JPS6329904B2 - - Google Patents
Info
- Publication number
- JPS6329904B2 JPS6329904B2 JP58048195A JP4819583A JPS6329904B2 JP S6329904 B2 JPS6329904 B2 JP S6329904B2 JP 58048195 A JP58048195 A JP 58048195A JP 4819583 A JP4819583 A JP 4819583A JP S6329904 B2 JPS6329904 B2 JP S6329904B2
- Authority
- JP
- Japan
- Prior art keywords
- mol
- dicarboxylic acid
- acid
- polyester
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920000728 polyester Polymers 0.000 claims description 20
- 239000004831 Hot glue Substances 0.000 claims description 17
- -1 poly(oxyalkylene) Polymers 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 8
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical group CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 6
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims description 6
- 125000003827 glycol group Chemical group 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 13
- 238000004132 cross linking Methods 0.000 description 9
- 238000005108 dry cleaning Methods 0.000 description 9
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 150000002009 diols Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000010409 ironing Methods 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005809 transesterification reaction Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WOPLHDNLGYOSPG-UHFFFAOYSA-N 2-butylbutanedioic acid Chemical compound CCCCC(C(O)=O)CC(O)=O WOPLHDNLGYOSPG-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VNMOIBZLSJDQEO-UHFFFAOYSA-N 1,10-diisocyanatodecane Chemical compound O=C=NCCCCCCCCCCN=C=O VNMOIBZLSJDQEO-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- TXTIIWDWHSZBRK-UHFFFAOYSA-N 2,4-diisocyanato-1-methylbenzene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CC1=CC=C(N=C=O)C=C1N=C=O TXTIIWDWHSZBRK-UHFFFAOYSA-N 0.000 description 1
- URMOYRZATJTSJV-UHFFFAOYSA-N 2-(10-methylundec-1-enyl)butanedioic acid Chemical compound CC(C)CCCCCCCC=CC(C(O)=O)CC(O)=O URMOYRZATJTSJV-UHFFFAOYSA-N 0.000 description 1
- LIDLDSRSPKIEQI-UHFFFAOYSA-N 2-(10-methylundecyl)butanedioic acid Chemical compound CC(C)CCCCCCCCCC(C(O)=O)CC(O)=O LIDLDSRSPKIEQI-UHFFFAOYSA-N 0.000 description 1
- JTWBYEWVFCYRSF-UHFFFAOYSA-N 2-(6-methylheptyl)butanedioic acid Chemical compound CC(C)CCCCCC(C(O)=O)CC(O)=O JTWBYEWVFCYRSF-UHFFFAOYSA-N 0.000 description 1
- HCUZVMHXDRSBKX-UHFFFAOYSA-N 2-decylpropanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)C(O)=O HCUZVMHXDRSBKX-UHFFFAOYSA-N 0.000 description 1
- QDCPNGVVOWVKJG-UHFFFAOYSA-N 2-dodec-1-enylbutanedioic acid Chemical compound CCCCCCCCCCC=CC(C(O)=O)CC(O)=O QDCPNGVVOWVKJG-UHFFFAOYSA-N 0.000 description 1
- FPOGSOBFOIGXPR-UHFFFAOYSA-N 2-octylbutanedioic acid Chemical compound CCCCCCCCC(C(O)=O)CC(O)=O FPOGSOBFOIGXPR-UHFFFAOYSA-N 0.000 description 1
- QJGNSTCICFBACB-UHFFFAOYSA-N 2-octylpropanedioic acid Chemical compound CCCCCCCCC(C(O)=O)C(O)=O QJGNSTCICFBACB-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- ZUWNQGRCWZDTKT-UHFFFAOYSA-N 3-(10-methylundecyl)oxolane-2,5-dione Chemical compound CC(C)CCCCCCCCCC1CC(=O)OC1=O ZUWNQGRCWZDTKT-UHFFFAOYSA-N 0.000 description 1
- NSJAWXMCLJVBPM-UHFFFAOYSA-N 3-butyloxolane-2,5-dione Chemical compound CCCCC1CC(=O)OC1=O NSJAWXMCLJVBPM-UHFFFAOYSA-N 0.000 description 1
- SYEOWUNSTUDKGM-YFKPBYRVSA-N 3-methyladipic acid Chemical compound OC(=O)C[C@@H](C)CCC(O)=O SYEOWUNSTUDKGM-YFKPBYRVSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- SXCBDZAEHILGLM-UHFFFAOYSA-N heptane-1,7-diol Chemical compound OCCCCCCCO SXCBDZAEHILGLM-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明はポリエステル系の反応性ホツトメルト
接着剤に関するものである。
