JPS63315574A - Method for removing binder from powder moldings - Google Patents
Method for removing binder from powder moldingsInfo
- Publication number
- JPS63315574A JPS63315574A JP62149135A JP14913587A JPS63315574A JP S63315574 A JPS63315574 A JP S63315574A JP 62149135 A JP62149135 A JP 62149135A JP 14913587 A JP14913587 A JP 14913587A JP S63315574 A JPS63315574 A JP S63315574A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- organic compound
- softening point
- binder
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 77
- 239000011230 binding agent Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims description 14
- 238000000465 moulding Methods 0.000 title abstract description 7
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 73
- 238000002844 melting Methods 0.000 claims abstract description 59
- 230000008018 melting Effects 0.000 claims abstract description 58
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 239000000047 product Substances 0.000 claims description 53
- 239000000203 mixture Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 239000012466 permeate Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 7
- 238000005336 cracking Methods 0.000 abstract description 6
- 230000008961 swelling Effects 0.000 abstract 2
- 229920005990 polystyrene resin Polymers 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 239000004200 microcrystalline wax Substances 0.000 description 5
- 235000019808 microcrystalline wax Nutrition 0.000 description 5
- 239000012188 paraffin wax Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000003350 kerosene Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 101100218970 Drosophila melanogaster borr gene Proteins 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 229920000209 Hexadimethrine bromide Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000003976 Ruta Nutrition 0.000 description 1
- 240000005746 Ruta graveolens Species 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 235000005806 ruta Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】
ｊＬＬｋ、−夏旦ユユ１
本発明は、セラミック粉末または全屈粉末に粘結剤とし
ての有機化合物を混合し、これを射出成形法、トランス
ファー成形法等の手法で成形して１！？た焼結用粉末成
形品から粘結剤を除去する方法に関するものである。[Detailed Description of the Invention] jLLk, -Xiatan Yuyu 1 The present invention involves mixing ceramic powder or total bending powder with an organic compound as a binder, and molding the mixture by a method such as injection molding or transfer molding. Do 1! ? The present invention relates to a method for removing a binder from a powder molded product for sintering.
−お び の、 。-Obino,.
近年）↑目をあびているセラミックス製品は、■セラミ
ック粉末に加熱状態で粘結剤（有機化合物）を混練し、
■得られた混合物を射出成形法によって成形し、■射出
成形品を加熱して粘結剤を分解除去し、■所定焼結温度
で加熱焼成することによって製造される。前記第三工程
■は脱脂工程と呼称され、射出成形品に含まれる粘結剤
を加熱によって完全に分解除去させる工程であり、その
加熱昇温速度が急激であると成形品の変形１割れ、ｉれ
等が発生する。従来では、この欠陥発生を防ぐために、
昇温速度を小さく抑えるか、あるいは適当な低温で長時
間の加熱を行なって対処していた。In recent years) ↑ Ceramic products that have attracted attention are: ■Ceramic powder is kneaded with a binder (organic compound) under heating.
It is manufactured by (1) molding the obtained mixture by injection molding, (2) heating the injection molded product to decompose and remove the binder, and (2) heating and firing at a predetermined sintering temperature. The third step (2) is called a degreasing step, and is a step in which the binder contained in the injection molded product is completely decomposed and removed by heating.If the heating temperature rise rate is rapid, the molded product may deform, crack, or crack. Irregularities, etc. occur. Conventionally, in order to prevent this defect from occurring,
This has been dealt with by keeping the temperature increase rate low or by heating at an appropriate low temperature for a long time.
しかしながら、成形品の肉厚がある程度人きい場合には
加熱条件を十分に制御しても欠陥が生じがちであった。However, if the wall thickness of the molded product is too thick to some extent, defects tend to occur even if the heating conditions are sufficiently controlled.
１１ ｔ るた の ｒよ −■本発明の目的
は、有機化合物を粘結剤として成形された粉末成形品か
ら、変形１割れ、膨れ等の欠陥発生を伴うことなく粘結
剤を加熱除去することである。11 t Ruta no Ryo -■ The purpose of the present invention is to remove the binder by heating from a powder molded product molded using an organic compound as a binder without causing defects such as deformation, cracking, and blistering. That's true.
