JPS6329325B2 - - Google Patents

Info

Publication number
JPS6329325B2
JPS6329325B2 JP54163114A JP16311479A JPS6329325B2 JP S6329325 B2 JPS6329325 B2 JP S6329325B2 JP 54163114 A JP54163114 A JP 54163114A JP 16311479 A JP16311479 A JP 16311479A JP S6329325 B2 JPS6329325 B2 JP S6329325B2
Authority
JP
Japan
Prior art keywords
wafer
core
gap
magnetic head
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54163114A
Other languages
Japanese (ja)
Other versions
JPS5687222A (en
Inventor
Yoshiaki Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP16311479A priority Critical patent/JPS5687222A/en
Publication of JPS5687222A publication Critical patent/JPS5687222A/en
Publication of JPS6329325B2 publication Critical patent/JPS6329325B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は記録及び若しくは再生ギヤツプと消去
ギヤツプとを一体的に備える複合磁気ヘツドの製
造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a composite magnetic head that integrally includes a recording and/or reproducing gap and an erasing gap.

最近VTRや磁気デイスク等で必要個所だけの
情報の入れ換え等編集の必要性が増し、フイール
ド毎やチヤンネル毎の消去、書き換えを行なうの
に第1図に示す様に記録・再生ギヤツプ1を有
し、所望のトラツク幅2を得るためにその幅を規
定する切欠孔3,4でしぼり込みかつ記録再生ギ
ヤツプから所定の間隔5をへだてゝ消去ギヤツプ
6が全幅7一杯に広がつた構造のものが提案され
ている。しかしこの構成では、耐磨耗性の点から
磁気ヘツドの全幅を小さくするのに制限があるた
め消去トラツク幅をそれ以上に小さくできない。
従つて、上記切欠孔3,4によつてせつかく記録
再生ギヤツプのトラツク幅2を小さくしてもその
トラツクのみを消去するためにはトラツクピツチ
を大きくとらなければならず高密度化の目的を達
成できない。そこで、この欠点を除去するために
消去ギヤツプについても記録再生ギヤツプの場合
と同様にトラツク幅を規定する切欠孔を設けるこ
とが考えられるが、消去動作を確実にするには消
去ギヤツプの全幅を記録再生ギヤツプのトラツク
幅に比較して大きくする必要がありこれが製造上
の難点となつていた。すなわち、第2図に示す如
く消去ギヤツプ8の全幅9を記録再生ギヤツプ1
のトラツク幅2に比較して大きくするには、全幅
9を規定する切欠孔10,11の形状をトラツク
幅2を規定する切欠孔10,11の形状をトラツ
ク幅2を規定する切欠孔3,4のそれと異なるも
のとしなければならず、各ギヤツプ成型時にカツ
ター刃を変更したりあるいはその送りピツチ等を
変更しなければならないと考えられていたからで
ある。
Recently, there has been an increasing need for editing such as replacing information only in the necessary parts with VTRs and magnetic disks, etc., and in order to erase and rewrite each field and each channel, a recording/playback gap 1 is required as shown in Figure 1. In order to obtain a desired track width 2, the erase gap 6 is narrowed down by the notch holes 3 and 4 that define the width and is spaced apart from the recording/reproducing gap by a predetermined distance 5, and the erase gap 6 is widened to the full width 7. Proposed. However, with this configuration, there is a limit to reducing the total width of the magnetic head from the viewpoint of wear resistance, so the erase track width cannot be further reduced.
Therefore, even if the track width 2 of the recording/reproducing gap that is forced by the notches 3 and 4 is reduced, the track pitch must be increased in order to erase only that track, thus achieving the goal of high density. Can not. Therefore, in order to eliminate this drawback, it is conceivable to provide the erase gap with a cutout hole that defines the track width in the same way as in the case of the recording/reproducing gap, but in order to ensure the erase operation, the entire width of the erase gap is recorded. It is necessary to make the track width larger than the track width of the regenerating gap, which has been a difficult point in manufacturing. That is, as shown in FIG.
To make the track width 2 larger than the track width 2, the shape of the notch holes 10 and 11 that define the overall width 9 is changed to the shape of the notch holes 10 and 11 that define the track width 2. This is because it was thought that the cutter blade had to be different from that of No. 4, and the cutter blade or the feed pitch etc. had to be changed during each gap molding.