近年ポリエチレンテレフタレート繊維を素材と
する衣料が多く使われるようになるにつれて該衣
料に対して接着性の良好なポリエステル系ホツト
メルト接着剤が接着芯地にも用いられるようにな
つてきている。現在市販されているポリエステル
系ホツトメルト接着剤はポリアミド系のものにく
らべて弾性が小さく軟らかい、黄変しない、ピカ
ピカ光らない等の特長があり薄手のポリエステル
衣料に適しているが、耐ドライクリーニング性が
悪いためその用途はドライクリーニングをしない
軽装衣料品用に限られている。またホツトメルト
接着剤に共通の欠点としてアイロン掛けを繰返す
間に接着剤が塑性変形を起こして風合いや接着力
の変化をまねくという問題がある。
本発明者らはこのような欠点を改良し耐ドライ
クリーニング性ならびに耐アイロン掛け性に優
れ、しかも風合いが軟らかで幅広く繊維接着の用
途に利用できるようなポリエステル系ホツトメル
ト接着剤について種々検討した結果本発明を完成
するに到つたのである。
即ち本発明は(a)芳香族ジカルボン酸残基30〜49
モル%、(b)一般式()
(式中、Rは炭素数4〜20のアルキル基又はアル
ケニル基)
で表わされるジカルボン酸の残基0.1〜5モル%、
(c)炭素数4〜12の直鎖又はメチル基を側鎖として
有する脂肪族ジカルボン酸残基0〜20モル%、(d)
炭素数2〜10の脂肪族ジオール残基30〜49モル
%、(e)数平均分子量500〜2500のポリ(オキシア
ルキレン)グリコール残基0〜10モル%、および
(f)一般式()
(式中、R′は炭素数2〜4のアルキレン基、x
+yが2〜18である)
で表わされる芳香族ジオールの残基0.1〜15モル
%より構成されるポリエステル(A)の分子鎖末端に
(g)多官能イソシアネート化合物を反応させて得ら
れるイソシアネート基含有ポリエステルからなる
ホツトメルト接着剤を提供するものである。
なお、本明細書においてジカルボン酸残基とは
ジカルボン酸のカルボキシル基から水酸基がとれ
た化学構造を意味し、ジオール残基とはジオール
の水酸基から水素原子がとれた化学構造を意味す
る。
本発明の芳香族ジカルボン酸残基(a)としては、
例えばテレフタル酸、イソフタル酸、フタル酸、
ジフエニル−p,p′−ジカルボン酸、ジフエニル
−m,m′−ジカルボン酸、ジフエニルメタン−
p,p′−ジカルボン酸、ジフエニルメタン−m,
m′−ジカルボン酸、2,2′−ビス(4−カルボキ
シフエニル)プロパン、ナフタリン−1,4−ジ
カルボン酸、ナフタリン−1,5−ジカルボン
酸、ナフタリン−2,6−ジカルボン酸、ナフタ
リン−2,7−ジカルボン酸、ジフエニルエーテ
ル−p,p′−ジカルボン酸、ジフエニルエーテル
−m,m′−ジカルボン酸、ジフエニルスルホン
−p,p′−ジカルボン酸、ジフエニルスルホン−
m,m′−ジカルボン酸等およびこれらの低級ア
ルキルエステル誘導体の残基を挙げることができ
る。
本発明の前記一般式()で表わされるジカル
ボン酸の残基(b)としてはn−ドデセニルコハク
酸、イソ−ドデセニルコハク酸、イソドデシルコ
ハク酸、イソオクチルコハク酸、n−オクチルコ
ハク酸、n−ブチルコハク酸等およびこれらの酸
無水物あるいは低級アルキルエステル誘導体の残
基を例示することができる。
本発明の炭素数4ないし12の直鎖状またはメチ
ル基を側鎖として有する脂肪族ジカルボン酸残基
(c)としてはコハク酸、グルタル酸、アジピン酸、
β−メチルアジピン酸、ピメリン酸、コルク酸、
アゼライン酸、セバシン酸、ノナンジカルボン
酸、デカンジカルボン酸、ウンデカンジカルボン
酸、ドデカンジカルボン酸等およびそれらの誘導
体の残基が挙げられる。
本発明の炭素数2ないし10の脂肪族ジオール残
基(d)としてはエチレングリコール、プロピレング
リコール、1,4−ブタンジオール、1,3−ブ
タンジオール、ネオペンチルグリコール、ペンタ
メチレングリコール、ヘキサメチレングリコー
ル、ヘプタメチレングリコール、オクタメチレン
グリコール、ノナメチレングリコール、デカメチ
レングリコール、ジエチレングリコール、トリエ
チレングリコール等の残基が挙げられる。
本発明のポリ(オキシアルキレン)グリコール
残基(e)としては数平均分子量が500ないし2500の
ポリエチレングリコール、ポリプロピレングリコ
ール、ポリテトラメチレングリコール等の残基が
挙げられる。
本発明の前記一般式()で表わされる芳香族
ジオールの残基(f)としては、ポリオキシエチレン
(4)−2,2−ビス(4−ヒドロキシフエニル)プ
ロパン、ポリオキシエチレン2−2,2−ビス
(4−ヒドロキシフエニル)プロパン、ポリオキ
シプロピレン(6)−2,2−ビス(4−ヒドロキシ
フエニル)プロパン、ポリオキシエチレン(12)−
2,2−ビス(4−ヒドロキシフエニル)プロパ
ン等の残基が挙げられる。
本発明に使用される共重合ポリエステル(A)は上
記のジカルボン酸成分とジオール成分をジオール
成分過剰の条件で直接エステル化法またはエステ
ル交換法等の公知の方法で重縮合して得られる。
本発明のポリエステル骨格に含まれる上記の各
成分のうち(a)の芳香族ジカルボン酸残基の割合は
30ないし49モル%が好ましい。30モル%より少な
い場合イソシアネート基による架橋構造が形成さ
れても耐ドライクリーニング性が悪く、また架橋
反応前におけるホツトメルト接着剤の軟化点が低
くなり過ぎるため好ましくない。逆に49モル%を
越えると樹脂が硬くなり過ぎて接着した衣料の風
合が損なわれるばかりか、架橋反応前の軟化点が
高くなるため高温で塗布しなければならず被着体
が熱におかされやすくなるので好ましくない。次
に(b)のジカルボン酸残基の割合は0.1ないし5モ
ル%が好ましい。該ジカルボン酸残基は樹脂の軟
化点を下げ、また、風合を軟らかくする効果をも
たらすが、その割合が5モル%を超えると樹脂の
軟化点が低くなり過ぎたり、あるいは架橋反応後
においても耐ドライクリーニング性が不足するの
で好ましくない。(c)の脂肪族ジカルボン酸残基の
割合は0ないし20モル%が好ましく、20モル%を
超えると架橋反応後においても耐ドライクリーニ
ング性が低下するので好ましくない。(d)の脂肪族
ジオール残基の割合は30モル%より少ないと樹脂
が硬くなるので30ないし49モル%とするのが好ま
しい。(e)のポリ(オキシアルキレン)グリコール
残基は樹脂を軟らかくする効果を持つがその割合
が10モル%を超える架橋形成後も耐ドライクリー
ニング性が不足すること、また架橋前の樹脂の軟
化点が低くなり過ぎてブロツキングを起こしやす
くなるので0ないし10モル%が好ましい。(f)の芳
香族ジオールの残基は優れた接着効果をもたらす
が15モル%を超えると樹脂が硬くなるので0.1な
いし15モル%であることが好ましい。
本発明に用いられる(g)多官能イソシアネート化
合物としては2,4−トルエンジイソシアネー
ト、2,6−トルエンジイソシアネート、4,
4′−ジフエニルメタンジイソシアネート、p−フ
エニレンジイソシアネート、m−フエニレンジイ
ソシアネート、ヘキサメチレンジイソシアネー
ト、デカメチレンジイソシアネート、m−キシリ
レンジイソシアネート、p−キシリレンジイソシ
アネート、4,4′−ジシクロヘキシルメタンジイ
ソシアネート、3,3′−ジメチル−4,4′−ジフ
エニルジイソシアネート、1,5−ナフタレンジ
イソシアネート等のジイソシアネート類が例示さ
れる。また、ポリメチレンポリフエニルイソシア
ネート、4,4′,4″−トリフエニルメタントリイ
ソシアネート、トリメチロールプロパン−トルエ
ンジイソシアネート付加体、トルエンジイソシア
ネートの2量体ならびに3量体等の3官能以上の
ポリイソシアネート類を少量併用してもよい。
該ポリイソシアネートと前記のポリエステルと
の付加反応はポリエステルの重縮合反応終了後ポ
リエステルの末端基数に対して1.0〜2.0倍量のモ
ル数のポリイソシアネートを添加し、常圧下で80
ないし180℃の温度で溶融混合することによつて
行なうことができる。また、イソシアネート基に
対して活性な水素原子を持たない前記ポリエステ
ルの溶媒中でポリエステルとポリイソシアネート
を上記の比率で混合して加熱下に反応せしめても
