JPS63318131A - Resin sealing method using hardening resin - Google Patents
Resin sealing method using hardening resinInfo
- Publication number
- JPS63318131A JPS63318131A JP15343487A JP15343487A JPS63318131A JP S63318131 A JPS63318131 A JP S63318131A JP 15343487 A JP15343487 A JP 15343487A JP 15343487 A JP15343487 A JP 15343487A JP S63318131 A JPS63318131 A JP S63318131A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- hot gas
- discharging
- discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 63
- 229920005989 resin Polymers 0.000 title claims abstract description 63
- 238000007789 sealing Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000007599 discharging Methods 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000000565 sealant Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000007921 spray Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 4
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 239000011295 pitch Substances 0.000 description 7
- 239000008393 encapsulating agent Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001474374 Blennius Species 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000011269 tar Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、半導体装置の製造に際しての樹脂封止を行
う場合に、樹脂吐出量を一定にして被封止物保護用封止
剤の安定被覆を可能とした樹脂封止方法に関するもので
ある。Detailed Description of the Invention (Industrial Field of Application) This invention is aimed at stabilizing a sealant for protecting an object by keeping the amount of resin discharged constant when performing resin sealing during the manufacture of semiconductor devices. The present invention relates to a resin sealing method that enables coating.
（従来の技術） 例えばチップオンボードやＴＡＢ（Ｔａｒｓ Ａｕｔ。(Conventional technology) For example, chip on board and TAB (Tars Out).
ｍａｔｅｄ Ｂｏｎｄｉｎｇ）のＩＣチップ保護用封止
剤には、固形又は液状樹脂が使用されている。しかし、
該封止剤の粘性、ＩＣチップや金線の樹脂に対する抵抗
基板の温度上昇時間などのいろいろの要因により該封止
剤が被封止物の全面を覆′い半硬化させることは必ずし
も容易ではない。A solid or liquid resin is used as a sealant for protecting IC chips (Mated Bonding). but,
Due to various factors such as the viscosity of the sealant and the temperature rise time of the resistor board relative to the resin of the IC chip and gold wire, it is not always easy for the sealant to cover the entire surface of the object to be sealed and semi-cure. do not have.
そして上記封止剤の溶解によりＩＣチップを覆う時間と
、封止剤の硬化時間とのギャップにより被封止物全面を
覆いきれないいわゆる未充填不良品を多数発生させる可
能性があった。Further, due to the gap between the time required to cover the IC chip by melting the sealant and the time required for the sealant to harden, there is a possibility that a large number of so-called unfilled defective products may be generated in which the entire surface of the object to be sealed cannot be covered.
さらに近年例えばＩＣカードなどに代表されるように、
チップオンボードには高機能製品が開発され、該ＩＣチ
ップも大型化の傾向にあり、上記封止剤の硬化時間が益
々長くなり、封止剤の硬化時間内にＩＣチップ全面を覆
うのが著しく難しくなってきている。Furthermore, in recent years, as exemplified by IC cards,
High-performance chip-on-board products have been developed, and the IC chips are also becoming larger. As a result, the curing time of the encapsulant is becoming longer and longer, making it difficult to cover the entire surface of the IC chip within the curing time of the encapsulant. It's becoming significantly more difficult.
かかる問題の対策として、液状樹脂吐出部を複数設け、
対応する補助加熱としてのポットガス吐出部を同様に？
ｌｌ数設ける方法、あるいは高温多量のホットガスを吹
き付けるなどの方法により樹脂のひろがりを補助促進し
ようどしている方法もある。As a countermeasure to this problem, multiple liquid resin discharge parts are provided,
Similarly, the pot gas discharge part as a corresponding auxiliary heating?
There are also methods that attempt to assist and promote the spread of the resin, such as by providing several liters of resin, or by blowing a large amount of hot gas at high temperatures.
（発明が解決しようとする問題点）
しかしながら、上記吐出部を複数設けた方法では、樹脂
を複数個所で吐出するため、時間の経過による樹脂硬化
の影響を受けやすく樹脂被覆の安定化が得られない。(Problem to be Solved by the Invention) However, in the method of providing multiple discharge portions, since the resin is discharged from multiple locations, it is susceptible to the effects of resin hardening over time, making it difficult to stabilize the resin coating. do not have.
