗浄
液が製品の内部に浸入するなどの欠点があった。Therefore, when soldering terminals, corrosive solvents such as flux that are sometimes generated enter the inside of the base through the above-mentioned gaps and adhere to the contact mechanism, resulting in corrosion of the contacts and an increase in contact resistance. . Further, there is a drawback that when cleaning the product, the cleaning liquid infiltrates into the interior of the product.
そこで、従来、端子のインサート部に接着剤を塗布して
硬化させ、上記隙間を封止する手段が採られていたが、
この場合は、接着剤の塗布、硬化の工程が増えるのみな
らず、そのような接着剤の塗布、硬化は連続処理が困難
でどうしてもノくツチ処理となるため、生産性が低く、
成形コストがＥ昇する欠点があり、また接着剤が人体に
有害な溶剤を含んでいるとか、ガスを発生するなどの作
業環境の悪化を招く欠点があった。Therefore, conventional methods have been taken to seal the gap by applying adhesive to the insert part of the terminal and curing it.
In this case, not only does the process of applying and curing the adhesive increase, but the process of applying and curing the adhesive is difficult to perform continuously and requires continuous processing, resulting in low productivity.
It has the disadvantage that the molding cost increases by E, and the adhesive contains a solvent harmful to the human body and generates gas, which worsens the working environment.
［発明の目的］
この発明は上記欠点を解決するためになされたもので、
成形前の簡単な表面改質処理によって、端子と合成樹脂
製ベースとのシール性を向上させることができるととも
に、生産性および作業環境のよい端子ベースの製造方法
を提供することを目的する。[Object of the invention] This invention was made to solve the above-mentioned drawbacks,
It is an object of the present invention to provide a method for manufacturing a terminal base that can improve the sealing properties between a terminal and a synthetic resin base by a simple surface modification treatment before molding, and that also provides good productivity and a good working environment.
［発明の構成と効果］
この発明に係る端子ベースの製造方法は、インサート成
形前に、端子のインサート部に静電気放電などのプラズ
マ処理を行なうことを特徴とする。[Configuration and Effects of the Invention] The method for manufacturing a terminal base according to the present invention is characterized in that, before insert molding, the insert portion of the terminal is subjected to plasma treatment such as electrostatic discharge.
この発明によれば、端子のインサート部にプラズマ処理
を施すことにより、端子とベースとのシール性を向上さ
せることができ、半田フラックスなどの溶剤や洗浄液の
浸入を有効に防止することができるとともに、接点の腐
食等の不良品の発生が防止できる。しかも、溶剤を含有
する接着剤の使用が不要であるから、生産性の向上、成
形コストの低減が図れ、かつ作業環境の改善にも効果が
ある。According to this invention, by subjecting the insert portion of the terminal to plasma treatment, it is possible to improve the sealing performance between the terminal and the base, and it is possible to effectively prevent the infiltration of solvents such as solder flux and cleaning liquid. , the occurrence of defective products such as corrosion of contacts can be prevented. Moreover, since it is not necessary to use an adhesive containing a solvent, productivity can be improved, molding costs can be reduced, and the working environment can be improved.
［実施例の説明］ 以下、この発明の実施例を図面にしたがって説明する。[Explanation of Examples] Embodiments of the present invention will be described below with reference to the drawings.
第１図はこの発明に係る製造方法を説明するための端子
ベースの一例を示し、１はフラットな金属製端子であっ
て、その外表面全域に静電気放電などのプラズマ処理を
成形前処理として行なうことにより、この端子ｌの表面
を改質してその接着性の向上が図られる。FIG. 1 shows an example of a terminal base for explaining the manufacturing method according to the present invention, in which 1 is a flat metal terminal, the entire outer surface of which is subjected to plasma treatment such as electrostatic discharge as a pre-molding treatment. By doing so, the surface of this terminal l is modified and its adhesiveness is improved.
上述のプラズマ処理の具体例として、第２図で示すよう
に、上記端子１を平板状のカウンター電極４上に固定し
、その上に配置したワイヤー電極５を端子１の一端側か
ら他端側に向けて移動させることによりコロナ放電処理
が行なわれる。その場合、上記コロナ放電処理は上記端
子１の表裏両面について行なわれる。As a specific example of the above-mentioned plasma treatment, as shown in FIG. 2, the terminal 1 is fixed on a flat counter electrode 4, and the wire electrode 5 placed thereon is moved from one end of the terminal 1 to the other end. Corona discharge treatment is performed by moving the specimen toward the target. In that case, the corona discharge treatment is performed on both the front and back surfaces of the terminal 1.