この目的は、相互に完全に溶け合うことがなく、かつそ
れぞれ軟化点または融点が異なる少なくとも二種類の有
機化合物を粘結剤として成形された粉末成形品を、軟化
点または融点が最も低い有機化合物の軟化点または融点
以上の温度であって軟化点または融点が最も高い有機化
合物の軟化点または融点よりも低い温度に加熱して、溶
融した有機化合物のみを除去し、次いで軟化点または融
点が最も高い有機化合物の軟化点または融点以上の温度
に加熱して該有機化合物を粉末成形品から除去すること
によって達成される。The purpose of this is to create a powder molded product that is molded using at least two types of organic compounds as binders that do not completely dissolve in each other and have different softening or melting points. Heating to a temperature above the softening point or melting point but below the softening point or melting point of the organic compound with the highest softening point or melting point to remove only the molten organic compound, then with the highest softening point or melting point This is achieved by heating the organic compound to a temperature above the softening point or melting point of the organic compound to remove the organic compound from the powder molded article.
粘結剤を構成する有機化合物を二段階に分けて除去する
斯かる手法によれば、粘結剤の除去速度を十分小さく抑
えることができ、欠陥発生のない焼結用粉末成形品を得
ることが可能である。According to such a method of removing the organic compound constituting the binder in two stages, the removal rate of the binder can be kept sufficiently low, and a powder molded product for sintering without defects can be obtained. is possible.
粉末成形品を形成するための粉末とし又は、窒化けい素
（ＳＬ３Ｎ ＋ ）、炭化けい素（ＳＬＣ）、アルミナ
（ＡＪ２０ ｓ ）、ジルコニア（Ｚｒ Ｏ２）、窒化
アルミニウム（へＩＮ１等の粉末を挙げることができる
。As a powder for forming a powder molded article, powders such as silicon nitride (SL3N + ), silicon carbide (SLC), alumina (AJ20s), zirconia (ZrO2), aluminum nitride (IN1, etc.) may be used. Can be done.
粘結剤用の有機化合物としては、パラフィンワックス、
微晶ろう（ｌｌｉｃｒｏｃｒｙｓｔａｌｌｉｎｅ ｗａ
ｘ） 、ボリエヂレン樹脂、ボリエヂレン樹脂、ポリプ
ロピレン樹脂、尿素樹脂等を挙げることができ、これ等
を、軟化点または融点が前記条件を満たず様に適宜組合
せて使用する。Organic compounds for binders include paraffin wax,
microcrystalline wax
x) Polyethylene resins, polyethylene resins, polypropylene resins, urea resins, etc. can be mentioned, and these are used in appropriate combinations so that the softening point or melting point does not satisfy the above conditions.
溶融した粘結剤を粉末成形品から除去するに当り、次の
手法を採用することが推奨される。When removing molten binder from powder molded products, it is recommended to use the following method.
■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点または融点が異なる少なくとも二種類の有機化合物を
粘結剤として成形された粉末成形品を、該粉末成形品の
粉末組成と同一または類似組成の粉末中に置き、全体を
加熱して溶融した粘結剤を前記周囲の粉末中に拡散、浸
透させる。■ Powder molded products molded using at least two types of organic compounds that do not completely dissolve each other and have different softening points or melting points, respectively, as binders, can be molded with powder compositions that are the same or similar to the powder composition of the powder molded product. Placed in powder, the whole is heated to cause the melted binder to diffuse and permeate into the surrounding powder.
■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点または融点が異なる少なくとも二種類の有機化合物を
粘結剤として成形された粉末成形品を、軟化点または融
点が最も低い有機化合物の軟化点または融点以上の温度
であって軟化点または融点が最も高い有機化合物の軟化
点または融点よりも低い温度に加熱した液体中に浸漬し
、溶融した有機化合物のみを液体中に溶解させて除去す
る。■Powder molded products that are molded using at least two types of organic compounds that do not completely dissolve each other and have different softening points or melting points as binders, or It is immersed in a liquid heated to a temperature higher than the melting point and lower than the softening point or melting point of the organic compound with the highest softening point, and only the molten organic compound is dissolved in the liquid and removed.
