JPS63283094A - Printed-circuit board - Google Patents
Printed-circuit boardInfo
- Publication number
- JPS63283094A JPS63283094A JP11846187A JP11846187A JPS63283094A JP S63283094 A JPS63283094 A JP S63283094A JP 11846187 A JP11846187 A JP 11846187A JP 11846187 A JP11846187 A JP 11846187A JP S63283094 A JPS63283094 A JP S63283094A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pad
- leads
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 239000000696 magnetic material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000006247 magnetic powder Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract 2
- 238000006073 displacement reaction Methods 0.000 abstract 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 6
- 101100229738 Mus musculus Gpank1 gene Proteins 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線基板に関し、特に表面実装半導体
装置との電気的接触を行うプリント配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a printed wiring board that makes electrical contact with a surface-mounted semiconductor device.
従来、この種のプリント配線基板は、表面実装半導体装
置との電気的接触を行うには、プリント配線基板上の電
気的接触部分（以下パッドと称す）に前記半導体装置の
リード部分を位置決めし両者を接着剤で仮止めした後半
田付けするか、あるいはプリント配線基板上に半田付け
されたソケットに前記半導体装置を搭載する方法がとら
れていた。Conventionally, in order to make electrical contact with a surface-mounted semiconductor device, this type of printed wiring board has been constructed by positioning the lead portion of the semiconductor device on an electrical contact portion (hereinafter referred to as a pad) on the printed wiring board. The semiconductor device is temporarily fixed with adhesive and then soldered, or the semiconductor device is mounted on a socket soldered onto a printed wiring board.
上述した従来のプリント配線基板は、表面実装半導体装
置を半田実装するのに際し正確な位置決めと接着剤によ
る仮止めという工程が必要であるという欠点があり、さ
らに位置すれによる接触不良が発生しやすいという欠点
がある。また、基板上に固定されたソケットを用いた場
合は表面実装半導体装置の搭載の自動化に困難を伴なう
という欠点を有している。The conventional printed wiring boards mentioned above have the disadvantage that they require accurate positioning and temporary fixing with adhesive when soldering surface-mounted semiconductor devices, and are also prone to poor contact due to positional misalignment. There are drawbacks. Furthermore, when a socket fixed on the substrate is used, there is a drawback that it is difficult to automate the mounting of the surface-mounted semiconductor device.
本発明の目的は、かかる半導体装置の実装に伴なう正確
な位置決めや仮止め工程などを必要とせすに且つ位置ず
れによる接触不良の発生を防止し、また半導体装置の搭
載の自動化をも実現するプリント配線基板を提供するこ
とにある。The purpose of the present invention is to prevent the occurrence of poor contact due to positional deviation, which requires accurate positioning and temporary fixing processes associated with the mounting of such semiconductor devices, and also to realize automation of the mounting of semiconductor devices. The purpose of the present invention is to provide a printed wiring board with
本発明のプリント配線基板は、表面実装半導体装との電
気的接触を行うパッドに磁性材を有するか、もしくは前
記バットを通電により電磁石として働くように構成され
る。The printed wiring board of the present invention has a magnetic material in the pad that makes electrical contact with the surface-mounted semiconductor device, or is configured to function as an electromagnet when the pad is energized.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第一の実施例を説明するためのプリン
ト配線基板の部分的な平面図である。FIG. 1 is a partial plan view of a printed wiring board for explaining a first embodiment of the present invention.
第１図に示すように、プリント配線基板１上には磁性粉
体５を含む磁気を有するパッド４がその周辺部に形成さ
れる。前記基板１の中央部には表面実装半導体装置２が
実装されるが、この半導体装置２におけるリート３は鉄
・ニッケル合金からなっているのて、リード３の厳密な
位置合せは不要であり、またバット４の有する磁力によ
って正確な位置合せかなされる。更に、基板１に半導体
装置２を半田実装するのに必要たった接着剤による仮止
めも不要になる。As shown in FIG. 1, a magnetic pad 4 containing magnetic powder 5 is formed on a printed wiring board 1 at its periphery. A surface-mounted semiconductor device 2 is mounted in the center of the substrate 1, but since the leads 3 in this semiconductor device 2 are made of an iron-nickel alloy, strict alignment of the leads 3 is not necessary. Further, accurate alignment is achieved by the magnetic force of the bat 4. Further, temporary fixing with adhesive, which is necessary for soldering the semiconductor device 2 to the substrate 1, is no longer necessary.
第２図は本発明の第二の実施例を説明するためのプリン
ト配線基板上の半導体装置を電気的に測定する測定装置
の正面図である。本実施例は表面実装半導体装置の電気
的測定に本発明を適用した例である。FIG. 2 is a front view of a measuring device for electrically measuring a semiconductor device on a printed wiring board for explaining a second embodiment of the present invention. This embodiment is an example in which the present invention is applied to electrical measurement of a surface-mounted semiconductor device.
