JPS63294010A - Surface acoustic wave resonator - Google Patents
Surface acoustic wave resonatorInfo
- Publication number
- JPS63294010A JPS63294010A JP13061987A JP13061987A JPS63294010A JP S63294010 A JPS63294010 A JP S63294010A JP 13061987 A JP13061987 A JP 13061987A JP 13061987 A JP13061987 A JP 13061987A JP S63294010 A JPS63294010 A JP S63294010A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- piezoelectric thin
- electrodes
- resonator
- surface wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 15
- 239000010409 thin film Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005368 silicate glass Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000000644 propagated effect Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000005360 phosphosilicate glass Substances 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000000496 pancreas Anatomy 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、圧電性薄膜を用いた弾性表面波共振器の改良
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in surface acoustic wave resonators using piezoelectric thin films.
[発明の概要]
本発明は、圧電性薄膜の上にガラス質層を形成し、その
ガラス質層に溝列(グループ)を形成して共振器とした
ものである。[Summary of the Invention] According to the present invention, a vitreous layer is formed on a piezoelectric thin film, and groove arrays (groups) are formed in the vitreous layer to form a resonator.
[従来の技術]
従来の弾性表面波共振器は、主に水晶、L i T a
O、などの圧電単結晶基板で構成されている。これに
対し、半導体基板上に圧電薄膜を形成したモノリシック
構造を有する弾性表面波共振器は1周辺回路を含めて1
チツプ集積化が実現でき。[Prior Art] Conventional surface acoustic wave resonators are mainly made of crystal, LiTa
It is composed of a piezoelectric single crystal substrate such as O. On the other hand, a surface acoustic wave resonator with a monolithic structure in which a piezoelectric thin film is formed on a semiconductor substrate has one part including one peripheral circuit.
Chip integration can be realized.
将来性に富む素子構造体と期待されている。This is expected to be a promising device structure.
[発明が解決しようとする問題点]
従来の圧電薄膜共振器には、その圧電薄膜として、Zn
O圧′?B、薄膜、A Q N圧電薄膜が多く使われて
いるが、ZnO圧電薄膜には。[Problems to be solved by the invention] In the conventional piezoelectric thin film resonator, Zn is used as the piezoelectric thin film.
O pressure'? B, thin film, A Q N piezoelectric thin film is often used, but ZnO piezoelectric thin film.
1)電圧印加により電気的不安定性が生ずる。1) Electrical instability occurs due to voltage application.
2)良質な膜が形成しにくい。2) It is difficult to form a high-quality film.
3)シリコン単結晶基板上に保護膜(Sin2)を必要
とする。3) A protective film (Sin2) is required on the silicon single crystal substrate.
4)高周波領域で弾性表面波の伝搬損失が大きい。4) The propagation loss of surface acoustic waves is large in the high frequency region.
5)通常のシリコンICプロセスと合致しない。。5) Does not match normal silicon IC process. .
などの欠点があり、特に1チツプ集積化用圧電薄膜とし
ては、AflN薄膵の方の使用が望まれる。Because of these drawbacks, it is particularly desirable to use AflN thin pancreas as a piezoelectric thin film for one-chip integration.
上記シリコン単結晶基板」ユのA Q N薄膜を用いて
共振器を構成した例として、L、G、Pearce e
tal(Appl、Phys、Letl Vol 39
(1981) Dec、、Vo、11゜NetiYor
k、U、S、A)の論文で、Al2N薄膜を2ポート共
振器に応用したものが記載されている。As an example of a resonator constructed using the AQN thin film of the silicon single crystal substrate mentioned above, L, G, Pearce
tal (Appl, Phys, Letl Vol 39
(1981) Dec, Vo, 11°NetiYor
K, U, S, A) describe the application of Al2N thin film to a two-port resonator.