その後、上記端子１を金型のキャビティ内の所定位置に
固定保持した状態で、溶融樹脂を射出して、樹脂製ベー
ス２を成形することにより、インサート部３のシール性
に優れ、半田フラックスや洗浄液等の浸入を防止するこ
とができる端子ベースを得る。なお、上記プラズマ処理
のための放電処理例としては、上記の内電極４．５をと
もに固定して端子ｌを移動させる方法や上記ワイヤー電
極５をポール電極、ローラー電極、ピン電極、スプリッ
ト電極等の他の電極に変更するとか、上記カウンター電
極４を使用しない方法も可能である。After that, with the terminal 1 fixed and held at a predetermined position in the cavity of the mold, molten resin is injected to form the resin base 2, which provides excellent sealing properties of the insert part 3, and solder flux or To obtain a terminal base capable of preventing infiltration of cleaning liquid and the like. Examples of discharge treatment for the plasma treatment include a method in which the inner electrodes 4 and 5 are fixed together and the terminal l is moved, and a method in which the wire electrode 5 is used as a pole electrode, a roller electrode, a pin electrode, a split electrode, etc. It is also possible to change to another electrode or to not use the counter electrode 4.
また、コロナ放電以外、ストリーマ放電、火花放電、沿
面放電などの静電気放電であっても、グロー放電等のプ
ラズマ処理を利用してもよい。In addition to corona discharge, electrostatic discharge such as streamer discharge, spark discharge, and creeping discharge may be used, and plasma treatment such as glow discharge may be used.
さらに、第３図で示すように、上記端子１のインサート
部３に凹凸部６を施してプラズマ処理することにより、
−足面積の端子１における表面改質面積を十分に大きく
して、インサート部３のシール性を一層向上させること
ができる。Furthermore, as shown in FIG. 3, by forming an uneven portion 6 on the insert portion 3 of the terminal 1 and subjecting it to plasma treatment,
- The surface-modified area of the terminal 1 of the foot area can be made sufficiently large to further improve the sealing performance of the insert part 3.
第１図はこの発明に係る製造方法を説明するための端子
ベースの一例を示す斜視図、＠２図は端子の放電処理の
−・例を説明するための斜視図、第３図はこの発明に係
る製造方法を説明するための端子の他の例を示す要部の
斜視図である。
ｌ・・・端子、２・・・ベース、３・・・インサート部
、４．５・・・放電電極、６・・・凹凸部。
第１図
第２図
第３図
ら
１・請仔
３・スシサー１−衣寥
４．５°放電亀肩に
６：ｆ！！］凸部Fig. 1 is a perspective view showing an example of a terminal base for explaining the manufacturing method according to the present invention, Fig. 2 is a perspective view showing an example of terminal discharge treatment, and Fig. 3 is a perspective view showing an example of the terminal base. It is a perspective view of the principal part which shows other examples of a terminal for explaining the manufacturing method concerning this. l...Terminal, 2...Base, 3...Insert part, 4.5...Discharge electrode, 6...Irregular part. Figure 1 Figure 2 Figure 3 Ra 1, Ukeko 3, Sushisa 1-Kiho 4.5° discharge to the shoulder 6: f! ! ]Protrusion
Claims (2)
子ベースの製造方法において、上記インサート成形前に
、上記端子のインサート部に静電気放電などのプラズマ
処理を行なうことを特徴とする端子ベースの製造方法。(1) A method for manufacturing a terminal base in which a terminal is insert-molded into a synthetic resin base, characterized in that, before the insert molding, the insert portion of the terminal is subjected to plasma treatment such as electrostatic discharge. .
の凹凸部にプラズマ処理を行なう特許請求の範囲第１項
記載の端子ベースの製造方法。(2) The method for manufacturing a terminal base according to claim 1, wherein after forming an uneven portion on the insert portion of the terminal, plasma treatment is performed on the uneven portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14773686A JPS633915A (en) | 1986-06-24 | 1986-06-24 | Manufacture of terminal base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14773686A JPS633915A (en) | 1986-06-24 | 1986-06-24 | Manufacture of terminal base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633915A true JPS633915A (en) | 1988-01-08 |
Family
ID=15436981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14773686A Pending JPS633915A (en) | 1986-06-24 | 1986-06-24 | Manufacture of terminal base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633915A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0684565A (en) * | 1992-07-13 | 1994-03-25 | Yazaki Corp | Connector seal structure and manufacture thereof |
| FR2718574A1 (en) * | 1994-04-12 | 1995-10-13 | Vagnone Boeri Srl | Method of sealing an electrical connector and connector thus obtained. |
| WO2004103680A1 (en) * | 2003-05-23 | 2004-12-02 | Krauss-Maffei Kunststofftechnik Gmbh | Production of hybrid components by insert injection moulding, using plasma-treated inserts |
| JP2011140167A (en) * | 2010-01-07 | 2011-07-21 | Toyoda Gosei Co Ltd | Method for manufacturing composite of metal and resin |
-
1986
- 1986-06-24 JP JP14773686A patent/JPS633915A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0684565A (en) * | 1992-07-13 | 1994-03-25 | Yazaki Corp | Connector seal structure and manufacture thereof |
| FR2718574A1 (en) * | 1994-04-12 | 1995-10-13 | Vagnone Boeri Srl | Method of sealing an electrical connector and connector thus obtained. |
| WO2004103680A1 (en) * | 2003-05-23 | 2004-12-02 | Krauss-Maffei Kunststofftechnik Gmbh | Production of hybrid components by insert injection moulding, using plasma-treated inserts |
| JP2011140167A (en) * | 2010-01-07 | 2011-07-21 | Toyoda Gosei Co Ltd | Method for manufacturing composite of metal and resin |
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