JPS63285945A - Semiconductor integrated circuit and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve the development efficiency of a semiconductor integrated circuit by isolating a development supporting circuit from a circuit body on a semiconductor chip to dispose it on the periphery of the chip. CONSTITUTION:A CPU 30, an ROM 31 and a peripheral circuit 32 are gathered substantially at the center of a semiconductor chip 33 to be laid out, I/O interfaces 34-39 are provided around them, and the interfaces 34, 39 are disposed on the peripheral edge of the chip 33. The CPU 30, the ROM 31, the peripheral circuit 32, and I/O interfaces 34-39 are connected to each other by a bus line 40 to form a circuit body. Blocked development supporting circuits 41, 42 are provided at the peripheral edges 33a, 33b of the chip 33, and connected to the line 40. After a hardware evaluation and a software development are finished by the circuits 41, 42, the mask pattern of the ROM 31 is determined in response to the developed program, and manufactured in a mass production. The peripheral edges 33a, 33b of the chip 33 are isolated at the time of manufacturing in a mass production. Thus, the development efficiency is improved and the developing period is shortened.

Description

[Detailed Description of the Invention] [Summary] The present invention is a semiconductor integrated circuit and a method for manufacturing the same, which improves development efficiency by separating a development support circuit from the circuit body and arranging it at the periphery of a semiconductor chip. and shorten the development period.

[Industrial application field]

The present invention relates to a semiconductor integrated circuit and a manufacturing method, and more particularly to a semiconductor integrated circuit and a manufacturing method for developing the circuit body by evaluating the hardware of the circuit body using a development support circuit.

2. Description of the Related Art Conventionally, there has been an ASIC (Application Specific Integrated Circuit) semiconductor integrated circuit as a custom circuit having a circuit configuration according to a user's specifications.

Among such semiconductor integrated circuits, there are those whose hardware is controlled by pre-stored software, such as single-chip microcomputers.

When developing a single-chip microcomputer based on the above-mentioned ASIC semiconductor integrated circuit, it is necessary to evaluate whether the hardware of this microcomputer operates according to specifications, and to evaluate whether the hardware of this microcomputer operates according to the specifications. It is necessary to develop a program to operate the microcomputer.

[Conventional technology]

A like the single-chip microcomputer mentioned above
When developing SIC semiconductor integrated circuits, a development support semiconductor integrated circuit for hardware evaluation, a development support semiconductor integrated circuit for program development, and a semiconductor integrated circuit for mass production are independently developed.

A development support semiconductor integrated circuit for hardware evaluation or program development has the configuration shown in FIG. 3, and a semiconductor integrated circuit for mass production has the configuration shown in FIG. 4.

In Figures 3 and 4, 10 is the CPU, 11 is the ROM, 1
Reference numeral 2 indicates peripheral circuits such as a timer and an A/D converter. I10 interface 13 ~ on the periphery of the semiconductor chip
18 are provided. The above CPU10. ROM11.
Peripheral circuit 12. The I/O interfaces 13 to 18 are connected by path lines 19 indicated by diagonal lines in the figure.

Further, a development support circuit 20 is provided in the development support semiconductor integrated circuit. This development support circuit 20 is a development support circuit for hardware evaluation in an integrated circuit for hardware evaluation, and is a development support circuit for software development in an integrated circuit for software development.

[Problem that the invention seeks to solve]

Conventionally, three types of semiconductor integrated circuits, one for hardware evaluation, one for software development, and one for mass production, had to be developed independently, which led to poor development efficiency and the need to determine the logic and layout of semiconductor integrated circuits for mass production too early. There was a problem that the development period was lengthened because the development process was not carried out properly.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a semiconductor integrated circuit that improves development efficiency and shortens the development period.

[Means for solving problems]

The semiconductor integrated circuit of the present invention includes a development support circuit (41, 42) on a semiconductor chip (33) and a circuit body (30-32.
34 to 39), and are arranged at the peripheral edge portions (33a, 33b) of the semiconductor chip (33).

Further, in the method for manufacturing a semiconductor integrated circuit of the present invention, the development support circuit (41° 42) is separated from the circuit main body (30 to 32, 34 to 39) on the semiconductor chip (33). Peripheral part (33a.

33b) to manufacture a semiconductor integrated circuit for development support.

33b) is separated to manufacture a semiconductor integrated circuit for mass production.

[Effect]

In the circuit of the present invention, at the time of development, the semiconductor chip (33)
The development support circuit (
41, 42) to the circuit body (30~32.34~3
At least the hardware evaluation of 9) is performed. The above-mentioned development support circuit (41, 42) is located at the peripheral part (33a, 33b) on the semiconductor chip (33).
34-39), so after development, the peripheral parts (33a, 33b) are separated and the circuit body (
30 to 32 and 34 to 39) can be easily taken out without changing the hardware, and there is no need to separately develop a semiconductor integrated circuit for development support and a semiconductor integrated circuit for mass production.

Further, in the method of the present invention, from the semiconductor chip (33) of the semiconductor integrated circuit for development support to the peripheral portion <33a, 33
By simply separating b), mass-produced semiconductor integrated circuits can be manufactured easily.

〔Example〕

FIG. 1 shows a configuration diagram of an embodiment of a semiconductor integrated circuit according to the present invention. This integrated circuit is a single-chip microcomputer.

