JPS63291444A - Structure for cooling integrated circuit element - Google Patents
Structure for cooling integrated circuit elementInfo
- Publication number
- JPS63291444A JPS63291444A JP62125732A JP12573287A JPS63291444A JP S63291444 A JPS63291444 A JP S63291444A JP 62125732 A JP62125732 A JP 62125732A JP 12573287 A JP12573287 A JP 12573287A JP S63291444 A JPS63291444 A JP S63291444A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- pressure
- circuit element
- circuit elements
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 239000011231 conductive filler Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
集積回路素子の冷却構造であって、集積回路素子とヒー
トシンクとの間に熱伝導性充填材を介在させ、所定の初
期圧力を所定時間与えることにより通常運用時は集積回
路素子に過度な圧力を与えることなく、しかも接触熱抵
抗を最小にすることを可能とする。[Detailed Description of the Invention] [Summary] This is a cooling structure for integrated circuit devices, in which a thermally conductive filler is interposed between the integrated circuit device and a heat sink, and a predetermined initial pressure is applied for a predetermined period of time. During operation, it is possible to minimize contact thermal resistance without applying excessive pressure to integrated circuit elements.
本発明は電子装置に用いられる集積回路素子の冷却構造
に関するものである。The present invention relates to a cooling structure for integrated circuit elements used in electronic devices.
電子機器の構成に用いられるプリント基板に実装される
集積回路素子などの電子部品は、近年ますます高密度化
、高速化が推進される様になり、これらの電子部品の発
熱量は増大される傾向にある。In recent years, electronic components such as integrated circuit elements mounted on printed circuit boards used in the construction of electronic devices have become increasingly denser and faster, and the amount of heat generated by these electronic components is increasing. There is a tendency.
したがって安定した稼動を得るためには、この様な発熱
量を如何に効率良く除去するかが大きな課題である。Therefore, in order to obtain stable operation, a major issue is how to efficiently remove this amount of heat.
この様な電子部品の冷却では高い冷却効果が得られる方
式として、一般的に冷水などの冷媒を用いて電子部品の
発熱を吸収する冷却装置が知られている。この様な冷却
装置では冷却効率の向上が重要である。In cooling such electronic components, a cooling device that absorbs the heat generated by the electronic components using a refrigerant such as cold water is generally known as a method that can obtain a high cooling effect. In such a cooling device, it is important to improve cooling efficiency.
第５図は従来め超大型コンピュータ等に用いられている
集積回路素子の伝導冷却構造を示す図である。同図ａに
示すものは、プリント板１に実装されたＩＣ，ＬＳＩ等
の集積回路素子２の上面よリヒートシンク３に設けられ
たピストン４をスプリング５で押圧接触させ、素子２を
冷却するよう、になっている。また同図すに示すものは
ヒートシンク３に伝熱板６を有するベローズ７を設け、
ヒートシンク３内に冷却媒体を流し、その圧力とベロー
ズ７の張力で伝熱板６を集積回路素子２に接触押圧させ
て冷却するようになっている。FIG. 5 is a diagram showing a conduction cooling structure of an integrated circuit element conventionally used in ultra-large computers and the like. In the device shown in FIG. 1A, a piston 4 provided on a reheat sink 3 is brought into pressure contact with the top surface of an integrated circuit element 2 such as an IC or LSI mounted on a printed circuit board 1 by a spring 5 to cool the element 2. ,It has become. In addition, the one shown in the same figure is provided with a bellows 7 having a heat transfer plate 6 on the heat sink 3,
A cooling medium is flowed into the heat sink 3, and the heat exchanger plate 6 is pressed against the integrated circuit element 2 by the pressure thereof and the tension of the bellows 7, thereby cooling the integrated circuit element 2.
このような従来の伝導冷却構造においては集積回路素子
２の表面及びピストン４又は伝熱板６等の接触部材の表
面が完全な平面ではなく、表面粗さや、うねり等がある
ため両者の接触部は点当りとなり熱抵抗を生ずる。この
ため接触部にＨｅなとの高熱伝導気体を充填する、或い
は、熱伝導性弾性シートを挿入するなどして伝熱効率を
向上しようとしている。In such a conventional conduction cooling structure, the surface of the integrated circuit element 2 and the surface of the contact members such as the piston 4 or the heat exchanger plate 6 are not perfectly flat, and have surface roughness, undulations, etc. hits a point and causes thermal resistance. For this reason, efforts are being made to improve heat transfer efficiency by filling the contact portion with a highly thermally conductive gas such as He or by inserting a thermally conductive elastic sheet.
