JPS63294471A - Low-temperature heat insulator - Google Patents
Low-temperature heat insulatorInfo
- Publication number
- JPS63294471A JPS63294471A JP12586687A JP12586687A JPS63294471A JP S63294471 A JPS63294471 A JP S63294471A JP 12586687 A JP12586687 A JP 12586687A JP 12586687 A JP12586687 A JP 12586687A JP S63294471 A JPS63294471 A JP S63294471A
- Authority
- JP
- Japan
- Prior art keywords
- cold storage
- gas
- low
- storage tank
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 title 1
- 239000007789 gas Substances 0.000 claims description 89
- 238000001816 cooling Methods 0.000 claims description 18
- 239000000112 cooling gas Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241000234479 Narcissus Species 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は低温保冷装置に係り、特にコンピュータのＣＰ
Ｕやメモリ等を冷却するのに好適な低温保冷装置に関す
るものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a low temperature cooling device, and particularly to a computer CPU.
The present invention relates to a low temperature cooling device suitable for cooling U, memory, etc.
従来の冷却装置、例えば、電子素子を実装したＣＰＵや
メモリを極低温に冷却して動作させる極低温コンピュー
タの冷却装置としては、アイ・イーｅイー・イー、トラ
ンザクション オン エレクトロン ディバイシス、Ｅ
Ｄ−３４Ｎｏ、１ （１９８７年）第４頁から第７頁（
Ｉ Ｅ Ｅ Ｅ ＴＲＡＮＳＡ ＣＴｌ０ＮＳ ＯＮ
ＥＬＥＣＴＲＯＮ ＤＥＶＩＣ：ＥＳ、 ＶＯＬ、
Ｅ Ｄ −３４、Ｎｏ、Ｉ ＪＡＮＵＡＲＹ １９８
７．ＰＰ４−７）において論じられている。Conventional cooling devices, such as cooling devices for cryogenic computers that operate by cooling CPUs and memory mounted with electronic elements to extremely low temperatures, are available from IE, Transaction on Electron Devices, and E.
D-34 No. 1 (1987) pages 4 to 7 (
IEEE TRANSA CTl0NS ON
ELECTRON DEVIC: ES, VOL,
ED-34, No. I JANUARY 198
7. PP4-7).
また、この種の装置として関連するものには例えば米国
特許第４２２３５４０号明細書等が挙げられる。Further, related devices of this type include, for example, US Pat. No. 4,223,540.
上記従来技術は冷却媒体の供給の点について配慮されて
おらず、保冷槽内の冷却媒体である液化ガスを供給また
は補充するのに液体ガスを供給しており、そのため液化
ガスを貯蔵した液化ガスタンクが必要になり、設備費が
掛かるという問題があった。The above conventional technology does not take into consideration the supply of the cooling medium, and instead supplies liquid gas to supply or replenish the liquefied gas that is the cooling medium in the cold storage tank, so the liquefied gas tank storing the liquefied gas There was a problem in that this required equipment costs.
本発明の目的は、設備費を安価にし、コスト低減を図る
ことのできる低温保冷装置を提供することにある。An object of the present invention is to provide a low-temperature cooling device that can reduce equipment costs and reduce costs.
上記目的は、低温ガスを充填し低温ガスで冷却される被
冷却体を収納した保冷槽と、保冷槽の外側に断熱空間を
形成する外槽と、保冷槽内の低温ガスを冷却または凝す
る冷却手段とで構成することにより、達成される。The above purpose is to provide a cold storage tank that is filled with low-temperature gas and stores objects to be cooled by the low-temperature gas, an outer tank that forms an insulating space on the outside of the cold storage tank, and a cooling or condensation system that cools or condenses the low-temperature gas inside the cold storage tank. This is achieved by comprising a cooling means.
保冷槽内にはガスを充填させ、該ガスを冷却手段によっ
て冷却し低温ガスとし、保冷槽内の被冷却体を該低温ガ
スにより冷却するようにしたことにより、液化ガスを用
いることなく、ガスの供給または補充だけですむので、
設備費を安価にしコスト低減を図ることができるという
効果がある。The cold storage tank is filled with gas, the gas is cooled by a cooling means to turn it into low-temperature gas, and the objects to be cooled in the cold storage tank are cooled by the low-temperature gas. It is only necessary to supply or replenish the
This has the effect of reducing equipment costs and reducing costs.