よい。必要に応じて3級アミン、スタナスオクト
エート、ジブチルチンジラウレート等の触媒を用
いてもよい。溶液状態で反応を行なつた場合には
反応終了後溶媒を蒸発せしめることによつて除去
する。
本発明の反応性ホツトメルト接着剤のJIS
K2817に準じて環球法により測定されるところの
軟化点は60ないし160℃、より好ましくは80ない
し130℃である。軟化点が60℃より低いとイソシ
アネート基による架橋反応が進んだ後でもアイロ
ン掛け等の熱圧着を繰返す毎に樹脂の塑性変形が
見られ接着した衣料の風合に変化が生じるので好
ましくない。軟化点が160℃を起えると衣料への
接着温度もそれ以上に高くせねばならず繊維の熱
変形が起きやすくなるので好ましくない。
本発明の反応性ホツトメルト接着剤には必要に
応じて酸化防止剤、充填剤、着色剤、滑剤等が加
えられる。
本発明の反応性ホツトメルト接着剤は乾燥雰囲
気下にペレツト化、フイルム化、ロツド化、繊維
化、粉末化等の形態上の種々の加工を行なうこと
ができる。かくして得られたイソシアネート基を
有するポリエステル樹脂よりなる反応性ホツトメ
ルト接着剤は水分が0.05%以下の乾燥状態で密封
すれば長期に渡つて保存することができる。
本発明の反応性ホツトメルト接着剤はポリエス
テル分子鎖の末端にあるイソシアネート基が空気
中の湿気あるいは被着体表面の水分と作用して反
応硬化する。スチーム等により加湿すれば硬化速
度ははやくなる。また被着体にイソシアネート基
に対して活性な水素原子が存在する場合には被着
体にも架橋結合を生じる。かくして本発明の反応
性ホツトメルト接着剤はホツトメルト接着剤に特
有の瞬間接着性と架橋形成による優れた耐溶剤性
ならびに耐熱性を発揮し、しかもポリエチレンテ
レフタレート繊維に対して優れた接着性を示すと
同時にポリエステル鎖中のソフトセグメントの効
果により接着した衣料に適度な風合いを賦与せし
めることができる。
以下本発明を実施例にて説明するが本発明はそ
れらに限定されるものではない。なお実施例中の
部とは重量部を意味する。
実施例 1
テレフタル酸ジメチル 48.5部(25モル%)
イソフタル酸ジメチル 27.2〃(14 〃 )
アジピン酸ジメチル 17.4〃(10 〃 )
1,4−ブタンジオール 61.3〃(68 〃 )
ポリテトラメチレングリコール(分子量約1000)
20.0〃( 2 〃 )
ポリオキシエチレン(2)−2,2−ビス(4−ヒド
ロキシフエニル)プロパン 15.8〃( 5 〃 )
テトラ−n−ブトキシチタン
0.080〃
をセパラブルフラスコに仕込み220℃まで昇温し
エステル交換反応を行なつた。理論量の約90%の
メタノールが留出した後n−ブチルコハク酸無水
物1.5部(1モル%)を添加し240℃まで昇温しつ
つ約40分間エステル化した。続いて250℃に昇温
し窒素雰囲気下に徐々に減圧にしていき1mmHg
以下の真空中において3時間重縮合反応を行ない
ポリエステル樹脂を得た。尚、過剰の1,4−ブ
タンジオールは反応中系外に除去された。該ポリ
エステル樹脂の酸価は1.2KOHmg/g、ヒドロキ
シル価は16.5KOHmg/gであつた(MW=
6339)。
該ポリエステル樹脂100部に対して、4,4′−
ジフエニルメタンジイソシアネート8.8部の割合
でニーダーに仕込み乾燥窒素雰囲気中120℃にて
約60分間溶融混練した後、押出機に移し130℃に
て押出して反応性ホツトメルト接着剤を得た。該
接着剤をシリコンオイル中で環球法により測定し
た軟化点は125℃であつた。
該接着剤をホツトメルトアプリケーター中140
℃で溶融し、ポリエステル/綿=65%/35%ブロ
ード布に0.5g/mの塗布量で線状に塗布した。
そして直ちに同種類の布を重ねスチームアイロン
により加湿しながら約200g/cm2の圧力で約10秒
間圧着した。該接着試片からの接着剤のしみ出し
はなく風合いも良好であつた。接着してから一週
間後に下記に示す方法で耐熱水洗濯試験ならびに
耐ドライクリーニング試験をしたところ表1に示
すように高い接着保持率を示した。またアイロン
掛けを繰返しても接着剤のしみ出しや風合いの変
化は認められなかつた。
なお耐熱水性洗濯試験は洗剤濃度0.3%、浴比
1対50、温度60℃で10分間の洗濯を5回繰返し
た。耐ドライクリーニング試験はパークレンを用
い浴比1対50、温度30℃で10分間振とうさせる方
式を5回繰返した。いずれも乾燥は自然乾燥(風
乾)とした。剥離強度は23℃、200mm/分の引張
速度でT剥離して求めた。
The present invention relates to a polyester-based reactive hot melt adhesive. In recent years, as clothing made of polyethylene terephthalate fibers has come into widespread use, polyester-based hot melt adhesives with good adhesive properties have come to be used as interlining for clothing. Currently commercially available polyester hot melt adhesives have less elasticity and softer properties than polyamide adhesives, do not yellow, and do not shine, making them suitable for thin polyester clothing, but they have poor dry cleaning resistance. Because of its poor quality, its use is limited to light clothing that does not need to be dry cleaned. A common drawback of hot melt adhesives is that the adhesive undergoes plastic deformation during repeated ironing, leading to changes in texture and adhesive strength. The present inventors have conducted various studies on polyester-based hot melt adhesives that can improve these shortcomings, have excellent dry cleaning resistance and ironing resistance, and have a soft texture that can be used in a wide range of fiber bonding applications. He has now completed his invention. That is, the present invention provides (a) aromatic dicarboxylic acid residues 30 to 49
Mol%, (b) General formula () (wherein R is an alkyl group or alkenyl group having 4 to 20 carbon atoms) 0.1 to 5 mol% of dicarboxylic acid residues,
(c) 0 to 20 mol% of aliphatic dicarboxylic acid residues having a straight chain of 4 to 12 carbon atoms or a methyl group as a side chain, (d)
30 to 49 mol% of aliphatic diol residues having 2 to 10 carbon atoms, (e) 0 to 10 mol% of poly(oxyalkylene) glycol residues having a number average molecular weight of 500 to 2,500, and
