JPS63296299A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce the outside dimensions of a hybrid integrated circuit device and reduce the weight by a method wherein the hybrid integrated circuit substrate is electrically and mechanically connected to a metal case with guides through a substrate grounding protrusion provided on the side surfaces of the metal case. CONSTITUTION:A circuit grounding external terminal 12 is provided at the right end of a hybrid integrated circuit substrate 11. The hybrid integrated circuit substrate 11 is inserted into a metal case 13 by using guides 14 formed on the two facing side surfaces of the metal case 13 by extrusion. Then, the circuit grounding external terminal 12 of the hybrid integrated circuit substrate 11 is connected to a grounding protrusion 15 protruding from the side surface part of the metal case 13 toward the circuit grounding external terminal 12 of the hybrid integrated circuit substrate 11 with solder 16. With this constitution, the hybrid integrated circuit substrate 11 is connected to the metal case 13 electrically and mechanically.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and particularly to a shield structure using a draft case.

[Conventional technology]

Conventionally, as shown in FIG. 2, this type of shield structure includes a hybrid integrated circuit board 2 in a gold bullion case 22 having a grounding tab 21 for grounding the printed wiring board.
It has been common practice to seal the entirety of the external terminal 24 with a seal 25 so that the direction in which the external terminal 24 is pulled out is in contact with the entire terminal 3.

[Problems to be Solved by the Invention] The conventional shield fIII structure described above requires a grounding claw 21 of the metal case 22 separately from the external terminal 24, which increases the size of the device. , filling the inside of the case 22 with resin increases the weight of the device, requires processing to attach the tabs 21 to the printed wiring board on which the device is mounted, and is used to ground the metal case during sealing. The claw part 21 and the external terminal 240 of the hybrid integrated circuit board 23
This method has drawbacks such as requiring a fi1 degree and using a positioning jig exclusively for manufacturing.

[Means for solving problems]

According to the present invention, a hybrid integrated circuit board having a plurality of external terminals on one side thereof, a metal case having guides into which the hybrid integrated circuit board is inserted on two opposing side surfaces;
and a grounding tab extending from the metal case to the vicinity of the grounding external terminal of the plurality of external terminals, and the hybrid integrated circuit board is inserted into the metal case along the guide, A hybrid integrated circuit device is obtained in which the external grounding terminal is electrically connected and fixed to the grounding tab.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, in which an external terminal 12 for circuit grounding is provided at the rightmost end of a hybrid integrated circuit board 11, and is provided by extrusion processing on two opposing sides of a metal case 13. The board 11 is inserted using the board insertion guide 14. Next, the grounding claw 15 pulled out from the side surface of the metal case 13 in the direction of the grounding external terminal 12 and the grounding external terminal 12 are connected by solder 16, and the metal coos 13, the hybrid integrated circuit board 11, and the t-electric It is a physical and mechanical connection.

〔Effect of the invention〕

As explained above, according to the present invention, the hybrid integrated circuit board is fixed to the metal case using guides and claws provided on the side, and there is no need to use a filler. This also has the effect of improving mass productivity and shortening the construction period by eliminating the step of injecting resin into the metal case. Also, on the user side, there is an advantage that there is no need to provide holes for inserting claws in the printed wiring board.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a front view of a conventional example. 11... Hybrid integrated circuit board, 12...
External grounding terminal, 13...Metal case, 14.
... Board insertion guide, 15 ... Grounding claw, 16 ... Solder, 21 ... Grounding claw, 22 ... Metal case , 23...
Hybrid integrated circuit board, 24...External terminal, 25.
−・・・Filling material. Agent Patent Attorney Susumu Uchihara,・−ノ□゛°′−
”MZ diagram

Claims (1)

[Claims] A hybrid integrated circuit board having a plurality of external terminals on one side and a guide into which the hybrid integrated circuit board is inserted are opposed to each other.
the hybrid integrated circuit board has a metal case on one side surface, and a grounding tab extending from the metal case to the vicinity of the grounding external terminal of the plurality of external terminals; A hybrid integrated circuit device, wherein the external grounding terminal is electrically connected to and fixed to the grounding tab.