■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点または融点が異なる小なくとも二種類の有機化合物を
粘結剤として成形された粉末成形品を、気圧５００トー
ルＢｏｒｒ）以下の真空中におき、第一段階として軟化
点または融点が最も低い有機化合物の軟化点または融点
以上の温度であって軟化点または融点が最も高い有機化
合物の軟化点または融点よりも低い温度に加熱して溶融
した有機化合物を気化させて除去し、第二段階として軟
化点または融点が最も高い有機化合物の軟化点または融
点以上の温度に加熱して溶融した残余の有機化合物を気
化させて除去する。■Powder molded products made using binders of at least two organic compounds that do not completely dissolve in each other and each having a different softening point or melting point are placed in a vacuum at an atmospheric pressure of 500 torr (Borr) or less. , in the first step, the organic compound is melted by heating to a temperature higher than the softening point or melting point of the organic compound with the lowest softening point or melting point, but lower than the softening point or melting point of the organic compound with the highest softening point or melting point. The compound is vaporized and removed, and in the second step, the remaining organic compound is heated to a temperature higher than the softening point or melting point of the organic compound having the highest softening point or melting point to vaporize and remove the melted remaining organic compound.
あるいは、第二段階の加熱を行うことなく、一部の有機
化合物が除去された粉末成形品を真空容器から取出して
加熱し、残余の有機化合物を除去する。Alternatively, the powder molded product from which some of the organic compounds have been removed is taken out from the vacuum container and heated to remove the remaining organic compounds without performing the second stage of heating.
■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点またはＦｊＡ魚が賃なる少なくとも二種類の有機化合
物を粘結剤として成形された粉末成形品の最小肉厚が１
０ｍｍ以上である場合には、全有機化合物中の高軟化点
または高融点を有する有機化合物の含有けを２０〜８０
Φ徂％とする。■The minimum wall thickness of a powder molded product molded using at least two types of organic compounds as binders that do not completely melt into each other and each having a softening point or FJA temperature is 1.
If it is 0 mm or more, the content of organic compounds with a high softening point or high melting point in all organic compounds should be 20 to 80 mm.
Let it be Φ徂%.
■軟化点または融点が最も低い有機化合物の軟化点また
は融点と、前記軟化点または融点が最も高い有機化合物
の軟化点または融点との温度差を１０℃〜８０℃とする
。(2) The temperature difference between the softening point or melting point of the organic compound having the lowest softening point or melting point and the softening point or melting point of the organic compound having the highest softening point or melting point is 10°C to 80°C.
項目■の手法によれば、粉末成形品中の有機化合物を加
熱溶融させて除去する間、粉末成形品が周囲の粉末によ
って背圧（支持圧）を与えられているため、粉末成形品
の変形９割れ、膨れ等の発生が効果的に防止される利点
がある。According to the method in item ■, while the organic compound in the powder molded product is removed by heating and melting, the powder molded product is given back pressure (supporting pressure) by the surrounding powder, which causes deformation of the powder molded product. There is an advantage that the occurrence of cracks, blisters, etc. can be effectively prevented.
項目■の手法によれば、粉末成形品の加熱が均等に行わ
れる、有機化合物の離脱速度が液体への溶解速度で規定
されて離脱が十分ゆっくりと行われる、相対的に低温で
溶融する有機化合物が除去される間、相対的に高温で溶
融する有機化合物によって粉末成形品の形状が保持され
る、粉末成形品が周囲の液体によって背圧（支持圧〉を
与えられている等の理由により粉末成形品の変形１割れ
。According to the method in item While the compound is removed, the shape of the powder molded product is maintained by the organic compound that melts at a relatively high temperature, and the powder molded product is given back pressure (support pressure) by the surrounding liquid, etc. Deformation and cracking of powder molded product.
膨れ等の発生が効果的に防止される利点がある。This has the advantage of effectively preventing the occurrence of blisters, etc.
項目■の手法によれば、溶解した有機化合物の気化が促
進され、有機化合物の除去を確実に行うことができる。According to the method of item (2), the vaporization of dissolved organic compounds is promoted, and the organic compounds can be reliably removed.
この場合、真空度が５００トールを越えると、常圧（大
気圧）との差が少なく気化促進効果が得られない。In this case, if the degree of vacuum exceeds 500 Torr, the difference from normal pressure (atmospheric pressure) is small and the effect of promoting vaporization cannot be obtained.
