JPS63303680A - Soldering method and its equipment - Google Patents

Abstract

PURPOSE:To improve the efficiency and reliability in soldering by discharging a molten solder by the amt. not dripping from the lower end of a nozzle, sticking a flux as well and bringing the solder thereof into contact with the body to be soldered. CONSTITUTION:A flux sticking part 3 and substrate holding part 6 having a vacuum suction function are arranged at the lower part of a soldering iron 1. A nozzle is provided at the lower part of the soldering iron 1 and the solder 8 melted by an electric heater 10 is stored inside the iron body 9. A solder feeding valve 12 is opened by a valve opening and closing rod 13 to discharge a solder 8 to the extent of its not discharging and the iron 1 is dipped into a flux 2 by moving it. A soldering is then executed by bringing the lead 18 of the substrate 4 into contact with it. Due to the need for cleaning the iron tip being almost eliminated the wear of the iron tip is eliminated. The soldering quality is thus improved. The efficiency and reliability in soldering are improved because of the operability being improved as well.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a soldering method and apparatus for automatically soldering, for example, multi-terminal electronic components.

(Prior art) In general, 7J buttopackage IC, which is a multi-terminal electronic component,
Soldering is most often done manually, but the production efficiency is extremely low and a high degree of skill is required to perform stable and highly reliable soldering. Therefore, an apparatus has been developed that automatically performs soldering of 7-tube package ICs. This device supplies an appropriate amount of solder from the outside to the tip of a soldering iron, and then transfers this solder to the IC.
The soldering process is performed by touching and scanning the bottle part of the machine.

However, automatic machines using such soldering irons have the following problems. In other words, ■7 on the tip of the soldering iron.
Cleaning is required because the carbide from Wokusu adheres to it. In some cases, mechanical removal using a wire brush or the like is also required.

■The iron tip is easily worn out and requires adjustment, for example, once every 1 to 2 days. Also, if the amount of wear increases, it must be replaced. ■Solder must be supplied to the iron tip one by one.

(Problems to be Solved by the Invention) The present invention has been made in consideration of the above-mentioned circumstances, and eliminates the need to frequently perform tip exchange adjustment work and cleaning work, improving work efficiency, It is an object of the present invention to provide a soldering method and apparatus that can stably perform highly reliable soldering.

[Structure of the invention]

(Means and actions for solving the problem) Discharge molten solder from the bottom end of the nozzle without dripping, apply flux to the discharged molten solder, and apply the molten solder with this flux attached to the solder. By bringing the soldering device into contact with the soldering body, highly reliable automatic soldering can be performed with high efficiency without requiring complicated work.

(Example) Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows the soldering apparatus of this embodiment.

This device has a soldering iron section (1
) and flux (
2), and an X-Y-1 having a vacuum suction function, for example, to hold and position in a predetermined position the substrate (5) to which the flat package IC (4) is attached by soldering. The board holding part (6) such as a table, the soldering iron part (1), and the flux application part (
3) and a control section (6a) that organically controls the later-described operations of the substrate holding section (6).

As shown in FIG. 2, the soldering iron part (1) has a cylindrical shape with a nozzle (7) at its lower end, and an iron body (9) that stores molten solder (8) inside. ), a rod-shaped T heat heater (11) that is loosely inserted into the inside of this iron body (9) and heats the solder (8) above the melting temperature, (IG, and a nozzle (7) of the iron body (9). ), for example, a spherical solder supply valve (14) made of stainless steel that controls the outflow of molten solder (8) from the tapered opening I of A valve opening/closing loft a4, a valve opening/closing driving means (not shown) that supports the upper end of the valve opening/closing loft a3 and drives it in the vertical direction (directions of arrows (14a) and (14b)), and a heater (II). , a power source (not shown) that supplies power to the soldering iron body (9), and a soldering iron transport means (not shown) that supports the soldering iron body (9) and moves and positions it to the 72x attachment part (3) and the board holding part (6). The iron body (9) is composed of a cylindrical body (end), a mortar-shaped conical part coaxially connected to the lower end of the cylindrical body, and It consists of a nozzle (7) coaxially connected to the tip of the conical part 0, and the material of each part is made of stainless steel, ceramics, etc. to which molten solder does not adhere.
It is made of cemented carbide. When the spherical solder supply valve (ls5) is seated on the conical part αe, the cylindrical body (1
! The valve is in a closed state in which the flow of molten solder (8) from the 9 side to the nozzle (7) is stopped. On the contrary, valve opening/closing loft C13
As the temperature rises in the direction of the arrow (14b), a gap is created between the conical portion e and the hill supply valve a, and the molten solder (8)
) is in the valve open state where it flows out from the cylindrical body (l!19 side to the nozzle (7) side.On the other hand, the flux attachment part (3) is
Flux tank (not shown) for storing flux (2)
And, the nozzle wholesaler installed in this 7-labx tank and the nozzle CI installed in the flux tank? ) to flux (
2) It consists of a t-spouting globella (not shown).