上記従来のヒートシンク３のピストン又は伝熱板６と集
積回路素子２との間にＨｅなどの高熱伝導気体を充填し
たもの及び熱伝導性弾性シートを用いたものは、それぞ
れの気体の熱伝導率が、それほど大きくないという理由
と、固体接触であるという理由によりそれぞれの冷却能
力の向上には限界があった。The above-mentioned conventional heat sink 3 in which a high heat conductive gas such as He is filled between the piston or heat transfer plate 6 and the integrated circuit element 2, and in which a heat conductive elastic sheet is used, have the thermal conductivity of each gas. However, there was a limit to the improvement of each cooling capacity because it was not that large and because it was a solid contact.
本発明はこのような点がかんがみて創作されたもので、
気体接触及び固体接触による冷却能力の向上の限界を打
破して冷却効率を向上した集積回路素子の冷却構造を提
供することを目的としている。The present invention was created with these points in mind.
It is an object of the present invention to provide a cooling structure for integrated circuit elements that has improved cooling efficiency by overcoming the limitations of improving cooling capacity through gas contact and solid contact.
第１図は本発明の詳細な説明するための図である。 FIG. 1 is a diagram for explaining the present invention in detail.
第１図ａにおいて、１１は集積回路素子、１２はヒート
シンク、１３は可撓性構造体、１４は伝熱板であり、該
伝熱板１４と集積回路素子１１との間に熱伝導性グリー
スやコンパウンド、液体金属等の熱伝導性充填材１５を
介在させ、その状態で伝熱板１４に圧力を加えるのであ
る。その加圧力と接触部の熱抵抗の関係は、第１図すに
示すように、印加する圧力Ｐが大きくなるに従って、Ａ
点からＢ点に向って熱抵抗は減少し、一定の圧力Ｐｃ以
上になると熱抵抗の減少はな（なる。そして熱抵抗が一
定となった点から圧力を減少させても熱抵抗はＢ点から
Ａ点へは戻らず０点となる。In FIG. 1a, 11 is an integrated circuit element, 12 is a heat sink, 13 is a flexible structure, and 14 is a heat exchanger plate, and thermally conductive grease is provided between the heat exchanger plate 14 and the integrated circuit element 11. A thermally conductive filler 15 such as a compound, a liquid metal, or the like is interposed, and pressure is applied to the heat exchanger plate 14 in this state. As shown in Figure 1, the relationship between the applied pressure and the thermal resistance of the contact part is as shown in Figure 1, as the applied pressure P increases, A
The thermal resistance decreases from point to point B, and when the pressure exceeds a certain pressure Pc, the thermal resistance does not decrease. It does not return to point A and becomes 0 point.
本発明はこのような特性を利用し組立時又は組立後にＰ
ｃ以上の圧力Ｐｉを所定時間加えた後、加圧力をＯに近
いｐｐまで戻したものである。The present invention utilizes such characteristics to reduce P during or after assembly.
After applying a pressure Pi of c or more for a predetermined period of time, the applied pressure was returned to pp close to O.
Ｐｃ以上の初期加圧力Ｐｉを加えることにより、加圧力
を０に近いｐｐまで戻しても熱抵抗を初期加圧力Ｐｉ印
加時と同じ状態を保つことができ、冷却効率の向上が可
能となる。By applying an initial pressurizing force Pi greater than Pc, even if the pressurizing force is returned to pp close to 0, the thermal resistance can be maintained in the same state as when the initial pressurizing force Pi was applied, and cooling efficiency can be improved.
第２図は本発明の第１の実施例を説明するための図であ
り、ａは加圧状態、ｂは使用時の状態を示している。同
図において１０はプリント板、１１は集積回路素子、１
２はヒートシンク、１３は可撓性構造体、１４は伝熱板
、１５は熱伝導性充填材である。FIG. 2 is a diagram for explaining the first embodiment of the present invention, in which a shows a pressurized state and b shows a state in use. In the figure, 10 is a printed board, 11 is an integrated circuit element, 1
2 is a heat sink, 13 is a flexible structure, 14 is a heat transfer plate, and 15 is a thermally conductive filler.
