JPS6329528Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) The present invention is a mold device for resin molding, especially a mold device for resin molding for pressurizing a coating film on the surface of a molded product (in-mold coating). It is related to.

(Prior technology) Conventionally, after molding an FRP resin molded product by SMC press molding, BMC molding, or injection molding, the upper mold is slightly raised and thermosetting paint is injected into the gap between the molded product and the upper mold. In-mold coating technology has already been put into practical use, in which a stable coating film with a beautiful finish is formed on the surface of a molded product by pressurizing the upper mold against the lower mold again. There is a problem in that when the molded product is lifted, it adheres to the upper mold side and is released from the lower mold, making it impossible to perform in-mold coating.

To solve this problem, as described in Japanese Utility Model Application Publication No. 57-159428, a plurality of undercuts are integrally molded on the bottom side of the molded product, protruding into the lower mold, and molding is performed using these undercuts. There are known devices in which the product is fixed to the lower mold.

However, the undercut part is unnecessary and must be removed, which increases the number of removal steps and the removal process is complicated, leaving scratches on the product and resulting in loss of resin material. There is a disadvantage that the mechanism for forming the mold and ejecting it onto the lower mold at the time of ejection becomes complicated.

(Purpose of the invention) This invention was made to eliminate the above-mentioned drawbacks, and it is possible to reliably hold and release the molded product with a simple mechanism without providing an undercut part. The purpose of the present invention is to provide a mold device for resin molding.

(Structure of the device) The feature of the structure is that among the lower mold outer edge forming portion and the upper mold outer edge forming portion that form the vertical outer edge of the molded product, the upper mold outer edge forming portion is formed at multiple locations in the circumferential direction. A vertical groove opening into the outer edge molding cavity is provided, a lower mold member for holding that fits into the vertical groove is provided so as to be freely retractable from the lower mold, and the lower mold member for holding is connected to the movable member of the eject mechanism. They are connected via a connecting mechanism that moves up and down in opposite directions, and the holding lower mold member is fitted into the vertical groove during molding and immersed into the lower mold during ejection.

(Effects of the invention) Since the present invention is constructed as described above, the outer edge of the molded product is restrained from the outside by the lower mold member for holding at multiple locations and tightly adheres to the outer edge forming part of the lower mold. Since it is held between the outer edge forming part and the lower holding mold member, the molded product is reliably held in the lower mold and will not be released even when the upper mold is raised due to in-mold coating.

Furthermore, when ejecting after in-mold coating, the holding lower mold member moves in the opposite direction to the movable member of the ejecting mechanism and sinks into the lower mold, so that the molded product can be reliably released from the mold.

In this way, a molded product can be reliably held and released using a simple and inexpensive mechanism consisting of a plurality of vertical grooves and a holding lower die member linked to an eject mechanism, which makes it possible to reliably hold and release a molded product. It is possible to omit the undercut portion in the above and eliminate all the drawbacks associated with it.

Moreover, the present invention can be easily applied to existing mold equipment.

(Example) Hereinafter, an example of the present invention will be described based on the drawings.

The resin molding mold device of the present invention is a device for molding SMC, which is a plate-shaped intermediate material for various FRPs, and then in-mold coating the surface of the molded product with a solvent-free two-component thermosetting paint.

As shown in FIG. 1, this resin molding mold device consists of an upper mold 2 fixed to an upper mold holding frame 1 of a vertical molding press, and a lower mold 4 fixed to a lower mold holding stand 3.
The holding lower die member 6, a link mechanism 7, etc. are added to the basic structure consisting of the eject mechanism 5 and the eject mechanism 5.

The molded product 8 illustrated in the figure is a sliding roof for an automobile, for example, by cutting SMC made of unsaturated polyester and glass fiber into a predetermined shape and pressurizing it into the molding cavity between the upper mold 2 and the lower mold 4. molded. After this molding, the upper mold 2 is raised by about 1 to 3 mm, the thermosetting paint is injected into the gap between the molded product 8 and the upper mold 2 from a paint injection device (not shown) of the upper mold 2, and the upper mold 2 is lowered again. The paint is spread on the surface of the molded product 8, and the upper mold 2 applies heat and pressure to coat the SMC molded product.Finally, the upper mold 2 is raised, and the ejecting cylinder 9 of the ejecting mechanism 5 is used to eject the paint. By projecting an eject pin 11 through an eject plate 10, the molded product 8 is released from the lower mold 4 and taken out of the machine.

