JPS63317266A - Manufacture of contact chip for resistance welding - Google Patents
Manufacture of contact chip for resistance weldingInfo
- Publication number
- JPS63317266A JPS63317266A JP15317287A JP15317287A JPS63317266A JP S63317266 A JPS63317266 A JP S63317266A JP 15317287 A JP15317287 A JP 15317287A JP 15317287 A JP15317287 A JP 15317287A JP S63317266 A JPS63317266 A JP S63317266A
- Authority
- JP
- Japan
- Prior art keywords
- contact chip
- welding
- contact
- chip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910052580 B4C Inorganic materials 0.000 claims abstract description 6
- 229910021538 borax Inorganic materials 0.000 claims abstract description 6
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004328 sodium tetraborate Substances 0.000 claims abstract description 6
- 235000010339 sodium tetraborate Nutrition 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 4
- 229910052845 zircon Inorganic materials 0.000 claims description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 description 14
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910007948 ZrB2 Inorganic materials 0.000 description 1
- WCERXPKXJMFQNQ-UHFFFAOYSA-N [Ti].[Ni].[Cu] Chemical compound [Ti].[Ni].[Cu] WCERXPKXJMFQNQ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- JUVGUSVNTPYZJL-UHFFFAOYSA-N chromium zirconium Chemical compound [Cr].[Zr] JUVGUSVNTPYZJL-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B23K35/402—Non-consumable electrodes; C-electrodes
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
本発明は抵抗溶接用コンタクトチップの製造方法に係り
、特に溶接時に発生するスパッタの付着を防止し、耐摩
耗性を向上させることのできるコンタクトチップの製造
方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of manufacturing a contact tip for resistance welding, and particularly to a contact tip that can prevent adhesion of spatter generated during welding and improve wear resistance. This invention relates to a method for manufacturing a chip.
従来、アーク溶接やスポット溶接などの抵抗溶接におい
て使用される溶接電極は、主として０．６％乃至１．２
％程度のＣｒを含有するクロム銅、もしくはこれにＺｒ
を混入したクロムジルコニウム鋼によって形成されてい
た。これらは一般に析出硬化型鋼合金と呼ばれており、
熱処理により鋼中にＣｒあるいはＣｕ、Ｃｒ を析出
させ、強度を向上させていた。Conventionally, welding electrodes used in resistance welding such as arc welding and spot welding mainly contain 0.6% to 1.2%
% of Cr, or Zr.
It was made of chromium zirconium steel mixed with. These are generally called precipitation hardening steel alloys.
Heat treatment precipitates Cr or Cu, Cr2 into the steel to improve its strength.
また、チップの表面硬度を高くしスパッタの付着を少な
くするために、実開昭６１−７７１７５号公報によって
開示されたようにチップを硬質セラミックスの薄い層で
被覆したものや、特開昭６１−１１１７８３号公報によ
って開示されたように熱伝導度がよく、かつ低熱膨張係
数の導電セラミックスを用いたものが知られている。In addition, in order to increase the surface hardness of the chip and reduce the adhesion of spatter, there are methods in which the chip is coated with a thin layer of hard ceramic as disclosed in Japanese Utility Model Application No. 61-77175, and As disclosed in Japanese Patent No. 111783, a device using a conductive ceramic having good thermal conductivity and a low coefficient of thermal expansion is known.
さらにまた、特開昭５７−２０５９１８号公報、特開昭
５７−２０７１６７号公報、特公昭６２−２６２７号公
報によってそれぞれ開示されたように、銅合金の表層部
に硼化物よりなる微細な粒子を形成して、耐摩耗性のす
ぐれた電気接点材料を作成した提案も知られている。Furthermore, as disclosed in JP-A-57-205918, JP-A-57-207167, and JP-A-62-2627, fine particles made of boride are added to the surface layer of a copper alloy. Proposals are also known in which electrical contact materials with excellent abrasion resistance are created by forming.