本実施例は先ず第２図ａに示すように、ヒートシンク１
２の伝熱板１４と集積回路素子１１との間に熱伝導性充
填材１５を介在させ、集積回路素子１１を搭載したプリ
ント板１０を加圧台１６等を用いてヒートシンク１２へ
押圧し、各集積回路素子１１に初期加圧力Ｐｉを所定時
間印加する。In this embodiment, first, as shown in FIG. 2a, a heat sink 1
A thermally conductive filler 15 is interposed between the heat transfer plate 14 of No. 2 and the integrated circuit element 11, and the printed board 10 on which the integrated circuit element 11 is mounted is pressed onto the heat sink 12 using a pressure table 16 or the like. An initial pressing force Pi is applied to each integrated circuit element 11 for a predetermined period of time.
次いで第２図すに示すように加圧台１６による加圧を除
去し所定の加圧力ｐｐが残るようにプリント板１０を支
持する。Next, as shown in FIG. 2, the pressure applied by the pressure table 16 is removed and the printed board 10 is supported so that a predetermined pressure pp remains.
このように構成された本実施例は、使用時において集積
回路素子１１に過度の加圧力が加わることなく、しかも
接触熱抵抗を小さくすることができ、冷却効率の向上及
び信頼性の向上が可能となる。This embodiment configured in this manner can reduce contact thermal resistance without applying excessive pressure to the integrated circuit element 11 during use, and can improve cooling efficiency and reliability. becomes.
第３図は本発明の第２の実施例を説明するための図であ
る。FIG. 3 is a diagram for explaining a second embodiment of the present invention.
本実施例が前実施例と異なるところは、集積回路素子１
１に伝熱板１４を押圧するのに、第２図の加圧台１６の
代りに各可撓性構造体１３の中から伝熱板１４を押圧で
きる加圧治具１７を用いたことであり、その効果は前実
施例と同様である。This embodiment differs from the previous embodiment in that the integrated circuit element 1
1 by using a pressing jig 17 that can press the heat exchanger plate 14 from within each flexible structure 13 instead of the pressure table 16 shown in FIG. The effect is the same as in the previous embodiment.
第４図は本発明の第３の実施例を説明するための図であ
る。FIG. 4 is a diagram for explaining a third embodiment of the present invention.
本実施例が第１．第２の実施例と異なるところは、第１
．第２の実施例が伝熱板１４を集積回路素子１１に押圧
するのに機械的に行なっていたものを本実施例ではポン
プ１９を用いて可撓性構造体１３に加圧液体を供給し加
圧するようにしたことであり、その効果は第１．第２の
実施例と同様である。This example is the first example. The difference from the second embodiment is that the first embodiment
．． While the second embodiment mechanically presses the heat exchanger plate 14 against the integrated circuit element 11, this embodiment uses a pump 19 to supply pressurized liquid to the flexible structure 13. The first effect is to apply pressure. This is similar to the second embodiment.
以上述べてきたように、本発明によれば、極めて簡易な
構成で、使用時において集積回路素子に過度な圧力を加
えることなく冷却効率の向上と信頼性の向上ができ、実
用的には極めて有用である。As described above, according to the present invention, with an extremely simple configuration, it is possible to improve cooling efficiency and reliability without applying excessive pressure to integrated circuit elements during use, and it is extremely practical. Useful.
