JPS6332270B2 - - Google Patents

Info

Publication number
JPS6332270B2
JPS6332270B2 JP55186879A JP18687980A JPS6332270B2 JP S6332270 B2 JPS6332270 B2 JP S6332270B2 JP 55186879 A JP55186879 A JP 55186879A JP 18687980 A JP18687980 A JP 18687980A JP S6332270 B2 JPS6332270 B2 JP S6332270B2
Authority
JP
Japan
Prior art keywords
heat
radiator
heat pipe
pipe
generating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55186879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57111053A (en
Inventor
Norio Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18687980A priority Critical patent/JPS57111053A/ja
Publication of JPS57111053A publication Critical patent/JPS57111053A/ja
Publication of JPS6332270B2 publication Critical patent/JPS6332270B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP18687980A 1980-12-26 1980-12-26 Heat radiation of electronic apparatus Granted JPS57111053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18687980A JPS57111053A (en) 1980-12-26 1980-12-26 Heat radiation of electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18687980A JPS57111053A (en) 1980-12-26 1980-12-26 Heat radiation of electronic apparatus

Publications (2)

Publication Number Publication Date
JPS57111053A JPS57111053A (en) 1982-07-10
JPS6332270B2 true JPS6332270B2 (enrdf_load_stackoverflow) 1988-06-29

Family

ID=16196275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18687980A Granted JPS57111053A (en) 1980-12-26 1980-12-26 Heat radiation of electronic apparatus

Country Status (1)

Country Link
JP (1) JPS57111053A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318700A (ja) * 1986-07-11 1988-01-26 三菱電機株式会社 発熱素子の冷却装置
JPH0351968A (ja) * 1989-07-19 1991-03-06 Toshiba Corp 直線化判別方式
JP2007032869A (ja) * 2005-07-22 2007-02-08 Fujitsu Ltd 冷却装置および冷却方法
US7382620B2 (en) * 2005-10-13 2008-06-03 International Business Machines Corporation Method and apparatus for optimizing heat transfer with electronic components
JP6203693B2 (ja) * 2014-09-12 2017-09-27 Idec株式会社 電気機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5358661A (en) * 1976-11-08 1978-05-26 Tokyo Shibaura Electric Co Device for cooling electronic parts

Also Published As

Publication number Publication date
JPS57111053A (en) 1982-07-10

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