しかしながら、前記析出硬化型銅合金は、加温すると銅
素地中にＣｒまたはＣｕ、Ｃｒ の析出相が溶は込ん
でしまうため軟化現象が生じる。However, when the precipitation hardening type copper alloy is heated, the precipitated phase of Cr or Cu or Cr 2 melts into the copper matrix, causing a softening phenomenon.
一方、アーク溶接においてはその溶接箇所が千数百℃に
もなり、この部分からの副射熱により溶接電極は順次高
温になるため、ＣｒまたはＣｕ、Ｃｒ 相が銅素地中に
溶は込み溶接！極が軟化するという問題があった。On the other hand, in arc welding, the temperature at the welding point is over 1,000 degrees Celsius, and the welding electrode gradually becomes hotter due to the side radiation from this part, so Cr or Cu, Cr phases penetrate into the copper base during welding. ! There was a problem with the poles becoming soft.
しかも、スポット溶接の場合はこの電極に対して垂直負
荷がかかり、アーク溶接の場合は溶接ワイヤが通過する
ため水平負荷がかかるため、上記のように軟化が進行す
ると電極の損偏が増大していく欠点があった。−
また、銅合金の表面にＣＶＤまたはＰＶＤ処理により数
乃至数十ミクロンのセラミックス層を一層または複数層
形成する場合も、この処理中に銅の軟化現象が発生する
ため、表面硬度を上げることはできるが、飛散する高熱
スパッタの突入溶融に対して、またアーク溶接の場合の
ワイヤ摺接部全面の摩耗に対しては充分に対応できない
という開運があった。Moreover, in the case of spot welding, a vertical load is applied to this electrode, and in the case of arc welding, a horizontal load is applied as the welding wire passes through it, so as the softening progresses as described above, the loss of the electrode increases. There were some drawbacks. - Also, when forming one or more ceramic layers of several to tens of microns on the surface of a copper alloy by CVD or PVD treatment, it is difficult to increase the surface hardness because the copper softens during this treatment. However, it is not possible to sufficiently cope with the inrush melting of flying high-temperature spatter and the wear of the entire surface of the wire sliding contact area in the case of arc welding.
さらに、この場合例えば窒化チタンのセラミックス層で
数μ銅基材を被覆した場合は銅基材のみの場合に比べて
２乃至３％給電率が低下するという欠点もあった。また
溶接電極全体を導電セラミックスで形成する場合は、耐
摩耗性の向上及びスパッタ付着防止の効果はあるが、材
料コスト及び加工コストが著しく高くなり、多量に使用
する場合には必ずしもコストバランスが充分とれろとは
言えなかった。Furthermore, in this case, for example, when a copper base material of several μm is coated with a ceramic layer of titanium nitride, there is a drawback that the power supply rate is reduced by 2 to 3% compared to the case where only the copper base material is used. In addition, when the entire welding electrode is made of conductive ceramics, it has the effect of improving wear resistance and preventing spatter adhesion, but the material cost and processing cost are significantly higher, and the cost balance is not necessarily sufficient when used in large quantities. I couldn't tell you to take it.
さらに銅合金の表層部に硼化物よりなる微細な粒子を形
成させる方法は、比抵抗の小さい電気接点材料を作成す
るためのものであり、これはセラミック粒子であるため
安定的に存在し、分散強化が弱められることがない。Furthermore, the method of forming fine particles of boride on the surface layer of copper alloy is used to create electrical contact materials with low resistivity.Since these are ceramic particles, they exist stably and are dispersed. The reinforcement is never weakened.
本発明は上記事情に鑑みてなされたものであり。The present invention has been made in view of the above circumstances.
スパッタ粒子の付着を防止し耐久性を向上させることの
できる抵抗溶接用コンタクトチップの製造方法を提供す
ることを目的とする。An object of the present invention is to provide a method for manufacturing a contact tip for resistance welding that can prevent adhesion of sputtered particles and improve durability.
本発明は上記目的を達成するために、ジルコン。 In order to achieve the above object, the present invention provides zircon.
