JPS63271962A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS63271962A JPS63271962A JP10527887A JP10527887A JPS63271962A JP S63271962 A JPS63271962 A JP S63271962A JP 10527887 A JP10527887 A JP 10527887A JP 10527887 A JP10527887 A JP 10527887A JP S63271962 A JPS63271962 A JP S63271962A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- lead frame
- alloy
- plating layer
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 50
- 238000007747 plating Methods 0.000 claims abstract description 42
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims abstract description 6
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- LBPABMFHQYNGEB-UHFFFAOYSA-N benzene;2h-triazole Chemical compound C=1C=NNN=1.C1=CC=CC=C1 LBPABMFHQYNGEB-UHFFFAOYSA-N 0.000 claims 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 abstract description 11
- 239000012964 benzotriazole Substances 0.000 abstract description 11
- 238000002845 discoloration Methods 0.000 abstract description 9
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- 239000000956 alloy Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 229910001431 copper ion Inorganic materials 0.000 abstract 2
- 238000007598 dipping method Methods 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- -1 Cu-3n-P alloy Chemical compound 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004649 discoloration prevention Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
皮呈上■肌里分立
本発明は、ＩＣなどの半導体集積回路の作製に利用され
るリードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to lead frames used in the production of semiconductor integrated circuits such as ICs.
従来及歪
一般に、ＩＣなどの半導体集積回路は、リードフレーム
に半導体ペレットをマウントし、該リードフレームのリ
ードと半導体ペレットの電極をボンディングワイヤーで
接合することにより作製されている。2. Description of the Related Art Generally, semiconductor integrated circuits such as ICs are manufactured by mounting a semiconductor pellet on a lead frame and bonding the leads of the lead frame and the electrodes of the semiconductor pellet with bonding wires.
従来、リードフレームは、一般にコバール４２合金又は
Ｃｕ合金等のリードフレーム材料の表面に金めつき又は
銀めっきを施してそのワイヤーボンディング性、半田付
性及び耐食性を向上させて用いられている。しかし、リ
ードフレーム材料に金めつき又は銀めっきを施すことは
、金並びに銀が高価であることから、リードフレームが
コスト高になるという問題がある。Conventionally, lead frames have been generally used by gold plating or silver plating the surface of a lead frame material such as Kovar 42 alloy or Cu alloy to improve wire bondability, solderability, and corrosion resistance. However, applying gold plating or silver plating to the lead frame material has a problem in that the lead frame becomes expensive because gold and silver are expensive.
一方、近年、ボンディングワイヤーとして従来の金ワイ
ヤーに代わる銅ワイヤーが開発されたことから、半導体
集積回路のコスト低下が進んできていることにより、リ
ードフレーム材料に銅製ワイヤーとのワイヤーボンディ
ング性が良好な銅めっきを、金めつき並びに銀めっきの
代替として使用することが提案されている。On the other hand, in recent years, copper wire has been developed to replace the conventional gold wire as a bonding wire, and the cost of semiconductor integrated circuits has been decreasing. It has been proposed to use copper plating as an alternative to gold plating as well as silver plating.
−Ｓに、リードフレーム材料に施される銅めっきは、柔
かい故にボンディングワイヤーとの接合性が良好である
資化銅浴が用いられている。-S, the copper plating applied to the lead frame material uses an assimilated copper bath, which is soft and has good bonding properties with the bonding wire.
しかし、資化銅浴は毒性の強い背比物を用いるため、浴
液の管理費が高く、また、資化銅浴よりの銅めっき層は
半田付性及び耐食性があまり良好でないという問題があ
る。However, since the assimilated copper bath uses highly toxic substances, the cost of managing the bath liquid is high, and the copper plating layer produced from the assimilated copper bath has problems such as poor solderability and corrosion resistance. .