項目■の数値限定は、後記試験例１に基づいてなされた
。すなわち、肉厚１５＃ｌ１１１の粉末成形品にあつで
は、全有機化合物中の高軟化点または高融点を有する有
機化合物の含有量が２２．２重Ｍ％（４／１８）以上必
要であり、肉厚２０ｍ＋の粉末成形品にあっては、前記
含有量が２７，８重間％（５／１８）以上必要であるこ
とから、肉厚１０＃ＩＩの粉末成形品では２０重量％（
＞３／１８）を下限とした。また、前記含有ωが１７．
８重量％（１４／１８）を超えると、成形性、脱脂性が
悪化するため、８０．０重量％を上限とした。The numerical limitations for item (2) were made based on Test Example 1 described later. That is, for a powder molded product with a wall thickness of 15#l111, the content of organic compounds having a high softening point or high melting point in all organic compounds must be 22.2% by weight (4/18) or more, For a powder molded product with a wall thickness of 20 m+, the content must be at least 27.8% by weight (5/18), so for a powder molded product with a wall thickness of 10#II, the content must be 20% by weight (5/18) or more.
>3/18) was set as the lower limit. Further, the content ω is 17.
If it exceeds 8% by weight (14/18), moldability and degreasing properties deteriorate, so the upper limit was set at 80.0% by weight.
項目■で有機化合物の温度特性を数値限定したのは、粘
結剤を構成する有機化合物の軟化点または融点の差が１
０℃以下では低融点有機化合物のみを溶融させる温度を
維持するのが難しく、その差が８０℃以上では粉末の成
形性が非常に悪くなり粘結剤として不適当であるからで
ある。The reason for numerically limiting the temperature characteristics of organic compounds in item
This is because if the temperature is below 0°C, it is difficult to maintain a temperature at which only the low-melting point organic compound is melted, and if the difference is above 80°C, the moldability of the powder becomes very poor, making it unsuitable as a binder.
敏１■ユ
■セラミック粉末として、平均粒径１．ＩＭの窒化けい
素（酸化マグネシウム（８ｇＯ）を１０１ａ％含有する
）を用意した。As a ceramic powder, the average particle size is 1. IM silicon nitride (containing 101a% of magnesium oxide (8gO)) was prepared.
■粘結剤用有機化合物として、パラフィンワックスと、
その融点よりも４０℃高い軟化点を有するポリスチレン
樹脂と、ステアリン酸とを用意した。■ Paraffin wax and organic compounds for binders,
A polystyrene resin having a softening point 40° C. higher than its melting point and stearic acid were prepared.
■窒化けい素８２重量％、パラフィンワックス１１．２
重量％、ポリスチレン樹脂５重ω％およびステアリン１
１．８ｔ！［％を配合し、これを高温ニーダ−（混線機
）にて温度１５０℃で十分に混合し、押出機を用いてこ
れを細い棒状に押出しして冷却後に裁断してベレットを
得た。■Silicon nitride 82% by weight, paraffin wax 11.2%
Weight%, polystyrene resin 5w% and stearin 1
1.8t! [%], thoroughly mixed in a high temperature kneader at a temperature of 150°C, extruded into a thin rod using an extruder, cooled and cut to obtain pellets.
■得られたベレットを用い、加熱シリンダ一温度１５０
℃、射出圧力１トン／ＩＩＪ！、金型温度３０℃として
射出成形を行い、肉厚２０ｍ＋の板状粉末成形品を得た
。■Using the obtained pellet, heat the cylinder at a temperature of 150
°C, injection pressure 1 ton/IIJ! Injection molding was performed at a mold temperature of 30° C. to obtain a plate-shaped powder molded product with a wall thickness of 20 m+.
■粉末成形品を前記項目■で用意した窒化けい素粉末と
同一組成の粉末中に埋め込み、真空度０．５トール以下
の雰囲気下で、パラフィンワックスの融点とポリスチレ
ン樹脂の軟化点との中間の温度で４０時間保持した。そ
の結果、粉末成形品中のパラフィンワックスが、周囲の
粉末中への拡散。■The powder molded product is embedded in a powder having the same composition as the silicon nitride powder prepared in the above item (■), and in an atmosphere with a degree of vacuum of 0.5 torr or less, Hold at temperature for 40 hours. As a result, the paraffin wax in the powder molded product diffuses into the surrounding powder.
