JPS6331301Y2 - - Google Patents
Info
- Publication number
- JPS6331301Y2 JPS6331301Y2 JP1981139097U JP13909781U JPS6331301Y2 JP S6331301 Y2 JPS6331301 Y2 JP S6331301Y2 JP 1981139097 U JP1981139097 U JP 1981139097U JP 13909781 U JP13909781 U JP 13909781U JP S6331301 Y2 JPS6331301 Y2 JP S6331301Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- insulating layer
- resistant resin
- acrylic resin
- varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004925 Acrylic resin Substances 0.000 claims description 10
- 229920000178 Acrylic resin Polymers 0.000 claims description 10
- 229920006015 heat resistant resin Polymers 0.000 claims description 10
- 239000002966 varnish Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Description
【考案の詳細な説明】
本考案は、巻線として好適の絶縁電線に関す
る。アクリル系樹脂は、電気特性が良好であり、
かつ、ワニス塗布焼付や電着塗布焼付など種々の
方法で導体上に容易に施すことができる長所を有
する反面、耐熱性にやゝ劣る問題がある。アクリ
ル系樹脂絶縁層の耐熱性を改善するために、該絶
縁層の上に、有機溶媒ワニスと比較して安価な水
系の耐熱性樹脂ワニスを用いて耐熱性樹脂層を形
成する試みを行つたところ、一般にアクリル系樹
脂層は、そのもとになるワニス中に常に含まれて
いる界面活性剤を含むため、この界面活性剤がア
クリル系樹脂層の表面に移行して一般に表面張力
の大きい水系ワニスを撥き、この結果、均一な耐
熱性樹脂層がアクリル系樹脂層上に形成され難い
問題がある。
上記に鑑み、本考案はかゝる問題の解消された
新規な絶縁電線を提案するものであつて、アクリ
ル系樹脂からなる絶縁層の上に、表面張力低下剤
を少量含む耐熱性樹脂の水系ワニスを用いて耐熱
性樹脂絶縁層を形成してなることを特徴とするも
のである。
本考案においては、耐熱性樹脂、たとえば、ポ
リアミド、ポリイミド、ポリアミド、ポリエステ
ルイミド、ポリウレタン、ポリエステルなどを水
に分散させた、あるいは水に溶解させてなる水系
ワニスとして、少量の表面張力低下剤たとえば、
水希釈性のシリコン樹脂を水系ワニス中に0.1〜
５％（重量％、以下、同様）程度含有するものを
用いる。該ワニスは、表面張力が小さいのでアク
リル系樹脂絶縁層上に撥かれることなく通常の方
法により均一に塗布することができ、而して塗布
層を焼付けることにより表面平滑な均一層を形成
することができる。本考案においては、アクリル
系樹脂絶縁層としては残留界面活性剤を含むすべ
てのものを対象とすることができる。
下表に各種実施例、比較例の電線構造と、耐熱
性樹脂層の性状をまとめて示す。この表より本考
案の顕著な効果が理解されよう。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulated wire suitable for winding. Acrylic resin has good electrical properties,
Although it has the advantage of being easily applied to conductors by various methods such as varnish coating and baking and electrodeposition coating and baking, it has the problem of somewhat inferior heat resistance. In order to improve the heat resistance of the acrylic resin insulating layer, we attempted to form a heat-resistant resin layer on the insulating layer using a water-based heat-resistant resin varnish, which is cheaper than organic solvent varnish. However, since the acrylic resin layer generally contains a surfactant that is always included in the varnish that forms the base, this surfactant migrates to the surface of the acrylic resin layer and is generally aqueous with a high surface tension. There is a problem in that the varnish is repelled, and as a result, it is difficult to form a uniform heat-resistant resin layer on the acrylic resin layer. In view of the above, the present invention proposes a new insulated wire that eliminates such problems, and consists of an insulating layer made of acrylic resin and an aqueous heat-resistant resin containing a small amount of surface tension reducing agent. It is characterized by forming a heat-resistant resin insulating layer using varnish. In the present invention, a water-based varnish is prepared by dispersing or dissolving a heat-resistant resin such as polyamide, polyimide, polyamide, polyesterimide, polyurethane, polyester, etc. in water, and a small amount of surface tension reducing agent, such as
Add water-dilutable silicone resin to water-based varnish from 0.1 to 0.1
A material containing approximately 5% (weight %, hereinafter the same) is used. Since the varnish has a low surface tension, it can be uniformly applied onto the acrylic resin insulating layer by a normal method without being repelled, and by baking the applied layer, a uniform layer with a smooth surface is formed. be able to. In the present invention, any acrylic resin insulating layer containing residual surfactant can be used as the acrylic resin insulating layer. The table below summarizes the electric wire structures of various examples and comparative examples and the properties of the heat-resistant resin layer. From this table, the remarkable effects of the present invention can be understood. 【table】
付図は本考案実施例の断面図であつて、１は導
体、２はアルクリル系樹脂絶縁層、３は耐熱性樹
脂層。
The attached figure is a cross-sectional view of an embodiment of the present invention, in which 1 is a conductor, 2 is an alkrylic resin insulating layer, and 3 is a heat-resistant resin layer.
Claims (1)
上に、表面張力低下剤を少量含む耐熱性樹脂の水
系ワニスを用いて耐熱性樹脂絶縁層を形成してな
ることを特徴とする絶縁電線。 An insulated wire characterized in that a heat-resistant resin insulating layer is formed on a baked insulating layer made of acrylic resin using a heat-resistant resin water-based varnish containing a small amount of a surface tension reducing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13909781U JPS5843717U (en) | 1981-09-18 | 1981-09-18 | insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13909781U JPS5843717U (en) | 1981-09-18 | 1981-09-18 | insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5843717U JPS5843717U (en) | 1983-03-24 |
| JPS6331301Y2 true JPS6331301Y2 (en) | 1988-08-22 |
Family
ID=29932300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13909781U Granted JPS5843717U (en) | 1981-09-18 | 1981-09-18 | insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5843717U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50140882A (en) * | 1974-05-02 | 1975-11-12 |
-
1981
- 1981-09-18 JP JP13909781U patent/JPS5843717U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50140882A (en) * | 1974-05-02 | 1975-11-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5843717U (en) | 1983-03-24 |
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