本発明は複合磁気ヘツドを構成する各コアの形
状に工夫を施こすことにより、トラツク幅を規定
する切欠孔の成型に当たりその条件を変更するこ
となく能率的に加工することができ、もつて安価
なしかも狭トラツク化に適する複合磁気ヘツドの
製造方法を提供しようとするものである。
By devising the shape of each core constituting the composite magnetic head, the present invention enables efficient processing without changing the conditions for forming the notch holes that define the track width, and is inexpensive. Moreover, it is an object of the present invention to provide a method for manufacturing a composite magnetic head suitable for narrowing the track.

第2図は本発明の複合磁気ヘツドの1実施例の
平面図を示したものである。図において、12は
記録再生及び消去動作の共通磁路を構成する中央
コアで、その長さ5は略0.8〜1.0〔mm〕に選定す
る。13は中央コア12と共に記録再生のための
磁路を構成する第1コアで、この第1コアにはト
ラツク幅1を略60〔μm〕に規定するため全厚7が
略160〔μm〕の両側から図示の如く対称的に切欠
孔3,4を設けている。14,15は中央コア1
2と第1コア13の融着時、この切欠孔3,4内
に同時に充填されたガラス体である。尚、記録再
生ギヤツプ1のギヤツプ長は略0.4〔μm〕、第1コ
ア13の全長16は略1.5〔mm〕に選定されてい
る。
FIG. 2 shows a plan view of one embodiment of the composite magnetic head of the present invention. In the figure, reference numeral 12 denotes a central core constituting a common magnetic path for recording, reproducing and erasing operations, and its length 5 is selected to be approximately 0.8 to 1.0 [mm]. Reference numeral 13 denotes a first core that constitutes a magnetic path for recording and reproducing together with the central core 12, and this first core has a total thickness 7 of approximately 160 [μm] in order to define a track width 1 of approximately 60 [μm]. Notch holes 3 and 4 are provided symmetrically from both sides as shown. 14 and 15 are central core 1
2 and the first core 13, the notch holes 3 and 4 are filled with the glass body at the same time. Incidentally, the gap length of the recording/reproducing gap 1 is selected to be approximately 0.4 [μm], and the total length 16 of the first core 13 is selected to be approximately 1.5 [mm].

17は中央コア12と共に消去動作のための磁
路を構成する第2コアで、この第2コア17にも
そのトラツク幅8を略66〔μm〕に規定するためそ
の両側から図示の如く切欠孔10,11を設けて
いる。そしてこの第2コア17は中央コア12に
対して略20〜30〔μ〕の間隔(消去ギヤツプ長)
を空けてガラス体18,19により融着されてい
る。この第2コア17の全長20は後述の様に第
1、第2コア13,17上に同一のカツテイング
条件で異なるトラツク幅1,8を残すために第1
コア13のそれ(略1.5〔mm〕)よりも少許小さく
設定されている。
Reference numeral 17 denotes a second core that constitutes a magnetic path for erasing operation together with the central core 12. In order to define the track width 8 of approximately 66 [μm], this second core 17 also has cut holes as shown in the figure from both sides. 10 and 11 are provided. This second core 17 is spaced approximately 20 to 30 [μ] from the center core 12 (elimination gap length).
They are fused together by glass bodies 18 and 19 with a gap in between. The total length 20 of the second core 17 is determined by the length 20 of the second core 17 in order to leave different track widths 1 and 8 on the first and second cores 13 and 17 under the same cutting conditions, as will be described later.
It is set slightly smaller than that of the core 13 (approximately 1.5 [mm]).

次に、かかる複合磁気ヘツドを構成するための
要部工程について説明する。第3図は第1コア1
3を構成する第1ウエハ21に所定の溝加工を施
こした状態を示し、また第4図は第2コア17を
構成する第2ウエハ22に所定の溝加工を施こし
た状態を示している。第1ウエハ21の厚さ23
は第2ウエハ22の厚さ24に比し少しく大きく
形成されている。これらを同一基準面に載せて第
5図に拡大して示す如く同一形状のカツター刃2
5によりトラツク幅を規定するための溝加工を施
こすと、第1ウエハ21についてはトラツク幅
T1及び溝幅W1の条溝26を形成することがで
き、また第2ウエハ22についてはトラツク幅
T2及び溝幅W2(T1+W1=T2+W2)の条溝27
を形成することができる。したがつて第1、第2
ウエハ21,22上に示す如く、同一のカツテイ
ング条件で異なる切欠孔3,10を構成するため
の条溝26,27を得ることができる。D1,D2
は第1、第2ウエハ21,22の各研削深さを示
し、θは刃面の傾斜角(45゜)である。尚、各ウ
エハ21,22上にはギヤツプ長を規定するため
の非磁性体層28,29、コイル巻線用溝30,
31、及びガラス充填用溝32,33等も形成さ
れるがこれらは従来のものと相違しない。
Next, the main steps for constructing such a composite magnetic head will be explained. Figure 3 shows the first core 1
FIG. 4 shows a state in which a predetermined groove has been formed on the first wafer 21 constituting the second core 17, and FIG. There is. Thickness 23 of first wafer 21
is formed to be slightly larger than the thickness 24 of the second wafer 22. These cutter blades 2 are placed on the same reference plane and have the same shape as shown enlarged in Fig. 5.
5, when grooves are formed to define the track width, the track width for the first wafer 21 is
T 1 and groove width W 1 can be formed, and for the second wafer 22, the track width can be
Groove 27 with T 2 and groove width W 2 (T 1 +W 1 =T 2 +W 2 )
can be formed. Therefore, the first and second
As shown on wafers 21 and 22, grooves 26 and 27 for forming different notch holes 3 and 10 can be obtained under the same cutting conditions. D1 , D2
indicates the respective grinding depths of the first and second wafers 21 and 22, and θ is the inclination angle (45°) of the blade surface. Incidentally, on each wafer 21, 22, non-magnetic layers 28, 29 for defining the gap length, coil winding grooves 30,
31 and glass filling grooves 32, 33, etc., are also formed, but these are no different from the conventional ones.