浸透および気化によって当初の約５０％に減少している
ことが確認された。また、粉末成形品に割れは生じなか
った。It was confirmed that the amount was reduced to about 50% of the original value due to infiltration and vaporization. Moreover, no cracks occurred in the powder molded product.
■前記項目■の処理を行なった粉末成形品を、１気圧の
窒素ガス中で、胃温速度り０℃／時間として温度５００
℃までが潟、加熱したところ、有機化合物を完全に除去
することができた。また、粉末成形品に割れは生じなか
った。■The powder molded product treated in the above item (■) was heated to a temperature of 500°C in a nitrogen gas atmosphere of 1 atm, with a stomach temperature rate of 0°C/hour.
When heated to a temperature of up to ℃, it was possible to completely remove organic compounds. Moreover, no cracks occurred in the powder molded product.
■同様な試験を、射出された板状粉末成形品の肉厚が１
５ｍ＋のちのについても行なった。また、パラフィンワ
ックスとポリスブレン樹脂の比率が前記項目■とは異な
るものについて、板状粉末成形品の肉Ｊ７を１５１ｎＭ
、２０＃ｌｌｌとして同様な試験を行なった。■A similar test was conducted when the wall thickness of the injected plate-shaped powder molded product was 1
5m+ was also carried out later. In addition, for those whose ratio of paraffin wax and polybrene resin is different from the above item (■), the flesh J7 of the plate-shaped powder molded product was
, 20#llll was used in a similar test.
以上の全試験結束を表１に示す。Table 1 shows all the above test ties.
（以下、余白） 表１ ＊注に数字はいずれも重量％である。(Hereafter, margin) Table 1 *All numbers in the notes are % by weight.
＊注２二〇は割れ発生がないことを、×は割れ発生があ
ることをそれぞれ意味している。*Note 220 means that no cracking occurred, and × means that cracking occurred.
〈試験結果の評価〉
■粉末形成品の肉厚が１５．のちのにおいては、ポリス
チレン樹脂を４重品％（有機化合物全体の２２重量％（
＝４／１８） ）以上配合する必要がある。<Evaluation of test results> ■The wall thickness of the powdered product is 15. Later, polystyrene resin was added to 4% by weight (22% by weight of all organic compounds).
=4/18)) It is necessary to mix the above.
■粉末成形品の肉厚が２０．のちのにおいては、ポリス
チレン樹脂を５重層％（有機化合物全体の２８重量％（
＝５／１８） ）以上配合する必要がある。■The wall thickness of the powder molded product is 20. Later, polystyrene resin was added at 5% by weight (28% by weight of the total organic compounds).
=5/18)) It is necessary to mix the above.
■ポリスチレン樹脂の配合色が１４重量％（有機化合物
全体の７７！ｔ！ ｍ％（＝１４／１８） ）に達する
と成形性が悪くなるだけでなく、脱脂の際に割れが生じ
るため、その配合遇を１４１１１％よりも少なくする必
要がある。■If the blended color of polystyrene resin reaches 14% by weight (77!t!m% (=14/18) of the total organic compounds), not only will the moldability deteriorate, but cracks will occur during degreasing. It is necessary to reduce the combined allowance to less than 14111%.
Ｌ監■ユ
■セラミック粉末として、平均粒径１．ＩＭの窒化けい
素（酸化マグネシウム（Ｈａｄ）を１０重量％含有する
）を用意した。As a ceramic powder, the average particle size is 1. IM silicon nitride (containing 10% by weight of magnesium oxide (Had)) was prepared.
■粘結剤用有機化合物として、微晶ろうと、その融点よ
りも４０℃高い軟化点を有するポリスチレン樹脂と、ス
テアリン酸とを用意した。(2) As an organic compound for a binder, a microcrystalline wax, a polystyrene resin having a softening point 40° C. higher than its melting point, and stearic acid were prepared.
■窒化けい素８２重量％、微晶ろう１１．２重量％、ポ
リスチレン樹脂５（酊％およびステアリン酸１．８重量
％を配合し、これを高温ニーダ−（混線機）にて温度１
５０℃で十分に混合し、押出機を用いてこれを細い棒状
に押出しして冷却後に裁断してベレットを得た。■82% by weight of silicon nitride, 11.2% by weight of microcrystalline wax, 5% by weight of polystyrene resin (5% by weight and 1.8% by weight of stearic acid), and mixed in a high-temperature kneader (mixer) at a temperature of 1.
