JPS6338334U - - Google Patents

Info

Publication number
JPS6338334U
JPS6338334U JP1986130952U JP13095286U JPS6338334U JP S6338334 U JPS6338334 U JP S6338334U JP 1986130952 U JP1986130952 U JP 1986130952U JP 13095286 U JP13095286 U JP 13095286U JP S6338334 U JPS6338334 U JP S6338334U
Authority
JP
Japan
Prior art keywords
recess
integrated circuit
conductive pattern
circuit chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986130952U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986130952U priority Critical patent/JPS6338334U/ja
Publication of JPS6338334U publication Critical patent/JPS6338334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/682—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP1986130952U 1986-08-27 1986-08-27 Pending JPS6338334U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986130952U JPS6338334U (cg-RX-API-DMAC10.html) 1986-08-27 1986-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986130952U JPS6338334U (cg-RX-API-DMAC10.html) 1986-08-27 1986-08-27

Publications (1)

Publication Number Publication Date
JPS6338334U true JPS6338334U (cg-RX-API-DMAC10.html) 1988-03-11

Family

ID=31028945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986130952U Pending JPS6338334U (cg-RX-API-DMAC10.html) 1986-08-27 1986-08-27

Country Status (1)

Country Link
JP (1) JPS6338334U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283883A (ja) * 1988-05-10 1989-11-15 Matsushita Electric Ind Co Ltd 発光ダイオードおよびその電極の形成方法
DE112017002421T5 (de) 2016-05-12 2019-01-24 Mitsubishi Electric Corporation Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283883A (ja) * 1988-05-10 1989-11-15 Matsushita Electric Ind Co Ltd 発光ダイオードおよびその電極の形成方法
DE112017002421T5 (de) 2016-05-12 2019-01-24 Mitsubishi Electric Corporation Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit
US10741413B2 (en) 2016-05-12 2020-08-11 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device

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