また、ホットガスを吹き付ける方法では、樹脂が硬化し
てしまうまでの短時間で樹脂を拡開するに足る高温でか
つ多量の吹き付けにより、樹脂の飛散等を生じ基板表面
の汚染又は樹脂温度の急激な上昇による樹脂発泡などの
他の問題があった。In addition, with the method of spraying hot gas, spraying at a high temperature and large amount that is sufficient to spread the resin in a short period of time until the resin hardens can cause resin scattering, contamination of the substrate surface, or rapid rise in resin temperature. There were other problems such as resin foaming due to the rise in temperature.
この発明は、前記従来技術が持っている問題点のうち、
樹脂の被膜量が安定しない点と、基板表面の汚染及び樹
脂発泡の問題点について解決する方法を提供するもので
ある。This invention solves the problems of the above-mentioned prior art.
The present invention provides a method for solving the problems of unstable resin coating amount, contamination of the substrate surface, and resin foaming.
（問題点を解決するための手段）
この発明は、半導体装置の製造に際して、被樹脂封止物
を所定ピッチで移送する工程と、該被樹脂封止物上の＠
脂吐出部をＸ−Ｙ駆動部によすｘ−Ｙ軸方向に駆動させ
て被樹脂封止物表面に封止剤樹脂を吐出する工程と、上
記Ｘ−Ｙ駆動部上の上記被樹脂封止物の移送ピッチの範
囲内に設置され上記樹脂吐出部と同一駆動される加熱用
ホットガス吐出部によりホットガスを封止剤樹脂上に吐
出させる工程とを導入したものである。(Means for Solving the Problems) The present invention provides a step of transporting a resin-sealed object at a predetermined pitch during the manufacture of a semiconductor device, and
A step of discharging the sealant resin onto the surface of the object to be sealed by driving the resin discharging section in the x-Y axis direction by the X-Y drive section; This method introduces a step of discharging hot gas onto the sealant resin by a heating hot gas discharging section that is installed within the range of the transfer pitch of the sealant and driven in the same manner as the resin discharging section.
（作 用）
この発明においては、半導体装置の製造に際して以上の
ような工程を導入したので、樹脂吐出部が被封着物表面
上でＸ−Ｙ方向に連続的に不定形状に移動させつつ保護
用の封止剤樹脂を吐出させ、同時に補助加熱用ホットガ
ス吐出部を同−Ｘ−Ｙ駆動部により駆動させ、吐出され
た封止剤樹脂上にホットガスを吐出させ、封止剤樹脂の
効率的な拡開を行うように作用し、シｔコがって前記問
題点を除去できる。(Function) In this invention, since the above-mentioned process is introduced when manufacturing a semiconductor device, the resin discharging part continuously moves in an irregular shape in the X-Y direction on the surface of the object to be sealed, and performs the protection. The efficiency of the encapsulant resin is increased by discharging the encapsulant resin, and at the same time driving the auxiliary heating hot gas discharging part by the X-Y drive part to discharge the hot gas onto the ejected encapsulant resin. Therefore, the above-mentioned problems can be eliminated.
（実 施 例）
以下、この発明の実施例について図面に基づき説明する
。図はその一実施例に適用される封止剤樹脂吐出装置の
斜視図であり、図中１はＸ軸駆動用パルスモータ、２は
Ｙ軸駆動用パルスモータである。(Example) Hereinafter, an example of the present invention will be described based on the drawings. The figure is a perspective view of a sealant resin discharging device applied to one embodiment of the present invention, and in the figure, 1 is a pulse motor for driving the X-axis, and 2 is a pulse motor for driving the Y-axis.
このＸ軸駆動用パルスモータ１及びＹ軸駆動用パルスモ
ータ２により、Ｘ−Ｙ駆動部３が被封着物１０の移送装
Ｍ （１１）上をＸ軸及びＹ軸方向に自在に移動し得ろ
ように構成されている。By means of the X-axis drive pulse motor 1 and the Y-axis drive pulse motor 2, the X-Y drive unit 3 can freely move on the transfer device M (11) for the object to be sealed 10 in the X-axis and Y-axis directions. It is configured as follows.
上記Ｘ軸駆動用パルスモータ１．Ｙ軸駆動用パルスモー
タ２はそれぞれマイクロコンピュータなどにより制御さ
れ、上述のＸ−Ｙ駆動部３のＸ−７両方向駆動を円滑に
行わせる。The above X-axis drive pulse motor 1. The Y-axis drive pulse motors 2 are each controlled by a microcomputer or the like, and smoothly drive the X-Y drive unit 3 in the X-7 direction.