(f) General formula () (In the formula, R' is an alkylene group having 2 to 4 carbon atoms, x
+y is 2 to 18) At the molecular chain end of polyester (A) composed of 0.1 to 15 mol% of aromatic diol residues represented by
(g) A hot melt adhesive comprising an isocyanate group-containing polyester obtained by reacting a polyfunctional isocyanate compound. In this specification, a dicarboxylic acid residue refers to a chemical structure in which a hydroxyl group is removed from the carboxyl group of a dicarboxylic acid, and a diol residue refers to a chemical structure in which a hydrogen atom is removed from a hydroxyl group in a diol. The aromatic dicarboxylic acid residue (a) of the present invention includes:
For example, terephthalic acid, isophthalic acid, phthalic acid,
Diphenyl-p,p'-dicarboxylic acid, diphenyl-m,m'-dicarboxylic acid, diphenylmethane-
p, p'-dicarboxylic acid, diphenylmethane-m,
m'-dicarboxylic acid, 2,2'-bis(4-carboxyphenyl)propane, naphthalene-1,4-dicarboxylic acid, naphthalene-1,5-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene- 2,7-dicarboxylic acid, diphenyl ether-p,p'-dicarboxylic acid, diphenyl ether-m,m'-dicarboxylic acid, diphenylsulfone-p,p'-dicarboxylic acid, diphenylsulfone-
Examples include residues of m,m'-dicarboxylic acids and lower alkyl ester derivatives thereof. The dicarboxylic acid residue (b) represented by the general formula () of the present invention includes n-dodecenylsuccinic acid, iso-dodecenylsuccinic acid, isododecylsuccinic acid, isooctylsuccinic acid, n-octylsuccinic acid, n-butylsuccinic acid, and n-butylsuccinic acid. Examples include residues of acids and their acid anhydrides or lower alkyl ester derivatives. A linear aliphatic dicarboxylic acid residue having 4 to 12 carbon atoms or having a methyl group as a side chain according to the present invention
(c) includes succinic acid, glutaric acid, adipic acid,
β-methyladipic acid, pimelic acid, corkic acid,
Examples include residues of azelaic acid, sebacic acid, nonanedicarboxylic acid, decanedicarboxylic acid, undecanedicarboxylic acid, dodecanedicarboxylic acid, and derivatives thereof. Examples of the aliphatic diol residue (d) having 2 to 10 carbon atoms in the present invention include ethylene glycol, propylene glycol, 1,4-butanediol, 1,3-butanediol, neopentyl glycol, pentamethylene glycol, and hexamethylene glycol. , heptamethylene glycol, octamethylene glycol, nonamethylene glycol, decamethylene glycol, diethylene glycol, triethylene glycol, and the like. Examples of the poly(oxyalkylene) glycol residue (e) of the present invention include residues such as polyethylene glycol, polypropylene glycol, and polytetramethylene glycol having a number average molecular weight of 500 to 2,500. The residue (f) of the aromatic diol represented by the general formula () of the present invention is polyoxyethylene
(4)-2,2-bis(4-hydroxyphenyl)propane, polyoxyethylene 2-2,2-bis(4-hydroxyphenyl)propane, polyoxypropylene(6)-2,2-bis( 4-Hydroxyphenyl)propane, polyoxyethylene(12)-
Examples include residues such as 2,2-bis(4-hydroxyphenyl)propane. The copolymerized polyester (A) used in the present invention is obtained by polycondensing the above-mentioned dicarboxylic acid component and diol component by a known method such as a direct esterification method or a transesterification method under conditions where the diol component is in excess. The proportion of aromatic dicarboxylic acid residues (a) among the above components contained in the polyester skeleton of the present invention is
