JPS63273394A - Material for manufacturing printed circuit board - Google Patents
Material for manufacturing printed circuit boardInfo
- Publication number
- JPS63273394A JPS63273394A JP10870287A JP10870287A JPS63273394A JP S63273394 A JPS63273394 A JP S63273394A JP 10870287 A JP10870287 A JP 10870287A JP 10870287 A JP10870287 A JP 10870287A JP S63273394 A JPS63273394 A JP S63273394A
- Authority
- JP
- Japan
- Prior art keywords
- polybutadiene
- weight
- photosensitive resin
- resin composition
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims abstract description 66
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 49
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 49
- 239000011342 resin composition Substances 0.000 claims abstract description 45
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000843 powder Substances 0.000 claims abstract description 21
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims description 47
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 28
- 229920001577 copolymer Polymers 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 15
- 238000005227 gel permeation chromatography Methods 0.000 claims description 14
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 14
- 125000000466 oxiranyl group Chemical group 0.000 claims description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 5
- 239000000194 fatty acid Substances 0.000 claims description 5
- 229930195729 fatty acid Natural products 0.000 claims description 5
- 229920000578 graft copolymer Polymers 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920001567 vinyl ester resin Polymers 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims 8
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 4
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 4
- -1 acrylic ester Chemical class 0.000 abstract description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 14
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 abstract description 7
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 4
- 238000004132 cross linking Methods 0.000 abstract description 4
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 abstract description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract 3
- 238000004587 chromatography analysis Methods 0.000 abstract 1
- 239000003505 polymerization initiator Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 33
- 239000011347 resin Substances 0.000 description 33
- 239000000243 solution Substances 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 230000007423 decrease Effects 0.000 description 12
- 150000002148 esters Chemical class 0.000 description 12
- 239000003999 initiator Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 6
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 4
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000001530 fumaric acid Substances 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229920005601 base polymer Polymers 0.000 description 3
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- HPRNPSLJNKWKCO-UHFFFAOYSA-N 1-(oxiran-2-yl)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)C1CO1 HPRNPSLJNKWKCO-UHFFFAOYSA-N 0.000 description 2
- CQGDBBBZCJYDRY-UHFFFAOYSA-N 1-methoxyanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2OC CQGDBBBZCJYDRY-UHFFFAOYSA-N 0.000 description 2
- SYENVBKSVVOOPS-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl prop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C=C SYENVBKSVVOOPS-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 2
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- ROWKJAVDOGWPAT-UHFFFAOYSA-N Acetoin Chemical compound CC(O)C(C)=O ROWKJAVDOGWPAT-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical group C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000012644 addition polymerization Methods 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- FCSHDIVRCWTZOX-DVTGEIKXSA-N clobetasol Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@H](C)[C@@](C(=O)CCl)(O)[C@@]1(C)C[C@@H]2O FCSHDIVRCWTZOX-DVTGEIKXSA-N 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 150000008049 diazo compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- DWXAVNJYFLGAEF-UHFFFAOYSA-N furan-2-ylmethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CO1 DWXAVNJYFLGAEF-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ONMLAAZEQUPQSE-UHFFFAOYSA-N (3-hydroxy-2,2-dimethylpropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)CO ONMLAAZEQUPQSE-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- XHAFIUUYXQFJEW-UHFFFAOYSA-N 1-chloroethenylbenzene Chemical compound ClC(=C)C1=CC=CC=C1 XHAFIUUYXQFJEW-UHFFFAOYSA-N 0.000 description 1
- FXKBLOJMHQMGBO-UHFFFAOYSA-N 1-cyclohexylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1C1CCCCC1 FXKBLOJMHQMGBO-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- AXFVIWBTKYFOCY-UHFFFAOYSA-N 1-n,1-n,3-n,3-n-tetramethylbutane-1,3-diamine Chemical compound CN(C)C(C)CCN(C)C AXFVIWBTKYFOCY-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- HGOUNPXIJSDIKV-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl 2-methylprop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C(C)=C HGOUNPXIJSDIKV-UHFFFAOYSA-N 0.000 description 1
- BUZAXYQQRMDUTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl prop-2-enoate Chemical compound CC(C)(C)CC(C)(C)OC(=O)C=C BUZAXYQQRMDUTM-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- VIIZJXNVVJKISZ-UHFFFAOYSA-N 2-(n-methylanilino)ethanol Chemical compound OCCN(C)C1=CC=CC=C1 VIIZJXNVVJKISZ-UHFFFAOYSA-N 0.000 description 1
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 description 1
- VTSDGYDTWADUJQ-UHFFFAOYSA-N 2-bromoanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Br)=CC=C3C(=O)C2=C1 VTSDGYDTWADUJQ-UHFFFAOYSA-N 0.000 description 1
- SZTBMYHIYNGYIA-UHFFFAOYSA-N 2-chloroacrylic acid Chemical compound OC(=O)C(Cl)=C SZTBMYHIYNGYIA-UHFFFAOYSA-N 0.000 description 1
- WHBAYNMEIXUTJV-UHFFFAOYSA-N 2-chloroethyl prop-2-enoate Chemical compound ClCCOC(=O)C=C WHBAYNMEIXUTJV-UHFFFAOYSA-N 0.000 description 1
- ISRGONDNXBCDBM-UHFFFAOYSA-N 2-chlorostyrene Chemical compound ClC1=CC=CC=C1C=C ISRGONDNXBCDBM-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- CKKQLOUBFINSIB-UHFFFAOYSA-N 2-hydroxy-1,2,2-triphenylethanone Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C(=O)C1=CC=CC=C1 CKKQLOUBFINSIB-UHFFFAOYSA-N 0.000 description 1
- YOJAHTBCSGPSOR-UHFFFAOYSA-N 2-hydroxy-1,2,3-triphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)(O)CC1=CC=CC=C1 YOJAHTBCSGPSOR-UHFFFAOYSA-N 0.000 description 1
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 1
- RZCDMINQJLGWEP-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpent-4-en-1-one Chemical compound C=1C=CC=CC=1C(CC=C)(O)C(=O)C1=CC=CC=C1 RZCDMINQJLGWEP-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- IUPSARVXBUSQKA-UHFFFAOYSA-N 2-hydroxyhexyl 2-methylprop-2-enoate Chemical compound CCCCC(O)COC(=O)C(C)=C IUPSARVXBUSQKA-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- TURITJIWSQEMDB-UHFFFAOYSA-N 2-methyl-n-[(2-methylprop-2-enoylamino)methyl]prop-2-enamide Chemical compound CC(=C)C(=O)NCNC(=O)C(C)=C TURITJIWSQEMDB-UHFFFAOYSA-N 0.000 description 1
- GROXSGRIVDMIEN-UHFFFAOYSA-N 2-methyl-n-prop-2-enylprop-2-enamide Chemical compound CC(=C)C(=O)NCC=C GROXSGRIVDMIEN-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- QCVMOSGPTRRUQZ-UHFFFAOYSA-N 2-nitroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC([N+](=O)[O-])=CC=C3C(=O)C2=C1 QCVMOSGPTRRUQZ-UHFFFAOYSA-N 0.000 description 1
- UWRZIZXBOLBCON-UHFFFAOYSA-N 2-phenylethenamine Chemical compound NC=CC1=CC=CC=C1 UWRZIZXBOLBCON-UHFFFAOYSA-N 0.000 description 1
- UIYHUUARNKRKGV-UHFFFAOYSA-N 2-prop-2-enoxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCC=C UIYHUUARNKRKGV-UHFFFAOYSA-N 0.000 description 1
- WUWVLTIKBWZFTM-UHFFFAOYSA-N 2-sulfanylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(S)=CC=C3C(=O)C2=C1 WUWVLTIKBWZFTM-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- YCIGYTFKOXGYTA-UHFFFAOYSA-N 4-(3-cyanopropyldiazenyl)butanenitrile Chemical compound N#CCCCN=NCCCC#N YCIGYTFKOXGYTA-UHFFFAOYSA-N 0.000 description 1
- LKVFCSWBKOVHAH-UHFFFAOYSA-N 4-Ethoxyphenol Chemical compound CCOC1=CC=C(O)C=C1 LKVFCSWBKOVHAH-UHFFFAOYSA-N 0.000 description 1
- CIICLJLSRUHUBY-UHFFFAOYSA-N 4-[(2-methylpropan-2-yl)oxy]phenol Chemical compound CC(C)(C)OC1=CC=C(O)C=C1 CIICLJLSRUHUBY-UHFFFAOYSA-N 0.000 description 1
- YMRDPCUYKKPMFC-UHFFFAOYSA-N 4-hydroxy-2,2,5,5-tetramethylhexan-3-one Chemical compound CC(C)(C)C(O)C(=O)C(C)(C)C YMRDPCUYKKPMFC-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- BVEYJWQCMOVMAR-UHFFFAOYSA-N 5-Hydroxy-4-octanone Chemical compound CCCC(O)C(=O)CCC BVEYJWQCMOVMAR-UHFFFAOYSA-N 0.000 description 1
- YGTVWCBFJAVSMS-UHFFFAOYSA-N 5-hydroxypentyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCO YGTVWCBFJAVSMS-UHFFFAOYSA-N 0.000 description 1
- INRQKLGGIVSJRR-UHFFFAOYSA-N 5-hydroxypentyl prop-2-enoate Chemical compound OCCCCCOC(=O)C=C INRQKLGGIVSJRR-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- VZAMYPINYMMSGD-UHFFFAOYSA-N 9,10-dioxoanthracene-1-carbaldehyde Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C=O VZAMYPINYMMSGD-UHFFFAOYSA-N 0.000 description 1
- LLSVGXGSYBLMNY-UHFFFAOYSA-N 9,10-dioxoanthracene-1-carbonyl chloride Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(=O)Cl LLSVGXGSYBLMNY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 1
- 241000723438 Cercidiphyllum japonicum Species 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical compound CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- APZPSKFMSWZPKL-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(CO)CO APZPSKFMSWZPKL-UHFFFAOYSA-N 0.000 description 1
- ZCZFEIZSYJAXKS-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COC(=O)C=C ZCZFEIZSYJAXKS-UHFFFAOYSA-N 0.000 description 1