この共振器の構成はA Q N / S iOz /
S l構造で、グレーティング反射器は短絡された40
0本のAuストリップで形成されている。The configuration of this resonator is A Q N / SiOz /
In the S l structure, the grating reflector is short-circuited 40
It is formed of 0 Au strips.
そして、上記共振器の特性は、共振周波数121、.7
MHzで、挿入損失27dB、性能指数(Qualit
y Factor) 3370とされており、充分な特
性とは言えない。The characteristics of the resonator are as follows: resonance frequency 121, . 7
At MHz, insertion loss is 27 dB, Qualit
y Factor) 3370, which cannot be said to be a sufficient characteristic.
従来、考えられている素子構成手段では、小型で、しか
も良好な特性を有する共振器を得ることは極めて雅しい
。With conventional device construction means, it is extremely easy to obtain a resonator that is small and has good characteristics.
本発明の目的は1弾性表面波素子と周辺回路を1チツプ
上に集積化するのに適する圧電薄膜型弾性表面波共振器
を提供することにある。An object of the present invention is to provide a piezoelectric thin film type surface acoustic wave resonator suitable for integrating one surface acoustic wave element and peripheral circuits on one chip.
[問題点を解決するための手段]
本発明は、上記の目的を達成するため、半心体基板上に
圧電薄膜を形成し、さらにその上にガラス質層を形成し
、このガラス質層に、前記圧電薄膜に設けた入出力用電
極の両側に位置する表面波反射用溝列を形成し、それに
よって上述した問題点の解決を図ったものである。[Means for Solving the Problems] In order to achieve the above object, the present invention forms a piezoelectric thin film on a semi-concentric substrate, further forms a vitreous layer thereon, and forms a piezoelectric thin film on the vitreous layer. , surface wave reflecting groove arrays are formed on both sides of the input/output electrodes provided on the piezoelectric thin film, thereby solving the above-mentioned problems.
前記ガラス質層としては、 シリコン酸化物(SiO2
)、リンケイ酸ガラス(PSG)、ホウケイ酸ガラス(
BSG)、ホンリンケイ酸ガラス(B P S G)等
がある。As the glassy layer, silicon oxide (SiO2
), phosphosilicate glass (PSG), borosilicate glass (
BSG), phosphorus silicate glass (BPSG), etc.
[作用]
上記構成においては、入出力用電極の両側に位置する表
面波反射用溝列間で表面波の定在波が生じ、それが前記
電極で検出される。[Operation] In the above configuration, a standing wave of surface waves is generated between the rows of surface wave reflecting grooves located on both sides of the input/output electrode, and is detected by the electrodes.
[実施例コ
第1図および第2図は、本発明を2ポート共振器に実施
した実施例であって、1はシリコン単結晶基板、2はそ
の上に形成されたAlN圧電薄膜層である。3はAlN
圧電薄膜層2の上に形成されたシリコン酸化膜層である
。4,5は、AlN圧’老R1f膜λり2とシリコン酸
化膜層3との間に形成された表面波の発生および検出用
櫛型電極である。[Example 1] Figures 1 and 2 show an example in which the present invention was implemented in a two-port resonator, in which 1 is a silicon single crystal substrate, and 2 is an AlN piezoelectric thin film layer formed thereon. . 3 is AlN
This is a silicon oxide film layer formed on the piezoelectric thin film layer 2. 4 and 5 are comb-shaped electrodes for generating and detecting surface waves formed between the AlN pressure sensitive R1f film λ layer 2 and the silicon oxide film layer 3.
6は表面波反射用としてシリコン酸化膜層3の表面に設
けられた周期な溝列(グループ・プレイ)であり、これ
は入出力電極4,5の両側に位置づけられている。Reference numeral 6 denotes periodic groove arrays (group play) provided on the surface of the silicon oxide film layer 3 for surface wave reflection, and these are positioned on both sides of the input/output electrodes 4 and 5.