30 to 49 mol% is preferred. If it is less than 30 mol%, even if a crosslinked structure is formed by isocyanate groups, dry cleaning resistance is poor and the softening point of the hot melt adhesive before the crosslinking reaction becomes too low, which is not preferable. On the other hand, if it exceeds 49 mol%, the resin will not only become too hard and affect the texture of the bonded clothing, but also have a high softening point before the crosslinking reaction, which means that it must be applied at a high temperature and the adherend will be exposed to heat. This is not desirable as it makes it easy to be attacked. Next, the proportion of dicarboxylic acid residues in (b) is preferably 0.1 to 5 mol%. The dicarboxylic acid residue has the effect of lowering the softening point of the resin and softening the hand, but if its proportion exceeds 5 mol%, the softening point of the resin may become too low, or even after the crosslinking reaction. It is not preferred because it lacks dry cleaning resistance. The proportion of the aliphatic dicarboxylic acid residue (c) is preferably 0 to 20 mol %, and if it exceeds 20 mol %, the dry cleaning resistance decreases even after the crosslinking reaction, which is not preferable. If the proportion of aliphatic diol residue (d) is less than 30 mol%, the resin becomes hard, so it is preferably 30 to 49 mol%. Although the poly(oxyalkylene) glycol residue (e) has the effect of softening the resin, dry cleaning resistance is insufficient even after crosslinking with a proportion exceeding 10 mol%, and the softening point of the resin before crosslinking. It is preferable to use 0 to 10 mol %, since blocking is likely to occur if the amount becomes too low. The aromatic diol residue (f) provides an excellent adhesive effect, but if it exceeds 15 mol %, the resin becomes hard, so it is preferably 0.1 to 15 mol %. (g) The polyfunctional isocyanate compound used in the present invention includes 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,
4'-diphenylmethane diisocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, hexamethylene diisocyanate, decamethylene diisocyanate, m-xylylene diisocyanate, p-xylylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, 3 , 3'-dimethyl-4,4'-diphenyl diisocyanate, and 1,5-naphthalene diisocyanate. In addition, trifunctional or higher functional polyisocyanates such as polymethylene polyphenyl isocyanate, 4,4′,4″-triphenylmethane triisocyanate, trimethylolpropane-toluene diisocyanate adduct, dimer and trimer of toluene diisocyanate, etc. The addition reaction between the polyisocyanate and the above-mentioned polyester is carried out by adding polyisocyanate in an amount of 1.0 to 2.0 times the number of end groups of the polyester after the completion of the polycondensation reaction of the polyester. 80 under pressure
This can be carried out by melt mixing at a temperature of from 180°C to 180°C. Alternatively, the polyester and polyisocyanate may be mixed at the above ratio in a solvent for the polyester that does not have hydrogen atoms active with respect to isocyanate groups, and the mixture may be reacted under heating. If necessary, a catalyst such as tertiary amine, stannath octoate, dibutyltin dilaurate, etc. may be used. When the reaction is carried out in a solution state, the solvent is removed by evaporation after the reaction is completed. JIS of the reactive hot melt adhesive of the present invention