ニッケル、チタンのうち１種または２種以上を含み、残
部が銅を主成分とする銅合金である金属材料を胴震する
第１の工程と、該金属材料をコンタクトチップの形状に
加工してコンタクトチップ素材を形成する第２の工程と
、該コンタクトチップ素材を硼砂及び炭化硼素粉末を含
む硼化処理浴中に浸漬し、加熱して硼化処理を行なう第
３の工程とにより抵抗溶接用コンタクトチップを製造す
る方法である。A first step of shaking a metal material, which is a copper alloy containing one or more of nickel and titanium, with the remainder being copper as a main component, and processing the metal material into the shape of a contact tip. A second step of forming a contact tip material, and a third step of immersing the contact tip material in a boriding bath containing borax and boron carbide powder, heating it, and performing a boriding treatment for resistance welding. This is a method of manufacturing a contact chip.
上記の方法によると、コンタクトチップ素材を硼砂及び
炭化硼素粉末を含む硼化処理浴中に浸漬し、約９５０℃
の高温で約４時間の硼化処理によって表面から約４０μ
ｍの深さまでジルコン、ニッケル、チタンのうち少なく
とも１つのポライドを分散させることができ、耐摩耗性
を向上させスパッタの付着性を低下することができる。According to the above method, a contact chip material is immersed in a boriding bath containing borax and boron carbide powder, and heated to approximately 950°C.
Approximately 40 μm is removed from the surface by boriding treatment at a high temperature for approximately 4 hours.
At least one of zircon, nickel, and titanium poride can be dispersed to a depth of m, thereby improving wear resistance and reducing sputter adhesion.
以下、本発明に係る抵抗溶接用コンタクトチップの製造
方法の実施例を図面を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for manufacturing a contact tip for resistance welding according to the present invention will be described with reference to the drawings.
実施例１゜
第１の工程において、Ｃｕ９４重量％とＺｒ６重量％と
を溶解してジルコニウム鋼合金を作成する０次に第２の
工程で通常のプレス加工及び切削加工により、第１図に
示すようなコンタクトチップ形状に加工する。このチッ
プは本体１の中心に軸方向に内径が約１．２ｍの溶接ワ
イヤ通過孔２が形成されており、一端に図示せぬトーチ
本体に取付けるための外径ねじ３が形成されている。Example 1 In the first step, 94% by weight of Cu and 6% by weight of Zr are melted to create a zirconium steel alloy.Next, in the second step, ordinary press working and cutting are performed to create the alloy shown in Fig. 1. It is processed into a contact chip shape like this. This tip has a welding wire passing hole 2 with an inner diameter of about 1.2 m formed in the axial direction at the center of the main body 1, and an outer diameter screw 3 for attachment to a torch main body (not shown) is formed at one end.
このように形成されたコンタクトチップ素材を第３の工
程において、硼砂６０重量％と粒径約３５μｍの炭化硼
素４０重量％とからなる硼化処理浴中に浸漬し、約９５
０℃で約４時間硼化処理を行なう。In the third step, the contact chip material thus formed is immersed in a boriding bath consisting of 60% by weight of borax and 40% by weight of boron carbide having a grain size of about 35 μm.
Boriding treatment is carried out at 0° C. for about 4 hours.
このようにして作成されたチップの断面のセラミック層
を測定した結果、約４０μｍの深さまでジルコンポライ
ドＺｒＢ２のセラミックス粒子が分散されていることが
確認された。As a result of measuring the ceramic layer of the cross section of the chip thus produced, it was confirmed that ceramic particles of zirconporide ZrB2 were dispersed to a depth of about 40 μm.
実施例２゜
第１の工程において、Ｃｕ８０重量％とＮｉ１５重量％
とＴｉ５重量％とを溶解してニッケルチタン銅合金を作
成する。第２．第３の工程は前記実施例１と同様である
。Example 2 In the first step, 80% by weight of Cu and 15% by weight of Ni
A nickel-titanium-copper alloy is prepared by melting and 5% by weight of Ti. Second. The third step is the same as in the first embodiment.