第２図に示すように、測定装置６の測定部７に載置され
たプリント配線基板１上のバット４′か電磁石になって
いる。すなわち、半導体装置２の周囲に形成されたり一
ト３がパッド４′に引きつけられる。まっ、ハンドラー
１０の半導体装置供給部８から表面実装半導体装Ｗ２が
測定部７に供給された時点でバット４′に通電すると、
発生した磁力により表面実装半導体装置２とパッド４′
とが電気的に接触し保持された状態で電気的測定が行わ
れる。次に、かかる半導体装置２の電気的測定か終了す
ると、バット４′の通電を止めることにより表面実装半
導体装置２はパッド４′との接触を断たれ、ハンドラー
１０の半導体装置収納部９へ周知の技術により収納され
る。As shown in FIG. 2, the bat 4' on the printed wiring board 1 placed on the measuring section 7 of the measuring device 6 is an electromagnet. That is, the pads 3 formed around the semiconductor device 2 are attracted to the pads 4'. First, when the batt 4' is energized at the time when the surface-mounted semiconductor device W2 is supplied from the semiconductor device supply section 8 of the handler 10 to the measurement section 7,
The generated magnetic force causes the surface mount semiconductor device 2 and pad 4' to
Electrical measurements are taken while the two are in electrical contact and held. Next, when the electrical measurement of the semiconductor device 2 is completed, the contact between the surface-mounted semiconductor device 2 and the pad 4' is cut off by stopping the power supply to the bat 4', and the information is sent to the semiconductor device storage section 9 of the handler 10. It is stored using this technology.
以上説明したように、本発明は表面実装半導体装置を実
装するプリント配線基板のバットに磁性材を有するか、
もしくは前記バットを通電により電磁石として働くよう
に形成することにより、前記半導体装置の半田実装工程
中において必要たった正確な位置決め及び接着剤による
仮止めを不要とし、且つ位置すれによる接触不良をも防
止することかてきる効果かある。また、表面実装半導体
装置の電気的測定において必要たった測定器のソケット
を不要とし、極めて容易に自動測定を実施てきるという
効果かある。As explained above, the present invention provides a printed wiring board on which a surface-mounted semiconductor device is mounted, which has a magnetic material in its butt.
Alternatively, by forming the bat to function as an electromagnet when energized, accurate positioning and temporary fixing with adhesive required during the soldering process of the semiconductor device are not required, and contact failure due to positional misalignment is also prevented. There are certain effects. Further, the present invention has the effect that a socket for a measuring device, which is necessary for electrical measurement of a surface-mounted semiconductor device, is not required, and automatic measurement can be carried out extremely easily.
第１図は本発明の第一の実施例を説明するためのプリン
ト配線基板の部分的な平面図、第２図は本発明の第二の
実施例を説明するためのプリント配線基板上の半導体装
置を電気的に測定する測定装置の正面図である。
１・・プリント配線基板、２・・表面実装半導体装置、
３・・リート、４．４′・・・パッド、５・・・磁性粉
体、６・・測定器、７・測定部、８・・・半導体装置供
給部、９・・・半導体装置収納部、１０・・・ハンドラ
ー。FIG. 1 is a partial plan view of a printed wiring board for explaining a first embodiment of the present invention, and FIG. 2 is a semiconductor on a printed wiring board for explaining a second embodiment of the present invention. FIG. 2 is a front view of a measuring device that electrically measures the device. 1. Printed wiring board, 2. Surface mount semiconductor device,
3...Leat, 4.4'...Pad, 5...Magnetic powder, 6...Measuring device, 7.Measuring section, 8...Semiconductor device supply section, 9...Semiconductor device storage section , 10...handler.
Claims (1)
分に磁性材を有するか、もしくは前記電気的接触部分を
通電により電磁石として働くように形成したことを特徴
とするプリント配線基板。1. A printed wiring board characterized in that an electrical contact portion that makes electrical contact with a surface-mounted semiconductor device includes a magnetic material, or the electrical contact portion is formed so as to function as an electromagnet when energized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846187A JPS63283094A (en) | 1987-05-14 | 1987-05-14 | Printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846187A JPS63283094A (en) | 1987-05-14 | 1987-05-14 | Printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63283094A true JPS63283094A (en) | 1988-11-18 |
Family
ID=14737227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11846187A Pending JPS63283094A (en) | 1987-05-14 | 1987-05-14 | Printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63283094A (en) |
-
1987
- 1987-05-14 JP JP11846187A patent/JPS63283094A/en active Pending
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