The softening point measured by the ring and ball method according to K2817 is 60 to 160°C, more preferably 80 to 130°C. If the softening point is lower than 60°C, even after the crosslinking reaction by the isocyanate group has progressed, plastic deformation of the resin will be observed every time heat compression bonding such as ironing is repeated, resulting in a change in the texture of the bonded clothing, which is undesirable. If the softening point is 160°C, the adhesion temperature to clothing must be higher than that, which is undesirable because the fibers are more likely to be thermally deformed. Antioxidants, fillers, colorants, lubricants, etc. may be added to the reactive hot melt adhesive of the present invention, if necessary. The reactive hot melt adhesive of the present invention can be subjected to various morphological processes such as pelletization, film formation, rod formation, fiber formation, powder formation, etc. in a dry atmosphere. The reactive hot melt adhesive made of a polyester resin having isocyanate groups thus obtained can be stored for a long period of time if sealed in a dry state with a moisture content of 0.05% or less. In the reactive hot melt adhesive of the present invention, the isocyanate group at the end of the polyester molecular chain reacts with moisture in the air or moisture on the surface of the adherend to cure the adhesive. Humidification using steam or the like will speed up the curing speed. Further, if the adherend contains hydrogen atoms that are active toward isocyanate groups, crosslinking also occurs in the adherend. Thus, the reactive hot melt adhesive of the present invention exhibits instant adhesive properties unique to hot melt adhesives and excellent solvent resistance and heat resistance due to crosslinking, and also exhibits excellent adhesion to polyethylene terephthalate fibers. The effect of the soft segments in the polyester chain gives the bonded clothing an appropriate texture. The present invention will be explained below with reference to Examples, but the present invention is not limited thereto. Note that parts in the examples mean parts by weight. Example 1 Dimethyl terephthalate 48.5 parts (25 mol%) Dimethyl isophthalate 27.2 (14) Dimethyl adipate 17.4 (10) 1,4-butanediol 61.3 (68) Polytetramethylene glycol (molecular weight approx. 1000)
20.0〃(2〃) Polyoxyethylene(2)-2,2-bis(4-hydroxyphenyl)propane 15.8〃(5〃) Tetra-n-butoxytitanium
0.080〃 was placed in a separable flask and the temperature was raised to 220°C to carry out the transesterification reaction. After about 90% of the theoretical amount of methanol was distilled off, 1.5 parts (1 mol %) of n-butylsuccinic anhydride was added and esterification was carried out for about 40 minutes while raising the temperature to 240°C. Next, the temperature was raised to 250℃ and the pressure was gradually reduced to 1mmHg under a nitrogen atmosphere.
Polycondensation reaction was carried out in the following vacuum for 3 hours to obtain a polyester resin. Incidentally, excess 1,4-butanediol was removed from the system during the reaction. The acid value of the polyester resin was 1.2KOHmg/g, and the hydroxyl value was 16.5KOHmg/g (MW=
6339). For 100 parts of the polyester resin, 4,4'-
Diphenylmethane diisocyanate was charged in a proportion of 8.8 parts into a kneader and melted and kneaded at 120°C for about 60 minutes in a dry nitrogen atmosphere, then transferred to an extruder and extruded at 130°C to obtain a reactive hot melt adhesive. The softening point of the adhesive measured by the ring and ball method in silicone oil was 125°C. Apply the adhesive in a hot melt applicator at 140° C.