前記電極4あるいは5で発生された表面波は、その電極
の両側に伝搬し、はぼ表面波・の半波長の整数倍の周期
の溝列6で効率よく反射され、溝列6.6間で表面波の
定在波が生じ、4あるいは5の電極で前記表面波の定在
波が検出される。The surface waves generated by the electrodes 4 or 5 propagate to both sides of the electrodes, are efficiently reflected by the groove rows 6 whose period is an integer multiple of half the wavelength of the surface waves, and are reflected between the groove rows 6.6. A standing wave of surface waves is generated, and the standing waves of surface waves are detected by four or five electrodes.
第3図のグラフは2ポート共振器の通過特性を示すもの
で、その共振器の構成を第4図に示しである。すなわち
、5i(100)基板1上にAlN圧電薄膜層2を0.
5μmの厚さに形成し、さらにその上にリンケイ酸ガラ
ス層3を約2.5μmの厚さに形成した。電極4.5と
なるIDTはAQで構成し、表面波の波長は32μm、
表面波の伝搬方向はSi[100]方向である。反射用
の溝゛6の深さは約5000人としている。The graph in FIG. 3 shows the pass characteristics of a two-port resonator, and the configuration of the resonator is shown in FIG. 4. That is, an AlN piezoelectric thin film layer 2 is deposited on a 5i (100) substrate 1 at a thickness of 0.5i (100).
It was formed to a thickness of 5 μm, and a phosphosilicate glass layer 3 was further formed thereon to a thickness of about 2.5 μm. The IDT serving as electrode 4.5 is composed of AQ, and the wavelength of the surface wave is 32 μm.
The propagation direction of the surface wave is the Si[100] direction. The depth of the reflective groove 6 is approximately 5,000 people.
共振器特性
共振周波数 145MHz
挿入損失 5dB
負荷Q 4000
(]、 oaded Q )
IDTの対数は16対、電極交差幅/ nm溝の本数は
230本
IDTとIDTの中央間の居機20λ
(λは表面波の波長)
IDTと溝の端間の距離(Lc)は約5/8λ。Resonator characteristics Resonance frequency 145 MHz Insertion loss 5 dB Load Q 4000 (], oaded Q) The logarithm of the IDT is 16 pairs, the electrode crossing width/nm number of grooves is 230, and the space between the centers of the IDTs is 20λ (λ is the surface wave wavelength) The distance (Lc) between the IDT and the groove edge is approximately 5/8λ.
上記P S G / A Q N / S Lの構成に
よる共振器では、Lc5/8λ(通常、溝では〜3/8
λ)の条件は、表面波の定在波を効率よく結合するため
に重要なものである。In the resonator with the above PSG/AQN/SL configuration, Lc5/8λ (usually ~3/8 in the groove)
The condition of λ) is important for efficiently coupling the standing waves of the surface waves.
第5図および第6図に示したものは、1ポート共振器の
実施例であって、本発明はこの構成にも適用することが
できる。What is shown in FIGS. 5 and 6 is an embodiment of a one-port resonator, and the present invention can also be applied to this configuration.
[発明の効果]
以上に述べたように、本発明によれば、圧電薄膜の上に
ガラス質層を形成し、そのガラス質層に、前記圧電薄膜
に設けた入出力用電極の両側に位置する表面波反射用溝
列を形成しているので、良好な共振特性を有する弾性表
面波共振器が得られる。[Effects of the Invention] As described above, according to the present invention, a glassy layer is formed on the piezoelectric thin film, and the glassy layer is provided with electrodes located on both sides of the input/output electrodes provided on the piezoelectric thin film. Since the surface wave reflecting groove array is formed, a surface acoustic wave resonator having good resonance characteristics can be obtained.