このようにして作成されたチップの断面のセラミック層
を測定した結果、ニッケルポライドＮｉ、Ｂ 及びチタ
ンポライドＴｉＢ、のセラミックス粒子が約３８μｍの
深さまで分散されていることが確認された。As a result of measuring the ceramic layer of the cross section of the chip thus produced, it was confirmed that ceramic particles of nickel polide Ni, B and titanium polide TiB were dispersed to a depth of about 38 μm.
次に上記各実施例によって作成されたチップと従来のク
ロム鋼合金製のチップとを比較したアーク溶接実験結果
を以下に示す。Next, the results of an arc welding experiment comparing the tips made according to each of the above embodiments and a conventional tip made of a chromium steel alloy are shown below.
これらのチップを用い、溶接条件を２２ｖ−２２ＯＡ、
使用ワイヤφ１．２ｎｏ、ワイヤ供給速度４０ ａａ／
ｓｅｅ 、Ｉ Ｏ分ＯＮ５分ＯＦＦとして溶接作業を繰
り返して、８時間使用後のチップ先端の開孔径を測定し
た結果、従来のクロム鋼合金チップでは１８０％乃至２
４０％へと大きくなったが、本実施例によるチップでは
１１５％乃至１２０％に大きくなっただけであり、耐久
性は５倍乃至７倍になった。Using these tips, welding conditions were 22v-22OA,
Wire used: φ1.2no, wire feeding speed: 40 aa/
See, I Welding was repeated with O minutes ON and 5 minutes OFF, and the opening diameter at the tip of the tip after 8 hours of use was measured. As a result, the diameter of the opening at the tip of the tip was 180% to 2
However, in the chip according to this example, the increase was only 115% to 120%, and the durability was increased by 5 to 7 times.
また、従来のクロム鋼合金のコンタクトチップでは、表
面に鉄のスパッタ粒子が付着すると落ちにくく除去が困
難であったが、表面にセラミック分散層をもった本実施
例によるチップではスパッタの付着反応性が小さく除去
作業が容易になった。In addition, with conventional chromium steel alloy contact tips, if iron sputter particles adhered to the surface, they were difficult to remove and were difficult to remove, but with the chip according to this example, which has a ceramic dispersion layer on the surface, the adhesion of sputter particles is difficult to remove. is smaller and easier to remove.
これはセラミックス分散効果により耐摩耗性が向上し、
鉄にぬれにくいとされる硼化物が表面にあるため耐反応
性も向上した結果と思われる。This improves wear resistance due to the ceramic dispersion effect,
This is thought to be the result of improved reaction resistance due to the presence of boride on the surface, which is said to be difficult to wet with iron.
なお、チップの開孔径は２００％位にまで大きくなると
、溶接ワイヤがチップ先端部で振れ廻り溶接線のずれが
発生して品位低下を招くため、開孔径は一般に２００％
が使用限界である。In addition, when the opening diameter of the tip increases to about 200%, the welding wire swings around at the tip of the tip, causing a shift in the weld line and degrading the quality.
is the limit of use.
上述した実施例では溶接ワイヤを用いたアーク溶接用チ
ップについて説明したが、スポット溶接に本実施例によ
り形成されたコンタクトチップを使用した場合も、耐久
性及びスパッタ付着防止効果を向上させることができる
。また導電率もセラミック被覆した場合のように低下す
ることはない。In the above-mentioned embodiment, a tip for arc welding using a welding wire was described, but when a contact tip formed according to this embodiment is used for spot welding, the durability and spatter adhesion prevention effect can also be improved. . Furthermore, the electrical conductivity does not decrease as in the case of ceramic coating.
さらに、本実施例によれば銅素地中に（ｕ、Ｃｒのよう
な金属化合物がないので、銅素地中にこれらの金属化合
物が再び溶は込むことがなく、チップが加温されてもセ
ラミック粒子であるため安定して存在し、分散強化が弱
められることはない。Furthermore, according to this example, since there are no metal compounds such as (U, Cr, etc.) in the copper base, these metal compounds will not melt into the copper base again, and even if the chip is heated, the ceramic Since it is a particle, it exists stably and the dispersion strengthening is not weakened.