日が”しようとする課
本発明は、リードフレームに関する従来技術における層
上の問題点に鑑みなされたものであって、金ワイヤー及
び銅ワイヤーとのワイヤーボンディング性が良好であり
、かつ半田付性及び耐食性の優れた銅めっき層を形成し
たリードフレーム、さらには政調めつき層上に保護皮膜
を形成することにより、変色の認められないリードフレ
ームを提供することを課題とする。The present invention was made in view of the layer-related problems in the prior art related to lead frames, and has good wire bonding properties with gold wires and copper wires, as well as good solderability and An object of the present invention is to provide a lead frame on which a copper plating layer with excellent corrosion resistance is formed, and furthermore, a lead frame that does not discolor by forming a protective film on the political plating layer.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
発明の構成
本発明の特徴は、■銅又は銅合金もしくは鉄又は鉄合金
からなるリードフレーム材料の表面に、ホウフッ化銅め
っき浴よりの銅めっき層を被覆形成したリードフレーム
、及び■上記鋼めっき層上に、さらにベンゾトリアゾー
ル０．００３〜０．５ｇ＃！又はイミダゾール０．３〜
２．０ｇ／ １もしくは両者を含有する溶液への浸漬に
より保護皮膜を形成したリードフレームにある。Structure of the Invention The features of the present invention include: (1) a lead frame in which the surface of a lead frame material made of copper or copper alloy, or iron or iron alloy is coated with a copper plating layer from a copper borofluoride plating bath, and (2) the above steel plating. On top of the layer, add 0.003 to 0.5 g of benzotriazole! Or imidazole 0.3~
The lead frame has a protective film formed by immersion in a solution containing 2.0g/1 or both.
課 を”′するための手
リードフレーム材料として汎用される銅又は銅合金（例
えばＣｕ−３ｎ−Ｐ合金、Ｃｕ−Ｃｒ−Ｚｒ合金、Ｃｕ
−Ｎｉ−３ｔ合金等）もしくは鉄又は鉄合金（例えばＦ
ｅ−Ｎｉ合金、Ｆｅ−Ｎｉ−Ｃｏ合金等）の表面は元来
硬いが、本発明によって、それにホウフッ化銅めっき浴
より銅めっき層を被覆形成すると柔かくなって、金ワイ
ヤー並びに銅ワイヤーとのワイヤーボンディング性が向
上して良好な接合が得られるようになる。Copper or copper alloys (e.g. Cu-3n-P alloy, Cu-Cr-Zr alloy, Cu
-Ni-3t alloy, etc.) or iron or iron alloys (e.g. F
The surface of e-Ni alloy, Fe-Ni-Co alloy, etc.) is originally hard, but by coating it with a copper plating layer using a copper borofluoride plating bath, it becomes soft, making it easier to bond with gold wire and copper wire. Wire bonding properties are improved and good bonding can be obtained.
特に、銅ワイヤーと上記銅めっきとの一接続においては
、従来の金ワイヤーとの接続に際してみられる金属間化
合物の形成による接合強度が劣化するという問題が解消
される。また、本発明により形成される銅めっき層は金
ワイヤーとの接続においても金属間化合物の形成速度が
非常に遅くなるので、接合強度の劣化はみられない。In particular, in the connection between a copper wire and the copper plating, the problem of deterioration in bonding strength due to the formation of an intermetallic compound, which occurs when connecting a conventional gold wire, is solved. Further, since the rate of formation of intermetallic compounds in the copper plating layer formed according to the present invention is extremely slow even when connected to gold wire, no deterioration in bonding strength is observed.
本発明による、リードフレーム材料表面における銅めっ
き層の被覆形成は、上記材料に常法により前処理を施し
た後、ホウフッ化銅浴により銅めっきを施すことにより
行う。めっきに際しての浴温度は３０℃前後でよく、電
流密度は５〜ＩＯＡ／ｄｒｒ＋程度である。まためっき
の厚さは１〜１０μ曙の広範囲に変えることができる。The formation of a copper plating layer on the surface of the lead frame material according to the present invention is carried out by subjecting the material to a pretreatment using a conventional method and then applying copper plating in a copper borofluoride bath. The bath temperature during plating may be around 30°C, and the current density is about 5 to IOA/drr+. Furthermore, the thickness of the plating can be varied over a wide range of 1 to 10 microns.
このようにして形成される銅めっきは、ワイヤーボン
ディング性及び半田付性が良好である。The copper plating thus formed has good wire bondability and solderability.
