JPS6333504B2 - - Google Patents
Info
- Publication number
- JPS6333504B2 JPS6333504B2 JP4588380A JP4588380A JPS6333504B2 JP S6333504 B2 JPS6333504 B2 JP S6333504B2 JP 4588380 A JP4588380 A JP 4588380A JP 4588380 A JP4588380 A JP 4588380A JP S6333504 B2 JPS6333504 B2 JP S6333504B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- resin
- prepolymer
- epoxy
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004643 cyanate ester Substances 0.000 claims description 25
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000011342 resin composition Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 11
- 229920002857 polybutadiene Polymers 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- -1 4-cyanatophenyl Chemical group 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical group C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 150000001913 cyanates Chemical class 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- HMHLDAMOJGEOMQ-UHFFFAOYSA-N (1-cyanato-4-phenylcyclohexa-2,4-dien-1-yl) cyanate Chemical group C1=CC(OC#N)(OC#N)CC=C1C1=CC=CC=C1 HMHLDAMOJGEOMQ-UHFFFAOYSA-N 0.000 description 1
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- YDCUTCGACVVRIQ-UHFFFAOYSA-N (3,6-dicyanatonaphthalen-1-yl) cyanate Chemical compound N#COC1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 YDCUTCGACVVRIQ-UHFFFAOYSA-N 0.000 description 1
- QQZZMAPJAKOSNG-UHFFFAOYSA-N (3-cyanatophenyl) cyanate Chemical compound N#COC1=CC=CC(OC#N)=C1 QQZZMAPJAKOSNG-UHFFFAOYSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- AJRXLFLENHFSKO-ZOKJKDLISA-H (Z)-but-2-enedioate dibutyltin(2+) tin(4+) Chemical compound [Sn+4].[O-]C(=O)\C=C/C([O-])=O.[O-]C(=O)\C=C/C([O-])=O.[O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC AJRXLFLENHFSKO-ZOKJKDLISA-H 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XOJRVZIYCCJCRD-UHFFFAOYSA-N 1-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1OC1=CC=C(N2C(C=CC2=O)=O)C=C1 XOJRVZIYCCJCRD-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- GEEGPFGTMRWCID-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylbutane-1,1-diamine Chemical compound CCCC(N(C)C)N(C)C GEEGPFGTMRWCID-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- WFNVGXBEWXBZPL-UHFFFAOYSA-N 3,5-diaminophenol Chemical compound NC1=CC(N)=CC(O)=C1 WFNVGXBEWXBZPL-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- CJXRYVQHINFIKO-UHFFFAOYSA-N 4-[1-(4-aminophenyl)-1-phenylethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C=1C=CC(N)=CC=1)(C)C1=CC=CC=C1 CJXRYVQHINFIKO-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- KIMCSKCETOAMBU-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dibromophenyl)propan-2-yl]-2,6-dibromoaniline Chemical compound C=1C(Br)=C(N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(N)C(Br)=C1 KIMCSKCETOAMBU-UHFFFAOYSA-N 0.000 description 1
- UBKRDXUXTYBRHS-UHFFFAOYSA-N 4-[2-(4-amino-3-methylphenyl)propan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=CC=2)=C1 UBKRDXUXTYBRHS-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- ZTKDMNHEQMILPE-UHFFFAOYSA-N 4-methoxy-n,n-dimethylaniline Chemical compound COC1=CC=C(N(C)C)C=C1 ZTKDMNHEQMILPE-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- GXFRMDVUWJDFAI-UHFFFAOYSA-N [2,6-dibromo-4-[2-(3,5-dibromo-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Br)=C(OC#N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OC#N)C(Br)=C1 GXFRMDVUWJDFAI-UHFFFAOYSA-N 0.000 description 1