Next, the soldering method of this embodiment will be described using the soldering apparatus having the above configuration.

First, the substrate holder (6) holds the substrate (5) and positions it at a reference position. Then, using a vacuum chuck (not shown), the 72-piece package IC (4) is connected to its lead U...
· Steel foil pattern Q9 coated on the substrate (5)
...Position it so that it is placed at the specified position above.

On the other hand, in the soldering iron part (1), heater αG, (1(
Power is supplied to I from the power supply to melt the solder (8). At this time, the valve opening/closing rod αJ is lowered in the direction of the arrow (14a), and the solder supply valve α is seated on the conical part (lFG) to keep the valve closed.Next, the valve opening/closing rod αJ is lowered. The molten solder (8) is raised in the direction of the arrow (14b) for a predetermined period of time, and the molten solder (8) flows out to an extent that the molten solder (8) does not drip from the opening I of the nozzle (7). , and is discharged from the opening portion υ of the nozzle (7).

Next, the soldering iron part (1) is
Move it in the direction of the arrow (to) and position it above the 7 rubs (2) spouting from the nozzle outlet (see Figure 1).

Then, lower the nozzle (7) in the direction of the arrow (14a).
The molten solder (8) being discharged from the flux (2)
After being immersed in the liquid, it is raised in the direction of the arrow (14b),
It is moved in one direction of the arrow and positioned on the outermost end of the lead α which requires soldering of the flat package IC (, i) positioned on the board (5). Then,
The soldering iron part (1) is again lowered in the direction of the arrow (14a) by means of the conveying means (1a), and the molten solder (8) to which the soldering iron (2) is attached comes into contact with the most side edge of the soldering iron. .

After that, as shown in FIG. 3, the board holding part (6) moves the arrows (
□ direction and lead the nozzle N (7) (LllG・
... Scan along. At this time, the molten solder (81, lead 118...
Since the oxide film adhering to the surfaces of the steel foil pattern α9 and the like is removed, the lead barrel A and the copper foil pattern α9 are reliably soldered. Then,
After completing the soldering, move the soldering iron part (1) to the conveying means (1
Return to the original position by a). When the soldering of the lead line on one side of the flat package IC (4) is completed, the lead line on the other side is automatically soldered in the same manner.

As mentioned above, in this example, since the molten solder (8) is supplied from the nozzle (7), it is not necessary to clean the tip much more than when using a normal soldering iron. work efficiency is greatly improved. Also,
There is no wear on the iron tip due to cleaning, and there is no need to perform iron replacement and adjustment work. Together, these effects greatly improve the efficiency and reliability of automatic soldering of multi-terminal electronic components.

In the above embodiment, the soldering iron part (1) is moved relative to the flux application part (3) and the board holding part (6)K, but the soldering iron part (1) is fixed and the flux is not applied. The attachment part (3) and the substrate holding part (6) may be moved.

〔Effect of the invention〕

According to the present invention, compared to the case of using an ordinary soldering iron, there is almost no need to clean the soldering iron tip, and workability is greatly improved. Additionally, there is no wear on the iron tip due to cleaning, and there is no need to replace or adjust the iron.

Together, these effects greatly improve the efficiency and reliability of automatic soldering of multi-terminal electronic components.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a soldering device according to an embodiment of the present invention;
FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is an explanatory diagram of a soldering method according to an embodiment of the present invention. (1): Soldering iron part, (1a): Conveying means,
(2) : Flux adhesion part, (4) : Flat package IC (body to be soldered),
(6) Two-board holding part (holding means), (7); Nozzle, (8): Molten solder, (
9): Iron body (soldering pot), (II: Heater,
(I3: Solder supply valve. Agent: Patent attorney Noriyuki Chika, Yudo, Mitsuyuki Matsuyama

Claims (2)

[Claims] (1) A discharging step in which molten solder is discharged from the lower end of a nozzle that is vertically installed in an amount that will not drip;
a flux adhesion step of adhering flux to the molten solder adhering to the lower end of the nozzle through the above-mentioned discharging step;
A soldering method comprising, after the flux adhesion step, a soldering step of bringing the molten solder to which the flux has adhered into contact with the object to be soldered. (2) A soldering device characterized by having the following configuration. (a) A solder pot for storing solder, a heater installed in the solder pot to melt the solder, a nozzle installed vertically in the solder pot to discharge the molten solder melted by the heater, and a nozzle for discharging the molten solder from the nozzle. A soldering iron section having a solder supply valve that controls the discharge amount of the molten solder. (b) Flux adhesion means for adhering flux to the molten solder staying at the lower end of the nozzle. (c) Holding means for holding and positioning the object to be soldered. (d) Conveying means for conveying the soldering iron part relative to the flux applying means and the holding means. (e) The soldering iron section, the flux applying means, the holding means, and the conveying means are electrically controlled to solder the object to be soldered with the molten solder staying at the lower end of the nozzle. control means for causing