このＸ−Ｙ駆動部３には、吐出ニードル４ａを備えた樹
脂吐出部４および補助加熱用ホットガス吐出部５が上記
被封着物１０の移送ピッチで設けられている。即ちＸ−
Ｙ［９部３がＸ軸及びＹ軸両方向に駆動されると、それ
とともに上記樹脂吐出部４及び補助加熱用ホットガス吐
出部５が同時に同様に駆動される。This X-Y drive section 3 is provided with a resin discharging section 4 having a discharging needle 4a and a hot gas discharging section 5 for auxiliary heating at a transfer pitch of the object to be sealed 10. That is, X-
When the Y[9 section 3 is driven in both the X-axis and Y-axis directions, the resin discharge section 4 and the auxiliary heating hot gas discharge section 5 are simultaneously driven in the same manner.
次に、この樹脂封止装置の作用について説明する。先づ
移送装ｒ１１１を駆動し被封着物１０を所定のピッチで
図の左方から右方に順次移送する。Next, the operation of this resin sealing device will be explained. First, the transfer device r111 is driven to sequentially transfer the objects 10 to be sealed from the left to the right in the figure at a predetermined pitch.
仮りに上記封着物１０が長四辺形である場合、上記吐出
ニードル４ａが略同形の軌跡を描くように、Ｘ軸駆動用
パルスモータ１およびＹ軸駆動用パルスモータ２をそれ
ぞれ駆動させ、Ｘ−Ｙ駆動部３が同軌跡上を駆動される
ようにする。Ｘ−Ｙ駆動部３のこの駆動により、上記樹
脂吐出部４と補助加熱用ホットガス吐出部５が同時に上
記ピッチで移送される被封止物（鴎上に樹脂吐出及びホ
ットガス吹き付けを行う。If the sealed object 10 is a long quadrilateral, the X-axis driving pulse motor 1 and the Y-axis driving pulse motor 2 are respectively driven so that the discharge needle 4a draws approximately the same locus, and the X- The Y drive unit 3 is driven on the same trajectory. By this driving of the X-Y drive section 3, the resin discharging section 4 and the auxiliary heating hot gas discharging section 5 simultaneously discharge resin and spray hot gas onto the object to be sealed (the seaweed) being transferred at the above pitch.
上記ｘ−ｙ＠Ｔｏ部３の駆動軌跡は上記「口」形に代え
、ｒＸＪ形、口Ｋ」形など連続的に動作させることが好
ましい。そして又、上記被封着物１０のピッチは樹脂吐
出部４及びホットガス吐出部５のピッチと同一であるも
のに限らず相互に整数倍の関係にあれば良い。It is preferable that the driving locus of the x-y@To section 3 be continuously operated such as an rXJ shape or a "K" shape instead of the "mouth" shape. Furthermore, the pitch of the objects to be sealed 10 does not have to be the same as the pitches of the resin discharge section 4 and the hot gas discharge section 5, but may be an integral multiple of each other.
上述の如くして、吐出された封止樹脂は、被封着物表面
上に拡げられ、補助加熱用ホットガス吐出部５が同軌跡
上を動作して封止樹脂上に噴射される。As described above, the discharged sealing resin is spread over the surface of the object to be sealed, and the auxiliary heating hot gas discharge section 5 moves on the same trajectory and is injected onto the sealing resin.
これにより、封止樹脂が適切に拡げられるとともに、こ
のホットガスにより封止樹脂の温度上昇も均一化される
。そして当然ホットガスの吐出量が少なくて済み、必要
以上にホットガス温度を上昇させなくても良い。Thereby, the sealing resin is appropriately expanded, and the temperature rise of the sealing resin is also made uniform by this hot gas. Naturally, the amount of hot gas discharged can be small, and there is no need to increase the hot gas temperature more than necessary.
そして更に上記例示の長方形状の樹脂封止は、被樹脂封
着物に対してその角部まで樹脂封止が行きわたり効率的
である。Furthermore, the above-mentioned rectangular resin sealing is efficient because the resin sealing extends to the corners of the object to be resin-sealed.
