JPS6329829B2 - - Google Patents

Info

Publication number
JPS6329829B2
JPS6329829B2 JP56053466A JP5346681A JPS6329829B2 JP S6329829 B2 JPS6329829 B2 JP S6329829B2 JP 56053466 A JP56053466 A JP 56053466A JP 5346681 A JP5346681 A JP 5346681A JP S6329829 B2 JPS6329829 B2 JP S6329829B2
Authority
JP
Japan
Prior art keywords
heating element
refrigerant liquid
element assembly
duct
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56053466A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57167663A (en
Inventor
Masao Fujii
Haruo Tetsuno
Kazunari Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56053466A priority Critical patent/JPS57167663A/ja
Priority to KR8201479A priority patent/KR860000253B1/ko
Priority to MX192188A priority patent/MX157055A/es
Priority to IN392/CAL/82A priority patent/IN155369B/en
Priority to AU82439/82A priority patent/AU551611B2/en
Priority to ES511289A priority patent/ES8304364A1/es
Priority to DE19823213112 priority patent/DE3213112A1/de
Priority to ZA822396A priority patent/ZA822396B/xx
Priority to US06/366,124 priority patent/US4572286A/en
Publication of JPS57167663A publication Critical patent/JPS57167663A/ja
Priority to US06/805,538 priority patent/US4653579A/en
Publication of JPS6329829B2 publication Critical patent/JPS6329829B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56053466A 1981-04-07 1981-04-07 Boiling and cooling device Granted JPS57167663A (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP56053466A JPS57167663A (en) 1981-04-07 1981-04-07 Boiling and cooling device
KR8201479A KR860000253B1 (ko) 1981-04-07 1982-04-03 비등 냉각장치(沸騰冷却裝置)
MX192188A MX157055A (es) 1981-04-07 1982-04-06 Mejoras en aparato de enfriamiento por ebullicion para autotransportes
ES511289A ES8304364A1 (es) 1981-04-07 1982-04-07 Aparato de refrigeracion por ebullicion.
AU82439/82A AU551611B2 (en) 1981-04-07 1982-04-07 Ebullition cooling apparatus
IN392/CAL/82A IN155369B (US06346242-20020212-C00066.png) 1981-04-07 1982-04-07
DE19823213112 DE3213112A1 (de) 1981-04-07 1982-04-07 Siedekuehlapparat
ZA822396A ZA822396B (en) 1981-04-07 1982-04-07 Boiling cooling apparatus
US06/366,124 US4572286A (en) 1981-04-07 1982-04-07 Boiling cooling apparatus
US06/805,538 US4653579A (en) 1981-04-07 1985-12-06 Boiling cooling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56053466A JPS57167663A (en) 1981-04-07 1981-04-07 Boiling and cooling device

Publications (2)

Publication Number Publication Date
JPS57167663A JPS57167663A (en) 1982-10-15
JPS6329829B2 true JPS6329829B2 (US06346242-20020212-C00066.png) 1988-06-15

Family

ID=12943637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56053466A Granted JPS57167663A (en) 1981-04-07 1981-04-07 Boiling and cooling device

Country Status (3)

Country Link
JP (1) JPS57167663A (US06346242-20020212-C00066.png)
IN (1) IN155369B (US06346242-20020212-C00066.png)
ZA (1) ZA822396B (US06346242-20020212-C00066.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037223U (US06346242-20020212-C00066.png) * 1989-06-09 1991-01-24
JPH0533429U (ja) * 1991-10-04 1993-04-30 ▲ヤス▼雄 藤間 キーボードのミスタツチ、誤打防止。

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886746A (en) * 1956-01-05 1959-05-12 Gen Electric Evaporative cooling system for electrical devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015098Y2 (ja) * 1976-02-04 1985-05-13 三菱電機株式会社 沸騰冷却装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886746A (en) * 1956-01-05 1959-05-12 Gen Electric Evaporative cooling system for electrical devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037223U (US06346242-20020212-C00066.png) * 1989-06-09 1991-01-24
JPH0533429U (ja) * 1991-10-04 1993-04-30 ▲ヤス▼雄 藤間 キーボードのミスタツチ、誤打防止。

Also Published As

Publication number Publication date
ZA822396B (en) 1983-02-23
JPS57167663A (en) 1982-10-15
IN155369B (US06346242-20020212-C00066.png) 1985-01-19

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