以下、本発明の一実施例を第１図により説明する。 An embodiment of the present invention will be described below with reference to FIG.
外槽３内に保冷槽１を設け、外槽３と保冷槽ｌとの間に
断熱空間２、この場合は、真空断熱空間を形成し、上部
にフランジ４を取り付けて容器を形成する。フランジ４
には、この場合、開口部が２ケ所設けてあり、一方には
冷凍機６を取り付け。A cold storage tank 1 is provided in an outer tank 3, a heat insulation space 2, in this case, a vacuum heat insulation space, is formed between the outer tank 3 and the cold storage tank 1, and a flange 4 is attached to the upper part to form a container. Flange 4
In this case, there are two openings, and the refrigerator 6 is attached to one of them.
冷凍機６のコールドステーション７を保冷槽１内に収納
し、他方の開口部にはＭ５を取り付け、蓋５にサポート
１０ａを介して支持した被冷却体、例えば、電子素子を
実装したＣＰＵやメモリを取り付けた基板８が保冷槽ｌ
内に収納しである。この場合、基板８はコールドステー
ション７の下方に配置してあり、基板８に接続されたリ
ード線９はＭ５を貫通して外部に引き出される。A cold station 7 of a refrigerator 6 is housed in a cold storage tank 1, an M5 is attached to the other opening, and an object to be cooled, such as a CPU or memory mounted with electronic elements, is supported on the lid 5 via a support 10a. The board 8 with attached is placed in the cold storage tank l
It is stored inside. In this case, the board 8 is placed below the cold station 7, and the lead wire 9 connected to the board 8 passes through M5 and is drawn out.
保冷槽１には流量調節弁１’ ｌを介してガスポンベ１
２が接続してあり、保冷槽１内にガスを供給可能にしで
ある。また、この場合、フランジ４および蓋５には、保
冷槽１内の温度および圧力を測定する温度計１３および
圧力計１４が設けてあり、それぞれの信号は制御装置１
５ａに入力され、制御装置１５ａは保冷槽ｌ内の温度お
よび圧力によって流量調整弁１１を制御するようになっ
ている。A gas pump 1 is connected to the cold storage tank 1 via a flow rate control valve 1'l.
2 is connected so that gas can be supplied into the cold storage tank 1. Further, in this case, the flange 4 and the lid 5 are provided with a thermometer 13 and a pressure gauge 14 for measuring the temperature and pressure inside the cold storage tank 1, and the respective signals are sent to the control device 1.
5a, and the control device 15a controls the flow rate regulating valve 11 according to the temperature and pressure inside the cold storage tank l.
上記構成の装置により、真空断熱した保冷槽１内にガス
ポンベ１２からガスを供給して充填し、冷凍機６を作動
させてコールドステーション７に寒冷を生じさせて、保
冷槽１内のガスを冷却し低温ガス１６を保冷槽１内に充
填させる。基板８はこの低温ガス１６によって冷却され
る。With the device configured as described above, gas is supplied from the gas pump 12 into the vacuum-insulated cold storage tank 1 to fill it, and the refrigerator 6 is operated to generate cold in the cold station 7 to cool the gas inside the cold storage tank 1. Then, the cold storage tank 1 is filled with low-temperature gas 16. The substrate 8 is cooled by this low temperature gas 16.
