JPS63284441A - Load cell - Google Patents
Load cellInfo
- Publication number
- JPS63284441A JPS63284441A JP11972287A JP11972287A JPS63284441A JP S63284441 A JPS63284441 A JP S63284441A JP 11972287 A JP11972287 A JP 11972287A JP 11972287 A JP11972287 A JP 11972287A JP S63284441 A JPS63284441 A JP S63284441A
- Authority
- JP
- Japan
- Prior art keywords
- film
- load cell
- conductor
- insulating film
- strain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000007772 electroless plating Methods 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 6
- 239000011701 zinc Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 5
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 4
- 229910001120 nichrome Inorganic materials 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 239000009719 polyimide resin Substances 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000000206 photolithography Methods 0.000 abstract description 2
- 238000006467 substitution reaction Methods 0.000 abstract description 2
- 239000000411 inducer Substances 0.000 abstract 2
- 229910004479 Ta2N Inorganic materials 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229940077844 iodine / potassium iodide Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of Force In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子式秤量計に用いられるロードセルに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a load cell used in an electronic weighing scale.
従来、薄膜型のロードセルにおいては、その配線導体を
Ａｕ又はＣ，ｕを主成分とする導体で形成していた。そ
して、フレキシブルケーブルや被覆線を半田付けにより
Ａｕ又はＣｕよりなる電極と接続していた。Conventionally, in a thin film type load cell, the wiring conductor thereof has been formed of a conductor mainly composed of Au, C, or u. A flexible cable or a coated wire is connected to an electrode made of Au or Cu by soldering.
上述した従来のロードセルの配線導体となるＡｕは、高
価である上に、このＡｕのエツチング液である沃素・沃
化カリウム液が起歪体の材質として、一般に使用される
アルミニウム合金と、激しく反応するので、起歪体の被
覆作業を必要とする。また、Ｃｕは廉価であるが、抵抗
体の安定化熱処理工程で厚い酸化膜が形成される。仮に
、酸化される銅の厚さを見込んで厚めに形成して後から
酸化膜を除去するにしても、成膜時間の増加が多すぎる
ので不利である。Au, which is used as the wiring conductor of the conventional load cell mentioned above, is expensive, and the iodine/potassium iodide solution used as the etching solution for this Au reacts violently with the aluminum alloy commonly used as the material for the strain-generating body. Therefore, it is necessary to cover the flexure element. Further, although Cu is inexpensive, a thick oxide film is formed during the stabilization heat treatment process of the resistor. Even if the oxide film is formed to be thicker in consideration of the thickness of the copper to be oxidized and the oxide film is removed later, this is disadvantageous because the film formation time increases too much.
本発明の目的は、このような欠点を除き、配線導体が廉
価であると共に、銅の様に厚い酸化膜を形成せず、更に
半田付けも容易であるロードセルを提供することにある
。An object of the present invention is to eliminate these drawbacks and provide a load cell in which the wiring conductor is inexpensive, does not form a thick oxide film unlike copper, and is easy to solder.
本発明の構成は、起歪体上に有機絶縁膜を形成し、この
有機絶縁膜上に薄膜ストレンゲージ回路を設けたロード
セルにおいて、前記有機絶縁膜上に形成される配線用導
体がアルミニウムを主成分とする金属からなり、その配
線用導体の電極ランド部分は半田ぬれ性の良い金属が無
電解がメッキにより形成されたものであることを特徴と
する。The present invention has a load cell in which an organic insulating film is formed on a strain body and a thin film strain gauge circuit is provided on the organic insulating film, in which the wiring conductor formed on the organic insulating film is mainly made of aluminum. The electrode land portion of the wiring conductor is formed by electroless plating of a metal with good solderability.
本発明のロードセルは、抵抗体及びアルミニウムを主成
分とする配線でパターン化したストレンジゲージ回路を
熱処理して抵抗体の安定化を行ない、その後、アルミニ
ウムを主成分とする配線の電極を形成する領域にのみ無
電解メッキ法で半田ぬれ性の良い金属を電着させている
事を特徴とする。In the load cell of the present invention, a strange gauge circuit patterned with a resistor and wiring mainly composed of aluminum is heat-treated to stabilize the resistor, and then a region where electrodes of the wiring mainly composed of aluminum are formed. It is characterized by electrodepositing a metal with good solderability only by electroless plating.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の一実施例を製作工程順
に説明した部分断面図である。FIGS. 1(a) and 1(b) are partial cross-sectional views illustrating an embodiment of the present invention in the order of manufacturing steps.
起歪体５上に塗布されたポリイミド系樹脂１からなる絶
縁膜上に、窒化タンタル（Ｔａ３Ｎ）２をスパッタ成膜
した後、ニクロム膜３、更に銅を４％重量比で含有する
アルミニウム膜４を連続的にスパッタ成膜する。そして
、通常のフォトリソグラフィ技術でストレンゲージ回路
を形成する。After sputtering tantalum nitride (Ta3N) 2 on the insulating film made of polyimide resin 1 coated on the flexure element 5, a nichrome film 3 and an aluminum film 4 containing 4% copper by weight are formed. is continuously deposited by sputtering. Then, a strain gauge circuit is formed using normal photolithography technology.
