JPS6338355U - - Google Patents
Info
- Publication number
- JPS6338355U JPS6338355U JP1986130321U JP13032186U JPS6338355U JP S6338355 U JPS6338355 U JP S6338355U JP 1986130321 U JP1986130321 U JP 1986130321U JP 13032186 U JP13032186 U JP 13032186U JP S6338355 U JPS6338355 U JP S6338355U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- peltier element
- peltier
- cooling
- laser module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986130321U JPS6338355U (US06174465-20010116-C00003.png) | 1986-08-28 | 1986-08-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986130321U JPS6338355U (US06174465-20010116-C00003.png) | 1986-08-28 | 1986-08-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6338355U true JPS6338355U (US06174465-20010116-C00003.png) | 1988-03-11 |
Family
ID=31027706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986130321U Pending JPS6338355U (US06174465-20010116-C00003.png) | 1986-08-28 | 1986-08-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6338355U (US06174465-20010116-C00003.png) |
-
1986
- 1986-08-28 JP JP1986130321U patent/JPS6338355U/ja active Pending