- YKONYNBAMHVIMF-UHFFFAOYSA-N [2,6-dichloro-4-[2-(3,5-dichloro-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Cl)=C(OC#N)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(OC#N)C(Cl)=C1 YKONYNBAMHVIMF-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- SNYVZKMCGVGTKN-UHFFFAOYSA-N [4-(4-cyanatophenoxy)phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OC1=CC=C(OC#N)C=C1 SNYVZKMCGVGTKN-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- AUYQDAWLRQFANO-UHFFFAOYSA-N [4-[(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1CC1=CC=C(OC#N)C=C1 AUYQDAWLRQFANO-UHFFFAOYSA-N 0.000 description 1
- PPZSVSGWDQKBIW-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphanyloxyphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OP(OC=1C=CC(OC#N)=CC=1)OC1=CC=C(OC#N)C=C1 PPZSVSGWDQKBIW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical class OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- BOTLEXFFFSMRLQ-UHFFFAOYSA-N cyclopentyloxycyclopentane Chemical compound C1CCCC1OC1CCCC1 BOTLEXFFFSMRLQ-UHFFFAOYSA-N 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 150000002825 nitriles Chemical group 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-M oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC([O-])=O ZQPPMHVWECSIRJ-KTKRTIGZSA-M 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 125000005590 trimellitic acid group Chemical class 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は接着性、可撓性、耐熱性、低温硬化可
能などにすぐれた新規なシアン酸エステル系の硬
化性樹脂組成物に関し、詳しくはa多官能性シア
ン酸エステル、該シアン酸エステルプレポリマー
或いは該シアン酸エステルとアミンとのプレポリ
マー、または前記aとb多官能性マレイミド、該
マレイミドプレポリマー或いは該マレイミドとア
ミンとのプレポリマー又はcエポキシ樹脂とを混
合または予備反応させてなる硬化性樹脂組成物
()において、ブタジエン系樹脂()および
下記一般式(3)で表されるアクリル酸エポキシエス
テル或いは該アクリル酸エポキシエステルプレポ
リマー()を、成分()30〜95重量%、成分
()2.5〜50重量%および成分()2.5〜50重
量%となる量で配合してなる硬化性樹脂組成物で
ある。
一般式(3):
(式中のRは、水素原子又はメチル基を示す)。
本発明の硬化性樹脂組成物()は、特公昭41
−1928号公報(a成分)、同46−41112(a+cの
組成物)、同54−30440(a+bの組成物)、同52−
31279(a+b+cの組成物)、その他により公知
であり、又、耐熱性、耐薬品性、接着性、電気特
性等、種々の物性においてすぐれたものであり、
実用化されているが、可撓性などの点に劣るとい
う欠点があつた。又、アクリル酸エポキシエステ
ルもしくはメタクリル酸のエポキシエステル或い
は該エポキシエステルのプレポリマー()の硬
化物はもろく、可撓性に劣り、耐熱性も不十分で
あつた。
本発明者らは、シアン酸エステル系樹脂組成物
の特性を生かした改良に関し鋭意研究をした結
果、接着性、可撓性、耐熱性、より低温で硬化可
能な新規な硬化性樹脂組成物を見いだし本発明を
完成させた。
以下、本発明の構成成分等について説明する。
まず、本発明のシアン酸エステル系樹脂組成物
()とは、前記の如く、a成分を必須とし、b
またはc成分を適宜用いてなるものである。必須
成分aである多官能性シアン酸エステルとは2個
以上のシアン酸エステル基を有する有機化合物で
あり、好適なシアン酸エステルは下記一般式
R(−O−C≡N)m …(1)
〔式中のmは2以上、通常5以下の整数であり
Rは芳香族性の有機基であつて、上記シアン酸エ
ステル基は該有機基Rの芳香環に結合しているも
の〕
で表わされる化合物である。具体的に例示すれば
1,3−または1,4−ジシアナートベンゼン、
1,3,5−トリシアナートベンゼン、1,3
−,1,4−,1,6−,1,8−,2,6−ま
たは2,7−ジシアナートナフタレン、1,3,
6−トリシアナートナフタレン、4,4−ジシア
ナートビフエニル、ビス(4−シアナートフエニ
ル)メタン、2,2−ビス(4−シアナートフエ
ニル)プロパン、2,2−ビス(3,5−ジクロ
ロ−4−シアナートフエニル)プロパン、2,2
−ビス(3,5−ジブロモ−4−シアナートフエ
ニル)プロパン、ビス(4−シアナートフエニ
ル)エーテル、ビス(4−シアナートフエニル)
チオエーテル、ビス(4−シアナートフエニル)
スルホン、トリス(4−シアナートフエニル)ホ
スフアイト、トリス(4−シアナートフエニル)
ホスフエート、およびノボラツクとハロゲン化シ
アンとの反応により得られるシアン酸エステルな
どである。これらの他に特公昭41−1928、特公昭
43−18468、特公昭44−4791、特公昭45−11712、
特公昭46−41112、特公昭47−26853および特開昭
51−63149などに記載のシアン酸エステルも用い
うる。
又、上述した多官能性シアン酸エステルを、鉱
酸、ルイス酸、炭酸ナトリウム或いは塩化リチウ
ム等の塩類、トリブチルホスフイン等のリン酸エ
ステル類等の触媒の存在下に重合させて得られる
プレポリマーとして用いる事ができる。これらの
プレポリマーは、前記シアン酸エステル中のシア
ン基が三量化する事によつて形成されるsym−ト