更に、本発明では、上記銅めっきを施したリードフレー
ムが経時的に変色するのを防止するために、表面に銅め
っき層を被覆形成したリードフレーム材料を、ベンゾト
リアゾールを０．００３〜０．５ｇ／ １又はイミダゾ
ールを０．３〜２．０ｇ／ １含有する溶液中、もしく
は両物質を上記濃度で含有する混合溶液中に浸漬するこ
とにより、上記鋼めっき層上にこれら物質から成る保護
皮膜を形成する。Furthermore, in the present invention, in order to prevent the copper-plated lead frame from discoloring over time, the lead frame material whose surface is coated with a copper plating layer is treated with benzotriazole in an amount of 0.003 to 0.0. A protective film made of these substances is formed on the steel plating layer by immersing it in a solution containing 5 g/1 or imidazole at 0.3 to 2.0 g/1, or a mixed solution containing both substances at the above concentrations. form.
ベンゾトリアゾール並びにイミダゾールは、いわゆるイ
ンヒビター（酸化安定剤）として作用して上記による変
色を防止する効果を示す。Benzotriazole and imidazole act as so-called inhibitors (oxidation stabilizers) and exhibit the effect of preventing the above-mentioned discoloration.
因に、インヒビターとしては上記両物質のほかに、ピロ
ール、ピラゾール、チアゾール、トリアゾール、メルカ
プタン及びそのＫｍ体のような複素環式窒素化合物が知
られているが、本発明では、特にベンゾトリアゾールと
イミダゾールを上記濃度で水成は有機溶剤に熔解した溶
液を用いるのが好ましい。また、水溶液として用いる場
合には、ｐＨ６〜１２に調整したものを用いると一層優
れた効果を呈する。Incidentally, in addition to the above two substances, heterocyclic nitrogen compounds such as pyrrole, pyrazole, thiazole, triazole, mercaptan, and their Km form are known as inhibitors, but in the present invention, benzotriazole and imidazole are particularly used. It is preferable to use a solution prepared by dissolving the above concentration in an organic solvent. Moreover, when using it as an aqueous solution, it exhibits even more excellent effects if the pH is adjusted to 6 to 12.
なお、ベンゾトリアゾール並びにイミダゾールの各濃度
を上記範囲に規定するのは、ベンゾトリアゾールの濃度
が０．００３ｇ／ １未満では変色防止の効果が不十分
であり、一方、０．５ｇ／βを超えると半田付性が劣る
ようになるからである。また、イミダゾールの濃度が０
．３ｇ／ １未満では変色防止の効果が不十分であり、
一方、２．０ｇ／ １を超えると浸漬時に銅めっき面に
却って変色が起る。なお、ベンゾトリアゾール並びにイ
ミダゾール溶液への浸漬時間は２０秒以上とすることが
、十分な変色防止効果を達成するために望ましい。The concentration of benzotriazole and imidazole is defined in the above ranges because if the concentration of benzotriazole is less than 0.003 g/1, the effect of preventing discoloration is insufficient, whereas if it exceeds 0.5 g/β, This is because solderability becomes inferior. Also, the concentration of imidazole is 0
．． If it is less than 3g/1, the effect of preventing discoloration is insufficient;
On the other hand, if it exceeds 2.0 g/1, discoloration will occur on the copper-plated surface during immersion. Note that it is desirable that the immersion time in the benzotriazole or imidazole solution be 20 seconds or more in order to achieve a sufficient discoloration prevention effect.
以下実施例により本発明とその効果を具体的に説明する
。The present invention and its effects will be specifically explained below using Examples.
実施例
ＳＯＳ ４３０条（０，１）ｍｍ’）からなるリードフ
レーム材料に、常法に従って前処理を施した後、ウッド
浴により０．１μｍ厚のＮｉ下地めっきを施した。Example SOS A lead frame material consisting of 430 strips (0,1 mm') was pretreated according to a conventional method, and then Ni underplating was applied to a thickness of 0.1 μm in a Wood bath.
次いで、この下地めっきをした材料に、下記めっき条件
により、ホウフッ化銅浴により、１．３．５．８、及び
１０μ−の各原の銅めっきを施した。Next, this base-plated material was subjected to copper plating of 1, 3, 5, 8, and 10 μm using a copper borofluoride bath under the following plating conditions.