- IDLJKTNBZKSHIY-UHFFFAOYSA-N [4-(diethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=CC=C1 IDLJKTNBZKSHIY-UHFFFAOYSA-N 0.000 description 1
- BEUGBYXJXMVRFO-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1 BEUGBYXJXMVRFO-UHFFFAOYSA-N 0.000 description 1
- CXSXCWXUCMJUGI-UHFFFAOYSA-N [methoxy(phenyl)methyl] prop-2-enoate Chemical compound C=CC(=O)OC(OC)C1=CC=CC=C1 CXSXCWXUCMJUGI-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ZEFVHSWKYCYFFL-UHFFFAOYSA-N diethyl 2-methylidenebutanedioate Chemical compound CCOC(=O)CC(=C)C(=O)OCC ZEFVHSWKYCYFFL-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- ZWWQRMFIZFPUAA-UHFFFAOYSA-N dimethyl 2-methylidenebutanedioate Chemical compound COC(=O)CC(=C)C(=O)OC ZWWQRMFIZFPUAA-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- CQNOGTUXPYIVDM-UHFFFAOYSA-N ethyl 3-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC(N(C)C)=C1 CQNOGTUXPYIVDM-UHFFFAOYSA-N 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- GFAZHVHNLUBROE-UHFFFAOYSA-N hydroxymethyl propionaldehyde Natural products CCC(=O)CO GFAZHVHNLUBROE-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- KAKALCZDCFZYRN-UHFFFAOYSA-N n-(2-ethoxyethyl)-2-methylprop-2-enamide Chemical compound CCOCCNC(=O)C(C)=C KAKALCZDCFZYRN-UHFFFAOYSA-N 0.000 description 1
- SWSFFBPGDIHBJL-UHFFFAOYSA-N n-(2-methoxyethyl)-2-methylprop-2-enamide Chemical compound COCCNC(=O)C(C)=C SWSFFBPGDIHBJL-UHFFFAOYSA-N 0.000 description 1
- KIHJKWNSLAKEPK-UHFFFAOYSA-N n-(2-methoxyethyl)prop-2-enamide Chemical compound COCCNC(=O)C=C KIHJKWNSLAKEPK-UHFFFAOYSA-N 0.000 description 1
- LSWADWIFYOAQRZ-UHFFFAOYSA-N n-(ethoxymethyl)prop-2-enamide Chemical compound CCOCNC(=O)C=C LSWADWIFYOAQRZ-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- YOZHLACIXDCHPV-UHFFFAOYSA-N n-(methoxymethyl)-2-methylprop-2-enamide Chemical compound COCNC(=O)C(C)=C YOZHLACIXDCHPV-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- OXZMJPQKHGOTGJ-UHFFFAOYSA-N n-[10-(prop-2-enoylamino)decyl]prop-2-enamide Chemical compound C=CC(=O)NCCCCCCCCCCNC(=O)C=C OXZMJPQKHGOTGJ-UHFFFAOYSA-N 0.000 description 1
- GJQRYIOSVPEUQJ-UHFFFAOYSA-N n-[3-(prop-2-enoylamino)propyl]prop-2-enamide Chemical compound C=CC(=O)NCCCNC(=O)C=C GJQRYIOSVPEUQJ-UHFFFAOYSA-N 0.000 description 1
- YQCFXPARMSSRRK-UHFFFAOYSA-N n-[6-(prop-2-enoylamino)hexyl]prop-2-enamide Chemical compound C=CC(=O)NCCCCCCNC(=O)C=C YQCFXPARMSSRRK-UHFFFAOYSA-N 0.000 description 1
- PMJFVKWBSWWAKT-UHFFFAOYSA-N n-cyclohexylprop-2-enamide Chemical compound C=CC(=O)NC1CCCCC1 PMJFVKWBSWWAKT-UHFFFAOYSA-N 0.000 description 1
- IQFXJRXOTKFGPN-UHFFFAOYSA-N n-ethenyl-n-ethylethanamine Chemical compound CCN(CC)C=C IQFXJRXOTKFGPN-UHFFFAOYSA-N 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- GCGQYJSQINRKQL-UHFFFAOYSA-N n-hexylprop-2-enamide Chemical compound CCCCCCNC(=O)C=C GCGQYJSQINRKQL-UHFFFAOYSA-N 0.000 description 1
- CNPHCSFIDKZQAK-UHFFFAOYSA-N n-prop-2-enylprop-2-enamide Chemical compound C=CCNC(=O)C=C CNPHCSFIDKZQAK-UHFFFAOYSA-N 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 229930015698 phenylpropene Natural products 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229940071207 sesquicarbonate Drugs 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-N sodium;hydron;carbonate Chemical compound [Na+].OC(O)=O UIIMBOGNXHQVGW-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XZHNPVKXBNDGJD-UHFFFAOYSA-N tetradecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C=C XZHNPVKXBNDGJD-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は、印刷回路板を製造する際に用いる材料に関し
、絶縁基板−導電性金属箔−感光性樹脂組成物の順で積
層された多層構造の印刷回路板製造用材料に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to materials used in manufacturing printed circuit boards, in which an insulating substrate, a conductive metal foil, and a photosensitive resin composition are laminated in this order. The present invention relates to a material for manufacturing printed circuit boards with a multilayer structure.
(口)従来の技術及び発明が解決しようとする問題点
従来より、印刷回路板製造用材料としては、絶縁基板−
導電性金属箔−感光性樹脂の順で積層された三層構造よ
りなるものが用いられている。これは、まず感光性樹脂
層に所定の回路図を焼き付け、その後現像する。これに
より、非配線部においては感光性樹脂が除去され導電性
金属箔が露出し、配線部においては感光性樹脂が残って
おり導電性金属箔は感光性樹脂で覆われている。そして
、露出した導電性金属箔をエツチング等の手段で除去し
且つ配線部上に残っている感光性樹脂を除去することに
より、所定の印刷回路板が得られるわけである。(Example) Problems to be solved by conventional techniques and inventions Conventionally, insulating substrates have been used as materials for manufacturing printed circuit boards.
A three-layer structure in which conductive metal foil and photosensitive resin are laminated in this order is used. This involves first printing a predetermined circuit diagram onto a photosensitive resin layer, and then developing it. As a result, in the non-wiring portion, the photosensitive resin is removed and the conductive metal foil is exposed, and in the wiring portion, the photosensitive resin remains and the conductive metal foil is covered with the photosensitive resin. Then, by removing the exposed conductive metal foil by means such as etching and removing the photosensitive resin remaining on the wiring portion, a desired printed circuit board is obtained.
しかしながら、配線部上に残っている感光性樹脂を除去
する作業は煩雑であり、感光性樹脂を完全に除去するこ
とは困難であった。また、配線部上に感光性樹脂が残っ
ていると、他の電線等を回路の配線部にハンダ付けする
際、悪影響を生じるということがあった。However, the work of removing the photosensitive resin remaining on the wiring portion is complicated, and it is difficult to completely remove the photosensitive resin. Further, if the photosensitive resin remains on the wiring part, it may have an adverse effect when other electric wires or the like are soldered to the wiring part of the circuit.
そこで、配線部上の感光性樹脂を除去しなくてもよいよ
うに、予め感光性樹脂中に導電性粉末を混入させておき
、配線部上の感光性樹脂を導電性にすることが考えられ
る。Therefore, it may be possible to mix conductive powder into the photosensitive resin in advance to make the photosensitive resin on the wiring part conductive so that the photosensitive resin on the wiring part does not have to be removed. .
しかし、一般的に感光性樹脂には主としてジアゾ化合物
が用いられており、耐摩耗性に劣るという欠点があった
。耐摩耗性に劣ると、導電性の感光性樹脂が使用中等に
脱落し、回路が短絡するという危険があった。However, generally, photosensitive resins mainly use diazo compounds, which have the disadvantage of poor abrasion resistance. If the abrasion resistance is poor, there is a risk that the conductive photosensitive resin will fall off during use, causing a short circuit.
そこで、本発明は特定の感光性樹脂に導電性粉末を混入
させ、耐摩耗性が良好な感光性樹脂組成物を用いた印刷
回路板製造用材料を提供しようとするものである。Therefore, the present invention aims to provide a material for manufacturing printed circuit boards using a photosensitive resin composition having good wear resistance by mixing a specific photosensitive resin with conductive powder.
(ハ)問題点を解決するための手段及び作用即ち本発明
は、絶縁基板と、該絶縁基板の表面に積層された導電性
金属箔と、該導電性金属箔の表面に積層された感光性樹
脂組成物とを具備する印刷回路板製造用材料において、
前記感光性樹脂組成物は、側鎖に不飽和基を有する光架
橋性且つアルカリ可溶性高分子と、架橋剤と、光重合開
始剤と、導電性粉末とよりなり、前記側鎖に不飽和基を
有する光架橋性且つアルカリ可溶性高分子として、(a
lポリブタジェン、ポリブタジェングリコール、ポリブ
タジェンカルボン酸、変性ポリブタジェンよりなる群か
ら選ばれたポリブタジェン化合物0.1〜5重量%、(
′b)アクリル酸エステル及び/又はメタクリル酸エス
テル5〜70重量%、(c1不飽和カルボン酸20〜7
0重量%、(dlスチレン及び/又はそのアルキル置換
誘導体5〜60重量%及び所望によりfe)脂肪酸ビニ
ルエステル5〜15重量%よりなる混合物を共重合して
得られ、且つ分子量がゲル浸透クロマトグラフィで測定
して20000〜60000である共重合体を用いるこ
と、若しくは前記側鎖に不飽和基を有する光架橋性且つ
アルカリ可溶性高分子として、(a)ポリブタジェン、
ポリブタジェングリコール、ポリブタジェンカルボン酸
。(c) Means and operation for solving the problems, that is, the present invention comprises an insulating substrate, a conductive metal foil laminated on the surface of the insulating substrate, and a photosensitive material laminated on the surface of the conductive metal foil. A printed circuit board manufacturing material comprising a resin composition,
The photosensitive resin composition is composed of a photocrosslinkable and alkali-soluble polymer having an unsaturated group in its side chain, a crosslinking agent, a photoinitiator, and a conductive powder, and has an unsaturated group in its side chain. As a photocrosslinkable and alkali-soluble polymer having (a
l 0.1 to 5% by weight of a polybutadiene compound selected from the group consisting of polybutadiene, polybutadiene glycol, polybutadiene carboxylic acid, and modified polybutadiene, (
'b) acrylic ester and/or methacrylic ester 5-70% by weight, (c1 unsaturated carboxylic acid 20-7
0% by weight, (5 to 60% by weight of dl styrene and/or its alkyl substituted derivatives and optionally 5 to 15% by weight of fe) fatty acid vinyl ester, and the molecular weight is determined by gel permeation chromatography. (a) polybutadiene,
Polybutadiene glycol, polybutadiene carboxylic acid.
変性ポリブタジェンよりなる群から選ばれたポリブタジ
ェン化合物0.1〜5重量%、(blアクリル酸エステ
ル及び/又はメタクリル酸エステル5〜70重量%、(
c)不飽和カルボン酸20〜70重量%、(d)スチレ
ン及び/又はそのアルキル置換誘導体5〜60重量%及
び所望により(e)脂肪酸ビニルエステル5〜15重量
%よりなる混合物を共重合して得ら°れ、且つ分子量が
ゲル浸透クロマトグラフィで測定して20000〜60
000である共重合体に、該共重合体のカルボキシル基
に対して0.03〜、0当量のオキシラン環含有エチレ
ン性不飽和化合物を付加したグラフト共重合体を用いる
ことを特徴とする印刷回路板製造用材料に関するもので
ある。0.1 to 5% by weight of a polybutadiene compound selected from the group consisting of modified polybutadiene, (5 to 70% by weight of bl acrylic ester and/or methacrylic ester, (
c) copolymerizing a mixture consisting of 20 to 70% by weight of an unsaturated carboxylic acid, (d) 5 to 60% by weight of styrene and/or its alkyl-substituted derivative, and optionally (e) 5 to 15% by weight of a fatty acid vinyl ester. obtained, and the molecular weight is 20,000 to 60 as measured by gel permeation chromatography.
A printed circuit characterized by using a graft copolymer obtained by adding an oxirane ring-containing ethylenically unsaturated compound in an amount of 0.03 to 0 equivalents relative to the carboxyl group of the copolymer to a copolymer of 0.000. This relates to materials for manufacturing plates.
本発明に用いる感光性樹脂組成物は、側鎖に不飽和基を
有する光架橋性且つアルカリ可溶性高分子と、架橋剤と
、光重合開始剤と、導電性粉末とよりなる。The photosensitive resin composition used in the present invention comprises a photocrosslinkable and alkali-soluble polymer having an unsaturated group in its side chain, a crosslinking agent, a photopolymerization initiator, and a conductive powder.
側鎖に不飽和を有する光架橋性且つアルカリ可溶性高分
子(以下、「光架橋性高分子」という。A photocrosslinkable and alkali-soluble polymer having unsaturation in its side chain (hereinafter referred to as a "photocrosslinkable polymer").
)は、下記(a)〜(d)の化合物を共重合したもの又
は下記(al〜(1141の化合物を共重合したもので
あって、分子量がゲル浸透クロマトグラフィで測定して
20000〜60000である共重合体、若しくはこの
共重合体に共重合体のカルボキシル基に対して0.03
〜、0当量のオキシラン環含有エチレン性不飽和化合物
を付加したグラフト共重合体を言う。) is a copolymerization of the following compounds (a) to (d) or a copolymerization of the following (al~(1141) compounds, and has a molecular weight of 20,000 to 60,000 as measured by gel permeation chromatography. copolymer, or 0.03 to the carboxyl group of the copolymer to this copolymer.
~, refers to a graft copolymer to which 0 equivalents of an oxirane ring-containing ethylenically unsaturated compound has been added.
光架橋性高分子の共重合成分の一つである(a)化合物
としては、ポリブタジェン、ポリブタジェングリコール
、ポリブタジェンカルボン酸、変性ポリブタジェンが用
いられる。ここでポリブタジェンとは、ポリマー鎖の約
90%が、2結合からなるポリ(1,2−ブタジェン)
のことを意味している。As the compound (a), which is one of the copolymerization components of the photocrosslinkable polymer, polybutadiene, polybutadiene glycol, polybutadiene carboxylic acid, and modified polybutadiene are used. Here, polybutadiene refers to poly(1,2-butadiene) in which about 90% of the polymer chain consists of 2 bonds.
It means.
従って、ポリブタジェン、ポリブタジェングリコール、
ポリブタジェンカルボン酸は、各々以下の如き構造式で
表される。Therefore, polybutadiene, polybutadiene glycol,
Polybutadienecarboxylic acids are each represented by the following structural formulas.
−(cHt−CH憂
昌
Hz
HOHzCHlC−4CHI −CH憂CH2CHz
OH■
CH
CHt
HooC−(cH2−CH&C00I(「
CM。-(cHt-CH ゆう昌 Hz HOHzCHlC-4CHI -CH ゆう CH2CHz
OH■ CH CHt HooC-(cH2-CH&C00I("CM.
変性ポリブタジェンとしては、前記ポリブタジェンを変
性させ分子骨格に一〇H基、−COOH基、−COOR
基を導入したもの、ポリウレタン型のプレポリマー、ポ
リブタジェンに一定量の水素を添加したものであって、
下記の構造式で表されるランダム共重合体が挙げられる
。The modified polybutadiene is modified by modifying the polybutadiene to add 10H groups, -COOH groups, -COOR groups to the molecular skeleton.
groups, polyurethane-type prepolymers, and polybutadiene with a certain amount of hydrogen added,
Examples include random copolymers represented by the following structural formula.
−(cH2−CH)r−4CH,−CH警I
CHCH2
CHz CH3
前記した如<(a)化合物はいわゆるプレポリマーと言
われるものであるが、分子量は700〜2000程度が
好ましい。分子量が700未満であると配線部上に残る
樹脂の強度が低下する傾向となるし、逆に2000を超
えると非配線部上の感光性樹脂組成物を現像液(アルカ
リ溶液)で除去し難い傾向となる。-(cH2-CH)r-4CH, -CH CHCH2 CHz CH3 As described above, the compound (a) is a so-called prepolymer, and its molecular weight is preferably about 700 to 2,000. When the molecular weight is less than 700, the strength of the resin remaining on the wiring portion tends to decrease, and on the other hand, when it exceeds 2000, it is difficult to remove the photosensitive resin composition on the non-wiring portion with a developer (alkaline solution). It becomes a trend.
(b)成分としては、アクリル酸エステル及び/又はメ
タクリル酸エステルが用いられ、その中でも特にアクリ
ル酸アルキルエステルやメタクリル酸アルキルエステル
が代表的である。アクリル酸アルキルエステルとしては
、アクリル酸メチル、アクリル酸エチル、アクリル酸プ
ロピル、アクリル酸ブチル、アクリル酸アミル、アクリ
ル酸エチルヘキシル、アクリル酸オクチル、アクリル酸
−t−オクチル等が用いられ、メタクリル酸アルキルエ
ステルとしては、メチルメタクリレート、エチルメタク
リレート、プロピルメタクリレート、イソプロピルメタ
クリレート、アミルメタクリレート。As the component (b), acrylic esters and/or methacrylic esters are used, of which acrylic acid alkyl esters and methacrylic acid alkyl esters are particularly representative. As the acrylic acid alkyl ester, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, amyl acrylate, ethylhexyl acrylate, octyl acrylate, t-octyl acrylate, etc. are used, and the methacrylic acid alkyl ester Examples include methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, and amyl methacrylate.
ヘキシルメタクリレート、シクロへキシルメタクリレー
ト、オクチルメタクリレート等が用いられる。その他の
アクリル酸エステル又はメタクリル酸エステルとしては
、クロルエチルアクリレート。Hexyl methacrylate, cyclohexyl methacrylate, octyl methacrylate, etc. are used. Other acrylic esters or methacrylic esters include chloroethyl acrylate.
2.2−ジメチルヒドロキシプロピルアクリレート。2.2-Dimethylhydroxypropyl acrylate.
5−ヒドロキシペンチルアクリレート、トリメチロール
プロパンモノアクリレート、ペンタエリスリトールモノ
アクリレート、グリシジルアクリレート、ベンジルアク
リレート、メトキシベンジルアクリレート、フルフリル
アクリレート、テトラヒドロフルフリルアクリレート、
4−ヒドロキシブチルメタクリレート、5−ヒドロキシ
ペンチルメタクリレ−)、2.2−ジメチル−3−ヒド
ロキシプロピルメタクリレート、トリメチロールプロパ
ンモノメタクリレート、ペンタエリスリトールモノメタ
クリレート、グリシジルメタクリレート、フルフリルメ
タクリレート、テトラヒドロフルフリルアクリレートが
単独又は混合して用いられる。5-hydroxypentyl acrylate, trimethylolpropane monoacrylate, pentaerythritol monoacrylate, glycidyl acrylate, benzyl acrylate, methoxybenzyl acrylate, furfuryl acrylate, tetrahydrofurfuryl acrylate,
4-hydroxybutyl methacrylate, 5-hydroxypentyl methacrylate), 2,2-dimethyl-3-hydroxypropyl methacrylate, trimethylolpropane monomethacrylate, pentaerythritol monomethacrylate, glycidyl methacrylate, furfuryl methacrylate, and tetrahydrofurfuryl acrylate. Used alone or in combination.
(c1化合物としては、不飽和カルボン酸が用いられる
。不飽和カルボン酸としては、アクリル酸。(Unsaturated carboxylic acid is used as the c1 compound. Acrylic acid is used as the unsaturated carboxylic acid.
イタコン酸、クロトン酸、マレイン酸、フマル酸。Itaconic acid, crotonic acid, maleic acid, fumaric acid.
ビニル酢酸、α−エチルアクリル酸、アンゲリカ酸、イ
タコン酸、マレイン酸等が用いられる。その他としては
、フマル酸のモノメチルエステル。Vinyl acetic acid, α-ethyl acrylic acid, angelic acid, itaconic acid, maleic acid, etc. are used. Others include monomethyl ester of fumaric acid.
モノエチルエステル、モノプロピルエステル、モノイソ
プロピルエステル、モノノルマルブチルエステル等が単
独又は混合して用いられる。Monoethyl ester, monopropyl ester, monoisopropyl ester, mono-normal butyl ester, etc. may be used alone or in combination.
fd)化合物としては、スチレンが代表的である。fd) Styrene is a typical compound.
その他としては、スチレンにアルキル基を導入した、α
−メチルスチレン、ビニルトルエン、β−メチルスチレ
ン等も用いることができる。Other products include α, which has an alkyl group introduced into styrene.
-Methylstyrene, vinyltoluene, β-methylstyrene, etc. can also be used.
+e)化合物としては、酢酸ビニルが代表的であり、そ
の他の脂肪酸ビニルエステルとしてはプロピオン酸ビニ
ルエステル等が用いられる。As the +e) compound, vinyl acetate is typical, and as other fatty acid vinyl esters, propionate vinyl ester and the like are used.
(a)〜(d)の化合物又はIFl)〜(114)の化
合物を共重合させて得られる共重合体に付加されるオキ
シラン環含有エチレン性不飽和化合物としては、グリシ
ジルアクリレート、グリシジルメタクリレート、アリル
グリシジルエーテル、α−エチルグリシジルアクリレー
ト、クロトニルグリシジルエーテル。The oxirane ring-containing ethylenically unsaturated compounds added to the copolymer obtained by copolymerizing the compounds (a) to (d) or IF1) to (114) include glycidyl acrylate, glycidyl methacrylate, allyl Glycidyl ether, α-ethyl glycidyl acrylate, crotonyl glycidyl ether.
グリシジルクロトネートグリシジルイソクロトネート、
イタコン酸モノアルキルエステルモノグリシジルエステ
ル、フマル酸モノアルキルエステルモノグリシジルエス
テル、マレイン酸モノアルキルエステルモノグリシジル
エステル等を用いることができる。glycidyl crotonate glycidyl isocrotonate,
Itaconic acid monoalkyl ester monoglycidyl ester, fumaric acid monoalkyl ester monoglycidyl ester, maleic acid monoalkyl ester monoglycidyl ester, etc. can be used.
(a)〜(d)の化合物又は(al〜(e)の化合物を
共重合させて、若しくはこの共重合体にオキシラン環含
有エチレン性不飽和化合物を付加(グラフト)して光架
橋性高分子が得られるわけであるが、この際(a)〜(
e)の化合物及びオキシラン環含有エチレン性不飽和化
合物の配合割合は以下のとおりである。A photocrosslinkable polymer is produced by copolymerizing the compounds (a) to (d) or the compounds (al to (e)), or by adding (grafting) an oxirane ring-containing ethylenically unsaturated compound to this copolymer. In this case, (a) to (
The compounding ratio of the compound e) and the oxirane ring-containing ethylenically unsaturated compound is as follows.
即ち、(a)化合物は0.1〜5重景%である。18)
化合物が0.1重量%未満であると配線部上に残る樹脂
(感光性樹脂組成物が光硬化したものを指す。以下同じ
。)の強度が低下し好ましくなく、また5重量%を超え
ると光架橋性高分子の現像液に対する溶解能が低下し、
非配線部上の感光性樹脂組成物を除去し難くなり好まし
くない。tb>化合物は5〜70重量%である。(b)
化合物が5重量%未満であると光架橋性高分子を含む感
光性樹脂組成物の皮膜の可撓性や強度が低下し、取り扱
い上好ましくなく、また70重量%を超えると配線部上
に残る樹脂が粘着性を帯びてくるため好ましくない。(
c)化合物は20〜70重量%である。(c)化合物が
20重景%未満であると光架橋性高分子の現像液に対す
る溶解能が低下し、非配線部上の感光性樹脂組成物を除
去し難くなり好ましくなく、また70重量%を超えると
光架橋性高分子を含む感光性樹脂組成物の皮膜の弾力性
が低下し跪くなり、感光性樹脂組成物が脱落し易くなる
ため好ましくない。(d)化合物は5〜60重量%であ
る。(d)化合物が5重量%未満であると配線部上の樹
脂に対する筆記性が劣るため好ましくなく、また60重
量%を超えても特に物性の向上が得られないので、他の
化合物を配合した方が有利である。(e)化合物は5〜
15重量%である。(e)化合物が5重量%未満である
と配線部上の樹脂に対する筆記性が劣るため好ましくな
い。また15重量%を超えると他の化合物の配合量が相
対的に減少し、物性の低下を来すので好ましくない。That is, the amount of compound (a) is 0.1 to 5% by weight. 18)
If the amount of the compound is less than 0.1% by weight, the strength of the resin (referring to the photocured photosensitive resin composition) remaining on the wiring portion will decrease, which is undesirable, and if it exceeds 5% by weight, it will be undesirable. The solubility of photocrosslinkable polymers in developing solutions decreases,
This is not preferable because it becomes difficult to remove the photosensitive resin composition on the non-wiring portions. tb> compound is 5-70% by weight. (b)
If the amount of the compound is less than 5% by weight, the flexibility and strength of the film of the photosensitive resin composition containing the photocrosslinkable polymer will decrease, making it unfavorable for handling, and if it exceeds 70% by weight, it will remain on the wiring part. This is not preferable because the resin becomes sticky. (
c) The compound is 20-70% by weight. (c) If the amount of the compound is less than 20% by weight, the solubility of the photocrosslinkable polymer in a developer will decrease, making it difficult to remove the photosensitive resin composition on the non-wiring area, which is undesirable. Exceeding this is not preferable because the elasticity of the film of the photosensitive resin composition containing the photocrosslinkable polymer decreases and the photosensitive resin composition tends to fall off. (d) The compound is 5-60% by weight. (d) If the amount of the compound is less than 5% by weight, the writing properties on the resin on the wiring part will be poor, which is undesirable, and if it exceeds 60% by weight, no particular improvement in physical properties will be obtained, so other compounds may be added. It is more advantageous. (e) The compound is 5-
It is 15% by weight. (e) If the amount of the compound is less than 5% by weight, the writing properties on the resin on the wiring portion will be poor, which is not preferable. Moreover, if it exceeds 15% by weight, the amount of other compounds blended will be relatively reduced, resulting in deterioration of physical properties, which is not preferable.
また、(al〜(dl化合物又は(al〜(e)化合物
のカルボキシル基に付加させるオキシラン環含有エチレ
ン性不飽和化合物は、(a)〜(d)化合物又は(a)
〜(e)化合物を共重合させて得られる共重合体中のカ
ルボキシル基1当量に対して0.03〜、0当量付加さ
せる。In addition, the oxirane ring-containing ethylenically unsaturated compound to be added to the carboxyl group of the (al-(dl) compound or (al-(e) compound) is the (a)-(d) compound or (a)
~(e) 0.03 to 0 equivalents are added per equivalent of carboxyl group in the copolymer obtained by copolymerizing the compound.
オキシラン環含有エチレン性不飽和化合物の付加数が0
.03当量未満の場合には、本発明における光架橋性高
分子の架橋度が十分増加せず、配線部上に残る樹脂の強
度が低下し好ましくない。満足な強度を持ち且つ十分な
弾力性を持つ樹脂を得るという観点からは、オキシラン
環含有エチレン性不飽和化合物の付加数が0.1〜0.
8当量程度であるのが好ましい。The number of added oxirane ring-containing ethylenically unsaturated compounds is 0.
.. If the amount is less than 0.03 equivalent, the degree of crosslinking of the photocrosslinkable polymer in the present invention will not increase sufficiently, and the strength of the resin remaining on the wiring portion will decrease, which is not preferable. From the viewpoint of obtaining a resin having satisfactory strength and sufficient elasticity, the number of added oxirane ring-containing ethylenically unsaturated compounds is 0.1 to 0.
It is preferable that the amount is about 8 equivalents.
本発明に用いられる架橋剤としては、アクリル酸、α−
クロルアクリル酸、メタクリル酸、アクリルアミド、メ
タクリルアミド、 N、N−ジメチルアクリルアミド、
N−イソプロピルアクリルアミド。The crosslinking agent used in the present invention includes acrylic acid, α-
Chloracrylic acid, methacrylic acid, acrylamide, methacrylamide, N,N-dimethylacrylamide,
N-isopropylacrylamide.
N−ヘキシルアクリルアミド、N−シクロヘキシルアク
リルアミド、N−メチロールアクリルアミド、 N−エ
チロールアクリルアミド、N−アミロ−ルアクリルアミ
ド、N−アリルアクリルアミド、 N、N’−メチレン
ビスアクリルアミド、N、N’−トリメチレンビスアク
リルアミド、 N、N’−へキサメチレンビスアクリル
アミド、 N、N’−デカメチレンビスアクリルアミド
、N−メトキシメチルアクリルアミド、N−メトキシエ
チルアクリルアミド、N−エトキシメチルアクリルアミ
ド、N−メチルメタクリルアミド、 N−アリルメタク
リルアミド、N−メチロールメタクリルアミド、 N、
N’−メチレンビスメタクリルアミド。N-hexyl acrylamide, N-cyclohexyl acrylamide, N-methylol acrylamide, N-ethyl acrylamide, N-amylol acrylamide, N-allyl acrylamide, N,N'-methylenebisacrylamide, N,N'-trimethylenebis Acrylamide, N,N'-hexamethylenebisacrylamide, N,N'-decamethylenebisacrylamide, N-methoxymethylacrylamide, N-methoxyethylacrylamide, N-ethoxymethylacrylamide, N-methylmethacrylamide, N-allyl methacrylamide, N-methylolmethacrylamide, N,
N'-methylenebismethacrylamide.
N−メトキシメチルメタクリルアミド、N−エトキシエ
チルメタクリルアミド、N−メトキシエチルメタクリル
アミド、メチルアクリレート、エチルアクリレート、ブ
チルアクリレート、イソブチルアクリレート、n−プロ
ピルアクリレート、イソプロピルアクリレート、2−エ
チルへキシルアクリレート。N-methoxymethyl methacrylamide, N-ethoxyethyl methacrylamide, N-methoxyethyl methacrylamide, methyl acrylate, ethyl acrylate, butyl acrylate, isobutyl acrylate, n-propyl acrylate, isopropyl acrylate, 2-ethylhexyl acrylate.
n−オクチルアクリレート、n−デシルアクリレート。n-octyl acrylate, n-decyl acrylate.
n−テトラデシルアクリレート、アリルアクリレート
フルフリルアクリレート、グリシジルアクリレート、メ
チル−2−クロルアクリレート、メチルメタクリレート
、エチルメタクリレート、n−ブチルメタクリレート、
イソブチルメタクリレート。n-tetradecyl acrylate, allyl acrylate
Furfuryl acrylate, glycidyl acrylate, methyl-2-chloroacrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate,
Isobutyl methacrylate.
2−エチルへキシルメタクリレート、ラウリルメタクリ
レート、フルフリルメタクリレート、ジエチレングリコ
ールジアクリレート、テトラエチレングリコールジアク
リレート、エチレングリコールモノメタクリレート、ジ
エチレングリコールモノアクリレート、ヘキサメチレン
グリコールジメタクリレート、テトラデシルエチレング
リコールジメタクリレート2−ヒドロキシエチルメタク
リレート、2−ヒドロキシプロピルメタクリレート、2
−ヒドロキシへキシルメタクリレート、グリシジルメタ
クリレート、テトラメチロールメタンテトラアクリレー
ト、テトラメチロールメタンテトラメタクリレート、テ
トラメチロールメタントリアクリレート、テトラメチロ
ールメタントリメタクリレート、スチレン、ジビニルベ
ンゼン、α−メチルスチレン、ビニルトルエン、α−ク
ロルスチレン、ビニルクロルベンゼン、ビニルフェノー
ル。2-ethylhexyl methacrylate, lauryl methacrylate, furfuryl methacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, ethylene glycol monomethacrylate, diethylene glycol monoacrylate, hexamethylene glycol dimethacrylate, tetradecyl ethylene glycol dimethacrylate 2-hydroxyethyl methacrylate , 2-hydroxypropyl methacrylate, 2
-Hydroxyhexyl methacrylate, glycidyl methacrylate, tetramethylolmethanetetraacrylate, tetramethylolmethanetetramethacrylate, tetramethylolmethane triacrylate, tetramethylolmethane trimethacrylate, styrene, divinylbenzene, α-methylstyrene, vinyltoluene, α-chlorostyrene , vinylchlorobenzene, vinylphenol.
アミノスチレン、ビニル安息香酸5エトキシスチレン、
アリルベンゼン、ジアリルベンゼン、了りルトルエン、
モノアリルフタレート ジアリルフタレート、アリルア
ルコール、アリルアセテート。aminostyrene, vinylbenzoate 5-ethoxystyrene,
Allylbenzene, diallylbenzene, lutoluene,
Monoallyl phthalate diallyl phthalate, allyl alcohol, allyl acetate.
ビニルアセテート、ビニルプロピオネート、マレイン酸
、フマル酸、イタコン酸、ジメチルマレエート、ジエチ
ルマレエート、ジメチルフマレート。Vinyl acetate, vinyl propionate, maleic acid, fumaric acid, itaconic acid, dimethyl maleate, diethyl maleate, dimethyl fumarate.
ジエチルフマレート ジメチルイタコネート、ジエチル
イタコネート、 桂Jll[、エチJl/ ヒニルエー
テル、プロピルビニルエーテル、メチルビニルケトン、
アクロレイン、ビニリデンクロライド、ビニルピリジン
、ビニルピロリドン、ジエチルビニルアミン、ビニルカ
ルバゾール等を挙げることができる。これは本発明にお
ける光架橋性高分子を架橋させるものである。Diethyl fumarate, dimethyl itaconate, diethyl itaconate, Katsura Jll[, Ethi Jl/ Hinyl ether, propyl vinyl ether, methyl vinyl ketone,
Examples include acrolein, vinylidene chloride, vinylpyridine, vinylpyrrolidone, diethylvinylamine, and vinylcarbazole. This crosslinks the photocrosslinkable polymer in the present invention.
本発明に用いられる光重合開始剤としては、ベンゾイン
、ブチロイン、トリオイン、アセトイン。Examples of the photopolymerization initiator used in the present invention include benzoin, butyroin, trioin, and acetoin.
α−メチルベンゾイン、α−フェニルベンゾイン。α-Methylbenzoin, α-phenylbenzoin.
α−アリルベンゾイン、α−ベンジルベンゾイン。α-Allylbenzoin, α-benzylbenzoin.
ベンゾインメチルエーテル、ベンゾインエチルエーテル
、ピバロインエチルエーテル、アニソインエーテル、ア
ントラキノン、2−メチルアントラキノン、2−エチル
アントラキノン、2−第三ブチルアントラキノン、1−
クロルアントラキノン、2−ブロムアントラキノン、2
−ニトロアントラキノン、アントラキノン−1−アルデ
ヒド、アントラキノン−2−チオール、4−シクロヘキ
シルアントラキノン。Benzoin methyl ether, benzoin ethyl ether, pivaloin ethyl ether, anisoin ether, anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-
Chloranthraquinone, 2-bromoanthraquinone, 2
-Nitroanthraquinone, anthraquinone-1-aldehyde, anthraquinone-2-thiol, 4-cyclohexylanthraquinone.
、4−ジメチルアントラキノン、1−メトキシアントラ
キノン、アントラキノン−1−カルボニルクロリド、テ
トラエチルチウラニムジスルフィド、ジフェニルジスル
フィド、ベンジル、ジアセチル、ウラニルプロピオネー
ト、アゾビスブチロニトリル。, 4-dimethylanthraquinone, 1-methoxyanthraquinone, anthraquinone-1-carbonyl chloride, tetraethylthiuranim disulfide, diphenyl disulfide, benzyl, diacetyl, uranylpropionate, azobisbutyronitrile.
メチルジェタノールアミン、ジメチルエタノールアミン
、エチルジェタノールアミン、ジエチルエタノールアミ
ン、トリエタノールアミン、ジメチルアミノエチルベン
ゾエート、エチル−3−ジメチルアミノベンゾエート、
4−ジメチルアミノベンゾフェノン、4−ジエチルアミ
ノベンゾフェノン、4゜4′−ビス(ジエチルアミノ)
ベンゾフェノン、4゜4′−ビス(ジメチルアミノ)ベ
ンゾフェノンI NlN−ジエチルアニリン、フェニル
メチルエタノールアミン、フェニルエチルエタノールア
ミン、フェニルジエタノールアミン、 N、 N、 N
’ 、 N’−テトラメチル−1,3−ブタンジアミン
等を挙げることができる。この光重合開始剤は、光架橋
性高分子の光硬化の開始を促進する作用を発揮するもの
である。Methylgetanolamine, dimethylethanolamine, ethylgetanolamine, diethylethanolamine, triethanolamine, dimethylaminoethylbenzoate, ethyl-3-dimethylaminobenzoate,
4-dimethylaminobenzophenone, 4-diethylaminobenzophenone, 4゜4'-bis(diethylamino)
Benzophenone, 4゜4'-bis(dimethylamino)benzophenone I NlN-diethylaniline, phenylmethylethanolamine, phenylethylethanolamine, phenyldiethanolamine, N, N, N
', N'-tetramethyl-1,3-butanediamine, and the like. This photopolymerization initiator has the effect of promoting the initiation of photocuring of the photocrosslinkable polymer.
本発明に用いる導電性粉末としては、銀111iiJ+
ニツケル、錫、アルミニウム等の金属の粉末が用いられ
る。また、タルク等の非導電性粉末の表面に銀等の金属
を蒸着した蒸着粉末も用いられる。As the conductive powder used in the present invention, silver 111iiJ+
Metal powders such as nickel, tin, and aluminum are used. Also used is a vapor-deposited powder in which a metal such as silver is vapor-deposited on the surface of a non-conductive powder such as talc.
これらの粉末の粒径は10−2〜10− ’ aa 8
度が好ましい。The particle size of these powders is between 10-2 and 10-' aa 8
degree is preferred.
本発明に用いる光架橋性高分子と、架橋剤と、光重合開
始剤と、導電性粉末との配合割合は、以下のとおりであ
るのが好ましい。The blending ratio of the photocrosslinkable polymer, crosslinking agent, photopolymerization initiator, and conductive powder used in the present invention is preferably as follows.
架橋剤は、光架橋性高分子100重量部に対して1〜1
00重量部、更に好ましくは5〜60重量部の範囲で使
用するのが好ましい。架橋剤が1重量部未満であると架
橋度が低下し、配線部上の樹脂が現像液によって溶は易
い傾向となる。また100重量部を超えると光架橋性高
分子の量が相対的に減少し、配線部上の樹脂の強度が低
下する傾向となる。光重合開始剤は、光架橋性高分子1
00重量部に対して0.001〜5重量部程度が好まし
い。光重合開始剤が0.001重量部より少ないと光架
橋性高分子の光硬化開始能が低下する傾向となり、また
5重量部より多すぎても光硬化開始能に変化が見られな
い。導電性粉末は、光架橋性高分子100重量部に対し
て5〜100重量部程度が好ましい。導電性粉末が5重
量部より少ないと配線部上の樹脂の導電性が低下する傾
向となり、また100重量部より多く配合しても樹脂の
導電性に変化が見られない。The crosslinking agent is used in an amount of 1 to 1 per 100 parts by weight of the photocrosslinkable polymer.
00 parts by weight, more preferably 5 to 60 parts by weight. If the amount of the crosslinking agent is less than 1 part by weight, the degree of crosslinking decreases, and the resin on the wiring portion tends to be easily dissolved by the developer. Moreover, when it exceeds 100 parts by weight, the amount of photocrosslinkable polymer decreases relatively, and the strength of the resin on the wiring part tends to decrease. The photopolymerization initiator is a photocrosslinkable polymer 1
It is preferably about 0.001 to 5 parts by weight per 00 parts by weight. If the photopolymerization initiator is less than 0.001 parts by weight, the photocuring initiating ability of the photocrosslinkable polymer tends to decrease, and if it is more than 5 parts by weight, no change is observed in the photocuring initiating ability. The conductive powder is preferably about 5 to 100 parts by weight based on 100 parts by weight of the photocrosslinkable polymer. If the amount of the conductive powder is less than 5 parts by weight, the conductivity of the resin on the wiring portion tends to decrease, and even if the amount is more than 100 parts by weight, no change is observed in the conductivity of the resin.
本発明に用いる感光性樹脂組成物は暗所での反応を防止
するため、また長期間安定に貯蔵するため、適当な熱重
合抑制剤を含有させることが好ましい。この熱重合抑制
剤としては、例えばハイドo−1−ノン、ハイドロキノ
ンモノメチルエーテル。The photosensitive resin composition used in the present invention preferably contains an appropriate thermal polymerization inhibitor in order to prevent reactions in the dark and to store it stably for a long period of time. Examples of the thermal polymerization inhibitor include hydro-1-non and hydroquinone monomethyl ether.
ハイドロキノンモノエチルエーテル、ハイドロキノンモ
ノ第三ブチルエーテル、ベンゾキノン、 P−メトキシ
フェノール、2.5−ジフェニルP−ベンゾフェノン、
ピリジン、フェノチアジン、P−ジアミノベンゼン、β
−ナフトール、ナフチルアミン、ピロガロール、第三ブ
チルカテコール、ニトロベンゼン等を挙げることができ
る。これらの熱重合抑制剤は、通常光架橋性高分子と架
橋剤と光重合開始剤と導電性粉末との全重量を100重
量部として0.005〜、0重量部の割合で配合される
。Hydroquinone monoethyl ether, hydroquinone monotert-butyl ether, benzoquinone, P-methoxyphenol, 2.5-diphenyl P-benzophenone,
Pyridine, phenothiazine, P-diaminobenzene, β
-Naphthol, naphthylamine, pyrogallol, tert-butylcatechol, nitrobenzene, etc. may be mentioned. These thermal polymerization inhibitors are usually blended in a proportion of 0.005 to 0 parts by weight, based on 100 parts by weight of the total weight of the photocrosslinkable polymer, crosslinking agent, photopolymerization initiator, and conductive powder.
また本発明に用いる感光性樹脂組成物は、充填剤、可塑
剤等を含有していてもよい。充填剤としては、例えばガ
ラス粉末、雲母、シリカ等の無機化合物、そしてポリエ
チレン、ポリエチレンオキサイド、ポリエステル、ポリ
アミド、ポリメタクリレート、セルロース及びそれらの
誘導体等の有機化合物が挙げられる。一方、可塑剤とし
てはフタル酸ジアルキルエステル、オリゴエチレングリ
コールモノアルキルエステル、オリゴエチレングリコー
ルジアルキルエステル、燐酸トリクレジル等を使用する
ことができる。The photosensitive resin composition used in the present invention may also contain fillers, plasticizers, and the like. Examples of fillers include inorganic compounds such as glass powder, mica, and silica, and organic compounds such as polyethylene, polyethylene oxide, polyester, polyamide, polymethacrylate, cellulose, and derivatives thereof. On the other hand, as the plasticizer, phthalic acid dialkyl ester, oligoethylene glycol monoalkyl ester, oligoethylene glycol dialkyl ester, tricresyl phosphate, etc. can be used.
本発明に用いる感光性樹脂組成物を溶液として調整する
に適した溶媒としては、エステル類、ケトン類、アルコ
ール類、エーテル類、芳香族炭化水素類等を挙げること
ができる。感光性樹脂組成物を溶液として扱う際の濃度
としては、その溶液の金属箔上への塗布様式や塗布条件
によっても異なるが、例えばホイラー塗りで作成する場
合は約5〜30重量%が適当である。Examples of solvents suitable for preparing the photosensitive resin composition used in the present invention as a solution include esters, ketones, alcohols, ethers, and aromatic hydrocarbons. The concentration when handling the photosensitive resin composition as a solution varies depending on the method and conditions of application of the solution onto the metal foil, but for example, when it is prepared by wheeler coating, approximately 5 to 30% by weight is appropriate. be.
本発明に用いる感光性樹脂組成物は、まず溶媒中に光架
橋性高分子を分散させ、次いで架橋剤と光重合開始剤と
導電性粉末とを加えて撹拌混合して均一な分散系として
製造することができる。光架橋性高分子を製造する好適
な具体例としては、清浄な逆流コンデンサー付反応槽に
、キシレン又はブチルセロソルブ等に溶解させたポリブ
タジェンを入れ、その後アクリル酸アルキルエステル及
び/又はメタクリル酸アルキルエステル、不飽和カルボ
ン酸、スチレン、所望により酢酸ビニルを所定量投入し
、反応触媒下に溶液重合する。この方法を採用する際に
は、反応槽内は窒素雰囲気とし、温度は80〜90“C
で4〜5時間反応させる。また、この共重合体のカルボ
キシル基に対するオキシラン環含有エチレン性不飽和化
合物の付加方法は、従来公知のカルボン酸とオキシラン
環化合物の反応が利用される。即ち、共重合体が得られ
た反応槽内にオキシラン環含有エチレン性不飽和化合物
と反応触媒、及び所望によりプロパツール。The photosensitive resin composition used in the present invention is produced by first dispersing a photocrosslinkable polymer in a solvent, then adding a crosslinking agent, a photopolymerization initiator, and a conductive powder and stirring and mixing to form a uniform dispersion system. can do. A preferred example of producing a photocrosslinkable polymer is to put polybutadiene dissolved in xylene or butyl cellosolve into a clean reaction tank equipped with a backflow condenser, and then add acrylic acid alkyl ester and/or methacrylic acid alkyl ester, and Saturated carboxylic acid, styrene, and if desired, vinyl acetate are added in predetermined amounts, and solution polymerization is carried out in the presence of a reaction catalyst. When using this method, the inside of the reaction tank should be kept in a nitrogen atmosphere, and the temperature should be 80 to 90"C.
Let it react for 4 to 5 hours. Further, as a method for adding the oxirane ring-containing ethylenically unsaturated compound to the carboxyl group of this copolymer, a conventionally known reaction between a carboxylic acid and an oxirane ring compound is utilized. That is, an oxirane ring-containing ethylenically unsaturated compound, a reaction catalyst, and optionally a propatool are placed in the reaction vessel in which the copolymer was obtained.
ブタノール等の反応溶媒を投入して3〜5時間反応させ
れば本発明に光架橋性高分子を得ることができる。尚、
付加反応の際に用いられる反応触媒としては、特にトリ
メチルベンジルアンモニウムハイドロオキサイドを用い
るのが好ましく、更にオキシラン環含有エチレン性不飽
和化合物のビニル型付加重合やベースポリマー中のポリ
ブタジェン化合物へのビニル型付加を抑制するため、重
合禁止剤としてハイドロキノン等の還元性物質を存在さ
せておくのが好ましい。The photocrosslinkable polymer of the present invention can be obtained by adding a reaction solvent such as butanol and allowing the reaction to proceed for 3 to 5 hours. still,
As the reaction catalyst used in the addition reaction, it is particularly preferable to use trimethylbenzylammonium hydroxide, and furthermore, it is preferable to use trimethylbenzylammonium hydroxide, and it is also suitable for vinyl type addition polymerization of oxirane ring-containing ethylenically unsaturated compounds and vinyl type addition polymerization to polybutadiene compounds in base polymers. In order to suppress this, it is preferable that a reducing substance such as hydroquinone be present as a polymerization inhibitor.
本発明に用いる感光性樹脂組成物は、一般に溶液状態で
、絶縁基板と導電性金属箔との積層物の導電性金属箔上
に塗布される。感光性樹脂溶液を塗布する場合の塗布方
法としては、回転塗布機(ホイラー)による塗布、カー
テンコーター、ロールコータ−等を使用した枚葉塗布又
はウェブ塗布を行う。The photosensitive resin composition used in the present invention is generally applied in a solution state onto a conductive metal foil of a laminate of an insulating substrate and a conductive metal foil. The coating method for applying the photosensitive resin solution is coating using a rotary coater (wheeler), sheet coating using a curtain coater, roll coater, or the like, or web coating.
また、本発明に用いる絶縁基板としてはポリエステルシ
ート、ガラス繊維強化プラスチツクシート等の公知のも
のが用いられ、導電性金属箔としてはアルミニウム箔、
銅箔、鉄箔等の公知のものが用いられる。Further, as the insulating substrate used in the present invention, known ones such as polyester sheet and glass fiber reinforced plastic sheet are used, and as the conductive metal foil, aluminum foil,
Known materials such as copper foil and iron foil are used.
本発明に用いる感光性樹脂組成物を導電性金属箔上に塗
布した印刷回路板製造用材料は、通常の平版と同様なプ
ロセスで焼付け、現像を行うことができ、活性光線光源
としてはアーク灯、水銀灯。The material for manufacturing printed circuit boards, in which the photosensitive resin composition used in the present invention is coated on conductive metal foil, can be baked and developed in the same process as ordinary lithographic printing, and an arc lamp is used as the active light source. ,Mercury lamp.
ケミカルランプ等が用いられる。現像後、露出した金属
箔をエツチング等の公知の方法で除去することにより、
所定の回路を形成した印刷回路板を得ることができる。A chemical lamp or the like is used. After development, by removing the exposed metal foil by a known method such as etching,
A printed circuit board on which a predetermined circuit is formed can be obtained.
なお、この際配線部上には樹脂が残存しているが、この
樹脂中には導電性粉末が混入しているため良好な導電性
を示す。それ故、従来技術の如く配線部上の樹脂を除去
する必要はない。Note that at this time, resin remains on the wiring portion, but since conductive powder is mixed in this resin, it exhibits good conductivity. Therefore, there is no need to remove the resin on the wiring part as in the prior art.
(ニ)実施例 実施例1 まず、次の方法により光架橋性高分子を製造した。(d) Examples Example 1 First, a photocrosslinkable polymer was produced by the following method.
あらかじめ清浄にした撹拌器、逆流コンデンサー、滴下
ロート及び温度計を備えたll用ガラス製反応容器に反
応溶媒としてブチルセロソルブ400gを入れ、反応容
器内に窒素を流入しながら撹拌し反応容器の外部より加
温する。ブチルセロソルブの温度が80°Cになれば次
に示す混合物を3時間で滴下し、滴下終了後引き続き反
応温度を80〜86°Cに調整しながら、2時間反応さ
せた。400 g of butyl cellosolve was placed as a reaction solvent in a glass reaction vessel equipped with a stirrer, a backflow condenser, a dropping funnel, and a thermometer that had been cleaned in advance, and the mixture was stirred while flowing nitrogen into the reaction vessel. Warm up. When the temperature of butyl cellosolve reached 80°C, the following mixture was added dropwise over 3 hours, and after the addition was completed, the reaction was continued for 2 hours while adjusting the reaction temperature to 80-86°C.
α−Wポリブタジェングリコール(数平均分子量; 1
350±50、日本曹達■製Nl5SOPB G−10
00g
メチルメタクリレート 30gスチレン
38gアクリル酸
30gアゾビスイソブチロニト
リル 1g得られた光架橋性高分子である4元
共重合体高分子の分子量は、ゲル浸透クロマトグラフィ
で測定して35000であった。α-W polybutadiene glycol (number average molecular weight; 1
350±50, Nl5SOPB G-10 manufactured by Nippon Soda ■
00g methyl methacrylate 30g styrene 38g acrylic acid
30 g Azobisisobutyronitrile 1 g The molecular weight of the obtained quaternary copolymer polymer, which is a photocrosslinkable polymer, was 35,000 as measured by gel permeation chromatography.
上記の光架橋性高分子50gをイソプロピルアルコール
1500 g 、キシレン200 g 、及び酢酸エチ
ル200gから成る混合溶媒で希釈し、これに架橋剤と
してジエチレングリコールジアクリレート10g、及び
光重合開始剤として各々ペン・)470.5gと4.4
′−ジメチルアミノベンゾフェノン0.5gと2−エチ
ルアントラキノン0.25gとを加えよく撹拌混合した
後、安定剤としてハイドロキノン0.2gを加えて約2
時間混合撹拌した後、ブフナーロートを用いて東洋濾紙
12.5cm431を通して吸引濾過し、その後粒径約
101−の銅粉末20gを加えて混合撹拌して感光性樹
脂組成物溶液を得た。50 g of the above photocrosslinkable polymer was diluted with a mixed solvent consisting of 1500 g of isopropyl alcohol, 200 g of xylene, and 200 g of ethyl acetate, and to this was added 10 g of diethylene glycol diacrylate as a crosslinking agent and Pen.) as a photopolymerization initiator. 470.5g and 4.4
0.5 g of '-dimethylaminobenzophenone and 0.25 g of 2-ethylanthraquinone were added, stirred and mixed well, and then 0.2 g of hydroquinone was added as a stabilizer to give about 2.
After mixing and stirring for a time, suction filtration was performed using a Buchner funnel through Toyo Roshi 12.5 cm 431, and then 20 g of copper powder with a particle size of about 101 was added and mixed and stirred to obtain a photosensitive resin composition solution.
この感光性樹脂組成物溶液を、厚さ5nのポリエステル
シートと厚さ0.1mの銅箔との積□層物の銅箔上にバ
ーコーターNo、6を用いて塗布した後、100″Cの
熱風乾燥機にて3分間乾燥して、銅箔上に感光性樹脂組
成物層を形成し、印刷回路板製造用材料を得た。この印
刷回路板製造用材料はポリエステルシート−銅箔−感光
性樹脂組成物層の順で積層された三層構造の材料である
。This photosensitive resin composition solution was applied onto the copper foil of a laminate of a polyester sheet with a thickness of 5 nm and a copper foil with a thickness of 0.1 m using a bar coater No. 6, and then A photosensitive resin composition layer was formed on the copper foil by drying it in a hot air dryer for 3 minutes to obtain a material for producing a printed circuit board.This material for producing a printed circuit board was a polyester sheet - copper foil -. It is a material with a three-layer structure in which photosensitive resin composition layers are laminated in this order.
実施例2
光架橋性高分子を下記に示す混合物を用いて、実施例1
と同様の方法で製造した。Example 2 Example 1 was carried out using the photocrosslinkable polymer as shown below.
Manufactured in the same manner as.
α−Wポリブタジェングリコール(数平均分子量; 1
350±50、日本曹達■製Nl5SOPHG−100
0)g
メチルアクリレート 30g2−エ
チルへキシルアクリレート25gスチレン
10gメタクリル酸
38g得られた光架橋性高分子である5元共重
合体高分子の分子量は、ゲル浸透クロマトグラフィで測
定して50000であった。α-W polybutadiene glycol (number average molecular weight; 1
350±50, Nl5SOPHG-100 manufactured by Nippon Soda ■
0)g Methyl acrylate 30g 2-ethylhexyl acrylate 25g styrene
10g methacrylic acid
The molecular weight of the 5-component copolymer polymer, which is a photocrosslinkable polymer obtained in an amount of 38 g, was 50,000 as measured by gel permeation chromatography.
この光架性高分子50gを用いて、実施例1と全く同様
の方法で感光性樹脂組成物溶液を得、更に導電性金属箔
として銅箔に代えてアルミニウム箔を用いる以外は実施
例1と同様の方法で印刷回路板製造用材料を得た。Using 50 g of this photocrossable polymer, a photosensitive resin composition solution was obtained in exactly the same manner as in Example 1, and the same procedure as in Example 1 was carried out except that aluminum foil was used instead of copper foil as the conductive metal foil. A material for printed circuit board production was obtained in a similar manner.
実施例3
光架橋性高分子を下記に示す混合物を用いて、実施例1
と同様の方法で製造した。Example 3 Example 1 was carried out using the photocrosslinkable polymer as shown below.
Manufactured in the same manner as.
α−Wポリブタジェンカルポン酸 2gブチルアク
リレート 30gスチレン
30gアクリル酸
30g酢酸ビニル
9g得られた光架橋性高分子である5元共重合体高分
子の分子量は、ゲル浸透クロマトグラフィで測定して4
0000であった。α-W polybutadienecarboxylic acid 2g butyl acrylate 30g styrene
30g acrylic acid
30g vinyl acetate
The molecular weight of the 5-component copolymer polymer, which is a photocrosslinkable polymer obtained in an amount of 9g, was 4 as measured by gel permeation chromatography.
It was 0000.
この光架橋性高分子50gを用いて、実施例1と全く同
様の方法で感光性樹脂組成物溶液を得、更に絶縁基板と
してポリエステルシートに代えて厚さ7鰭のガラス繊維
強化エポキシシートを用いる以外は実施例1と同様の方
法で印刷回路板製造用材料を得た。Using 50 g of this photocrosslinkable polymer, a photosensitive resin composition solution was obtained in exactly the same manner as in Example 1, and a glass fiber reinforced epoxy sheet with a thickness of 7 fins was used as an insulating substrate instead of the polyester sheet. A material for producing a printed circuit board was obtained in the same manner as in Example 1 except for this.
実施例4
光架橋性高分子を下記に示す混合物を用いて、実施例1
と同様の方法で製造した。Example 4 Example 1 was carried out using the photocrosslinkable polymer as shown below.
Manufactured in the same manner as.
α−Wポリブタジェンカルボン酸 0.1gブチルア
クリレート 30gスチレン
30gアクリル酸
30g酢酸ビニル
10g得られた光架橋性高分子である5元共重合体
高分子の分子量は、ゲル浸透クロマトグラフィで測定し
て30000であった。α-W polybutadienecarboxylic acid 0.1g Butyl acrylate 30g Styrene
30g acrylic acid
30g vinyl acetate
The molecular weight of the 5-component copolymer polymer, which is a photocrosslinkable polymer obtained in an amount of 10 g, was 30,000 as measured by gel permeation chromatography.
この光架橋性高分子50gを用いて、銅粉末に代えて粒
径約10−’amの銀粉末を用いた以外は実施例1と全
く同様の方法で感光性樹脂組成物溶液を得、更に実施例
1と同様の方法で印刷回路板製造用材料を得た。Using 50 g of this photocrosslinkable polymer, a photosensitive resin composition solution was obtained in exactly the same manner as in Example 1, except that silver powder with a particle size of about 10-'am was used in place of copper powder, and A material for producing a printed circuit board was obtained in the same manner as in Example 1.
実施例5
光架橋性高分子を下記に示す混合物を用いて、実施例1
と同様の方法で製造した。Example 5 Example 1 was carried out using the photocrosslinkable polymer as shown below.
Manufactured in the same manner as.
水素添加型ポリブタジェン(沃素価15±6、B1−1
000 > 5 gエチ
ルアクリレート 50gスチレン
10gアクリル酸
35g得られたベースポリマーで
ある4元共重合体高分子の分子量は、ゲル浸透クロマト
グラフィで測定して40000であった。Hydrogenated polybutadiene (iodine number 15±6, B1-1
000 > 5 g ethyl acrylate 50 g styrene
10g acrylic acid
The molecular weight of the quaternary copolymer polymer, which is the base polymer obtained in an amount of 35 g, was 40,000 as measured by gel permeation chromatography.
この光架橋性高分子50gを用い、実施例4と全く同様
の方法で感光性樹脂組成物溶液を得、更に実施例4と同
様の方法で印刷回路板製造用材料を得た。Using 50 g of this photocrosslinkable polymer, a photosensitive resin composition solution was obtained in exactly the same manner as in Example 4, and a material for producing a printed circuit board was further obtained in the same manner as in Example 4.
実施例6
光架橋性高分子を下記に示す混合物を用いて、実施例1
と同様の方法で製造した。Example 6 Example 1 was carried out using the photocrosslinkable polymer as shown below.
Manufactured in the same manner as.
α−Wポリブタジェングリコール 1gエチルアク
リレート 60gスチレン
10gアクリル酸
29g得られた光架橋性高分子である4元共
重合体高分子の分子量は、ゲル浸透クロマトグラフィで
測定して30000であった。α-W polybutadiene glycol 1g ethyl acrylate 60g styrene
10g acrylic acid
The molecular weight of the 29 g photocrosslinkable quaternary copolymer polymer obtained was 30,000 as measured by gel permeation chromatography.
この光架橋性高分子50gを用い、光開始重合剤として
、2−ベンズアントラキノン0.4g及びベンゾインメ
チルエーテル0.1gを用いる以外は実施例1と全く同
様の方法で感光性樹脂組成物溶液を得、更に実施例1と
同様の方法で印刷回路板製造用材料を得た。Using 50 g of this photocrosslinkable polymer, a photosensitive resin composition solution was prepared in exactly the same manner as in Example 1, except that 0.4 g of 2-benzanthraquinone and 0.1 g of benzoin methyl ether were used as photoinitiated polymerization agents. Furthermore, a material for producing a printed circuit board was obtained in the same manner as in Example 1.
実施例7
光架橋性高分子を下記に示す混合物を用いて、実施例1
と同様の方法で製造した。Example 7 Example 1 was carried out using the following photocrosslinkable polymer mixture.
Manufactured in the same manner as.
α−Wポリブタジェングリコール 3gエチルメタ
クリレート10g
トリメチロールプロパンモノアクリレート0g
ブチルメタクリレート 10gスチレン
20gメタクリル酸
37g得られたベースポリマーで
ある6元共重合体高分子の分子量は、ゲル浸透クロマト
グラフィで測定して40000であった。α-W polybutadiene glycol 3g ethyl methacrylate 10g trimethylolpropane monoacrylate 0g butyl methacrylate 10g styrene 20g methacrylic acid
The molecular weight of the base polymer (6-component copolymer polymer) obtained in an amount of 37 g was 40,000 as measured by gel permeation chromatography.
この高分子50gを用い、光重合開始剤として4゜4′
−ジメチルアミノベンゾフェノン1gを用いる以外は実
施例1と全く同様の方法で感光性樹脂組成物溶液を得、
更に実施例1と同様の方法で印刷回路板製造用材料を得
た。Using 50 g of this polymer, 4°4' was used as a photopolymerization initiator.
- Obtain a photosensitive resin composition solution in exactly the same manner as in Example 1 except for using 1 g of dimethylaminobenzophenone,
Furthermore, a material for producing a printed circuit board was obtained in the same manner as in Example 1.
実施例8
実施例1で得られた四元共重合体を反応容器に入れ60
°Cに保ち、次いで、反応容器中にイソプロピルアルコ
ール96g1重合禁止剤としてハイドロキノン0.3g
、反応触媒としてトリメチルベンジルアンモニウムハイ
ドロオキサイドの40%メタノール溶液3.75gを投
入した。そして、反応容器を加熱してイソプロピルアル
コール等の反応溶媒の温度を80°Cに昇温し、ハイド
ロキノン0.3gを含むグリシジルメタクリレート30
gを1時間で滴下し、滴下終了後引き続き4時間反応さ
せた。Example 8 The quaternary copolymer obtained in Example 1 was placed in a reaction vessel for 60 minutes.
°C, then in the reaction vessel 96 g of isopropyl alcohol 1 0.3 g of hydroquinone as polymerization inhibitor
3.75 g of a 40% methanol solution of trimethylbenzylammonium hydroxide was added as a reaction catalyst. Then, the temperature of the reaction solvent such as isopropyl alcohol was raised to 80°C by heating the reaction vessel, and 30% of glycidyl methacrylate containing 0.3g of hydroquinone was heated.
g was added dropwise over a period of 1 hour, and after the addition was completed, the reaction was continued for 4 hours.
得られた、四元共重合体にグリシジルメタクリレートを
付加させた光架橋性高分子の分子量は、ゲル浸透ガスク
ロマトグラフィで測定して46000であった。The molecular weight of the photocrosslinkable polymer obtained by adding glycidyl methacrylate to a quaternary copolymer was 46,000 as measured by gel permeation gas chromatography.
四元共重合体を得た際の残余のアクリル酸、四元共重合
体の分子量、光架橋性高分子の分子量等から推測して、
グリシジルメタクリレートの四元共重合体中カルボキシ
ル基に対する付加反応率は約65%、部ち約0.65当
量である。Estimated from the residual acrylic acid when the quaternary copolymer was obtained, the molecular weight of the quaternary copolymer, the molecular weight of the photocrosslinkable polymer, etc.
The addition reaction rate of glycidyl methacrylate to carboxyl groups in the quaternary copolymer is about 65%, or about 0.65 equivalent.
このようにして得られたグラフト共重合体である光架橋
性高分子50gを用いて、実施例1と同様の方法で感光
性樹脂組成物溶液を得、さらに実施例1と同様の方法で
印刷回路板製造用材料を得た。Using 50 g of the photocrosslinkable polymer, which is the graft copolymer thus obtained, a photosensitive resin composition solution was obtained in the same manner as in Example 1, and then printed in the same manner as in Example 1. A material for manufacturing circuit boards was obtained.
実施例9
実施例3の方法で得られた5元共重合体を用いて、実施
例8と同様の方法でグリシジルアクリレートを5元共重
合体に付加させて光架橋性高分子を得た。Example 9 Using the quinary copolymer obtained by the method of Example 3, glycidyl acrylate was added to the quinary copolymer in the same manner as in Example 8 to obtain a photocrosslinkable polymer.
この光架橋性高分子50gを用いて、実施例1と同様の
方法で感光性樹脂組成物溶液を得、さらに実施例1と同
様の方法で印刷回路板製造用材料を得た。Using 50 g of this photocrosslinkable polymer, a photosensitive resin composition solution was obtained in the same manner as in Example 1, and a material for producing a printed circuit board was further obtained in the same manner as in Example 1.
実施例10
グリシジルアクリレートに代えてα−エチルグリシジル
アクリレートを用いる以外は実施例8と同様の方法で印
刷回路板製造用材料を得た。Example 10 A material for producing a printed circuit board was obtained in the same manner as in Example 8, except that α-ethylglycidyl acrylate was used in place of glycidyl acrylate.
実施例11
グリシジルアクリレートに代えてα−エチルグリシジル
アクリレートを用いる以外は実施例9と同様の方法で印
刷回路板製造用材料を得た。Example 11 A material for producing a printed circuit board was obtained in the same manner as in Example 9, except that α-ethylglycidyl acrylate was used in place of glycidyl acrylate.
比較例
ジアゾ化合物(P−ジアゾジフェニルアミンとパラホル
ムアルデヒドの縮合物である2−メトキシ−4−ヒドロ
オキシ−5−ベンゾインベンゼンスルホンM)50gを
イソプロピルアルコール1500 g 、キシレン20
0 g 、及び酢酸エチル200gから成る混合溶媒で
希釈した後、粒径約1010の銅粉末20gを加えて混
合撹拌して感光性樹脂組成物溶液を得た。Comparative Example 50 g of a diazo compound (2-methoxy-4-hydroxy-5-benzoinbenzenesulfone M, which is a condensate of P-diazodiphenylamine and paraformaldehyde) was mixed with 1500 g of isopropyl alcohol and 20 g of xylene.
After diluting with a mixed solvent consisting of 0 g and 200 g of ethyl acetate, 20 g of copper powder with a particle size of about 1010 was added and mixed and stirred to obtain a photosensitive resin composition solution.
この感光性樹脂組成物溶液を用いて実施例1と同様の方
法で印刷回路板製造用材料を得た。A material for producing a printed circuit board was obtained in the same manner as in Example 1 using this photosensitive resin composition solution.
上記実施例1〜11及び比較例で得られた印刷回路板製
造用材料を真空焼枠中で陰面を通して、dKW用超高圧
水銀灯にて1mの距離から感光性樹脂組成物層を露光し
、下記現像液を用いて未露光部を除去した。The printed circuit board manufacturing materials obtained in Examples 1 to 11 and Comparative Examples above were passed through the hidden side in a vacuum baking frame, and the photosensitive resin composition layer was exposed from a distance of 1 m using an ultra-high pressure mercury lamp for dKW. The unexposed areas were removed using a developer.
セスキ炭酸ソーダ 5gペンチルア
ルコール 5gゾンテスAL−10(
松本油脂製薬■製)30g水
960g感光性樹脂組成物が除去さ
れた部分は金属箔が露出しており、その露出した金属箔
をエツチング処理によって除去し、印刷回路板を得た。Sesquicarbonate soda 5g Pentyl alcohol 5g Zontes AL-10 (
Matsumoto Yushi Pharmaceutical ■) 30g water
Metal foil was exposed in the area where 960 g of the photosensitive resin composition was removed, and the exposed metal foil was removed by etching to obtain a printed circuit board.
配線部上には硬化した樹脂が残存しており、この樹脂の
耐摩耗性を試験した。試験方法は、印刷回路板をオフセ
ット印刷機にかけ、印刷用紙と摩擦させ、何枚の印刷用
紙との摩擦に耐えうるかで評価した。その結果、実施例
1〜11に係る印刷回路板は10万枚の摩擦に耐えられ
るのに対し、比較例に係る印刷回路板は10万枚の摩擦
によって樹脂の脱落及び破壊が見られた。Hardened resin remained on the wiring section, and the wear resistance of this resin was tested. The test method was to place a printed circuit board in an offset printing machine, rub it against printing paper, and evaluate how many sheets of printing paper it could withstand. As a result, the printed circuit boards according to Examples 1 to 11 were able to withstand the friction of 100,000 sheets, whereas the printed circuit boards according to the comparative example showed resin falling off and destruction due to the friction of 100,000 sheets.
(ホ)発明の詳細(e) Details of the invention
Claims (4)
性金属箔と、該導電性金属箔の表面に積層された感光性
樹脂組成物とを具備する印刷回路板製造用材料において
、前記感光性樹脂組成物は、側鎖に不飽和基を有する光
架橋性且つアルカリ可溶性高分子と、架橋剤と、光重合
開始剤と、導電性粉末とよりなり、前記側鎖に不飽和基
を有する光架橋性且つアルカリ可溶性高分子として、(
a)ポリブタジエン、ポリブタジエングリコール、ポリ
ブタジエンカルボン酸、変性ポリブタジエンよりなる群
から選ばれたポリブタジエン化合物0.1〜5重量%、
(b)アクリル酸エステル及び/又はメタクリル酸エス
テル5〜70重量%、(c)不飽和カルボン酸20〜7
0重量%、(d)スチレン及び/又はそのアルキル置換
誘導体5〜60重量%よりなる混合物を共重合して得ら
れ、且つ分子量がゲル浸透クロマトグラフィで測定して
20000〜60000である共重合体を用いることを
特徴とする印刷回路板製造用材料。(1) A printed circuit board manufacturing material comprising an insulating substrate, a conductive metal foil laminated on the surface of the insulating substrate, and a photosensitive resin composition laminated on the surface of the conductive metal foil, The photosensitive resin composition is composed of a photocrosslinkable and alkali-soluble polymer having an unsaturated group in its side chain, a crosslinking agent, a photoinitiator, and a conductive powder, and has an unsaturated group in its side chain. As a photocrosslinkable and alkali-soluble polymer having (
a) 0.1 to 5% by weight of a polybutadiene compound selected from the group consisting of polybutadiene, polybutadiene glycol, polybutadiene carboxylic acid, and modified polybutadiene;
(b) acrylic acid ester and/or methacrylic acid ester 5-70% by weight, (c) unsaturated carboxylic acid 20-7%
(d) styrene and/or its alkyl-substituted derivative, and has a molecular weight of 20,000 to 60,000 as measured by gel permeation chromatography. A material for manufacturing printed circuit boards, characterized in that it is used.
性金属箔と、該導電性金属箔の表面に積層された感光性
樹脂組成物とを具備する印刷回路板製造用材料において
、前記感光性樹脂組成物は、側鎖に不飽和基を有する光
架橋性且つアルカリ可溶性高分子と、架橋剤と、光重合
開始剤と、導電性粉末とよりなり、前記側鎖に不飽和基
を有する光架橋性且つアルカリ可溶性高分子として、(
a)ポリブタジエン、ポリブタジエングリコール、ポリ
ブタジエンカルボン酸、変性ポリブタジエンよりなる群
から選ばれたポリブタジエン化合物0.1〜5重量%、
(b)アクリル酸エステル及び/又はメタクリル酸エス
テル5〜70重量%、(c)不飽和カルボン酸20〜7
0重量%、(d)スチレン及び/又はそのアルキル置換
誘導体5〜60重量%、(e)脂肪酸ビニルエステル5
〜15重量%よりなる混合物を共重合して得られ、且つ
分子量がゲル浸透クロマトグラフィで測定して2000
0〜60000である共重合体を用いることを特徴とす
る印刷回路板製造用材料。(2) A printed circuit board manufacturing material comprising an insulating substrate, a conductive metal foil laminated on the surface of the insulating substrate, and a photosensitive resin composition laminated on the surface of the conductive metal foil, The photosensitive resin composition is composed of a photocrosslinkable and alkali-soluble polymer having an unsaturated group in its side chain, a crosslinking agent, a photoinitiator, and a conductive powder, and has an unsaturated group in its side chain. As a photocrosslinkable and alkali-soluble polymer having (
a) 0.1 to 5% by weight of a polybutadiene compound selected from the group consisting of polybutadiene, polybutadiene glycol, polybutadiene carboxylic acid, and modified polybutadiene;
(b) acrylic acid ester and/or methacrylic acid ester 5-70% by weight, (c) unsaturated carboxylic acid 20-7%
0% by weight, (d) 5 to 60% by weight of styrene and/or its alkyl substituted derivatives, (e) fatty acid vinyl ester 5
obtained by copolymerizing a mixture consisting of ~15% by weight, and has a molecular weight of 2000 as measured by gel permeation chromatography.
A material for producing a printed circuit board, characterized in that a copolymer having a molecular weight of 0 to 60,000 is used.
性金属箔と、該導電性金属箔の表面に積層された感光性
樹脂組成物とを具備する印刷回路板製造用材料において
、前記感光性樹脂組成物は、側鎖に不飽和基を有する光
架橋性且つアルカリ可溶性高分子と、架橋剤と、光重合
開始剤と、導電性粉末とよりなり、前記側鎖に不飽和基
を有する光架橋性且つアルカリ可溶性高分子として、(
a)ポリブタジエン、ポリブタジエングリコール、ポリ
ブタジエンカルボン酸、変性ポリブタジエンよりなる群
から選ばれたポリブタジエン化合物0.1〜5重量%、
(b)アクリル酸エステル及び/又はメタクリル酸エス
テル5〜70重量%、(c)不飽和カルボン酸20〜7
0重量%、(d)スチレン及び/又はそのアルキル置換
誘導体5〜60重量%よりなる混合物を共重合して得ら
れ、且つ分子量がゲル浸透クロマトグラフィで測定して
20000〜60000である共重合体に、該共重合体
のカルボキシル基に対して0.03〜1.0当量のオキ
シラン環含有エチレン性不飽和化合物を付加したグラフ
ト共重合体を用いることを特徴とする印刷回路板製造用
材料。(3) A printed circuit board manufacturing material comprising an insulating substrate, a conductive metal foil laminated on the surface of the insulating substrate, and a photosensitive resin composition laminated on the surface of the conductive metal foil, The photosensitive resin composition is composed of a photocrosslinkable and alkali-soluble polymer having an unsaturated group in its side chain, a crosslinking agent, a photoinitiator, and a conductive powder, and has an unsaturated group in its side chain. As a photocrosslinkable and alkali-soluble polymer having (
a) 0.1 to 5% by weight of a polybutadiene compound selected from the group consisting of polybutadiene, polybutadiene glycol, polybutadiene carboxylic acid, and modified polybutadiene;
(b) acrylic acid ester and/or methacrylic acid ester 5-70% by weight, (c) unsaturated carboxylic acid 20-7%
0% by weight, (d) styrene and/or its alkyl substituted derivative 5 to 60% by weight, and has a molecular weight of 20,000 to 60,000 as measured by gel permeation chromatography. A material for producing a printed circuit board, characterized in that a graft copolymer is used, in which 0.03 to 1.0 equivalents of an oxirane ring-containing ethylenically unsaturated compound are added to the carboxyl group of the copolymer.
性金属箔と、該導電性金属箔の表面に積層された感光性
樹脂組成物とを具備する印刷回路板製造用材料において
、前記感光性樹脂組成物は、側鎖に不飽和基を有する光
架橋性且つアルカリ可溶性高分子と、架橋剤と、光重合
開始剤と、導電性粉末とよりなり、前記側鎖に不飽和基
を有する光架橋性且つアルカリ可溶性高分子として、(
a)ポリブタジエン、ポリブタジエングリコール、ポリ
ブタジエンカルボン酸、変性ポリブタジエンよりなる群
から選ばれたポリブタジエン化合物0.1〜5重量%、
(b)アクリル酸エステル及び/又はメタクリル酸エス
テル5〜70重量%、(c)不飽和カルボン酸20〜7
0重量%、(d)スチレン及び/又はそのアルキル置換
誘導体5〜60重量%、(e)脂肪酸ビニルエステル5
〜15重量%よりなる混合物を共重合して得られ、且つ
分子量がゲル浸透クロマトグラフィで測定して2000
0〜60000である共重合体に、該共重合体のカルボ
キシル基に対して0.03〜1.0当量のオキシラン環
含有エチレン性不飽和化合物を付加したグラフト共重合
体を用いることを特徴とする印刷回路板製造用材料。(4) A printed circuit board manufacturing material comprising an insulating substrate, a conductive metal foil laminated on the surface of the insulating substrate, and a photosensitive resin composition laminated on the surface of the conductive metal foil, The photosensitive resin composition is composed of a photocrosslinkable and alkali-soluble polymer having an unsaturated group in its side chain, a crosslinking agent, a photoinitiator, and a conductive powder, and has an unsaturated group in its side chain. As a photocrosslinkable and alkali-soluble polymer having (
a) 0.1 to 5% by weight of a polybutadiene compound selected from the group consisting of polybutadiene, polybutadiene glycol, polybutadiene carboxylic acid, and modified polybutadiene;
(b) acrylic acid ester and/or methacrylic acid ester 5-70% by weight, (c) unsaturated carboxylic acid 20-7%
0% by weight, (d) 5 to 60% by weight of styrene and/or its alkyl substituted derivatives, (e) fatty acid vinyl ester 5
obtained by copolymerizing a mixture consisting of ~15% by weight, and has a molecular weight of 2000 as measured by gel permeation chromatography.
It is characterized by using a graft copolymer obtained by adding an oxirane ring-containing ethylenically unsaturated compound in an amount of 0.03 to 1.0 equivalent to the carboxyl group of the copolymer to a copolymer having a molecular weight of 0 to 60,000. Materials for manufacturing printed circuit boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10870287A JPS63273394A (en) | 1987-04-30 | 1987-04-30 | Material for manufacturing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10870287A JPS63273394A (en) | 1987-04-30 | 1987-04-30 | Material for manufacturing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63273394A true JPS63273394A (en) | 1988-11-10 |
Family
ID=14491454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10870287A Pending JPS63273394A (en) | 1987-04-30 | 1987-04-30 | Material for manufacturing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63273394A (en) |
-
1987
- 1987-04-30 JP JP10870287A patent/JPS63273394A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102019580B1 (en) | Photosensitive resin composition | |
EP0489553B1 (en) | Photosensitive polymeric printing medium and water developable printing plates | |
US8101339B2 (en) | Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board | |
JP3771714B2 (en) | Photosensitive resin composition and photo solder resist ink for printed wiring board manufacture | |
JP2891704B2 (en) | Water developable photosensitive resin composition, resin printing plate using the same, and method for producing resin printing plate | |
JPH0359416B2 (en) | ||
TWI240149B (en) | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board | |
JP4936848B2 (en) | Photosensitive resin composition and laminate thereof | |
US8007983B2 (en) | Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board | |
DE2517656A1 (en) | PHOTOPOLYMERIZABLE COMPOUNDS, IN PARTICULAR IN RECORDING MATERIALS, AND THEIR USE | |
JP2005331966A (en) | Polymeric film having controlled viscosity response to temperature and shear | |
JP2003131380A (en) | Photosensitive resin composition | |
JP3267703B2 (en) | New photopolymerizable resin laminate | |
JP4147920B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method | |
JPS63273394A (en) | Material for manufacturing printed circuit board | |
JP2001159817A (en) | Photosensitive resin composition, photosensitive element using same, method for producing resist pattern and method for producing printed wiring board | |
JPH02161442A (en) | Photopolymerizable composition | |
JP2690494B2 (en) | Photoresist composition | |
JP3859934B2 (en) | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board | |
JP4360769B2 (en) | Photosensitive resin laminate | |
JPH0326822B2 (en) | ||
EP2063318A1 (en) | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | |
JPH0727205B2 (en) | Photosensitive resin composition laminate | |
JP4238631B2 (en) | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method | |
JPH03153750A (en) | Photopolymerizable composition |