Here, as shown in FIGS. 1 to 3, of the lower mold outer edge forming part 4a and the upper mold outer edge forming part 2a forming the vertical outer edge 8a of the molded product 8, the upper mold outer edge forming part 2a is 2 on each side at appropriate intervals in the circumferential direction
Vertical square grooves 12 are recessed at a total of eight locations and open into the outer edge molding cavity. Further, directly below each square groove 12, a vertical square hole 13 is provided in the lower mold 4,
An elongated prismatic rod 14 is inserted into each square hole 13 so as to be vertically slidable, and the lower holding mold member 6 consisting of the upper end thereof can be freely inserted into and removed from the square groove 12. The lower half is extended to near the eject plate 10 of the eject mechanism 5, and its lower end is interlocked and connected to the eject plate 10 via a link mechanism 7 as a connection mechanism so that both move up and down in opposite directions. be.

That is, in the link mechanism 7, a link member 17 is pivotally supported on the top of a post 16 erected on a base 15 in the shape of a balance, and a rod 14 is inserted into an elongated hole at one end of the link member 17.
Connect the lower end of the link tool 17 with a pin, and connect the connecting tool 1 on the eject plate 10 side to the elongated hole at the other end of the link tool 17.
8 is connected with a pin, and when the eject pin 11 is retracted during molding, the holding lower mold member 6 fits into the square groove 12 and functions as a part of the upper mold outer edge forming portion 2a. When the eject pin 11 protrudes during ejection, the lower mold member 6 is inserted into the square hole 1 of the lower mold 4 via the link mechanism 7.
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In addition to the link mechanism 7 described above, a pushable cable is used as a connecting mechanism to move the lower mold member 6 up and down in opposite directions to a movable member such as the eject plate 10 of the eject mechanism 5. You can also do that.

Furthermore, the outer edge portion 8a of the molded product 8 does not necessarily have to extend over the entire circumference; for example, the outer edge portion 8a may only be present on three sides of a quadrilateral (in plan view) or on two opposing sides.

In addition to forming a part of the molded product 8, the outer edge portion 8a may be temporarily formed integrally with the molded product 8 in order to apply this mold device.

In addition, this mold equipment can be used in addition to SMC molding.
Of course, it can also be applied to BMC molding and injection molding.

Next, the operation of the above configuration will be explained.

After molding the SMC, when the upper mold 2 is raised by about 1 to 3 mm, for example, as shown in FIG. It is held and supported from the outside to maintain a close contact with the lower mold outer edge forming part 4a, and is also held between the lower mold outer edge forming part 4a and the lower mold member 6, so that a contact friction force also acts.

This makes it difficult for air to enter between the molded product 8 and the lower mold 4 when the upper mold 2 rises, making it difficult for air to separate from the outer edge forming part 4a of the lower mold. The molded product 8 is reliably released from the upper mold 2.

In this way, the paint is injected into the gap between the molded product 8 and the upper mold 2, and after the upper mold 2 is lowered to form a coating film, when the eject mechanism 5 ejects the product, the eject plate 10 moves upward. Since the lower mold member 6 then starts to move downward and sinks into the lower mold 4, it does not interfere with ejection and can be reliably ejected.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a longitudinal sectional front view of the main parts of a mold device for resin molding, and FIG. 2 is an end view taken along the line shown in FIG. 1, which is a plan view of a molded product and a lower mold. , FIG. 3 is an enlarged longitudinal sectional front view of the main part showing the upper die in a raised state. 2... Upper mold, 2a... Upper mold outer edge forming part, 4...
Lower mold, 4a... Lower mold outer edge forming portion, 5... Eject mechanism, 6... Lower mold member for holding, 7...
... Link mechanism, 8 ... Molded product, 8a ... Outer edge,
10...Movable member, 12...Vertical ditch.

Claims (1)

[Scope of utility model registration request] In a resin molding mold device consisting of an upper mold, a lower mold, and an eject mechanism, the upper mold outer edge forming part is the lower mold outer edge forming part and the upper mold outer edge forming part forming the vertical outer edge of the molded product. Vertical grooves opening into the outer edge molding cavity are provided at multiple locations in the circumferential direction, and a holding lower mold member that fits into the vertical grooves is provided so as to be freely retractable from the lower mold, and the holding lower mold member is inserted into the eject mechanism. A mold device for resin molding, characterized in that it is connected to a movable member via a connection mechanism that moves up and down in the opposite direction.