第6図は中央コア12を構成する所定の厚さの
中央ウエハ34を挟んで第1、第2ウエハ21,
22を一体化する工程を示している。溝32,3
3内に挿入したガラス棒35を溶融固化して、第
1第2ウエハ21,22の条溝26,27内及び
各ウエハ間の空隙内にガラス体を充填し、また各
ウエハを一体化する。これをA―A′,B―B′,
C―C′に沿つてブロツク切断し、次いで第7図に
示す如くテープ当接面36が所定の形状になるよ
うに、またギヤツプデプス37が所望の深さとな
るように研磨する。その後、第8図に示す如く、
このテープ当接面上に、コア全厚7を規定しかつ
切欠孔3,10が対称的に残る様に溝38を順次
研削し、さらに図中のD―D′,E―E′、…に沿つ
てスライシングして第9図に示す複合磁気ヘツド
を得る。尚、第2図はこの複合磁気ヘツドのテー
プ当接面の平面図を示している。
FIG. 6 shows first and second wafers 21 and
22 is shown. groove 32,3
The glass rod 35 inserted into the wafer 3 is melted and solidified to fill the grooves 26 and 27 of the first and second wafers 21 and 22 and the gaps between each wafer with the glass body, and also to integrate each wafer. . This is A-A', B-B',
The block is cut along C--C', and then polished so that the tape contact surface 36 has a predetermined shape and the gap depth 37 has a desired depth, as shown in FIG. After that, as shown in Figure 8,
On this tape abutting surface, grooves 38 are sequentially ground so as to define the core total thickness 7 and leave notch holes 3, 10 symmetrically, and then D-D', E-E', . . . The composite magnetic head shown in FIG. 9 is obtained by slicing along the lines. Incidentally, FIG. 2 shows a plan view of the tape abutting surface of this composite magnetic head.

叙上の如く本発明は消去ギヤツプについても記
録再生ギヤツプと同様にトラツク幅規定用の切欠
孔を備えるようにしたから耐磨耗性を害なうこと
なくトラツクピツチの狭い記録再生トラツクを隣
接トラツクを消去することなく消去することがで
き、しかも記録再生用コア(第1コア)に比し消
去用コア(第2コア)の全長を少しく短かくした
ので上記切欠孔の成型に供するカツテイング動作
を第1、第2コアについて各別に変更する必要が
なくなり量産に適し安価な複合磁気ヘツドの製造
方法を提供することができる。
As mentioned above, in the present invention, the erasing gap is also provided with a cutout hole for defining the track width in the same way as the recording/reproducing gap, so that it is possible to use a recording/reproducing track with a narrow track pitch to cover an adjacent track without impairing wear resistance. Erasing can be performed without erasing, and since the overall length of the erasing core (second core) is slightly shorter than that of the recording/reproducing core (first core), the cutting operation for forming the notched hole is There is no need to change the first and second cores individually, and it is possible to provide a method of manufacturing a composite magnetic head that is suitable for mass production and is inexpensive.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例のテープ当接面の平面図、第2
図は本発明の1実施例のテープ当接面の平面図で
ある。第3図及び第4図は第1及び第2ウエハを
示し各図においてイは平面図、ロは側面図であ
る。第5図はカツテイング動作説明図、第6図は
各ラエハの一体化工程を示す斜視図である。第
7、第8図イ,ロは成型工程説明図、第9図は複
合磁気ヘツドの構成斜視図である。 主な図番の説明 12…中央コア、13…第1
コア、14…第2コア、16,20…第1、第2
コアの各全長。
Figure 1 is a plan view of the conventional tape contact surface;
The figure is a plan view of the tape abutting surface of one embodiment of the present invention. 3 and 4 show the first and second wafers, and in each figure, A is a plan view and B is a side view. FIG. 5 is an explanatory diagram of the cutting operation, and FIG. 6 is a perspective view showing the process of integrating each layer. 7 and 8A and 8B are explanatory views of the molding process, and FIG. 9 is a perspective view of the configuration of the composite magnetic head. Explanation of main drawing numbers 12...Central core, 13...1st
Core, 14...second core, 16, 20...first, second
Each total length of the core.