保冷槽１は一応密閉しであるので、保冷槽１外への低温
ガス１６のリークはないと考えられるが、仮に、低温ガ
ス１６がリークして保冷槽１内の低温ガスが少なくなれ
ば、温度計１３によって測定した保冷槽１内の低温ガス
温度と、圧力計１４によって測定した保冷槽１内の低温
ガス圧力とによって、制御装置１５ａにより保冷槽１内
が所定温度、圧力時に必要となる低温ガス量となるべく
、現在温度でのガス圧力を算出し、該圧力となるように
流量制御弁１１を制御してガスポンベ１２からガスを保
冷槽ｌ内に補給する。Since the cold storage tank 1 is sealed, it is thought that there is no leakage of the low temperature gas 16 to the outside of the cold storage tank 1, but if the low temperature gas 16 leaks and the low temperature gas inside the cold storage tank 1 decreases, Based on the low-temperature gas temperature in the cold storage tank 1 measured by the thermometer 13 and the low-temperature gas pressure in the cold storage tank 1 measured by the pressure gauge 14, the control device 15a determines when the inside of the cold storage tank 1 is at a predetermined temperature and pressure. In order to obtain the low-temperature gas amount, the gas pressure at the current temperature is calculated, and the flow rate control valve 11 is controlled so as to achieve the calculated pressure, and gas is supplied from the gas pump 12 into the cold storage tank l.
保冷槽ｌ内では、コールドステーション７によって冷却
された低温ガスが下に降りて行き、コールドステーショ
ン７の下部に配置された基板８が充分に冷却された低温
ガスで有効に冷却される。In the cold storage tank 1, the low temperature gas cooled by the cold station 7 descends, and the substrate 8 disposed at the bottom of the cold station 7 is effectively cooled by the sufficiently cooled low temperature gas.
以上、本−実施例によれば、保冷槽ｌ内に収納した基板
８を低温ガスで有効に冷却することができるので、液化
ガスを使用する必要がなく、設備費が安くなりコスト低
減を図ることができるという効果がある。As described above, according to this embodiment, the substrate 8 housed in the cold storage tank l can be effectively cooled with low-temperature gas, so there is no need to use liquefied gas, and equipment costs are reduced, resulting in cost reduction. It has the effect of being able to
また、保冷槽１内の低温ガスが少なくなっても保冷槽１
内の温度および圧力をみて制御装置１５ａによって自動
的にガスのみを供給するだけで補給ができるという効果
がある。In addition, even if the low temperature gas in the cold storage tank 1 decreases, the cold storage tank 1
There is an effect that replenishment can be performed by simply supplying only gas automatically by the control device 15a based on the temperature and pressure inside.
なお、本−実施例によれば基板８の冷却はコールドステ
ーション７で冷却した低温ガスとなっているが、コール
ドステーション７でガスを凝縮して、凝縮された液化ガ
スを基板８上に滴下し、さらに冷却効率を上げるように
しても良い。According to this embodiment, the substrate 8 is cooled with low-temperature gas cooled at the cold station 7, but the gas is condensed at the cold station 7 and the condensed liquefied gas is dropped onto the substrate 8. , the cooling efficiency may be further increased.
次に、本発明の他の実施例を第２図により説明する。Next, another embodiment of the present invention will be described with reference to FIG.
本図において第１図と同符号のものは同一部材を示し、
説明は省略する０本図が第１図と異なる点は、保冷槽１
内に液化ガス２２がシ留められ、液面計２１が設けてあ
り、液面計からの信号が制御装置１５ｂに入力されてい
る点と、流量制御弁１１に吸着器１７および加圧機１８
が順次つながり、加圧機１８の他方には空気取入口１９
が接続しである点と、制御装置１５ｂによって制御され
る熱負荷装置２０が冷凍機６のコールドステーション７
に取り付けである点である。１０ｂは基板８を液化ガス
の液面上部に支持するサポートである。In this figure, the same symbols as in Figure 1 indicate the same members,
Description is omitted.The difference between this figure and Figure 1 is that the cold storage tank 1
The liquefied gas 22 is stored inside the tank, a liquid level gauge 21 is provided, and a signal from the level gauge is input to the control device 15b.
are connected in sequence, and the other side of the pressurizer 18 has an air intake port 19.
is connected to the cold station 7 of the refrigerator 6, and the heat load device 20 controlled by the control device 15b is connected to the cold station 7 of the refrigerator 6.
The point is that it is attached. 10b is a support that supports the substrate 8 above the liquid level of the liquefied gas.