第1図は本発明の一実施例を示す弾性表面波共振器の縦
断面図、第2図は平面図、第3図は共振器の通過特性を
示すグラフ、第4図は共振器の構成説明図、第5図は他
の実施例を示す弾性表面波共振器の縦断面図、第6図は
平面図である。
1・・・シリコン単結晶基板。
2・・・AlN圧電薄膜層、
3・・・シリコン酸化膜層、
4.5・・・入出力電極、
6・・・表面波反射用溝列。
特許出願人 クラリオン株式会社代理人 弁
理士 永 1)武 三 部−(1″′、・。
J“:7
第1図
第3図
S坂歓(MHz)
第4図Fig. 1 is a longitudinal cross-sectional view of a surface acoustic wave resonator showing an embodiment of the present invention, Fig. 2 is a plan view, Fig. 3 is a graph showing the passage characteristics of the resonator, and Fig. 4 is the configuration of the resonator. An explanatory diagram, FIG. 5 is a longitudinal sectional view of a surface acoustic wave resonator showing another embodiment, and FIG. 6 is a plan view. 1...Silicon single crystal substrate. 2... AlN piezoelectric thin film layer, 3... Silicon oxide film layer, 4.5... Input/output electrode, 6... Groove array for surface wave reflection. Patent Applicant Clarion Co., Ltd. Agent Patent Attorney Nagai 1) Take Mibe - (1″',... J”:7 Figure 1 Figure 3 Kan Kan Saka (MHz) Figure 4
Claims (4)
ラス質層が形成され、このガラス質層に、前記半導体基
板と圧電薄膜との間に形成された表面波発生および検出
用電極の両側に位置する表面波反射用溝列が形成されて
いることを特徴とする弾性表面波共振器。(1) A piezoelectric thin film is formed on a semiconductor substrate, a glassy layer is formed on top of the piezoelectric thin film, and a surface wave generation and detection electrode formed between the semiconductor substrate and the piezoelectric thin film is formed on this glassy layer. A surface acoustic wave resonator characterized in that a row of surface wave reflecting grooves are formed on both sides.
ポートのいずれかに構成されている特許請求の範囲第1
項記載の弾性表面波共振器。(2) Two ports or one electrode for surface wave generation and detection
Claim 1 configured in any of the ports
The surface acoustic wave resonator described in .
、Lc≒5/8λ(λは表面波の波長)とされている特
許請求の範囲第2項記載の弾性表面波共振器。(3) The surface acoustic wave according to claim 2, wherein the end-to-end distance (Lc) between the electrode and the surface wave reflecting groove array is Lc≈5/8λ (λ is the wavelength of the surface wave). resonator.
する特許請求の範囲第1項記載の弾性表面波共振器。(4) The surface acoustic wave resonator according to claim 1, wherein the piezoelectric thin film is made of an AlN thin film.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13061987A JPS63294010A (en) | 1987-05-26 | 1987-05-26 | Surface acoustic wave resonator |
GB8811620A GB2206257B (en) | 1987-05-26 | 1988-05-17 | Surface acoustic wave device |
US07/196,123 US4879487A (en) | 1987-05-26 | 1988-05-19 | Surface-acoustic-wave device |
DE3817718A DE3817718A1 (en) | 1987-05-26 | 1988-05-25 | SURFACE WAVE COMPONENT |
FR888806955A FR2616022B1 (en) | 1987-05-26 | 1988-05-25 | SURFACE ACOUSTIC WAVE DEVICE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13061987A JPS63294010A (en) | 1987-05-26 | 1987-05-26 | Surface acoustic wave resonator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63294010A true JPS63294010A (en) | 1988-11-30 |
Family
ID=15038559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13061987A Pending JPS63294010A (en) | 1987-05-26 | 1987-05-26 | Surface acoustic wave resonator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63294010A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5656025A (en) * | 1979-10-13 | 1981-05-16 | Toshiba Corp | Elastic surface wave resonator |
-
1987
- 1987-05-26 JP JP13061987A patent/JPS63294010A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5656025A (en) * | 1979-10-13 | 1981-05-16 | Toshiba Corp | Elastic surface wave resonator |
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