JPS63285979A - Method of fixing optical semiconductor component - Google Patents

Abstract

PURPOSE:To eliminate the possibility of the displacement of an optical axis with simple fixture of an optical semiconductor component to a holder by securing the component to the holder by the recovering force of a ring made of a shape memory alloy. CONSTITUTION:A taper 3a is formed corresponding to the taper 13 of a holder 1 on the side face of a ring 3 made of a shape memory alloy, such as an Ni-Ti alloy. One position of the annular ring 1 is cut out, and the shape is stored in a forcibly spread state. When an assembly is formed, an optical semiconductor component 2 is first placed at a predetermined position on the inner end face 14 of the holder 1, and the deformed ring 3 is placed through a small- diameter inner wall 11 on the flange 2b of the component 2. Then, it is entirely heated to a temperature of the transformation point of the metal of the ring 3 or higher in this state to recover the ring 3. The recovering force of the ring 3 is divided downward by the operation of the taper 13 at this time, and the component 2 is secured to the inner end face 14 by the force.

Description

[Detailed Description of the Invention] Overview An optical semiconductor component is placed on the inner end surface of a holder in which a tapered part is formed, and a ring made of a shape memory alloy is restored within the tapered part, and this ring and the inner The optical semiconductor component is sandwiched between the end faces. According to this method, the optical semiconductor component can be fixed to the holder easily and without causing optical axis deviation.

INDUSTRIAL APPLICATION FIELD The present invention relates to a method for fixing optical semiconductor components when constructing a light emitting/light receiving element module.

In the field of optical communications, light-emitting elements such as LEDs and LDs on the transmitting side or light-receiving elements such as APDs and PINs on the receiving side are usually packaged together with a ``litter'' (hereinafter referred to as eugenic optical semiconductor components). ) is put into practical use.

In this case, the relative positional relationship between the optical semiconductor component and the lens for converting the emitted light into a parallel beam or condensing the parallel beam directly affects the coupling efficiency, so it is necessary to shift the position of the optical semiconductor component. There is a need for a method of fixing the device to a holder without any problems. In addition, it is desired that the workability is good.

LL Standing I Conventionally, this type of optical semiconductor component was fixed to a holder by tightening screws, etc. by force. This will be explained with reference to FIG. In the same figure, 21 is an opening 2 for emitted light at one end.
1a is formed, and the holder 21 has a screw thread 21 on the inner periphery to which a screw member 23 can be screwed.
b is formed. The optical semiconductor component 2 to be fixed includes a package body 2a, a flange portion 2b having a larger diameter than the package body 2a, and an electrode 2 led out from an optical semiconductor element chip (not shown).
It consists of c and 2c. The optical semiconductor component 2 placed at a predetermined position in the holder 21 is tightened downward in the figure by a screw member 23 via a cylindrical adapter 22 that is engaged with the seven ring portions 2b. Fixed.

Problem 1 to be Solved by the Invention However, in the method of fixing an optical semiconductor component as described above, the rotational force of the screw member 23 when tightening the optical semiconductor component 2 to the holder 21 is transferred to the optical semiconductor through the adapter 22. Part 2
In order to act on the flange portion 2b of the optical axis, there is a problem that if the optical axis is set in advance, this setting may be deviated. Although there is a mechanism in which the rotational force of the screw member 23 is not transmitted to the optical semiconductor component 2, such a mechanism generally has a complicated structure.

Furthermore, in the conventional example shown in FIG.
3 and the holder 21, there is also the problem that it takes time and effort to process the parts.

The present invention was created in view of these problems, and its purpose is to provide a method that is simple and free from the risk of optical axis misalignment when fixing an optical semiconductor component to a holder.

The problems of the above-mentioned conventional techniques for achieving this can be solved by fixing the optical semiconductor component by the following method.

First, an optical semiconductor component is placed on the inner end surface on the large-diameter inner wall side of a holder in which a tapered portion is formed between the small-diameter inner wall and the large-diameter inner wall.

Next, the ring made of a shape memory alloy that has been deformed so as to be able to pass through the small-diameter inner wall of the holder is restored within the tapered part to move the ring toward the inner end surface of the holder, and the optical semiconductor is placed between the ring and the inner end surface. Clamp parts.

This achieves fixation of the optical semiconductor component.

Function The shape memory alloy used in the present invention is generally called unidirectional, and if it is deformed below the transformation point and heated above the transformation point, the shape will be restored, but if it is cooled below the transformation point again, the shape will be restored. However, it will not return to its pre-restoration shape.

Therefore, by passing the deformed ring through the small-diameter inner wall of the holder and guiding it into the tapered part, and restoring it, the restoring force of the ring is applied in a direction that presses the optical semiconductor component against the holder via the tapered part. This allows the optical semiconductor component to be fixed to the holder.

EMBODIMENTS Preferred embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 shows an optical semiconductor component 2 placed in a holder 1 by applying the present invention.
FIG. 2 is a cross-sectional configuration diagram of an optical semiconductor assembly fixed therein. Components that are substantially the same as those in FIG. 6 showing the conventional example are given the same reference numerals, and their explanations will be omitted. For example, the holder 1 made of a weldable metal material includes a small-diameter inner wall portion 11 that is larger in diameter than the optical semiconductor component 2 to be fixed, a large-diameter inner wall portion 12 that shares the same central axis as the small-diameter inner wall portion 11, It has a flat tapered part 13 that is continuous with the small diameter inner wall part 11 and the large diameter inner wall part 12. An inner end surface 14 of the holder 1 on the side of the large-diameter inner wall portion 12 is formed flat, and an opening 15 through which light emitted from the optical semiconductor component 2 passes is formed approximately in the center of the inner end surface 14. . Internal end face 1
4 may not be flat, but may have a recessed portion, for example, so that the flange portion 2b of the optical semiconductor component 2 can be seated in a roughly positioned state.