It was melted at 0.degree. C. and applied linearly to a 65%/35% polyester/cotton broadcloth at a coating weight of 0.5 g/m.
Immediately, the same type of cloth was layered and compressed for about 10 seconds at a pressure of about 200 g/cm 2 while humidifying with a steam iron. No adhesive seeped out from the adhesive sample, and the feel was good. One week after adhesion, a hot water washing resistance test and a dry cleaning resistance test were conducted using the methods described below, and as shown in Table 1, a high adhesion retention rate was shown. Furthermore, no adhesive seepage or change in texture was observed even after repeated ironing. In the hot water resistance washing test, washing was repeated five times for 10 minutes at a detergent concentration of 0.3%, a bath ratio of 1:50, and a temperature of 60°C. The dry cleaning resistance test was conducted using percrene in a bath ratio of 1:50 and shaking at a temperature of 30°C for 10 minutes, which was repeated 5 times. In both cases, drying was done naturally (air drying). The peel strength was determined by T-peeling at 23° C. and a tensile speed of 200 mm/min.
【表】
実施例 2
テレフタル酸ジメチル 48.5部(25モル%)
イソフタル酸ジメチル 44.7〃(23 〃 )
1,4−ブタンジオール 58.6〃(65 〃 )
ネオペンチルグリコール 6.6〃( 5 〃 )
ポリオキシエチレン(12)−2,2−ビス(4−ヒド
ロキシフエニル)プロパン 37.8〃( 5 〃 )
テトラ−n−ブトキシチタン
0.080〃
をセパラブルフラスコに仕込み実施例1と同様に
してエステル交換反応を行ない理論量の約90%の
メタノールが留出した後イソドデシルコハク酸無
水物5.4部(2モル%)を添加し、以下実施例1
と同様の方法にてエステル化および重縮合反応を
行なつた。得られたポリエステル樹脂の酸価は
0.9KOHmg/g、ヒドロキシル価は12.8KOHmg/
g(MW=8190)であつた。
該ポリエステル樹脂100部に対してヘキサメチ
レンジイソシアネート4.5部の割合でニーダーに
仕込み乾燥窒素雰囲気中130℃にて約60分間溶融
混練した後、押出機に移し140℃にて押出して反
応性ホツトメルト接着剤を得た。該接着剤の軟化
点は128℃であつた。
該接着剤をホツトメルトアプリケーター中150
℃で溶融しポリエステルジヤージ布に0.5g/m
の塗布量で線状に塗布した。そして直ちに同種類
の布を重ねスチームアイロンにて加湿しながら
130℃、約200g/cm2の圧力で約10秒間圧着した。
接着剤のしみ出しはなく風合いも良好であつた。
実施例1と同様にして耐熱水洗濯試験ならびに耐
ドライクリーニング試験をした結果表2に示すよ
うに高い接着保持率を有していることがわかつ
た。[Table] Example 2 Dimethyl terephthalate 48.5 parts (25 mol%) Dimethyl isophthalate 44.7 (23) 1,4-butanediol 58.6 (65) Neopentyl glycol 6.6 (5) Polyoxyethylene ( 12)-2,2-bis(4-hydroxyphenyl)propane 37.8〃(5〃) Tetra-n-butoxytitanium
0.080〃 was placed in a separable flask and the transesterification reaction was carried out in the same manner as in Example 1. After about 90% of the theoretical amount of methanol was distilled off, 5.4 parts (2 mol%) of isododecylsuccinic anhydride was added. Example 1 below
Esterification and polycondensation reactions were carried out in the same manner as described above. The acid value of the obtained polyester resin is
0.9KOHmg/g, hydroxyl value is 12.8KOHmg/
g (MW=8190). A ratio of 4.5 parts of hexamethylene diisocyanate to 100 parts of the polyester resin was charged into a kneader and melted and kneaded at 130°C in a dry nitrogen atmosphere for about 60 minutes, then transferred to an extruder and extruded at 140°C to obtain a reactive hot melt adhesive. I got it. The softening point of the adhesive was 128°C. 150°C of the adhesive in a hot melt applicator.
0.5g/m melted on polyester jersey cloth at °C
It was applied in a linear manner with a coating amount of . Then, immediately layer the same type of cloth and use a steam iron to moisturize it.
Pressure bonding was carried out at 130° C. and a pressure of about 200 g/cm 2 for about 10 seconds.
There was no adhesive seepage and the texture was good.
A hot water washing resistance test and a dry cleaning resistance test were carried out in the same manner as in Example 1. As a result, as shown in Table 2, it was found that the adhesive retention rate was high.