リアジン環を、一般に分子中に有している。本発
明においては、平均分子量400〜6000の前記プレ
ポリマーを用いるのが好ましい。
更に、上記した多官能性シアン酸エステルはア
ミンとのプレモリマーの形でも使用できる。好適
に用いうるアミンを例示すれば、メタまたはパラ
フエニレンジアミン、メタまたはパラキシリレン
ジアミン、1,4−または1,3−シクロヘキサ
ンジアミン、ヘキサヒドロキシリレンジアミン、
4,4′−ジアミノビフエニル、ビス(4−アミノ
フエニル)メタン、ビス(4−アミノフエニル)
エーテル、ビス(4−アミノフエニル)スルホ
ン、ビス(4−アミノ−3−メチルフエニル)メ
タン、ビス(4−アミノ−3,5−ジメチルフエ
ニル)メタン、ビス(4−アミノフエニル)シク
ロヘキサン、2,2−ビス(4−アミノフエニ
ル)プロパン、2,2−ビス(4−アミノ−3−
メチルフエニル)プロパン、2,2−ビス(3,
5−ジブロモ−4−アミノフエニル)プロパン、
ビス(3−クロロ−4アミノフエニル)メタン、
ビス(4−アミノフエニル)フエニルメタン、
3,4−ジアミノフエニル−4′−アミノフエニル
メタン、1,1−ビス(4−アミノフエニル)−
1−フエニルエタン等である。
むろん、上述した多官能性シアン酸エステルそ
のプレポリマー、およびアミンとのプレポリマー
は混合物の形で使用できる。
次に、b成分である多官能性マレイミドとは、
上述したa成分と組合せて用いることにより更に
耐熱性、耐湿性などにすぐれた硬化性樹脂組成物
とするものであり、マレイミド基を2個以上有す
る化合物である。
本発明に好適に使用される多官能性マレイミド
は下記一般式
〔式中、Rは2個以上、通常5個以下の芳香族
又は脂環族性有機基であり、X1,X2は水素、ハ
ロゲン、またはアルキル基であり、nは2以上で
通常5以下である。〕
で表わされる化合物である。上式で表わされるマ
レイミド類は無水マレイン酸類と2個以上のアミ
ノ基を有するポリアミン類とを反応させてマレア
ミド酸を調製し、次いでマレアミド酸を脱水環化
させるそれ自体公知の方法で製造することができ
る。用いる多価アミン類は芳香族アミンであるこ
とが最終樹脂の耐熱性等の点で好ましいが、樹脂
の可撓性や柔軟性が望ましい場合には、脂環族ア
ミンを単独或いは組合せで使用してもよい。ま
た、多価アミン類は第1級アミンであることが反
応性の点で特に望ましいが、第2級アミンも使用
できる。好適なアミン類としては、前記の多官能
性シアン酸エステルとアミンとのプレポリマーの
製造で例示したもの、およびs−トリアジン環を
もつたメラミン、アニリンとホルマリンとを反応
させてベンゼン環をメチレン結合で結んだポリア
ミンなどが示される。
本発明においては、上述した多官能性マレイミ
ドは、所謂モノマーの形で使用する代りにプレポ
リマーの形で用いることもできるし、更には、多
官能性マレイミド合成に用いたアミンとのプレポ
リマーの形でも好適に用いうる。
又、c成分のエポキシ樹脂とは、接着力の向
上、粘度の調整などのために使用されるものであ
り、分子中にエポキシ基を2個以上有する化合物
およびそのプレポリマーである。例示すれば、ポ
リオール、ポリヒドロキシベンゼン、ビスフエノ
ール、低分子量のノボラツク型フエノール樹脂、
水酸基含有シリコン樹脂、アニリン、3,5−ジ
アミノフエノールなどとエピハロヒドリンとの反
応によつて得られるポリグリシジル化合物類、ブ
タジエン、ペンタジエン、ビニルシクロヘキセ
ン、ジシクロペンテルエーテルなどの二重結合を
エポキシ化したポリエポキシ化合物類などであ
る。
本発明のブタジエン系樹脂()とは、ブタジ
エンを必須成分として重合して得られるゴム類で
あり、例えばポリブタジエン樹脂(ポリブタジエ
ンゴム、シンジオタクテイク1,2−ポリブタジ
エン)、スチレン−ブタジエン共重合樹脂(スチ
レン−ブタジエンゴム、熱可塑性のスチレン−ブ
タジエン−スチレンブロツク共重合体ゴム)、ア
クリロニトリル−ブタジエン共重合樹脂、および
常温液状の分子内に水酸基またはカルボキシル基
を有する通常平均分子量500〜10000のポリブタジ
エン樹脂、ブタジエン−アクリロニトリル共重合
樹脂、およびこれらをエポキシ樹脂と予備反応さ
せたものなどが挙げられる。本発明に於ては、操
作方法等にもよるが常温液状のゴムが好ましく、
特に分子内に水酸基またはカルボキシル基を有す
る通常平均分子量500〜10000、好ましくは700〜
5000のポリブタジエン樹脂、ブタジエン−アクリ
ロニトリル共重合樹脂が好ましい。
本発明の成分()のアクリル酸エポキシエス
テルとは上記の一般式(3)で表されるものであり、
グリシジルアクリレート又はグリシジルメタクリ
レートが挙げられる。又、これら(メタ)アクリ
ル酸エポキシエステル類を有機過酸化物、イオン
性重合触媒、熱或いは紫外線などによつてプレポ
リマー化したものも、特に不気揆性となる点など
から好適である。
以上の(),(),()の構成成分の使用量
比は、用いる用途により適宜選択されるものであ
るが、好ましくは成分()を30〜95wt%、成
分(),()をそれぞれ2.5〜50wt%の範囲で
用いるのがよく、例えば耐熱性が特に要求される
場合には()成分50wt%以上、更に60wt%以
上用いればよいし、又、常温液状とする場合には
成分()をモノマーの形で用いるなどすればよ
い。
又、成分(),(),()から本発明の硬化
性樹脂組成物を調製する方法も、特に限定される
ものではない。例えば、成分()として()
のa.およびb成分を予備反応させ、これに単に
(),()を混合する方法、成分()のc成
分と成分()とを予備反応させ、これに成分
()のaもしくはaとbおよび成分()を混
合する方法、その他種々の方法で調製する事がで
きるものである。
以上の成分からなる本発明の硬化性樹脂組成物
の硬化反応については、明確に証明されたもので
はないが、以下の如く推定されるものである。
(2) 多官能性マレイミドの反応、
本発明のその他成分であるエポキシ樹脂のエポ
キシ基については、水酸基、カルボキシル基、ア
ミノ基、酸無水物基などとの反応機構は知られて
いる。
以上から、本発明の組成物中においては、公知
である多官能性シアン酸エステル類と多官能性マ
レイミド類、更にエポキシ樹脂からなる組成物中
で起こつていると推定される反応の他に、新たに
成分として加えたアクリル酸エポキシエステルの
エポキシ基や不飽和二重結合との反応、ブタジエ
ン系樹脂が末端基として水酸基或いはカルボキシ
ル基を有する場合はそれらと上記した成分との間
に反応、更に不飽和二重結合との反応なども起こ
る可能性を有するものと推定される。
しかしながら、各成分が全て上記の推測の如く
官能基の量に比例反応して本願実施例の如き性能
が発揮されるとの推定には、各々の官能基がそれ
ぞれ固有の温度、その他に対応する反応の速度、
選択性、その他を有するものあることから、疑問
のあるものであり、硬化反応の主体は同一官能基
の相互反応(自己重合反応)にあり、異なる官能
基の相互反応は補助的なものでそれらは各成分の
より微細な相互分散及び各成分間の相溶性改良の
促進にあると推定する考え方もあるものである。
以上の3成分からなる本発明の硬化性樹脂組成
物はそれ自体加熱により結合し網状化して耐熱性
樹脂となる性質を有しているが、架橋網状化を促
進する目的で、通常は触媒を含有させて使用す
る。このような触媒としては、2−メチルイミダ
ゾール、2−ウンデシルイミダゾール、2−ヘプ
