JPS633148U - - Google Patents
Info
- Publication number
- JPS633148U JPS633148U JP9723586U JP9723586U JPS633148U JP S633148 U JPS633148 U JP S633148U JP 9723586 U JP9723586 U JP 9723586U JP 9723586 U JP9723586 U JP 9723586U JP S633148 U JPS633148 U JP S633148U
- Authority
- JP
- Japan
- Prior art keywords
- thin metal
- metal wire
- bonding device
- clamper
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims 2
- 229920002379 silicone rubber Polymers 0.000 claims 2
- 239000004945 silicone rubber Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例を示す主要部の平
面図、第２図は従来装置を示す主要部の斜視図で
ある。 図において、２Ａ，４Ａは１対のクランパ、９
は金属細線である。なお、各図中同一符号は同一
部分を示す。
面図、第２図は従来装置を示す主要部の斜視図で
ある。 図において、２Ａ，４Ａは１対のクランパ、９
は金属細線である。なお、各図中同一符号は同一
部分を示す。
Claims (1)
- 【実用新案登録請求の範囲】 (1) ２点間を金属細線を用いて電気的接続し、
接続完了後前記金属細線を１対のクランパにより
クランプし、前記金属細線の先端を引きちぎる構
造を持つワイヤボンデイング装置において、前記
クランパの少なくとも前記金属細線と係合する部
分を前記金属細線の硬度より柔らかい材料により
形成したことを特徴とするワイヤボンデイング装
置。 (2) クランパの少なくとも金属細線と係合する
部分を、金属細線の硬度より柔らかい材質でかつ
導電性を有する材料とした実用新案登録請求の範
囲第１項記載のワイヤボンデイング装置。 (3) クランパが、シリコンゴムにより被覆され
たものである実用新案登録請求の範囲第１項記載
のワイヤボンデイング装置。 (4) クランパが、シリコンゴムにより形成され
たものである実用新案登録請求の範囲第１項記載
のワイヤボンデイング装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9723586U JPS633148U (ja) | 1986-06-25 | 1986-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9723586U JPS633148U (ja) | 1986-06-25 | 1986-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633148U true JPS633148U (ja) | 1988-01-11 |
Family
ID=30963985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9723586U Pending JPS633148U (ja) | 1986-06-25 | 1986-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633148U (ja) |
-
1986
- 1986-06-25 JP JP9723586U patent/JPS633148U/ja active Pending