The mixture was thoroughly mixed at 50° C., extruded into a thin rod using an extruder, cooled, and then cut to obtain pellets.
■得られたペレットを用い、加熱シリンダー塩ＩＱ １
５０℃、射出圧力１トン／ｃｉ、全型温度３０℃として
射出成形を行い、肉厚１０ｓｌＩの板状粉末成形品を得
た。■ Using the obtained pellets, heat cylinder salt IQ 1
Injection molding was performed at 50°C, injection pressure of 1 ton/ci, and total mold temperature of 30°C to obtain a plate-shaped powder molded product with a wall thickness of 10 slI.
■粉末成形品を、微晶ろうの融点とポリスチレン樹脂の
軟化点との中間の温度に維持した灯油中にａ’ ｉｌ
して４０時間放置した。その結果、粉末成形品中の微晶
ろうがほぼ１００％灯油中に溶解したことが確認された
。また、粉末成形品に割れは生じなかった。■The powder molded product is placed in kerosene maintained at a temperature between the melting point of the microcrystalline wax and the softening point of the polystyrene resin.
and left for 40 hours. As a result, it was confirmed that almost 100% of the microcrystalline wax in the powder molded product was dissolved in the kerosene. Moreover, no cracks occurred in the powder molded product.
■前記項目■の処理を行なった粉末成形品を、１気圧の
窒素ガス中で、昇温速度６０℃／時間として温度５００
℃まで昇温、加熱したところ、イｊ磯化合物を完全に除
去することができた。また、粉末成形品に割れは生じな
かった。■The powder molded product subjected to the treatment in the above item
When the temperature was raised to ℃ and heated, the Ijiso compound could be completely removed. Moreover, no cracks occurred in the powder molded product.
■試験例１における試料Ｎｏ、 ３相当品（同一条件に
て成形）を、１気圧の窒素ガス中で、昇温速度６０℃／
時間として温度５００℃まで昇温、加熱したところ、粉
末成形品全体に微細なひび割れが認められた。■A product equivalent to sample No. 3 in Test Example 1 (molded under the same conditions) was heated at a heating rate of 60°C/in nitrogen gas at 1 atm.
When the temperature was increased to 500° C. and heated, fine cracks were observed throughout the powder molded product.
几１至１１
以上の説明から明らかな様に、相互に完全に溶け合うこ
とがなく、かつそれぞれ軟化点または融点が異なる少な
くとも二種類の有機化合物を粘結剤として成形された粉
末成形品を、軟化点または融点が最も低い有機化合物の
軟化点または融点以上の温度であって軟化点または融点
が最も高い有機化合物の軟化点または融点よりも低い温
度に加熱して、溶融した有機化合物のみを除去し、次い
で軟化点または融点が最も高い有機化合物の軟化点また
は融点以上の温度に加熱して該有機化合物を除去するこ
とを特徴とする粉末成形品からの粘結剤の除去方法が提
案された。几1～11 As is clear from the above explanation, a powder molded product formed using at least two types of organic compounds that do not completely melt with each other and have different softening points or melting points as a binder can be softened. Remove only the molten organic compound by heating to a temperature that is higher than the softening point or melting point of the organic compound with the lowest softening point or melting point and lower than the softening point or melting point of the organic compound with the highest softening point or melting point. Then, a method for removing a binder from a powder molded article was proposed, which comprises heating the organic compound to a temperature higher than the softening point or melting point of the organic compound having the highest softening point or melting point to remove the organic compound.
斯様に、粘結剤を構成する有機化合物を二段階に分けて
加熱、除去するならば、粘結剤の除去速度を十分小さく
抑えることができ、変形１割れ。In this way, if the organic compound constituting the binder is heated and removed in two stages, the removal rate of the binder can be kept sufficiently low, resulting in less deformation.
膨れ等の欠陥発生のない粉末成形品を得ることが可能で
ある。It is possible to obtain powder molded products without defects such as blisters.
なお、本発明は、セラミックス用粉末成形品に限らず粉
末冶金用予備成形品の製造にも適用され得るものである
。Note that the present invention can be applied not only to the production of powder molded products for ceramics but also to the production of preformed products for powder metallurgy.