In FIG. 1, 30 is a CPU, and 31 is a mask ROM that stores programs and the like to be executed by the CPU 30. The peripheral circuit 32 is a timer, an A/D converter, a register, etc. according to the user's specifications.

Above (7) CPU30. ROM31. The peripheral circuits 32 are laid out in a concentrated manner near the center of the semiconductor chip 33, and surrounding them are I10 interfaces 34 to 39.
I10 interface 34.39
Each is located at the periphery of the semiconductor chip 33.

CPU30. ROM31. Peripheral circuit 32. The I10 interfaces 34 to 39 are connected to each other by a pass line 40 shown with diagonal lines in the figure, thereby forming a circuit body as a mass-produced product.

Furthermore, the left and right peripheral edges 33a, 3 in the figure of the semiconductor chip 33 are
Blocked development support circuits 41 and 42 are provided in 3b. Each of the development support circuits 41 and 42 is connected to the pass line 40.

The development support circuits 41 and 42 are provided with a hardware evaluation circuit and a software development circuit.

The hardware evaluation circuit includes, for example, a buffer 7 circuit connected to the pass line 40, a circuit for time-sharing an internal clock signal, a timing signal, an address, etc. with a gater and outputting it to the outside from an I10 interface 34.39;
It is a circuit etc. for bringing the PU 30 into a ready state and a stop state.

This allows the CPU 30 to be
The hardware can be evaluated by interrupting the operation and reading out the address, timing signal, etc. indicating the operating state.

The software development circuit includes a buffer circuit connected to the pass line 40, an I10 interface that outputs addresses and data to the outside, and the like.

This makes it possible to connect an external EPROM (erasable programmable ROM) to the pass line 40, store a program under development in the EPROM instead of the mask ROM 31, debug the program, and develop software.

After completing the hardware evaluation and software development using the development support circuits 41 and 42 described above, the mask pattern of the mask ROM 31 is determined according to the developed program, and the semiconductor integrated circuit shown in Figure 1 is mass-produced. .

During mass production, the dot-dashed line 5 of the semiconductor chips 33
The peripheral edge 33a to the left of 0 and the peripheral edge 33b to the right of the dashed-dotted line 51 are separated. This is because the development support circuits 41 and 42 are not necessary for mass-produced semiconductor integrated circuits, and as a result, the semiconductor integrated circuit of the IL product, that is, the product, has the configuration shown in FIG. In FIG. 2, the same parts as in FIG. 1 are given the same reference numerals, and their explanations will be omitted.

In this way, the peripheral edge 33a of the semiconductor chip 33.

By simply separating 33b, a mass-produced semiconductor integrated circuit can be obtained without changing the layout of the circuit body, so there is no need to develop the development support semiconductor integrated circuit and the mass-produced semiconductor integrated circuit separately as in the past. There is no. This improves development efficiency 1 and shortens the development period.

Note that in a semiconductor integrated circuit using an EPROM instead of the mask ROM 31 on the semiconductor chip 33, there is no need to provide a software development circuit in the development support circuits 41 and 42, and the invention is not limited to the above embodiment.

〔Effect of the invention〕

As described above, according to the semiconductor integrated circuit of the present invention, there is no need to separately develop semiconductor integrated circuits for development support and production use, improving development efficiency and shortening the development period. Extremely useful.

Further, according to the manufacturing method of the present invention, a semiconductor integrated circuit for mass production can be easily manufactured by simply cutting off the peripheral portion of a semiconductor integrated circuit for development support, and is extremely useful in practice.

[Brief explanation of drawings]

Figure 1 is a configuration diagram of an embodiment of the semiconductor integrated circuit of the present invention, and Figure 2 is a diagram of the manufacturing method of the present invention! l! FIG. 3 is a configuration diagram of an example of a conventional development support semiconductor integrated circuit, and FIG. 4 is a configuration diagram of an example of a conventional semiconductor integrated circuit for mass production. It is a diagram. In FIGS. 1 and 2, 30 is CPtJ. 31 is a mask ROM. 32 is a peripheral circuit; 33 is a semiconductor chip; 33a and 33b are peripheral edges 1. 34 to 39 are I10 interfaces, 40 is a pass line, and 41 and 42 are development support circuits. Jutsu Ezu/Zuke 4 prongs

Claims (2)

[Claims] (1) In semiconductor integrated circuits that perform at least hardware evaluation of circuit bodies (30 to 32, 34 to 39) that become products using development support circuits (41, 42) during development, on semiconductor chips (33). The development support circuit (41, 42) is connected to the circuit body (30-32, 34-39).
) of the semiconductor chip (33).
a, 33b). (2) Semiconductor integrated circuits for development support that use the development support circuits (41, 42) during development to perform at least hardware evaluation of the circuit bodies (30 to 32, 34 to 39) that will become products, and for mass production that will become products. In a semiconductor integrated circuit manufacturing method for manufacturing a semiconductor integrated circuit, the development support circuit (41, 42) is attached to the circuit body (30-32, 34-39) on a semiconductor chip (33).
) of the semiconductor chip (33).
a, 33b) to manufacture the semiconductor integrated circuit for development support, and from the semiconductor chip (33) to the peripheral portion (33a, 33b).
1. A method for manufacturing a semiconductor integrated circuit, comprising: manufacturing a semiconductor integrated circuit for mass production by separating the semiconductor integrated circuit.