JPS6338338U - - Google Patents
Info
- Publication number
- JPS6338338U JPS6338338U JP1986129488U JP12948886U JPS6338338U JP S6338338 U JPS6338338 U JP S6338338U JP 1986129488 U JP1986129488 U JP 1986129488U JP 12948886 U JP12948886 U JP 12948886U JP S6338338 U JPS6338338 U JP S6338338U
- Authority
- JP
- Japan
- Prior art keywords
- cooling liquid
- liquid chamber
- heating element
- chamber
- stud
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005192 partition Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 238000009835 boiling Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986129488U JPS6338338U (enrdf_load_stackoverflow) | 1986-08-27 | 1986-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986129488U JPS6338338U (enrdf_load_stackoverflow) | 1986-08-27 | 1986-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6338338U true JPS6338338U (enrdf_load_stackoverflow) | 1988-03-11 |
Family
ID=31026100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986129488U Pending JPS6338338U (enrdf_load_stackoverflow) | 1986-08-27 | 1986-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6338338U (enrdf_load_stackoverflow) |
-
1986
- 1986-08-27 JP JP1986129488U patent/JPS6338338U/ja active Pending