タデシルイミダゾール、2−フエニルイミダゾー
ル、2−エチル4−メチルイミダゾール、1−ベ
ンジル−2メチルイミダゾール、1−ブロピル−
2−メチルイミダゾール、1−シアノエチル−2
−メチルイミダゾール、1−シアノエチル−2エ
チル−4メチルイミダゾール、1−シアノエチル
−2−ウンデシルイミダゾール、1−シアノエチ
ル−2−フエニルイミダゾール、1−グアナミノ
エチル2−メチルイミダゾールで例示されるイミ
ダゾール類、さらには、これらのイミダゾール類
のトリメリト酸付加体など;N,N−ジメチルベ
ンジルアミン、N,N−ジメチルアニリン、N,
N−ジメチルトルイジン、N,N−ジメチル−p
−アニシジン、p−ハロゲノ−N,N−ジメチル
アニリン、2−N−エチルアニリノエタノール、
トリ−n−ブチルアミン、ピリジン、キノリン、
N−メチルモルホリン、トリエタノールアミン、
トリエチレンジアミン、N,N,N′,N′−テト
ラメチルブタンジアミン、N−メチルピペリジン
などの第3級アミン類;フエノール、クレゾー
ル、カテコール、キシレノール、レゾルシン、フ
ロログルシン等のフエノール類;ナフテン酸鉛、
ステアリン酸鉛、ナフテン酸亜鉛、オクチル酸亜
鉛、オレイン酸スズジブチル錫マレエート、ナフ
テン酸マンガン、ナフテン酸コバルト、アセチル
アセトン鉄などの有機金属化合物;SnCl4,
ZnCl2,AlCl3などの無機金属化合物;過酸化ベ
ンゾイル、ラウロイルパーオキサイド、カプリリ
ルパーオキサイド、アセチルパーオキサイド、パ
ラクロロベンゾイルパーオキサイド、ジ−ターシ
ヤリーブチルジーパーフタレートなどの過酸化物
が挙げられる。その他に一般にエポキシ樹脂の硬
化剤又は触媒として知られているもの、例えば無
水ピロメリト酸、無水フタル酸のような酸無水物
も併用できる。触媒の添加量は、一般的な意味で
の触媒量の範囲で十分であり、たとえば全組成物
に対して5重量%以下の量で使用されればよい。
本発明の組成物には、組成物本来の特性が損な
われない範囲で、所望に応じて種々の添加物を配
合することができる。これらの添加物としては、
本発明の組成物に新たな性質を付与するための天
然または合成の樹脂類、繊維質補強材;充填剤;
染顔料;増粘剤;滑剤;難燃剤等公知の各種添加
剤が含まれ、所望に応じて適宜組合せて用いられ
る。
本発明の硬化性樹脂組成物を硬化させるための
温度は、硬化剤や触媒の有無、組成成分の種類な
どによつても変化するが、通常100〜250℃の範囲
で選ばれればよい。成形品、積層品、接着構造物
等の製造に用いられる場合には加熱硬化に際して
圧力を加えることが好ましく、一般的に言つて10
〜500Kg/cm2の範囲内で適宜行う。
以下、実施例、比較例により本発明を説明す
る。
実施例 1
1,3−ジシアナベンゼン400gを150℃で150
分間予備反応させシアン酸エステルプレポリマー
とした。平均分子量1700、分子内の平均のカルボ
キシル基2・2個であるポリブタジエン樹脂60g
とビスフエノールA型エポキシ樹脂(平均の分子
内のエポキシ基2個数平均分子量2000)240gと
を80℃で180分間混合反応させエポキシ変性ポリ
ブタジエン樹脂とした後、上記シアン酸エステル
プレポリマーを80℃で均一に混合した。この混合
樹脂液に、グリシジルメタアクリレート200gを
80℃下で混合し、室温まで冷却したのち更に触媒
としてオクチル酸亜鉛0.1g、トリエチレンジア
ミン0.2g、および過酸化ベンゾイル0.2gを均一
に溶解混合し液状樹脂液とした。
長さ125mm、巾25mm、厚さ0.4mmのエポキシ樹脂
試験片に上記樹脂液を塗布し、加熱してB−
stageとした後、該試験片の長手方向端部が10mm
重複するようにB−stage化面を重ねた後、120℃
で24時間硬化させた。
この接着部の試験結果を第1表に示した。
実施例 2
2,2−ビス(4−シアナトフエニル)エーテ
ル900gとビス(4−マレイミドフエニル)エー
テル100gとを150℃で120分間予備反応させ、こ
れに実施例1と同様にして得たエポキシ変性ポリ
ブタジエン樹脂300gおよびグリシジルアクリレ
ート300gを80℃下で均一に混合した後、室温ま
で冷却したのち、更に触媒としてt−ブチルパー
オキサイド0.2g、オクチル酸亜鉛0.4g、および
2−エチルイミダゾール0.2gを添加し均一に混
合し液状の樹脂液とした。
この樹脂液を用いて実施例1と同様にして接着
及び接着部の試験をした。結果を第1表に示し
た。
The present invention relates to a novel cyanate ester-based curable resin composition that has excellent adhesiveness, flexibility, heat resistance, low-temperature curability, etc., and specifically relates to a polyfunctional cyanate ester and the cyanate ester prepolymer. Alternatively, a prepolymer of the cyanate ester and an amine, a polyfunctional maleimide of a and b, a maleimide prepolymer, a prepolymer of the maleimide and an amine, or c an epoxy resin are mixed or curable by pre-reaction. In the resin composition (), the butadiene resin () and the acrylic acid epoxy ester represented by the following general formula (3) or the acrylic acid epoxy ester prepolymer () are combined in an amount of 30 to 95% by weight of the component () and the component (). ) 2.5 to 50% by weight and component ( ) in an amount of 2.5 to 50% by weight. General formula (3): (R in the formula represents a hydrogen atom or a methyl group). The curable resin composition () of the present invention is
-1928 Publication (component a), Publication No. 46-41112 (composition of a+c), Publication No. 54-30440 (composition of a+b), Publication No. 52-
31279 (composition of a+b+c) and others, and is excellent in various physical properties such as heat resistance, chemical resistance, adhesiveness, and electrical properties.