上記構成の装置により、空気取入口１９がら加圧機１８
に吸込まれた空気が加圧されて吸着器１７に送られ、不
純物を吸着する活性炭等を封入した吸着器１７で水分、
炭酸ガス、炭化水素ガス等の不純物を吸着除去した酸素
および窒素の混合ガス、または酸素も吸着除去した窒素
ガスを制御装置１５ｂによって制御される流量制御弁１
１を介して、保冷槽１内に供給する。With the device configured as described above, the air intake port 19 and the pressurizer 18
The air sucked into the air is pressurized and sent to the adsorber 17, where it is filled with activated carbon to adsorb impurities, where it absorbs water and water.
A flow rate control valve 1 controlled by a control device 15b controls a mixed gas of oxygen and nitrogen from which impurities such as carbon dioxide and hydrocarbon gas have been adsorbed and removed, or nitrogen gas from which oxygen has also been adsorbed and removed.
1 into the cold storage tank 1.
保冷槽１内では、送り込まれたガスが冷凍機６のコール
ドヘッド７によって冷却され凝縮し、液化して保冷槽１
の底部に溜まる。液化ガスが所定量溜まると、液面計２
１からの信号が制御装置１５ｂに入力され、加圧機１８
の停止および流量制御弁１１の閉動作が行なわれ、ガス
の供給が止められる。Inside the cold storage tank 1, the fed gas is cooled and condensed by the cold head 7 of the refrigerator 6, and is liquefied and stored in the cold storage tank 1.
It collects at the bottom of the. When a predetermined amount of liquefied gas accumulates, the liquid level gauge 2
1 is input to the control device 15b, and the pressure machine 18
is stopped and the flow rate control valve 11 is closed, and the gas supply is stopped.
保冷槽１内の液化ガスは外部からのわずかな熱侵入によ
って少しずつ蒸発し、ガス化した低温ガスによって基板
８が冷却される。この間、蒸発した低温ガスはコールド
へラド７で再凝縮され液化ガスとなり、これを繰り返す
、このとき、保冷槽１内での基板８の冷却が安定するよ
うに、すなわち、保冷槽ｌ内の低温ガス圧力が一定する
ように、低温ガス圧力を圧力計１４によって測定し、コ
ールドステーション７で凝縮され液化ガスとなる量を熱
負荷装置２０を制御装置１５ｂによって制御する。なお
、この場合、熱負荷装置２０にはコールドステーション
７の温度を測定する温度計が内設されており、制御装ｆ
ｉ１５ｂに信号が送られ、加温温度を制御するようにな
っている。The liquefied gas in the cold storage tank 1 evaporates little by little due to slight heat intrusion from the outside, and the substrate 8 is cooled by the gasified low-temperature gas. During this time, the evaporated low-temperature gas is recondensed into liquefied gas in the cold storage tank 7, and this process is repeated. In order to keep the gas pressure constant, the low-temperature gas pressure is measured by the pressure gauge 14, and the amount of condensed gas at the cold station 7 to become liquefied gas is controlled by the heat load device 20 by the control device 15b. In this case, the heat load device 20 is equipped with a thermometer for measuring the temperature of the cold station 7, and the control device f
A signal is sent to i15b to control the heating temperature.
また、この制御において、コールドステーション７の温
度が大気圧での液化ガスの沸点温度よりもかなり低い場
合には保冷槽内の圧力は負圧となるので、この場合、圧
力計１４の信号を制御装置１５ｂが受けて熱負荷装置２
０を作動させ、コールドステーション７を加温する。ま
た、熱負荷装置２０に設けた温度計の測定値が液化ガス
の沸点温度よりも充分低く、なおかつ、保冷槽１内の圧
力が増加する場合は、コールドステーション７の９ｉ縮
面で液化ガスが固化しているので、熱負荷装置２０を作
動させてコールドステーション７を加温し固化ガスを溶
かし、凝縮面を再生する。In addition, in this control, if the temperature of the cold station 7 is considerably lower than the boiling point temperature of the liquefied gas at atmospheric pressure, the pressure inside the cold storage tank becomes negative pressure, so in this case, the signal of the pressure gauge 14 is controlled. The heat load device 2 receives on the device 15b
0 to warm the cold station 7. In addition, if the measured value of the thermometer installed in the heat load device 20 is sufficiently lower than the boiling point temperature of the liquefied gas and the pressure inside the cold storage tank 1 increases, the liquefied gas will rise at the 9i condensation surface of the cold station 7. Since it is solidified, the heat load device 20 is activated to heat the cold station 7 to melt the solidified gas and regenerate the condensation surface.
