JPS63299357A - Substrate mounting board - Google Patents

Abstract

PURPOSE:To enable the easy cooling of a substrate mounting board and to reduce a cooling time, by making air flow in air flow paths disposed internally on the substrate mounting board and next cooling the substrate mounting board. CONSTITUTION:After a wafer is measured in its heated state, a measurement stage 6 is set on a normal temperature state. After the wafer is carried from the stage 6 to the other position, an operation of a solenoid valve 18 is ex changed to make air flow from an air supply structure 16 via a tube 17, the solenoid valve 18, and a tube 14 to the inside of air flowing paths 12 disposed internally on the stage 6, and the air is ejected from holes 11. Hence, this cooling time is reduced in comparison with that of natural cooling.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a substrate mounting table.

(Prior Art) In the process of manufacturing a substrate such as a semiconductor wafer, a probe device is used to inspect and measure the electrical characteristics of the manufactured wafer. Further, inspection and measurement methods for semiconductor wafers differ depending on the type of semiconductor wafer, and depending on the type, the inspection and measurement may be performed by heating the semiconductor wafer. This heating of the semiconductor wafer has usually been handled by providing a heating mechanism on the mounting table on which the semiconductor wafer is mounted. Furthermore, in order to perform inspection and measurement at room temperature after performing inspection and measurement on a heated mounting table, the mounting table must be cooled.

As mentioned above, a mounting table having a heating mechanism and a cooling mechanism is well known from Japanese Patent Application Laid-Open No. 55-44931.

(Problems to be Solved by the Invention) However, with a mounting table having a heating/cooling mechanism as described above, the structure becomes complicated and the mounting table itself becomes large, and furthermore, it is not possible to use an existing mounting table. Therefore, it was necessary to newly manufacture an expensive mounting table, and it lacked versatility.

This invention was made to improve the above points,
The present invention provides a substrate mounting table that allows the mounting table to be easily cooled and has the effect of shortening the cooling time.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a substrate mounting table characterized in that the substrate mounting table is cooled by circulating air through an air flow path provided inside the substrate mounting table. .

(Function) The effect of making it possible to easily cool the substrate mounting table and shorten the cooling time by cooling the substrate mounting table by circulating air through the air flow path installed inside the substrate mounting table. is obtained.

(Example) Next, an example in which the substrate mounting table of the present invention is mounted on a probe device will be described with reference to the drawings.

This probe device (2) is as shown in FIG.

Twenty-five substrates, such as semiconductor wafers (2), are placed in a wafer cassette (2) at predetermined intervals. The cassette ■ containing this wafer ■ is carried into the cassette storage section. Take out the wafers ■ one by one from this storage part (a) using vacuum tweezers (not shown).

Transfer the wafer to the preliminary positioning stage ■. After pre-positioning the wafer ■ to an accuracy of ±1° using this preliminary positioning stage (c) based on the orientation flat of the wafer ■, the wafer ■ is transferred to a mounting table, such as a measurement stage ■, and the back side of the wafer ■ is held by suction using a vacuum suction mechanism. do. This transportation is carried out by vacuum suctioning the back surface of the wafer (2). In order to position the wafer (2) transferred to the measurement stage (0) with even higher precision.

A pattern recognition mechanism using a CCD camera or a recognition mechanism using a laser is applied. After this accurate positioning, the wafer ■ is automatically raised from below to the tip of the probe needle (8) of the probe card ■, and the wafer (2) is touched softly.
) to measure the electrical properties of the

When performing this measurement, depending on the type of wafer, it is necessary to set the wafer (1) to a heated state and perform the measurement. The heating of the wafer (2) is carried out by heating the measurement stage 0 on which the wafer (2) is placed, and utilizing heat conduction from the measurement stage (2) to the wafer (2). The measurement stage 0 can be heated to, for example, about 150° C. by a heating mechanism 0) provided on the measurement stage 0. Next, after the measurement of the wafer 1 in the heated state is completed, when measuring the wafer 2 at room temperature, for example, about 25° C., it is necessary to cool the measurement stage 0 in the heated state to return it to the room temperature. This cooling is performed using, for example, the vacuum suction mechanism described above. The vacuum suction mechanism has a hole (11) provided on the mounting surface (10) on which the wafer ■ is placed, and the hole (11)
An air flow path (12) corresponding to the measurement stage 0 is provided inside the mounting table, for example, the measurement stage 0, and the air flow path (12) is connected to a vacuum mechanism (13). This vacuum suction mechanism is used as a cooling mechanism. That is, the tube (14) from the air flow passage installed inside the measurement stage (0), the tube (15) from the vacuum mechanism (13), and the tube (17) from the air delivery mechanism (16) are switched. It is connected to a valve, for example, a solenoid valve (18) in a three-board state.By operating the solenoid valve (18), the vacuum suction mechanism and the cooling mechanism can be switched and used.

Next, the operation of the mounting table will be explained.

A substrate, such as a semiconductor wafer (1), is suddenly placed on a mounting table, such as a measurement stage. At this time, the back side of the wafer (■) is held by suction.

This suction holding is performed on the mounting surface (10) of the measurement stage (toward).
Hole (11) and vacuum mechanism (13) provided in
However, the tube (15), solenoid valve (18) and tube (1
4) through the air flow path (12), the vacuum mechanism (13) is operated to vacuum-suction the wafer (2) in the hole (11). At the same time as this adsorption, a heating mechanism (9) provided on measurement stage 0 is used to heat the wafer
After heating the wafer to about 50° C., the electrical characteristics of the wafer (1) are inspected and measured using predetermined operations. After measuring the wafer (2) in the heated state, the measurement stage 0 is set to the normal temperature state.

For this setting, after transporting the wafer ■ from measurement stage 0 to another position, switch the solenoid valve (18) and send air from the air delivery mechanism (16) to the tube (17) and the solenoid valve (18).
), air is circulated through the tube (14) into the air flow path (12) installed inside the measurement stage ■, and the hole (1
Air is blown out from 1). In this way, the measurement stage (
By forcing air to flow through the air, the cooling time can be shortened compared to natural cooling.

FIG. 3 shows a comparison between forced cooling and natural cooling described above. Setting temperature of the mounting table is 90℃, room temperature is 21℃
, the mounting table room temperature is set to 22.5℃, and the vertical axis is the mounting table temperature (
°C), and the horizontal axis is the elapsed time (minutes), (A) is natural cooling, and (B) is forced cooling. Set the temperature of the mounting table to 90
To cool from ℃ to room temperature 22.5℃, natural cooling (A
), it takes more than 60 minutes, while forced cooling (B) completes cooling in about 30 minutes. That is, in the case of forced cooling, it is possible to cool the mounting table in about half the time compared to natural cooling.

The present invention is not limited to the above embodiments, and the cooling time can be further shortened by using cooling air. Furthermore, the air only needs to flow within the mounting table and does not necessarily need to be blown out from the mounting surface. Furthermore, if air is circulated inside the mounting table and air is blown from the outside toward the mounting table at the same time, a further cooling effect can be obtained.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a substrate mounting table for explaining one embodiment of the present invention, FIG. 2 is a diagram of a probe device equipped with the mounting table of FIG. 1, and FIG. 3 is a diagram of the mounting table of FIG. 1. It is a figure showing the cooling time of. 6...Measurement stage 9...Heating mechanism 11...
Hall 12... Air flow path 16... Air delivery mechanism 18... Solenoid valve patent applicant Tokyo Electron Ltd. Figure 1 Figure 2

Claims (1)

[Claims] A substrate mounting table characterized in that the substrate mounting table is cooled by circulating air through an air flow path provided inside the substrate mounting table.