このときアルミニウムをりん酸系エッチャントでエツチ
ングし、ニクロムを過塩素酸系エッチャントでエツチン
グし、さらに窒化タンタルをフッ酸系エッチャントでエ
ツチングする。従って、アルミニウム合金よりなる起歪
体５は、被覆しなくても、せいぜい表面の２〜３μｍが
エツチングされるだけであり、起歪体５の力学特性には
影響を与えない。At this time, aluminum is etched with a phosphoric acid etchant, nichrome is etched with a perchloric acid etchant, and tantalum nitride is etched with a hydrofluoric acid etchant. Therefore, even if the strain-generating body 5 made of aluminum alloy is not coated, at most only 2 to 3 μm of the surface will be etched, and the mechanical properties of the strain-generating body 5 will not be affected.
この様にパターン化されたロードセルを抵抗体６の安定
化の為に２５０℃、５時間の条件で熱処理を行なう、こ
の熱処理終了後に、電極形成部７のみが露出する様に、
パターン面及び起歪体を被覆する（第１図（ａ））、次
に、亜鉛置換法を適用して半田ぬれ性の良い金属である
ニッケル８を無電解メッキする（第１図（ｂ））。この
前処理として、酸化膜除去の酸洗浄を行って亜鉛メッキ
する。In order to stabilize the resistor 6, the load cell patterned in this way is heat-treated at 250°C for 5 hours. After this heat treatment, only the electrode forming part 7 is exposed.
The pattern surface and the strain-generating body are coated (Fig. 1 (a)), and then nickel 8, a metal with good solderability, is electrolessly plated by applying the zinc substitution method (Fig. 1 (b)). ). As this pretreatment, acid cleaning is performed to remove the oxide film, and then zinc plating is performed.
それから、ニッケルと亜鉛の置換メッキを行ない、２〜
３μｍニッケル層を、容易に堆積する事ができる。メッ
キ用の被覆を除去した後外部回路と接続する為のケーブ
ルを電極のニッケル膜と半田接続する。そして、耐湿用
樹脂で回路面を被覆する事によりロードセルが完成する
。Then, nickel and zinc displacement plating is performed, and 2~
A 3 μm nickel layer can be easily deposited. After removing the plating coating, a cable for connecting to an external circuit is soldered to the nickel film of the electrode. The load cell is then completed by covering the circuit surface with a moisture-resistant resin.
以上説明した様に本発明は、ストレンジージ回路用の導
体層を、アルミニウムを主成分とする金属を用いて形成
し、電極部のみに半田ぬれ性の良い金属を無電解メッキ
法で電着しているので、廉価に形成できると共に、抵抗
体の安定化を熱処理工程に対応でき、更に半田接続が容
易な配線導体を有するロードセルを実現する事ができる
。As explained above, in the present invention, a conductor layer for a strange circuit is formed using a metal whose main component is aluminum, and a metal with good solderability is electrodeposited only on the electrode portions by electroless plating. Therefore, it is possible to form the load cell at a low cost, to stabilize the resistor in a heat treatment process, and to have a wiring conductor that can be easily soldered.
第１図（ａ）、（ｂ）は、本発明の一実施例を製造工程
順に示したロードセルの部分断面図である。
１・・・ポリイミド系樹脂、２・・・窒化タンタル、３
・・・ニクロム、４・・・アルミニウム、５・・・起歪
体、６・・・抵抗体、７・・・電極形成部、８・・・ニ
ッケル。FIGS. 1(a) and 1(b) are partial sectional views of a load cell showing an embodiment of the present invention in the order of manufacturing steps. 1... Polyimide resin, 2... Tantalum nitride, 3
... Nichrome, 4 ... Aluminum, 5 ... Strain element, 6 ... Resistor, 7 ... Electrode forming part, 8 ... Nickel.
Claims (1)
膜ストレンゲージ回路を設けたロードセルにおいて、前
記有機絶縁膜上に形成される配線用導体がアルミニウム
を主成分とする金属からなり、その配線用導体の電極ラ
ンド部分は半田ぬれ性の良い金属が無電解がメッキによ
り形成されたものであることを特徴とするロードセル。In a load cell in which an organic insulating film is formed on a strain body and a thin film strain gauge circuit is provided on the organic insulating film, the wiring conductor formed on the organic insulating film is made of a metal containing aluminum as a main component. A load cell characterized in that the electrode land portion of the wiring conductor is formed by electroless plating of a metal with good solderability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11972287A JPS63284441A (en) | 1987-05-15 | 1987-05-15 | Load cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11972287A JPS63284441A (en) | 1987-05-15 | 1987-05-15 | Load cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63284441A true JPS63284441A (en) | 1988-11-21 |
Family
ID=14768501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11972287A Pending JPS63284441A (en) | 1987-05-15 | 1987-05-15 | Load cell |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63284441A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019100883A (en) * | 2017-12-04 | 2019-06-24 | ミネベアミツミ株式会社 | Strain gauge |
| WO2022092203A1 (en) * | 2020-10-30 | 2022-05-05 | 日東電工株式会社 | Strain sensor and laminate |
-
1987
- 1987-05-15 JP JP11972287A patent/JPS63284441A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019100883A (en) * | 2017-12-04 | 2019-06-24 | ミネベアミツミ株式会社 | Strain gauge |
| WO2022092203A1 (en) * | 2020-10-30 | 2022-05-05 | 日東電工株式会社 | Strain sensor and laminate |
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