第１図は本発明の詳細な説明するための図、第２図は本
発明の第１の実施例を説明するだめの図、
第３図は本発明の第２の実施例を説明するための図、
第４図は本発明の第３の実施例を説明するための図、
第５図は従来の集積回路素子の伝導冷却構造を示す図で
ある。
第１図、第２図、第３図、第４図において、１０はプリ
ント板、 １１は集積回路素子、１２はヒートシンク
、１３は可撓性構造体、１４は伝熱板、 １５は
熱伝導性充填材、１６は加圧台、 １７は加圧治
具、１８は止栓、 １９は加圧ポンプである。
（Ｑ） 断面図
加圧力と熱抵抗の
（ｂ） 関係を示す図
本発明の詳細な説明するための図
第１図
１２・・ ヒートシンク １５・・・熱伝導性
充填材（Ｑ） 加圧状態
（ｂ） 使用時の状態
本発明の第４の実施例を説明するための間第２図
１３ ・・町撓性溝造体
］１
本発明の第２の実施例を説明するための同第３図
本発明の第３の実施例を脱甲するための同第４図
１０ ・・プリント板 １５・・・熱伝導性
充填材１１・・・集積回路素子 １７・・・加
圧治具］
（ＣＩ）
従来の集積回路素子の伝導冷却構造を示す図３・・・
ヒートンンク
４・・・ ピストン
５・・・スプリング
６・・・伝熱版
７・・・可涜性構造体Fig. 1 is a diagram for explaining the present invention in detail, Fig. 2 is a diagram for explaining the first embodiment of the invention, and Fig. 3 is a diagram for explaining the second embodiment of the invention. FIG. 4 is a diagram for explaining a third embodiment of the present invention, and FIG. 5 is a diagram showing a conventional conduction cooling structure for an integrated circuit element. 1, 2, 3, and 4, 10 is a printed board, 11 is an integrated circuit element, 12 is a heat sink, 13 is a flexible structure, 14 is a heat transfer plate, and 15 is a thermal conductor. 16 is a pressure table, 17 is a pressure jig, 18 is a stopper, and 19 is a pressure pump. (Q) Cross-sectional view Diagram showing the relationship between pressurizing force and thermal resistance (b) Diagram for detailed explanation of the present invention Fig. 1 12... Heat sink 15... Thermally conductive filler (Q) Pressurized state (b) Condition during use Fig. 2 for explaining the fourth embodiment of the present invention [Town flexible groove structure] 1 Fig. 2 for explaining the fourth embodiment of the present invention FIG. 4 for removing the shell of the third embodiment of the present invention (FIG. 3). Printed board 15. Thermal conductive filler 11. (CI) Figure 3 shows the conduction cooling structure of a conventional integrated circuit element...
Heat exchanger 4... Piston 5... Spring 6... Heat transfer plate 7... Destructible structure
Claims (1)
間に熱伝導性充填材（１５）を介在させ、所定の初期圧
力（Ｐｉ）を所定時間与えた後、加圧力を零よりやや高
い加圧力（Ｐｐ）に設定したことを特徴とした集積回路
素子の冷却構造。1. A thermally conductive filler (15) is interposed between the integrated circuit element (11) and the heat sink (12), and after applying a predetermined initial pressure (Pi) for a predetermined time, the applied pressure is slightly higher than zero. A cooling structure for an integrated circuit element, characterized in that the pressure is set to a pressure (Pp).
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125732A JP2578429B2 (en) | 1987-05-25 | 1987-05-25 | Cooling body manufacturing method |
| KR1019880005235A KR910008985B1 (en) | 1987-05-25 | 1988-05-06 | System for cooling solid circuit components and a method for providing thermlly conductive compound means therefor |
| CA000566836A CA1295753C (en) | 1987-05-25 | 1988-05-16 | Printed circuit board cooling system employing bellows and layer of thermal grease and method for forming the layer |
| AU16557/88A AU587937B2 (en) | 1987-05-25 | 1988-05-24 | Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer |
| DE19883852845 DE3852845T2 (en) | 1987-05-25 | 1988-05-25 | Cooling system for solid-state circuit components and a method for providing thermoconductive compositions. |
| EP19880401277 EP0293297B1 (en) | 1987-05-25 | 1988-05-25 | A system for cooling solid circuit components and a method for providing thermally conductive compound means therefor |
| US07/785,198 US5195020A (en) | 1987-05-25 | 1991-11-01 | Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125732A JP2578429B2 (en) | 1987-05-25 | 1987-05-25 | Cooling body manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63291444A true JPS63291444A (en) | 1988-11-29 |
| JP2578429B2 JP2578429B2 (en) | 1997-02-05 |
Family
ID=14917414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62125732A Expired - Fee Related JP2578429B2 (en) | 1987-05-25 | 1987-05-25 | Cooling body manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2578429B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0766186A3 (en) * | 1995-09-27 | 1997-12-29 | Yokogawa Electric Corporation | Data processor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160149A (en) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | Cooling system for integrated circuit device |
-
1987
- 1987-05-25 JP JP62125732A patent/JP2578429B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160149A (en) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | Cooling system for integrated circuit device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0766186A3 (en) * | 1995-09-27 | 1997-12-29 | Yokogawa Electric Corporation | Data processor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2578429B2 (en) | 1997-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |