JPS63274590A - Relief printing - Google Patents
Relief printingInfo
- Publication number
- JPS63274590A JPS63274590A JP62111423A JP11142387A JPS63274590A JP S63274590 A JPS63274590 A JP S63274590A JP 62111423 A JP62111423 A JP 62111423A JP 11142387 A JP11142387 A JP 11142387A JP S63274590 A JPS63274590 A JP S63274590A
- Authority
- JP
- Japan
- Prior art keywords
- printing ink
- printed matter
- powder
- relief
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 claims abstract description 38
- 238000004049 embossing Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 229910052724 xenon Inorganic materials 0.000 abstract description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) この発明は浮出し印刷方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to an embossing printing method.
(従来の技術)
文字1図柄などの印刷部分を1紙面から浮き上がるよう
に形成する浮出し、印刷は既によく知られている。これ
は印刷部分に浮出粉末(たとえばポリアミドダイマー酸
系の樹脂)を振り掛けて加熱すれば、浮出粉末が溶解し
て付着することによって行なわれる。(Prior Art) Embossing and printing, in which a printed part such as a character or a design is formed so as to be raised from the surface of a sheet of paper, are already well known. This is done by sprinkling embossing powder (for example, polyamide dimer acid resin) on the printed area and heating it, so that the embossing powder melts and adheres to the printed area.
ところで従来ではこの種印刷にあたり、印刷インキで印
刷したあと、その印刷インキが乾かない間に浮出粉末を
振り掛け、そのときの印刷インキの粘着力を利用して浮
出粉末を仮りに付着させておいてから、余分の浮出粉末
を払い落とし、そのあとこれを加熱するようにしている
。By the way, in the past, in this type of printing, after printing with printing ink, embossed powder was sprinkled while the printing ink was not drying, and the embossed powder was temporarily attached using the adhesive force of the printing ink at that time. After setting it aside, the excess embossing powder is brushed off, and then it is heated.
これによれば目的とする浮出し印刷は可能であるが、前
記した説明から理解されるように、印刷直後の印刷イン
キが乾かない短時間の間(たとえば1時間程度)に浮出
粉末を散布しなければならない、したがって印刷インキ
が乾いてしまったあとは、もはやこの種滓出し印刷を実
行することができなくなる欠点があった。According to this method, the intended embossing printing is possible, but as can be understood from the above explanation, the embossing powder cannot be applied immediately after printing for a short period of time (for example, about 1 hour) before the printing ink dries. This has the disadvantage that it has to be sprayed, and therefore, after the printing ink has dried, it is no longer possible to carry out this type of slag printing.
(発明が解決しようとする問題点)
この発明は印刷インキが乾いたあとでも、任意に浮出し
印刷を可能とする印刷方法を提案することを目的とする
。(Problems to be Solved by the Invention) An object of the present invention is to propose a printing method that enables arbitrary relief printing even after the printing ink has dried.
(問題点を解決するための手段)
この発明は印刷物の表面にまず浮出粉末を散布し、その
あとその印刷物に熱線を短時間照射して。(Means for Solving the Problems) This invention first sprinkles embossing powder on the surface of a printed matter, and then irradiates the printed matter with heat rays for a short period of time.
印刷インキを発熱させ、そのときの熱によってさきに散
布した浮出粉末を軟化させて、この軟化によってその印
刷インキに浮出粉末を仮りに付着させるようにし、この
あと余分の浮出粉末を前記印刷物の表面から払い落とし
、次にその印刷物を従来と同様にその浮出粉末が溶解す
る程度に加熱するようにしたことを特徴とする。The printing ink is heated, and the heat generated softens the previously sprinkled embossing powder, and this softening causes the embossing powder to temporarily adhere to the printing ink. It is characterized in that it is brushed off from the surface of the printed matter, and then the printed matter is heated to an extent that the embossed powder is dissolved in the same manner as in the past.
(実施例) この発明の実施例方法を図によって説明する。(Example) An example method of this invention will be explained with reference to the drawings.
1は既に表面に所要の印刷が済んでいる印刷物で。1 is a printed matter that has already had the required printing completed on its surface.
これはまず最初にコンベア2によってホッパ3の下方に
送られてくる。ホッパ3には浮出粉末4が収納されてあ
り、ホッパ3がたとえば電磁振動されることにより、下
面の小孔からさきに送られてきた印刷物1の表面に全面
的に散布される。This is first sent to the lower part of the hopper 3 by the conveyor 2. The hopper 3 stores an embossing powder 4, and when the hopper 3 is subjected to electromagnetic vibration, for example, the embossing powder 4 is scattered over the entire surface of the printed matter 1 that has been previously sent through a small hole in the lower surface.
そのあと印刷物1はコンベア5によって加熱フラッシュ
部6の中に搬送される。加熱フラッシュ部6は熱線を照
射するたとえばストロボランプあるいはキセノンランプ
7によって構成されである。The printed product 1 is then conveyed by a conveyor 5 into a heating flash section 6 . The heating flash unit 6 is constituted by, for example, a strobe lamp or a xenon lamp 7 that irradiates heat rays.
そしてこれから発せられる熱線を印刷物1に照射する。The printed matter 1 is then irradiated with the heat rays emitted from this.
この熱線を印刷物の表面の印刷インキが吸収することに
よって、その印刷インキが発熱する。その熱により印刷
インキの表面にある浮出粉末が軟化し、浮出粉末同志が
互いに仮りに付着するし、また発熱している印刷インキ
に仮りに付着する。When the printing ink on the surface of the printed material absorbs this heat ray, the printing ink generates heat. The heat softens the embossed powder on the surface of the printing ink, causing the embossed powder to temporarily adhere to each other and to the printing ink that is generating heat.
このようにして印刷インキを発熱させて、浮出粉末を付
着させるようにすれば、従来のように印刷インキが乾く
までに浮出粉末を散布する必要は全くなくなる。If the printing ink is heated in this manner and the embossed powder is attached, there is no need to spread the embossed powder until the printing ink dries as in the conventional method.
この加熱フラッシュ部6による印刷インキの加熱によっ
て、印刷物の表面が変色してはならない。The surface of the printed matter must not change color due to the heating of the printing ink by the heating flash unit 6.
また浮出粉末は約100℃で軟化するので、したがって
ランプ7を瞬時発光させて加熱するようにするとよい、
ここでは700Wのキセノンランプ7を数ミリ秒程度照
射して、その加熱を行なった。Furthermore, since the embossed powder softens at about 100°C, it is preferable to heat the lamp 7 by emitting light instantaneously.
Here, heating was performed by irradiating with a 700 W xenon lamp 7 for several milliseconds.
なお印刷インキの種類あるいはその色などによって、熱
線吸収の度合が異なるため、浮出粉末を均等に散布して
も、その印刷インキに付着する浮出粉末の付着量は、印
刷個所によって相違するようになる。具体的には非印刷
部分あるいは薄色部分などの付着量は少なく、また濃色
部分はど多量に付着するようになる。Note that the degree of heat absorption differs depending on the type of printing ink or its color, so even if the embossing powder is spread evenly, the amount of embossing powder adhering to the printing ink will vary depending on the printed area. become. Specifically, the amount of adhesion on non-printed areas or light-colored areas is small, and the amount of adhesion is large on dark-colored areas.
このあと印刷物1の表面から余分の浮出粉末を払い落と
す、これはたとえば図に示すように複数の送りローラ8
からなる搬送機構9を使用し、印刷物1を上方に搬送す
るとともに、印刷物1の裏面に羽根付きの加震ローラ1
0をあてて振動させると、簡単に余分な浮出粉末が払い
落とされるようになる0図中11は浮出粉末を回収する
春巻である。After this, excess raised powder is brushed off from the surface of the printed product 1, for example by using a plurality of feed rollers 8 as shown in the figure.
The printed material 1 is transported upward using a transport mechanism 9 consisting of
If you apply 0 and vibrate, excess embossed powder will be easily shaken off. 0 In the figure, 11 is a spring roll for collecting embossed powder.
以後は従来と同様に印刷物1をコンベア12によって加
熱部13に送り、ここで加熱して浮出粉末を溶解させる
。加熱部13はたとえば赤外線ヒータ14によって構成
されてあり、これからの熱によってを浮出粉末を溶解さ
せる。溶解した浮出粉末は印刷インキの表面に、従来方
法と同様に盛り上がるようにして付着する。15は紙受
は部である。Thereafter, the printed matter 1 is sent to the heating section 13 by the conveyor 12 in the same manner as before, and heated there to dissolve the embossed powder. The heating section 13 is constituted by, for example, an infrared heater 14, and the embossed powder is melted by the heat generated therefrom. The dissolved embossed powder adheres to the surface of the printing ink in a raised manner as in the conventional method. 15 is a paper tray.
(発明の効果)
以上詳述したようにこの発明によれば、印刷インキが乾
くまでに浮出粉末を散布する必要は全くなくなるので、
したがって印刷物に対して、いつでもしかも任意に浮出
し印刷の処理を行なうことができるといった効果を奏す
る。(Effects of the Invention) As detailed above, according to the present invention, there is no need to spray embossing powder until the printing ink dries.
Therefore, it is possible to perform embossing printing on printed matter at any time and at any time.
図はこの発明の一実施例方法を説明するための装置の正
面図である。
1・・・印刷物、4・・・浮出粉末、6・・・加熱フラ
ッシュ部、13・・・加熱部。The figure is a front view of an apparatus for explaining a method according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Printed matter, 4... Embossed powder, 6... Heating flash section, 13... Heating section.
Claims (1)
印刷物に熱線を短時間照射して、印刷インキを発熱させ
、そのときの熱によってさきに散布した浮出粉末を軟化
させるようにし、この軟化によって前記印刷インキに浮
出粉末を仮りに付着させ、このあと余分な浮出粉末を印
刷物の表面より払い落としてから、次に前記印刷物をそ
の表面に付着している浮出粉末が溶解する程度に加熱し
て前記印刷インクの表面に盛り上がるように付着させる
ことを特徴とする浮出し印刷方法。The embossing powder is first sprinkled on the surface of the printed matter, and then the printed matter is irradiated with heat rays for a short time to generate heat in the printing ink, and the heat generated at that time softens the previously sprinkled embossing powder. The embossed powder is temporarily attached to the printing ink by softening, and then the excess embossed powder is brushed off from the surface of the printed matter, and then the embossed powder adhering to the surface of the printed matter is dissolved. An embossment printing method characterized in that the printing ink is heated to a certain degree and adhered to the surface of the printing ink in a raised manner.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62111423A JPS63274590A (en) | 1987-05-06 | 1987-05-06 | Relief printing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62111423A JPS63274590A (en) | 1987-05-06 | 1987-05-06 | Relief printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63274590A true JPS63274590A (en) | 1988-11-11 |
JPH0428554B2 JPH0428554B2 (en) | 1992-05-14 |
Family
ID=14560802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62111423A Granted JPS63274590A (en) | 1987-05-06 | 1987-05-06 | Relief printing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63274590A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0550582A (en) * | 1991-08-23 | 1993-03-02 | Shimada Kikai Service:Yugen | Powder adhesion device for relief processing |
US20110038974A1 (en) * | 2004-11-24 | 2011-02-17 | Ncc Nano, Llc | Electrical Plating and Catalytic Uses of Metal Nanomaterial Compositions |
-
1987
- 1987-05-06 JP JP62111423A patent/JPS63274590A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0550582A (en) * | 1991-08-23 | 1993-03-02 | Shimada Kikai Service:Yugen | Powder adhesion device for relief processing |
US20110038974A1 (en) * | 2004-11-24 | 2011-02-17 | Ncc Nano, Llc | Electrical Plating and Catalytic Uses of Metal Nanomaterial Compositions |
CN102601363A (en) * | 2004-11-24 | 2012-07-25 | 诺瓦森特里克斯公司 | Electrical plating and catalytic uses of metal nanomaterial compositions |
CN102601363B (en) * | 2004-11-24 | 2015-10-28 | 诺瓦森特里克斯公司 | The electricity of metal nanomaterial compositions, plating and catalysis use |
US9494068B2 (en) * | 2004-11-24 | 2016-11-15 | Ncc Nano, Pllc | Electrical plating and catalytic uses of metal nanomaterial compositions |
Also Published As
Publication number | Publication date |
---|---|
JPH0428554B2 (en) | 1992-05-14 |
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