Claims (6)
軟化点または融点が異なる少なくとも二種類の有機化合
物を粘結剤として成形された粉末成形品を、軟化点また
は融点が最も低い有機化合物の軟化点または融点以上の
温度であって軟化点または融点が最も高い有機化合物の
軟化点または融点よりも低い温度に加熱して、溶融した
有機化合物のみを除去し、次いで軟化点または融点が最
も高い有機化合物の軟化点または融点以上の温度に加熱
して該有機化合物を除去することを特徴とする粉末成形
品からの粘結剤の除去方法。(1) A powder molded product that is molded using at least two types of organic compounds that do not completely dissolve each other and have different softening points or melting points as a binder, is made by softening the organic compound with the lowest softening point or melting point. The organic compound with the highest softening point or melting point is removed by heating to a temperature above the softening point or melting point of the organic compound with the highest softening point or melting point, and then the organic compound with the highest softening point or melting point is removed. A method for removing a binder from a powder molded article, which comprises removing the organic compound by heating to a temperature higher than the softening point or melting point of the compound.
一または類似組成の粉末中に置き、全体を加熱して溶融
した粘結剤を前記周囲の粉末中に拡散、浸透させること
を特徴とする特許請求の範囲第１に記載された粉末成形
品からの粘結剤の除去方法。(2) The powder molded product is placed in a powder having the same or similar powder composition to that of the powder molded product, and the whole is heated to cause the melted binder to diffuse and permeate into the surrounding powder. A method for removing a binder from a powder molded article according to claim 1.
有機化合物の軟化点または融点以上の温度であって軟化
点または融点が最も高い有機化合物の軟化点または融点
よりも低い温度に加熱した液体中に浸漬し、溶融した有
機化合物のみを液体中に溶解させて除去することを特徴
とする特許請求の範囲第１項に記載された粉末成形品か
らの粘結剤の除去方法。(3) The powder molded article was heated to a temperature that was higher than the softening point or melting point of the organic compound having the lowest softening point or melting point and lower than the softening point or melting point of the organic compound having the highest softening point or melting point. A method for removing a binder from a powder molded article according to claim 1, which comprises immersing it in a liquid and dissolving only the molten organic compound in the liquid to remove it.
におき、溶融した有機化合物を気化させて除去すること
を特徴とする特許請求の範囲第１項に記載された粉末成
形品からの粘結剤の除去方法。(4) The powder molded product is placed in a vacuum with an atmospheric pressure of 500 torr or less, and the molten organic compound is vaporized and removed. How to remove binder.
、全有機化合物中の高軟化点または高融点を有する有機
化合物の含有量が２０〜８０重量％であることを特徴と
する特許請求の範囲第１項に記載された粉末成形品から
の粘結剤の除去方法。(5) A patent claim characterized in that the minimum wall thickness of the powder molded product is 10 mm or more, and the content of organic compounds having a high softening point or high melting point in all organic compounds is 20 to 80% by weight. A method for removing a binder from a powder molded product as described in Item 1.
化点または融点と、前記軟化点または融点が最も高い有
機化合物の軟化点または融点との温度差が１０℃〜８０
℃であることを特徴とする特許請求の範囲第１項に記載
された粉末成形品からの粘結剤の除去方法。(6) The temperature difference between the softening point or melting point of the organic compound having the lowest softening point or melting point and the softening point or melting point of the organic compound having the highest softening point or melting point is 10°C to 80°C.
A method for removing a binder from a powder molded article according to claim 1, wherein the temperature is .degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62149135A JPS63315574A (en) | 1987-06-17 | 1987-06-17 | Method for removing binder from powder moldings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62149135A JPS63315574A (en) | 1987-06-17 | 1987-06-17 | Method for removing binder from powder moldings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63315574A true JPS63315574A (en) | 1988-12-23 |
Family
ID=15468509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62149135A Pending JPS63315574A (en) | 1987-06-17 | 1987-06-17 | Method for removing binder from powder moldings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63315574A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06122902A (en) * | 1992-06-02 | 1994-05-06 | Advanced Materials Technol Pte Ltd | Injection-moldable metallic material, and production of injection-molded metallic article |
-
1987
- 1987-06-17 JP JP62149135A patent/JPS63315574A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06122902A (en) * | 1992-06-02 | 1994-05-06 | Advanced Materials Technol Pte Ltd | Injection-moldable metallic material, and production of injection-molded metallic article |
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