JPS63318757A - Device for manufacturing semiconductor - Google Patents

Abstract

PURPOSE:To obtain an imprinting-machine handling mechanism, the through-put speed of imprinting of which is increased, by moving a semiconductor product as it is lect as it is admitted into a magazine case, detecting the position of imprinting of the semiconductor product introduced into the magazine case and imprinting the semiconductor product through laser irradiation. CONSTITUTION:A magazine case guide 1 guiding a magazine case 2, an imprinting-position sensing section 4 sensing the positions of imprinting of semiconductor products 3 in the magazine case 2, a feed section feeding the magazine case 2 at a constant pitch toward the imprinting-position sensing section 4 along the magazine case guide 1, a laser section 6 marking the semiconductor products 3 through laser irradiation, and a control section 7 emitting a drive command to the laser section 6 on the basis of an output from the imprinting- position sensing section 4 are mounted. A feed pawl 5 driven in one direction by an endless belt 8 stretched between two rollers 9a, 9a is used as said feed section. Accordingly, the speed of throughput of imprinting can be increased largely more than a conventional method in which articles to be imprinted are imprinted one by one.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a handling mechanism for supplying, transporting, stamping, and storing semiconductor products.

[Conventional technology]

Conventionally, this type of stamping machine handling mechanism has been configured to take out semiconductor products one by one from a magazine case, feed them to a stamping position, position them, stamp them, and then store them back into the magazine case after stamping.

[Problem that the invention seeks to solve]

The above-mentioned conventional stamping machine handling mechanism takes out semiconductor products one by one from a magazine case, feeds them to the stamping position, positions them, stamps them, and then puts them back into the magazine case after stamping. This has the disadvantage that it takes a long time to handle each piece, and the stamping processing speed cannot be increased.

The object of the present invention is to provide a semiconductor manufacturing apparatus that solves the above-mentioned problems;
In particular, the object is to provide a stamping machine handling mechanism.

[Differences between the invention and the prior art]

In contrast to the above-mentioned conventional marking machine handling mechanism, the present invention moves the semiconductor product while it is in the magazine case,
The difference is that the marking position of the semiconductor products contained in the magazine case is detected and laser irradiation is applied to stamp each magazine case.

[Means for solving problems]

The present invention includes a magazine case guide that guides a magazine case, a stamp position detection section that detects the stamp position of a semiconductor product in the magazine case, and a magazine case that directs the magazine case toward the stamp position detection section along the magazine case guide. It is characterized by comprising: a feed section that feeds at a constant pitch; a laser section that marks a semiconductor product by laser irradiation; and a control section that issues a drive command to the laser section based on the output of the marking position detection section. This is semiconductor manufacturing equipment.

(Example〕 ' Hereinafter, one embodiment of the present invention will be explained with reference to the drawings.

(Example 1) FIGS. 1 and 2 are diagrams showing a first example of the present invention. In FIGS. 1 and 2, 1 the present invention is a magazine case 2.
a magazine case guide 1 for guiding the semiconductor products 3, 3, . . . in the magazine case 2; A feed claw 5 that feeds at a fixed pitch toward the position detection section 4, a laser section 6 that marks the semiconductor product 3 by laser irradiation, and a drive command to the laser section 6 based on the output of the marking position detection section 4. It has a control section 7 that emits the signal. Further, reference numeral 8 denotes an endless belt passed between two rollers 9a, 9a, and the belt 8 drives the feed claw 5 in one direction.

In the embodiment, the semiconductor product 3 is stored in the magazine case 2 and is fed by the feeding claw 5.

The magazine case 2 is guided by the magazine case guide 1 and is fed at a fixed pitch toward the stamp position detection section 4.

The stamp position of the semiconductor product 3 in the magazine case 2 that has reached the stamp position detector 4 is detected by the stamp position detector 4 . The control section 7 issues a drive command for the laser section 6 based on the output of the stamp position detection section 4. Based on a drive command from the control section 7, the laser section 6 irradiates a specific semiconductor product 3 detected by the marking position detection section 4 with a laser beam to attach a necessary mark.

Perform the above operation for each semiconductor product in magazine case 2,
All semiconductor products in the magazine case 2 are marked.

(Embodiment 2) FIG. 3 is a front view showing a second embodiment of the present invention, and FIG. 4 is a side view of the same.

In this embodiment, the semiconductor product 3 is stamped while being housed in the magazine case 2. The stamp position detection section 4 and the laser section 6 are moved over each row of magazine cases 2 by a laser section moving arm 10.

Detecting the marking position on the semiconductor product 3 and irradiating it with laser 8
In this embodiment, unlike the first embodiment, the magazine case 2 is fed in the direction of the shorter side of the magazine case 2 by the feed pawl 5, which has the advantage that the device space can be reduced. .

〔Effect of the invention〕

As explained above, the present invention moves the semiconductor products while they are in the magazine case, detects the marking position of the semiconductor products in the magazine case, and stamps the semiconductor products by irradiating the laser with a laser. This method has the effect of greatly speeding up the stamping process compared to the method of stamping semiconductor products.

[Brief explanation of drawings]

Fig. 1 is a plan view showing the first embodiment of the present invention, Fig. 2 is a side view of the same, Fig. 3 is a plan view showing the second embodiment of the invention, and Fig. 4 is a side view of the same. be. 1...Magazine case guide 2...Magazine case 3...Semiconductor product 4...Marking position detection section 5...Feeding claw 6...Laser section 7.
・Control unit

Claims (1)

[Claims] (1) A magazine case guide that guides the magazine case, a stamp position detection section that detects the stamp position of the semiconductor product in the magazine case, and a magazine case that directs the magazine case toward the stamp position detection section along the magazine case guide. Semiconductor manufacturing characterized by having a feeding unit that feeds at a fixed pitch, a laser unit that marks a semiconductor product by laser irradiation, and a control unit that issues a drive command to the laser unit based on the output of the marking position detection unit. Device.