JPH0236680B2 - KOSHUHASENRINYOZETSUENDENSENNOSEIZOHO - Google Patents

Description

[Detailed description of the invention]

[Industrial Field of Application] The present invention relates to a method for manufacturing insulated wires for circuit components that require high frequency characteristics. [Conventional technology] Insulated wires are made by plating pure iron ferromagnetic material on copper wires, then coating and baking enamel insulating resin on them.
It is known that when this is used as a high-frequency coil winding, the high-frequency gain Q can be improved. In particular, insulated wires made of nickel-plated pure iron wires have been put to practical use because they have the above-mentioned high-frequency characteristics as well as solderability. (Utility Model Publication No. 42-1339) [Problems to be solved by the invention] In recent years, as high-frequency circuit components have become lighter, thinner, shorter, and more sophisticated, the insulated wires used have also become smaller in diameter and have even better Q characteristics. More and more things are being demanded. conventionally,
An insulated wire is used, which is made by plating pure iron on a copper wire with a wire diameter of 0.12 to 0.18 mmφ, and forming a nickel plating layer of 0.1 to 0.5 μ thick on top of the copper wire. It had been achieved.
However, as diameters become smaller and wire diameters reach 0.03 to 0.10 mmφ, when nickel plating is applied to the same thickness as before through a pure iron plating layer, the plating thickness becomes relatively large. Therefore, the improvement effect in Q characteristics cannot be obtained as much as in the conventional case. Therefore, when the thickness of this nickel plating layer is reduced to less than 0.1 μm, the Q characteristic is greatly improved as shown in FIG. A, B, and C in the figure are pure iron plating applied to copper wire with an outer diameter of 0.06 mmφ, nickel plating is formed on top of it to a specified thickness, and then polyurethane insulation paint is applied and baked to two different thicknesses. The high-frequency insulated wire for coil winding was wound into a coil, and its Q characteristic was measured. D is the Q characteristic of a wire that does not form nickel plating under the same conditions, and E is the Q characteristic of a polyurethane insulated copper wire. Compared to polyurethane copper wire E, A with 0.1μ thick nickel wire is
Since almost no effect of improving the Q characteristic is obtained, it is excluded from the scope of the present invention. It is clear that B, C, and D, in which the nickel plating layer is smaller than 0.1μ, have extremely excellent Q characteristics. In this way, as the conductor diameter becomes smaller, by making the nickel plating layer formed on the pure iron plating layer thinner, it is possible to prevent the Q characteristics of the coil from being impaired. However, as the nickel thickness decreases, another problem arises:
A problem arises in that the underlying pure iron plating oxidizes and loses solderability. Particularly in a hot and humid environment, pure iron plating rapidly oxidizes within several hours or days after plating, resulting in poor soldering. [Means for Solving the Problems] In order to solve the above problems, the present invention selects a copper wire 1 having a wire diameter of 0.03 to 0.10 mmφ, as shown in FIG. 2, and coats it with pure iron plating 2. After forming 0.03μ
Nickel plating 3 with a thickness of less than 0.1μ is applied,
Then immediately apply enamel insulation resin 4 that has brazing properties.
A method of coating and baking was adopted. Here, "immediately after nickel plating" means before the underlying pure iron plating oxidizes, and preferably, after the plating process, the material is continuously subjected to an enamel insulation resin baking process to form a coating film. By this,
Productivity can also be improved. FIG. 1 is a schematic diagram of an apparatus for explaining the manufacturing method of the present invention, in which a thin wire 1 to be plated is fed out from a bobbin 1, is led to a pure iron plating tank 12, and after pure iron plating is formed on the surface. In the nickel plating tank 13, nickel plating is applied to a thickness of 0.03 μm or more and less than 0.1 μm. The thin wire that has undergone the plating process is dried in a drying oven, and then immediately led to a coating and drying device 14 for coating and drying an enamel insulating resin paint having soldering properties, where a coating film is formed, and then wound onto a bobbin 15. For thin wires, an insulating resin coating is formed immediately after the plating process, so
There is no possibility that the pure iron plating layer 2 will be oxidized. [Example] Pure iron plating was applied to a copper wire having an outer diameter of 0.06 mmφ, and nickel plating was formed thereon to a thickness of 0.03 μm, 0.05 μm, and 0.08 μm, respectively. Solderability was compared between insulated wires in which polyurethane insulating paint was applied and baked immediately after nickel plating, and insulated wires in which polyurethane insulating paint was applied and baked 2 and 5 days after nickel plating. The following table shows the characteristics results.

[Action and effect]

According to the manufacturing method of the present invention, copper wire, especially wire diameter 0.03
After forming a pure iron plating layer on a thin wire of ~0.10mmφ and applying nickel plating to a thickness of 0.03μ or more and less than 0.1μ, an enamel insulating resin with solderability is immediately applied and baked, so the base layer is The pure iron plating layer does not oxidize, has excellent solderability, and the Q characteristic of the coil is greatly improved compared to that of copper wire.
It also has the additional effect of preventing scratches that are likely to occur on the surface of the plating layer during the process.

[Brief explanation of drawings]

Fig. 1 is a schematic configuration diagram of an apparatus for explaining the manufacturing method of the present invention, Fig. 2 is a cross-sectional view of an insulated wire obtained by the present invention, and Fig. 3 is a frequency f when the insulated wire is wound into a coil. It is a graph showing the relationship between and the Q value. 1...Copper wire with a wire diameter of 0.03 to 0.10 mmφ, 2...Pure iron plating layer, 3...Nickel plating layer having a thickness of 0.03μ or more and less than 0.1μ, 4...Insulating resin layer having solderability.

Claims (1)

[Claims] 1. After forming a pure iron plating layer 2 on a copper wire 1 and applying a nickel plating 3 with a thickness of 0.03μ or more and less than 0.1μ, the pure iron plating layer 2 is oxidized. A method for manufacturing an insulated wire for a high-frequency wire wheel, which comprises applying and baking an enamel insulating resin layer 4 having solderability before applying. 2. The method for manufacturing an insulated wire for high-frequency coils according to claim 1, characterized in that the wire diameter of the copper wire 1 is in the range of 0.03 to 0.10 mmφ.