また、保冷槽１は一応密閉しであるので、保冷槽１外へ
の低温ガス１６のリークはないと考えられ、この状態で
は液化ガス２２の液面は一定の高さに保持される。しか
し、仮に、低温ガス１６がリークしたとしたら、その分
液化ガス２２が少なくなり液面が低下する。液化ガス２
２の液面が低下し液面計２１の所定位置まで液面が低下
すると、制御装置１５ｂに液面計９からの信号が送られ
、制御装置１５ｂは加圧器１８および流量調整弁１１を
制御して、精製したガスを保冷槽ｌ内に少量づつ補給る
す、補給されたガスは保冷槽１内の低温ガスに混じり、
コールドステーション７で冷却、凝縮され、液化し液化
ガスとなって保冷槽１底部に溜まり、徐々に液面が上昇
する。液面が所定高さまで達すると、制御装置１５ｂは
液面計２１からの信号を受けて、加圧機１８および流量
調整弁１１を制御してガスの供給を停止させ、補給を終
了する。Furthermore, since the cold storage tank 1 is sealed, it is considered that there is no leakage of the low temperature gas 16 to the outside of the cold storage tank 1, and in this state, the liquid level of the liquefied gas 22 is maintained at a constant level. However, if the low temperature gas 16 were to leak, the amount of the liquefied gas 22 would decrease and the liquid level would drop. liquefied gas 2
When the liquid level of No. 2 decreases to a predetermined position of the liquid level gauge 21, a signal from the liquid level gauge 9 is sent to the control device 15b, and the control device 15b controls the pressurizer 18 and the flow rate adjustment valve 11. Then, the purified gas is replenished into the cold storage tank 1 little by little, and the replenished gas mixes with the low temperature gas in the cold storage tank 1,
It is cooled and condensed at the cold station 7, becomes liquefied, becomes liquefied gas, and accumulates at the bottom of the cold storage tank 1, and the liquid level gradually rises. When the liquid level reaches a predetermined height, the control device 15b receives a signal from the liquid level gauge 21, controls the pressurizer 18 and the flow rate adjustment valve 11 to stop the gas supply, and ends the replenishment.
以上、本他の実施例によれば、液化ガスが基発した低温
ガスにより基板８を有効に冷却することができ、液化ガ
スを多量に使用する必要がなく、ガスを供給し少量の液
化ガスを作る程度の冷凍機ですむので、設備費が安くな
り、コスト低減を図ることができる。As described above, according to this other embodiment, the substrate 8 can be effectively cooled with a low-temperature gas based on liquefied gas, and there is no need to use a large amount of liquefied gas. Since only a refrigerator is needed to make 1000 ml, equipment costs are low and costs can be reduced.
また、ガス供給は、空気を精製して供給できるので、い
つでも冷媒ガスを供給できるとともに、冷媒ガスを購入
する必要もない。Furthermore, since gas can be supplied by purifying air, refrigerant gas can be supplied at any time, and there is no need to purchase refrigerant gas.
さらに、前記一実施例と同様、ガスのみを供給するので
、液化ガスに比べて管理が簡単になるという効果がある
。Furthermore, as in the previous embodiment, since only gas is supplied, there is an effect that management is easier than with liquefied gas.
なお、水仙の実施例ではガスを供給する際に、加圧機１
８で空気を加圧して送るようにしているが、少なくとも
ガス供給時は保冷槽１内の圧力を大気圧よりも低い圧力
で運転するようにしておけば、差圧によってガスを保冷
槽１内へ送り込むことができ、ガス供給部の装置を簡単
にできる。In addition, in the Daffodil example, when supplying gas, the pressurizer 1
8, the air is pressurized and sent, but if the pressure inside the cold storage tank 1 is set to be lower than atmospheric pressure at least when gas is supplied, the gas can be pumped into the cold storage tank 1 by the differential pressure. The gas supply unit can be easily configured.
また、基板８を液化ガス２２に一部漬けたり。Further, the substrate 8 is partially immersed in the liquefied gas 22.