またチップの表面層に硼化物拡散ができるので、セラミ
ックス分散型の銅系素材が作成でき、表面層の硬度も高
くなってチップ寿命を延ばすことができる。Furthermore, since boride can be diffused into the surface layer of the chip, a ceramic-dispersed copper-based material can be created, and the hardness of the surface layer can be increased, extending the life of the chip.
上述したように本発明によれば、ジルコン、ニッケル、
チタンのうち少なくとも１種を含む銅合金でコンタクト
チップを形成し、これを硼化処理洛中に浸漬加熱して硼
化処理を行なったので、セラミック分散効果により硬度
及び耐摩耗性が向上し、鉄にぬれにくい硼化物が表面に
あるため耐反応性が向上し、溶接時に発生するスパッタ
の付着を防止することができるとともに、耐久性を著し
く向上させることができる。As described above, according to the present invention, zircon, nickel,
The contact tip was formed from a copper alloy containing at least one type of titanium, and was immersed and heated in a boriding solution to improve hardness and wear resistance due to the ceramic dispersion effect. Since the surface contains boride, which is difficult to wet with water, the reaction resistance is improved, and the adhesion of spatter generated during welding can be prevented, and durability can be significantly improved.
第１図は本発明に係る抵抗溶接用コンタクトチップの製
造方法によって製造されたコンタクトチップの一例を示
す一部断面側面図である。
１・・・コンタクトチップ本体。FIG. 1 is a partially sectional side view showing an example of a contact tip manufactured by the method of manufacturing a contact tip for resistance welding according to the present invention. 1...Contact chip body.
Claims (2)
種以上を含み、残部が銅を主成分とする銅合金である金
属材料を調製する第１の工程と、該金属材料をコンタク
トチップの形状に加工してコンタクトチップ素材を形成
する第２の工程と、該コンタクトチップ素材を硼砂及び
炭化硼素粉末を含む硼化処理浴中に浸漬し、加熱して硼
化処理を行なう第３の工程とよりなることを特徴とする
抵抗溶接用コンタクトチップの製造方法。(1) One or two of zircon, nickel, and titanium
A first step of preparing a metal material that is a copper alloy containing at least one species and the remainder being copper as a main component, and a second step of processing the metal material into the shape of a contact chip to form a contact chip material. and a third step of immersing the contact tip material in a boriding bath containing borax and boron carbide powder, and performing boriding treatment by heating. Method.
は３時間乃至５時間であることを特徴とする特許請求の
範囲第１項記載の抵抗溶接用コンタクトチップの製造方
法。(2) The method for manufacturing a contact tip for resistance welding according to claim 1, wherein the temperature of the boriding treatment is 900° C. to 1000° C. and the time is 3 hours to 5 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15317287A JPH0787993B2 (en) | 1987-06-19 | 1987-06-19 | Method for manufacturing contact tip for resistance welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15317287A JPH0787993B2 (en) | 1987-06-19 | 1987-06-19 | Method for manufacturing contact tip for resistance welding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63317266A true JPS63317266A (en) | 1988-12-26 |
| JPH0787993B2 JPH0787993B2 (en) | 1995-09-27 |
Family
ID=15556627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15317287A Expired - Lifetime JPH0787993B2 (en) | 1987-06-19 | 1987-06-19 | Method for manufacturing contact tip for resistance welding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0787993B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5440091A (en) * | 1993-08-23 | 1995-08-08 | U.S. Dent Master, Inc. | Sheet metal working electrode and handpiece |
-
1987
- 1987-06-19 JP JP15317287A patent/JPH0787993B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5440091A (en) * | 1993-08-23 | 1995-08-08 | U.S. Dent Master, Inc. | Sheet metal working electrode and handpiece |
| US5541381A (en) * | 1993-08-23 | 1996-07-30 | U.S. Dent Master, Inc. | Sheet metal working electrode and handpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0787993B2 (en) | 1995-09-27 |
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