Claims (1)
一般式() (式中、Rは炭素数4〜20のアルキル基又はアル
ケニル基) で表わされるジカルボン酸の残基0.1〜5モル%、
(c)炭素数4〜12の直鎖又はメチル基を側鎖として
有する脂肪族ジカルボン酸残基0〜20モル%、(d)
炭素数2〜10の脂肪族ジオール残基30〜49モル
%、(e)数平均分子量500〜2500のポリ(オキシア
ルキレン)グリコール残基0〜10モル%、および
(f)一般式() (式中、R′は炭素数2〜4のアルキレン基、x
+yが2〜18である) で表わされる芳香族ジオールの残基0.1〜15モル
%より構成されるポリエステル(A)の分子鎖末端に
(g)多官能イソシアネート化合物を反応させて得ら
れるイソシアネート基含有ポリエステルからなる
ホツトメルト接着剤。[Claims] 1 (a) 30 to 49 mol% of aromatic dicarboxylic acid residues, (b)
General formula () (wherein R is an alkyl group or alkenyl group having 4 to 20 carbon atoms) 0.1 to 5 mol% of dicarboxylic acid residues,
(c) 0 to 20 mol% of aliphatic dicarboxylic acid residues having a straight chain of 4 to 12 carbon atoms or a methyl group as a side chain, (d)
30 to 49 mol% of aliphatic diol residues having 2 to 10 carbon atoms, (e) 0 to 10 mol% of poly(oxyalkylene) glycol residues having a number average molecular weight of 500 to 2,500, and
(f) General formula () (In the formula, R' is an alkylene group having 2 to 4 carbon atoms, x
+y is 2 to 18) At the molecular chain end of polyester (A) composed of 0.1 to 15 mol% of aromatic diol residues represented by
(g) A hot melt adhesive comprising an isocyanate group-containing polyester obtained by reacting a polyfunctional isocyanate compound.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58048195A JPS59172576A (en) | 1983-03-23 | 1983-03-23 | Hot-melt adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58048195A JPS59172576A (en) | 1983-03-23 | 1983-03-23 | Hot-melt adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59172576A JPS59172576A (en) | 1984-09-29 |
JPS6329904B2 true JPS6329904B2 (en) | 1988-06-15 |
Family
ID=12796598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58048195A Granted JPS59172576A (en) | 1983-03-23 | 1983-03-23 | Hot-melt adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59172576A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01243503A (en) * | 1988-03-25 | 1989-09-28 | Toshiba Corp | Static magnetic field magnet for magnetic resonance imaging device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8613573D0 (en) * | 1986-06-04 | 1986-07-09 | Scott Bader Co | Urethane based melt adhesives |
AU667448B2 (en) * | 1994-02-22 | 1996-03-21 | National Starch And Chemical Investment Holding Corporation | Catalyst for reactive hot melt adhesives |
-
1983
- 1983-03-23 JP JP58048195A patent/JPS59172576A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01243503A (en) * | 1988-03-25 | 1989-09-28 | Toshiba Corp | Static magnetic field magnet for magnetic resonance imaging device |
Also Published As
Publication number | Publication date |
---|---|
JPS59172576A (en) | 1984-09-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3658939A (en) | Polyurethane and adhesive solution of a polyurethane | |
CN109852326B (en) | Polyurethane hot-melt adhesive containing oxime urethane dynamic bond and preparation method thereof | |
US7025853B2 (en) | Reactive hot-melt adhesive compositions with improved green strength | |
US4436896A (en) | Polyester copolymer | |
US4233359A (en) | Leathery sheet material and process for the preparation thereof | |
CN109777336A (en) | A kind of PVC reaction type polyurethane hot-melt adhesive and preparation method thereof | |
US5977283A (en) | Thermosetting adhesive and method of making same | |
CN1350016A (en) | Water dispersion of polyurethane resin and binding agent containing water | |
US7060759B2 (en) | Urethane polymer compositions | |
US4098773A (en) | Process for preparing heat-resistant polyurethane elastomers having no secondary softening range | |
US3373143A (en) | Manufacture of polyurethane solutions | |
US3686146A (en) | Thermoplastic polyurethanes for adhesives,coatings and moldings | |
JPH1077457A (en) | Polyurethane-based one-pack hot-melt adhesive improved in initial cohesive power | |
KR20180114414A (en) | Reactive polyurethane hotmelt adhesives having the non-swelling property and producing method of coating textile using the same | |
GB2098225A (en) | Curable adhesive compositions | |
JP2001026762A (en) | Reactive hot-melt adhesive and adhesive interlining cloth using the same | |
JPH07113004A (en) | Thermoplastic polyurethane elastomer and production thereof | |
JPS6329904B2 (en) | ||
US3718713A (en) | Thermoplastic polyamide polyester urethane urea resin | |
JPS59172575A (en) | Hot-melt adhesive and its preparation | |
JPS6253525B2 (en) | ||
JP3144435B2 (en) | Method for producing polyester polyol and curable resin composition | |
JP3101701B2 (en) | New polyurethane and its manufacturing method | |
JPS60149624A (en) | Thermoplastic polyurethane resin | |
JPS6329903B2 (en) |