Claims (1)

【特許請求の範囲】[Claims] 1 酸化物磁性材料よりなる第1ウエハと、酸化
物磁性材料よりなり前記第1ウエハと厚みが異な
る第2ウエハとを同一基準面上に載置し、前記第
1ウエハと前記第2ウエハの上面に夫々同一形状
のカツター刃により異なる溝幅の条構を形成する
と共に前記第1ウエハと第2ウエハの上面に前記
条構と略直交するコイル巻線用溝とガラス充填用
溝とを形成する第1の工程と、前記第1の工程終
了後、前記第1ウエハの上面と中央ウエハの一方
の面とをギヤツプ長を規定する非磁性体層を介し
て衝き合わせると共に前記第2ウエハの上面と前
記中央ウエハの他方の面とをギヤツプ長を規定す
る非磁性体層を介して衝き合わせ前記ガラス充填
用溝に充填されたガラスを溶融固化して前記第1
ウエハと前記第2ウエハとを前記中央ウエハを挾
んで一体化してブロツクを形成する第2の工程
と、前記第2の工程終了後、前記ブロツクを切断
して磁気ヘツドコアを形成する第3の工程とを備
えることを特徴とする複合磁気ヘツドの製造方
法。
1. A first wafer made of an oxide magnetic material and a second wafer made of an oxide magnetic material and having a different thickness from the first wafer are placed on the same reference surface, and the first wafer and the second wafer are A strip structure with different groove widths is formed on the upper surface by cutter blades of the same shape, and a coil winding groove and a glass filling groove are formed on the upper surfaces of the first wafer and the second wafer, which are substantially orthogonal to the strip structure. After the first step, the top surface of the first wafer and one surface of the center wafer are brought into contact with each other through a non-magnetic layer that defines a gap length, and the second wafer is The upper surface and the other surface of the central wafer are brought into contact with each other through a non-magnetic layer that defines a gap length, and the glass filled in the glass filling groove is melted and solidified to melt and solidify the glass filled in the first glass filling groove.
a second step of integrating the wafer and the second wafer by sandwiching the center wafer to form a block; and a third step of cutting the block to form a magnetic head core after the second step is completed. A method for manufacturing a composite magnetic head, comprising:
JP16311479A 1979-12-14 1979-12-14 Composite magnetic head Granted JPS5687222A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16311479A JPS5687222A (en) 1979-12-14 1979-12-14 Composite magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16311479A JPS5687222A (en) 1979-12-14 1979-12-14 Composite magnetic head

Publications (2)

Publication Number Publication Date
JPS5687222A JPS5687222A (en) 1981-07-15
JPS6329325B2 true JPS6329325B2 (en) 1988-06-13

Family

ID=15767423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16311479A Granted JPS5687222A (en) 1979-12-14 1979-12-14 Composite magnetic head

Country Status (1)

Country Link
JP (1) JPS5687222A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278216A (en) * 1988-04-28 1989-11-08 Son Yoshikata Structure of block penetrating section with cables, pipes, etc., in buildings and its construction
JPH04194477A (en) * 1990-11-28 1992-07-14 Sansei Giken Kk Blockade and method for blocking through hole of building of house or the like

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2557045B2 (en) * 1986-01-13 1996-11-27 キヤノン電子株式会社 Magnetic head
JPH0682443B2 (en) * 1986-02-19 1994-10-19 株式会社東芝 Magnetic recording method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5298418U (en) * 1976-01-23 1977-07-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278216A (en) * 1988-04-28 1989-11-08 Son Yoshikata Structure of block penetrating section with cables, pipes, etc., in buildings and its construction
JPH04194477A (en) * 1990-11-28 1992-07-14 Sansei Giken Kk Blockade and method for blocking through hole of building of house or the like

Also Published As

Publication number Publication date
JPS5687222A (en) 1981-07-15

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