浸漬したりすれば、さらに効率的に冷却できることはい
うまでもない。It goes without saying that cooling can be done even more efficiently by immersing it.
また、冷凍４ｙｉ６においても、往復動式の膨張機、タ
ービン式の膨張機、磁気冷凍機等いろいろ適用でき、限
定されるものではない。In addition, the refrigerator 4yi6 can also be used in various ways, such as a reciprocating expander, a turbine expander, a magnetic refrigerator, etc., and is not limited thereto.
本発明によれば、保冷槽内へはガスを供給するだけで良
く、設備費が安価になり、コスト低減を図ることができ
るという効果がある。According to the present invention, it is sufficient to simply supply gas into the cold storage tank, and there is an effect that the equipment cost is reduced and costs can be reduced.
第１図は本発明の一実施例である低温保冷装置を示す断
面図、７３２図は本発明の他の実施例である低温保冷装
置を示す断面図である。FIG. 1 is a cross-sectional view showing a low-temperature cold storage device according to an embodiment of the present invention, and FIG. 732 is a cross-sectional view showing a low-temperature cold storage device according to another embodiment of the present invention.
Claims (1)
を収納した保冷槽と、該保冷槽の外側に断熱空間を形成
する外槽と、前記保冷槽内の低温ガスを冷却または凝縮
する冷却手段とから成ることを特徴とする低温保冷装置
。 ２、前記保冷槽の上部に前記冷却手段を配置し、前記保
冷槽の下部に被冷却体を配置した特許請求の範囲第１項
記載の低温保冷装置。 ３、前記被冷却体が前記冷却手段の下にある特許請求の
範囲第２項記載の低温保冷装置。４、液化ガスまたは低
温ガスを貯蔵する保冷槽と、該保冷槽の外側に断熱空間
を形成する外槽と、前記保冷槽内の液化ガスまたは低温
ガスのガスを供給する供給手段と、前記保冷槽内のガス
を凝縮または冷却する冷却手段とから成ることを特徴と
する低温保冷装置。 ５、前記保冷槽内に前記液化ガスまたは前記液化ガスが
蒸発した低温ガスで冷却される被冷却体を収納した特許
請求の範囲第４項記載の低温保冷装置。 ６、前記保冷槽内に前記低温ガスで冷却される被冷却体
を収納した特許請求の範囲第４項記載の低温保冷装置。[Scope of Claims] 1. A cold storage tank filled with low-temperature gas and containing objects to be cooled to be cooled by the low-temperature gas, an outer tank forming a heat insulating space outside the cold storage tank, and a 1. A low-temperature refrigerator comprising a cooling means for cooling or condensing low-temperature gas. 2. The low-temperature cold storage device according to claim 1, wherein the cooling means is arranged in the upper part of the cold storage tank, and the object to be cooled is arranged in the lower part of the cold storage tank. 3. The low-temperature cold storage device according to claim 2, wherein the object to be cooled is below the cooling means. 4. A cold storage tank for storing liquefied gas or low-temperature gas, an outer tank forming a heat insulating space outside the cold storage tank, a supply means for supplying the liquefied gas or low-temperature gas in the cold storage tank, and the cold storage tank. A low-temperature cooling device characterized by comprising a cooling means for condensing or cooling gas in a tank. 5. The low-temperature cold storage device according to claim 4, wherein an object to be cooled to be cooled by the liquefied gas or a low-temperature gas obtained by evaporating the liquefied gas is housed in the cold storage tank. 6. The low-temperature cold storage device according to claim 4, wherein an object to be cooled by the low-temperature gas is housed in the cold storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12586687A JPS63294471A (en) | 1987-05-25 | 1987-05-25 | Low-temperature heat insulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12586687A JPS63294471A (en) | 1987-05-25 | 1987-05-25 | Low-temperature heat insulator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63294471A true JPS63294471A (en) | 1988-12-01 |
Family
ID=14920875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12586687A Pending JPS63294471A (en) | 1987-05-25 | 1987-05-25 | Low-temperature heat insulator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63294471A (en) |
-
1987
- 1987-05-25 JP JP12586687A patent/JPS63294471A/en active Pending
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