Reference numeral 3 denotes a ring made of, for example, a Ni-Ti-based shape memory alloy, and a tapered portion 3a is formed on a side surface of the ring 3 in correspondence with the tapered portion 13 of the holder 1. One part of the annular shape of the ring 3 is cut out, as shown in Figure 2 (a).
), the shape is memorized in the expanded state. Then, at a temperature below the martensitic transformation point of the material metal (hereinafter simply referred to as the transformation point), it is deformed in a direction in which the diameter decreases as shown in FIG. be made able to do so. The ring 3 prepared in this way is irreversibly heated to a temperature above the transformation point as shown in Fig. 2 (
Since the optical semiconductor component 2 is about to be restored to the state shown in a), this restoring force is used to fix the optical semiconductor component 2.

That is, when creating the assembly shown in FIG. 1, the optical semiconductor component 2 is first placed at a predetermined position on the inner end surface 14 of the holder 1, and then deformed into the shape shown in FIG. 2(b). The optical semiconductor component 2 is passed through the ring 3 through the small diameter inner wall portion 11.
is placed on the flange portion 2b of. Next, in this state, the entire ring 3 is heated to a temperature higher than the transformation point of the metal material of the ring 3, and the ring 3 is restored to the state shown in FIG. 2(a). At this time, the restoring force of the ring 3 generates a component force in the downward direction in FIG. It is something that can be done.

FIG. 3 shows an optical semiconductor assembly 4 constructed as described above.
FIG. 2 is a partial cross-sectional configuration diagram of an optical semiconductor module having as its constituent elements. 5 is a lens assembly, and a holder 5
1 has a spherical lens 52 fixedly held therein. 6 is also a lens assembly, in which a spherical lens 62 is mounted on a holder 61.
It becomes fixed and held. The optical fiber assembly 7 has a structure in which a strand 74 of an optical fiber cord 73 is inserted and fixed into a seven errule 72, and this is further inserted and fixed into a holder 71.

The above module components 4.5.6.7 are placed in respective holders 1, 51,
61 and 71 are integrally fixedly connected by welding, soldering, or gluing to be assembled as a module. Whether or not the optical axes of the assemblies 4, 5, 6.7 coincide has a great influence on the coupling efficiency of the optical semiconductor module, and the method of the present invention satisfies the above needs. be able to.

FIGS. 4 and 5 show other embodiments of the present invention. In this embodiment, a ring 3 having a partially cut-out shape is used.
Instead, a ring 3' having a plurality of claws 3'a protruding from an annular member is used. Ring 3' is the fifth
As shown in Figure 5(a), the shape is memorized in the open state, and as shown in Figure 5(b), the winter melon 3'
The optical semiconductor components 2 are introduced into the small-diameter inner wall portion 11 of the holder 1 in a state where a is approximately parallel to each other, and heated in the same manner as in the previous embodiment to fix the optical semiconductor component 2. Even in this case, the restoring force of the ring 3', that is, the component force of the force that causes the claws 3/a to spread, acts to press the optical semiconductor component 2 against the inner end surface 14 of the holder 1. It is.

The shape memory alloy that is the material of the ring 3 or 3' may have any composition as long as it is unidirectional and irreversibly restores its shape. For example, in addition to the Ni-Ti alloy, a Cu-Zn-Aj alloy can also be used.

Effects of the Invention As detailed above, according to the present invention, the optical semiconductor component is fixed to the holder by the restoring force of the ring made of a shape memory alloy, so that rotational force is not applied to the optical semiconductor component during fixation. Since there is no action, there is no risk of optical axis misalignment. There is also the effect that complicated operations such as screw machining become unnecessary.

[Brief explanation of the drawing]

FIG. 1 is an embodiment of the present invention, and is a cross-sectional configuration diagram of an optical semiconductor assembly formed by fixing an optical semiconductor component to a holder by the method of the present invention. FIGS. 2(a) and (b) are FIG. FIG. 3 is a plan view of the ring before and after deformation, as shown in FIG. The figure shows another embodiment of the present invention, and is a cross-sectional configuration diagram of an optical semiconductor assembly formed by fixing an optical semiconductor component to a holder by the method of the present invention. FIG. 6 is a perspective view of the ring before and after deformation as shown in FIG. 1.21, 51.61.71...Holder, 2...Optical semiconductor component, 3.3'...Ring, 11...Small diameter inner wall portion, 12...Large diameter inner wall portion, 13. ...Tapered portion, 14...Inner end surface. Figure 1 (0) (b) Figure 1 (0) (b) Figure 2 Figure 3 Figure 4 (b) Figure 4 (b) Figure 4 (b) Figure 4 (b) Figure 5 Figure 6

Claims (1)

[Claims] An inner end surface (14) on the large-diameter inner wall (12) side of the holder (1) in which a tapered portion (13) is formed between the small-diameter inner wall (11) and the large-diameter inner wall (12). ), and the ring (3) made of a shape memory alloy that has been deformed so as to be able to pass through the small diameter inner wall (11) of the holder (1) is restored in the tapered part (13). By moving the ring (3) toward the inner end surface (14) of the holder (1), the optical semiconductor component (2) is moved between the ring (3) and the inner end surface (14).
1. A method for fixing optical semiconductor components, characterized by sandwiching the components.