Although it has been put into practical use, it has the disadvantage of being inferior in terms of flexibility. Furthermore, cured products of acrylic acid epoxy esters, methacrylic acid epoxy esters, or prepolymers () of the epoxy esters were brittle, had poor flexibility, and had insufficient heat resistance. As a result of intensive research into improvements that take advantage of the characteristics of cyanate ester resin compositions, the present inventors have discovered a new curable resin composition that has good adhesion, flexibility, heat resistance, and can be cured at lower temperatures. This discovery led to the completion of the present invention. The constituent components of the present invention will be explained below. First, as mentioned above, the cyanate ester resin composition () of the present invention has component a as an essential component and b.
Alternatively, the c-component may be appropriately used. The polyfunctional cyanate ester which is essential component a is an organic compound having two or more cyanate ester groups, and a suitable cyanate ester has the following general formula R(-O-C≡N)m...(1) ) [In the formula, m is an integer of 2 or more and usually 5 or less, R is an aromatic organic group, and the cyanate ester group is bonded to the aromatic ring of the organic group R] The compound represented by Specific examples include 1,3- or 1,4-dicyanatobenzene,
1,3,5-tricyanatobenzene, 1,3
-,1,4-,1,6-,1,8-,2,6- or 2,7-dicyanatonaphthalene, 1,3,
6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis(4-cyanatophenyl)methane, 2,2-bis(4-cyanatophenyl)propane, 2,2-bis(3, 5-dichloro-4-cyanatophenyl)propane, 2,2
-Bis(3,5-dibromo-4-cyanatophenyl)propane, bis(4-cyanatophenyl)ether, bis(4-cyanatophenyl)
Thioether, bis(4-cyanatophenyl)
Sulfone, tris(4-cyanatophenyl) phosphite, tris(4-cyanatophenyl)
These include phosphates, and cyanate esters obtained by the reaction of novolacs with cyanogen halides. In addition to these, Tokuko Sho 41-1928, Tokko Sho
43-18468, Special Publication 44-4791, Special Publication 45-11712,
Special Publication No. 46-41112, Special Publication No. 47-26853, and Special Publication No. 1983
Cyanic acid esters described in 51-63149 and the like can also be used. Further, a prepolymer obtained by polymerizing the above-mentioned polyfunctional cyanate ester in the presence of a catalyst such as a mineral acid, a Lewis acid, a salt such as sodium carbonate or lithium chloride, or a phosphate ester such as tributylphosphine. It can be used as These prepolymers generally have a sym-triazine ring in the molecule, which is formed by trimerization of the cyanide group in the cyanate ester. In the present invention, it is preferable to use the prepolymer having an average molecular weight of 400 to 6,000. Furthermore, the above-mentioned polyfunctional cyanate esters can also be used in the form of a premolymer with an amine. Examples of amines that can be suitably used include meta or paraphenylene diamine, meta or para xylylene diamine, 1,4- or 1,3-cyclohexane diamine, hexahydroxylylene diamine,
4,4'-diaminobiphenyl, bis(4-aminophenyl)methane, bis(4-aminophenyl)
Ether, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-aminophenyl)cyclohexane, 2,2- Bis(4-aminophenyl)propane, 2,2-bis(4-amino-3-
methylphenyl)propane, 2,2-bis(3,
5-dibromo-4-aminophenyl)propane,
bis(3-chloro-4aminophenyl)methane,
bis(4-aminophenyl)phenylmethane,
3,4-diaminophenyl-4'-aminophenylmethane, 1,1-bis(4-aminophenyl)-
1-phenylethane and the like. Of course, the polyfunctional cyanate esters mentioned above, their prepolymers, and prepolymers with amines can be used in the form of mixtures. Next, what is the polyfunctional maleimide that is component b?
When used in combination with the above-mentioned component a, a curable resin composition with even better heat resistance and moisture resistance can be obtained, and it is a compound having two or more maleimide groups. The polyfunctional maleimide suitably used in the present invention has the following general formula: [In the formula, R is 2 or more and usually 5 or less aromatic or alicyclic organic groups, X 1 and X 2 are hydrogen, halogen, or an alkyl group, and n is 2 or more and usually 5 It is as follows. ] It is a compound represented by Maleimides represented by the above formula can be produced by a method known per se, in which maleic anhydride and polyamines having two or more amino groups are reacted to prepare maleamic acid, and then maleamic acid is cyclodehydrated. Can be done. The polyvalent amines used are preferably aromatic amines in terms of the heat resistance of the final resin, but if flexibility and flexibility of the resin are desired, alicyclic amines may be used alone or in combination. It's okay. Furthermore, it is particularly desirable that the polyvalent amines be primary amines in terms of reactivity, but secondary amines can also be used. Suitable amines include those exemplified in the production of the prepolymer of polyfunctional cyanate ester and amine, melamine having an s-triazine ring, and melamine having an s-triazine ring, and converting benzene rings into methylene by reacting aniline with formalin. Polyamines connected by bonds are shown. In the present invention, the above-mentioned polyfunctional maleimide can be used in the form of a prepolymer instead of in the form of a so-called monomer, and furthermore, it can be used in the form of a prepolymer with the amine used in the synthesis of the polyfunctional maleimide. It can also be suitably used in the form of The epoxy resin as component c is used for improving adhesive strength, adjusting viscosity, etc., and is a compound having two or more epoxy groups in the molecule and a prepolymer thereof. Examples include polyol, polyhydroxybenzene, bisphenol, low molecular weight novolak type phenolic resin,
Hydroxyl group-containing silicone resins, polyglycidyl compounds obtained by reacting aniline, 3,5-diaminophenol, etc. with epihalohydrin, polyamides with epoxidized double bonds such as butadiene, pentadiene, vinylcyclohexene, dicyclopentyl ether, etc. These include epoxy compounds. The butadiene resin () of the present invention is a rubber obtained by polymerizing butadiene as an essential component, such as polybutadiene resin (polybutadiene rubber, syndiotactic 1,2-polybutadiene), styrene-butadiene copolymer resin ( Styrene-butadiene rubber, thermoplastic styrene-butadiene-styrene block copolymer rubber), acrylonitrile-butadiene copolymer resin, and polybutadiene resin which is liquid at room temperature and has a hydroxyl group or carboxyl group in the molecule and usually has an average molecular weight of 500 to 10,000. Examples include butadiene-acrylonitrile copolymer resins, and those obtained by preliminarily reacting these with epoxy resins. In the present invention, rubber that is liquid at room temperature is preferable, although it depends on the operating method etc.
In particular, it has a hydroxyl group or a carboxyl group in its molecule and usually has an average molecular weight of 500 to 10,000, preferably 700 to 10,000.
5000 polybutadiene resin and butadiene-acrylonitrile copolymer resin are preferred. The acrylic acid epoxy ester of the component () of the present invention is represented by the above general formula (3),
Glycidyl acrylate or glycidyl methacrylate may be mentioned. Moreover, those obtained by prepolymerizing these (meth)acrylic acid epoxy esters using organic peroxides, ionic polymerization catalysts, heat, or ultraviolet rays are also suitable since they are particularly resistant to air. The usage ratios of the above components (), (), and () are appropriately selected depending on the intended use, but preferably component () is 30 to 95 wt%, and components () and () are each used at 30 to 95 wt%. It is best to use it in the range of 2.5 to 50 wt%. For example, if heat resistance is particularly required, component () may be used at 50 wt% or more, furthermore, at least 60 wt%. Also, if it is to be liquid at room temperature, component ( ) may be used in the form of a monomer. Furthermore, the method for preparing the curable resin composition of the present invention from components (), (), and () is not particularly limited. For example, as component()()
A method of pre-reacting components a. and b of , and then simply mixing () and () with the pre-reaction, or a method of pre-reacting component c of component () with component (), and then pre-reacting component c of component () with component a or a of component (). It can be prepared by mixing b and component (), or by various other methods. Although the curing reaction of the curable resin composition of the present invention comprising the above components has not been clearly proven, it is estimated as follows. (2) Reaction of polyfunctional maleimide, Regarding the epoxy group of the epoxy resin, which is another component of the present invention, the reaction mechanism with hydroxyl group, carboxyl group, amino group, acid anhydride group, etc. is known. From the above, in the composition of the present invention, in addition to the reactions that are presumed to occur in a composition comprising a known polyfunctional cyanate ester, a polyfunctional maleimide, and an epoxy resin, Reaction with the epoxy group or unsaturated double bond of the acrylic acid epoxy ester newly added as a component, reaction between these and the above components if the butadiene resin has a hydroxyl group or carboxyl group as a terminal group, and further It is presumed that reactions with unsaturated double bonds may also occur. However, in order to assume that each component reacts proportionally to the amount of functional groups as estimated above and exhibits the performance as in the present example, it is necessary to assume that each functional group responds to its own unique temperature and other conditions. rate of reaction,
This is questionable because some of them have selectivity and others, and the main curing reaction is the mutual reaction of the same functional groups (self-polymerization reaction), and the mutual reactions of different functional groups are auxiliary. Some people believe that this is due to the promotion of finer mutual dispersion of each component and improvement of compatibility between each component. The curable resin composition of the present invention, which is composed of the above three components, has the property of becoming a heat-resistant resin by bonding and forming a network when heated. Contain and use. Such catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-ethyl 4-methylimidazole, 1-benzyl-2methylimidazole, 1-bropyl-
2-methylimidazole, 1-cyanoethyl-2
- Imidazoles exemplified by methylimidazole, 1-cyanoethyl-2ethyl-4methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-guanaminoethyl-2-methylimidazole; are trimellitic acid adducts of these imidazoles; N,N-dimethylbenzylamine, N,N-dimethylaniline, N,
N-dimethyltoluidine, N,N-dimethyl-p
-anisidine, p-halogeno-N,N-dimethylaniline, 2-N-ethylanilinoethanol,
tri-n-butylamine, pyridine, quinoline,
N-methylmorpholine, triethanolamine,
Tertiary amines such as triethylenediamine, N,N,N',N'-tetramethylbutanediamine, N-methylpiperidine; Phenols such as phenol, cresol, catechol, xylenol, resorcin, phloroglucin; Lead naphthenate,
Organometallic compounds such as lead stearate, zinc naphthenate, zinc octylate, tin dibutyltin maleate oleate, manganese naphthenate, cobalt naphthenate, iron acetylacetonate; SnCl 4 ,
Examples include inorganic metal compounds such as ZnCl 2 and AlCl 3 ; peroxides such as benzoyl peroxide, lauroyl peroxide, caprylyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, and di-tertiary butyl diperphthalate. In addition, those generally known as curing agents or catalysts for epoxy resins, such as acid anhydrides such as pyromellitic anhydride and phthalic anhydride, can also be used in combination. The amount of the catalyst to be added is sufficient within the general range of the catalyst amount, for example, it may be used in an amount of 5% by weight or less based on the total composition. The composition of the present invention may contain various additives as desired, as long as the original properties of the composition are not impaired. These additives include:
Natural or synthetic resins and fibrous reinforcements for imparting new properties to the composition of the present invention; fillers;
Various known additives such as dyes and pigments; thickeners; lubricants; and flame retardants are included, and may be used in appropriate combinations as desired. The temperature for curing the curable resin composition of the present invention varies depending on the presence or absence of a curing agent and catalyst, the types of composition components, etc., but may be generally selected within the range of 100 to 250°C. When used in the production of molded products, laminated products, adhesive structures, etc., it is preferable to apply pressure during heat curing, and generally speaking,
Appropriately within the range of ~500Kg/ cm2 . The present invention will be explained below with reference to Examples and Comparative Examples. Example 1 400g of 1,3-dicyanabenzene was heated to 150℃ at 150℃.
A pre-reaction was carried out for a minute to obtain a cyanate ester prepolymer. 60g of polybutadiene resin with an average molecular weight of 1700 and an average of 2.2 carboxyl groups in the molecule.
and 240 g of bisphenol A type epoxy resin (number average molecular weight of 2 epoxy groups in the molecule: 2000) were mixed and reacted at 80°C for 180 minutes to obtain an epoxy-modified polybutadiene resin, and then the cyanate ester prepolymer was mixed at 80°C. Mixed evenly. Add 200g of glycidyl methacrylate to this mixed resin liquid.
After mixing at 80° C. and cooling to room temperature, 0.1 g of zinc octylate, 0.2 g of triethylenediamine, and 0.2 g of benzoyl peroxide as catalysts were further uniformly dissolved and mixed to obtain a liquid resin solution. The above resin liquid was applied to an epoxy resin test piece with a length of 125 mm, a width of 25 mm, and a thickness of 0.4 mm, and heated to obtain B-
After setting the stage, the longitudinal end of the specimen is 10mm
After overlapping the B-staged surfaces, heat at 120℃.
and cured for 24 hours. Table 1 shows the test results for this bonded part. Example 2 900 g of 2,2-bis(4-cyanatophenyl) ether and 100 g of bis(4-maleimidophenyl) ether were pre-reacted at 150°C for 120 minutes, and this was mixed with an epoxy-modified product obtained in the same manner as in Example 1. After uniformly mixing 300 g of polybutadiene resin and 300 g of glycidyl acrylate at 80°C and cooling to room temperature, 0.2 g of t-butyl peroxide, 0.4 g of zinc octylate, and 0.2 g of 2-ethylimidazole were added as catalysts. The mixture was mixed uniformly to obtain a liquid resin solution. Adhesion and bonded portion tests were conducted in the same manner as in Example 1 using this resin liquid. The results are shown in Table 1.
【表】
実施例 3
ブタジエン−アクリロニトリル共重合体(アク
リル成分8.5%、粘度117ポイズ、分子内の平均の
カルボキシル基1.16、水酸基1.41)50gとビスフ
エノールA型エポキシ樹脂(数平均分子量1500、
分子内の平均のエポキシ基2)200gとを80℃で
200分間予備反応させ、エポキシ変性ブタジエン
−アクリロニトリル共重合体とした。
2,2−ビス(4−シアナトフエニル)プロパ
ン800gとビス(4−マレイミドフエニル)メタ
ン200gとを150℃で150分間予備反応させ、これ
をメチルエチルケトンとジメチルホルムアミドと
の混合溶剤に溶解させシアン酸エステル系樹脂溶
液とした。
更に、グリシジルアクリレート400gを過酸化
ベンゾイル0.2gとともにアセトンに溶解させ、
環流下に90分間予備反応させプレポリマー溶液と
した。
上記で得たエポキシ変性ブタジエン−アクリロ
ニトリル共重合体、シアン酸エステル系樹脂溶
液、およびグリシシルアクリレートプレポリマー
溶液に、更にエポキシ樹脂(ECN−1273、チバ
ガイギー社製)200gを加え均一に溶解混合した
後、触媒としてオクチル酸亜鉛0.4g、トリエチ
レンジアミン0.3gを加え均一に溶解混合しワニ
スとした。
このワニスをガラス布に含浸し、乾燥させてB
−stageのプリプレグを作り、該プリプレグと厚
さ35μの電解銅箔を用いて温度165℃、圧力40
Kg/cm2で120分間積層成形し、両面銅張積層板を
得た。
この積層板の性能を第2表に示した。
比較例 1
実施例3においてシアン酸エステル系樹脂溶液
を用いない他は同様にして両面銅張積層板を作つ
た。この積層板の性能を第2表に示した。[Table] Example 3 50 g of butadiene-acrylonitrile copolymer (acrylic component 8.5%, viscosity 117 poise, average carboxyl group 1.16, hydroxyl group 1.41 in the molecule) and bisphenol A type epoxy resin (number average molecular weight 1500,
Average epoxy group in the molecule 2) 200g at 80℃
A preliminary reaction was carried out for 200 minutes to obtain an epoxy-modified butadiene-acrylonitrile copolymer. 800 g of 2,2-bis(4-cyanatophenyl)propane and 200 g of bis(4-maleimidophenyl)methane were pre-reacted at 150°C for 150 minutes, and this was dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide to form cyanate ester. A system resin solution was prepared. Furthermore, 400 g of glycidyl acrylate was dissolved in acetone along with 0.2 g of benzoyl peroxide,
A prepolymer solution was prepared by pre-reacting for 90 minutes under reflux. After adding 200 g of epoxy resin (ECN-1273, manufactured by Ciba Geigy) to the epoxy-modified butadiene-acrylonitrile copolymer, cyanate ester resin solution, and glycycyl acrylate prepolymer solution obtained above, they were uniformly dissolved and mixed. Then, 0.4 g of zinc octylate and 0.3 g of triethylenediamine were added as catalysts and uniformly dissolved and mixed to form a varnish. Impregnate a glass cloth with this varnish, dry it, and
-stage prepreg was made, and the temperature was 165℃ and the pressure was 40℃ using the prepreg and 35μ thick electrolytic copper foil.
Lamination molding was carried out for 120 minutes at Kg/cm 2 to obtain a double-sided copper-clad laminate. The performance of this laminate is shown in Table 2. Comparative Example 1 A double-sided copper-clad laminate was produced in the same manner as in Example 3, except that the cyanate ester resin solution was not used. The performance of this laminate is shown in Table 2.
【表】
実施例 4
1,3−ジシアナトベンゼン900gを150℃で
300分間予備反応させた予備反応物に、エポキシ
樹脂(ECN−1273、チバガイギー社製)100g、
グリシジルメタアクリレート400g、およびブタ
ジエン−アクリロニトリル共重合体(アクリル成
分7.2%、平均分子量1800)600gを入れ均一に混
合した後、触媒としてオクチル酸亜鉛0.2g、ト
リエチレンジアミン0.1g、過酸化ベンゾイル0.2
gを入れ均一に溶解した。この樹脂液を金型に入
れ120℃で150分、160℃で240分間注型成形し、良
好な注型物を得た。この注型物は弾性があり、屈
曲性にすぐれていた。[Table] Example 4 900g of 1,3-dicyanatobenzene at 150℃
To the pre-reacted material pre-reacted for 300 minutes, 100 g of epoxy resin (ECN-1273, manufactured by Ciba Geigy),
Add 400 g of glycidyl methacrylate and 600 g of butadiene-acrylonitrile copolymer (7.2% acrylic component, average molecular weight 1800) and mix uniformly, then add 0.2 g of zinc octylate, 0.1 g of triethylenediamine, and 0.2 g of benzoyl peroxide as catalysts.
g was added and dissolved uniformly. This resin liquid was put into a mold and cast molded at 120°C for 150 minutes and at 160°C for 240 minutes to obtain a good cast product. This cast product was elastic and had excellent flexibility.
Claims (1)
ステルプレポリマー或いは該シアン酸エステルと
アミンとのプレポリマー、または前記aとb.多官
能性マレイミド、該マレイミドプレポリマー或い
は該マレイミドとアミンとのプレポリマー又はc.
エポキシ樹脂とを混合または予備反応させてなる
硬化性樹脂組成物()において、ブタジエン系
樹脂()および下記一般式(3)で表されるアクリ
ル酸エポキシエステル或いは該アクリル酸エポキ
シエステルプレポリマー()を、成分()30
〜95重量%、成分()2.5〜50重量%および成
分()2.5〜50重量%となる量で配合してなる
硬化性樹脂組成物。 一般式(3): (式中のRは、水素原子又はメチル基を示す)。[Scope of Claims] 1 a. A polyfunctional cyanate ester, a prepolymer of the cyanate ester, or a prepolymer of the cyanate ester and an amine, or a and b. a polyfunctional maleimide, a prepolymer of the maleimide, or Prepolymer of maleimide and amine or c.
In a curable resin composition () obtained by mixing or pre-reacting with an epoxy resin, a butadiene resin () and an acrylic acid epoxy ester represented by the following general formula (3) or the acrylic acid epoxy ester prepolymer () are used. , component()30
95% by weight, component () 2.5-50% by weight, and component () 2.5-50% by weight. General formula (3): (R in the formula represents a hydrogen atom or a methyl group).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4588380A JPS56141310A (en) | 1980-04-08 | 1980-04-08 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4588380A JPS56141310A (en) | 1980-04-08 | 1980-04-08 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56141310A JPS56141310A (en) | 1981-11-05 |
JPS6333504B2 true JPS6333504B2 (en) | 1988-07-05 |
Family
ID=12731625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4588380A Granted JPS56141310A (en) | 1980-04-08 | 1980-04-08 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56141310A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11448700B2 (en) | 2018-09-14 | 2022-09-20 | Kabushiki Kaisha Yaskawa Denki | Operation data collection system, operation data collection method, and information storage medium |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61209214A (en) * | 1985-03-14 | 1986-09-17 | Matsushita Electric Works Ltd | Ultraviolet-curable resin composition |
JPS6333472A (en) * | 1986-07-28 | 1988-02-13 | Yokohama Rubber Co Ltd:The | Thermosetting resin composition |
US4894414A (en) * | 1987-07-30 | 1990-01-16 | The Dow Chemical Company | Rubber-modified cyanate ester resins and polytriazines derived therefrom |
US5079294A (en) * | 1987-07-30 | 1992-01-07 | The Dow Chemical Company | Rubber-modified cyanate ester resins and polytriazines derived therefrom |
JP4055424B2 (en) * | 2001-01-30 | 2008-03-05 | 日立化成工業株式会社 | Thermosetting resin composition and use thereof |
JP6819854B2 (en) * | 2016-08-26 | 2021-01-27 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, laminate resin sheet, resin sheet, and printed wiring board |
CN110198968B (en) * | 2017-01-26 | 2022-06-21 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
-
1980
- 1980-04-08 JP JP4588380A patent/JPS56141310A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11448700B2 (en) | 2018-09-14 | 2022-09-20 | Kabushiki Kaisha Yaskawa Denki | Operation data collection system, operation data collection method, and information storage medium |
Also Published As
Publication number | Publication date |
---|---|
JPS56141310A (en) | 1981-11-05 |
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