（発明の効果）
以上詳細に説明したように、この発明によれば、樹脂吐
出部と補助加熱用ホットガス吐出部とをＸ−Ｙ軸方向に
駆動させて封止樹脂吐出及びホットガス吐出を連続的に
行い適切に封止樹脂の拡開を行うようにしたので、ホッ
トガスによる加熱温度上昇が均一化され樹脂の被覆量が
安定する。(Effects of the Invention) As described in detail above, according to the present invention, the resin discharging section and the auxiliary heating hot gas discharging section are driven in the X-Y axis direction to discharge the sealing resin and the hot gas. Since the sealing resin is spread continuously and the sealing resin is spread appropriately, the heating temperature rise due to the hot gas is made uniform and the amount of resin covered is stabilized.
さらに、ホットガス吐出量が比較的少なくて済み、その
加熱温度の伝達も均一化されるので、樹脂の拡がりが迅
速かつ均一化され、例えばＩＣチップの品質向上に著し
く寄与し得る。Furthermore, since the amount of hot gas discharged is relatively small and the heating temperature is evenly transmitted, the resin spreads quickly and uniformly, which can significantly contribute to improving the quality of IC chips, for example.
図はこの発明の樹脂封止方法の実施に使用される樹脂吐
出装置の斜視図である。
１・・・Ｘ軸ｗＡｗＩＪ用パルスモータ、２・・・Ｙ軸
駆動用パルスモータ、３・・・Ｘ−Ｙ駆動部、４・・・
樹脂吐出部、５・・・補助加熱用ホットガス吐出部、１
０・・・被封着物、１１・・・移送装置。The figure is a perspective view of a resin discharging device used to implement the resin sealing method of the present invention. 1... Pulse motor for X-axis wAwIJ, 2... Pulse motor for Y-axis drive, 3... X-Y drive unit, 4...
Resin discharge part, 5... Hot gas discharge part for auxiliary heating, 1
0...Object to be sealed, 11...Transfer device.
Claims (1)
で移送する工程と、該被樹脂封止物上の樹脂吐出部をＸ
−Ｙ駆動部によりＸ−Ｙ軸方向に駆動させて被樹脂封止
物表面に封止剤樹脂を吐出する工程と、上記Ｘ−Ｙ駆動
部上の上記被樹脂封止物の移送ピッチの範囲内に設置さ
れ上記樹脂吐出部と同一駆動される加熱用ホットガス吐
出部によりホットガスを封止剤樹脂上に吐出させる工程
とを含む硬化樹脂による樹脂封止方法。When manufacturing semiconductor devices, there is a process of transferring the resin-sealed object at a predetermined pitch, and a process of moving the resin discharging part on the resin-sealed object with an X
- A step of discharging the sealant resin onto the surface of the object to be resin-sealed by driving it in the X-Y axis direction by a Y drive section, and a transfer pitch range of the object to be resin-sealed on the X-Y drive section. A resin sealing method using a cured resin, the method comprising the step of discharging hot gas onto a sealant resin by a heating hot gas discharging section installed within the mold and driven in the same manner as the resin discharging section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15343487A JPS63318131A (en) | 1987-06-22 | 1987-06-22 | Resin sealing method using hardening resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15343487A JPS63318131A (en) | 1987-06-22 | 1987-06-22 | Resin sealing method using hardening resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63318131A true JPS63318131A (en) | 1988-12-27 |
Family
ID=15562436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15343487A Pending JPS63318131A (en) | 1987-06-22 | 1987-06-22 | Resin sealing method using hardening resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63318131A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416573A1 (en) * | 1989-09-05 | 1991-03-13 | Kabushiki Kaisha Toshiba | Resin sealing type semiconductor device having outer leads designed for multi-fonctions |
| CN103737777A (en) * | 2013-12-20 | 2014-04-23 | 玉托英 | Automatic pouring PU (Polyurethane) earplug manufacturing device |
-
1987
- 1987-06-22 JP JP15343487A patent/JPS63318131A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416573A1 (en) * | 1989-09-05 | 1991-03-13 | Kabushiki Kaisha Toshiba | Resin sealing type semiconductor device having outer leads designed for multi-fonctions |
| US5031024A (en) * | 1989-09-05 | 1991-07-09 | Kabushiki Kaisha Toshiba | Resin sealing type semiconductor device having outer leads designed for multi-functions |
| CN103737777A (en) * | 2013-12-20 | 2014-04-23 | 玉托英 | Automatic pouring PU (Polyurethane) earplug manufacturing device |
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