汝２Ｎ条作
ホウフッ化銅浴組成ニ
ホウフッ化銅 ２２５ ｇｅｌホウフッ化酸
１５ ｇ／ｊ！浴温 ３０
℃
電流密度 ５〜１０ Ａ／ｄ耐上述のように
して得られた銅めっき材を、ベンゾトリアゾール０．０
１ｇ／ ｌとイミダゾール０．８ｇ／ Ｒの混合水溶液
（ｐＨ９，０）に３０秒間浸漬して乾燥を行った。得ら
れたリードフレームを試験片として、４０℃、相対湿度
９２％の湿潤環境に１週間保持後、金ワイヤー並びに銅
ワイヤーとのワイヤーボンディング性、半田付性及び変
色状況を下記によりそれぞれ評価した。You 2N strip production Copper borofluoride bath composition Copper borofluoride 225 gel Borofluoric acid
15 g/j! Bath temperature 30
°C Current density 5 to 10 A/d resistance The copper plating material obtained as described above was treated with benzotriazole 0.0
It was immersed for 30 seconds in a mixed aqueous solution (pH 9,0) of 1 g/l and imidazole 0.8 g/R to dry. The obtained lead frame was used as a test piece, and after being kept in a humid environment of 40° C. and 92% relative humidity for one week, the wire bondability with gold wire and copper wire, solderability, and discoloration were evaluated as follows.
０ワイヤーボンディング性−一−−−−−前記試験片上
に２５μφの金線もしくは銅線をフォーミングガス中で
１）の間隔でボールウェッジボンドを施し、その引張強
度を測定することにより評価を行った。0 Wire bonding property - 1 - Ball wedge bonding of 25μφ gold or copper wires was performed on the above test piece in forming gas at intervals of 1), and evaluation was performed by measuring the tensile strength. .
０半田付性−一一一一一−該試験片を２５％ロジン−メ
タノールに５秒浸漬した後、２３５±５℃に保持された
６０／４０ （Ｓｎ／Ｐｂ）半田浴中に５秒浸漬し、そ
の時の外観状況を観察して評価を行った。0 Solderability - 11111 - The test piece was immersed in 25% rosin-methanol for 5 seconds, and then immersed in a 60/40 (Sn/Pb) solder bath held at 235±5°C for 5 seconds. The appearance was then observed and evaluated.
０変色状況−−−−−・−該試験片を湿潤環境に１週間
保持後、目視により観察して評価を行った。0 Status of discoloration --- After the test piece was kept in a humid environment for one week, it was visually observed and evaluated.
上記評価は表１に示すとおりである。The above evaluation is as shown in Table 1.
また、比較例として、実施例で用いたホウフッ化銅に代
えて資化銅浴を用いるほかは、実施例に記載と同様の手
順で銅めっきを施して得られたリードフレームの試験片
について同様の評価を行い、その結果を表１に併せて示
した。なお、資化銅浴による銅めつき条件は下記のとお
りである。In addition, as a comparative example, a test piece of a lead frame obtained by copper plating in the same procedure as described in the example was used, except that an assimilated copper bath was used in place of the copper borofluoride used in the example. The results were also shown in Table 1. The conditions for copper plating using a synergized copper bath are as follows.
汝２Ｎ魚註
背比銅浴組成：
資化！１ｉ１７０ ｇｅｌ
資化ナトリウム Ｂｏｇ／ｌ
水酸化カリウム ２５ ｇ＃！浴温
５０〜７０ ℃電流密度 １〜５Ａ
／ｄｎ（表１
（イ）ワイヤーボンディング性において、（ロ）半田付
性において、
ｘ番刻結５が認められる。Thy 2N fish note ratio copper bath composition: Assimilation! 1i170 gel Assimilated sodium Bog/l Potassium hydroxide 25 g#! bath temperature
50~70℃ Current density 1~5A
/dn (Table 1) In (a) wire bonding properties and (b) soldering properties, x number 5 was observed.
表１にみられるとおり、本発明に従って、リードフレー
ム材料への銅めっきを、ホウフッ化銅浴により施して得
られるリードフレームは、ワイヤーボンディング性及び
半田付性が、従来法により資化銅浴を用いた場合に比べ
て優れており、さらに、本発明により、ベンゾトリアゾ
ールとイミダゾールの溶液に浸漬したものでは変色が起
らないことがわかる。As shown in Table 1, the lead frame obtained by applying copper plating to the lead frame material in accordance with the present invention using a copper borofluoride bath has wire bondability and solderability that is higher than that obtained using a fertilized copper bath using the conventional method. Furthermore, according to the present invention, it can be seen that discoloration does not occur when immersed in a solution of benzotriazole and imidazole.
Claims (4)
ドフレーム材料の表面に銅めつき層を被覆形成したリー
ドフレームにおいて、銅めつき層をホウフッ化銅めつき
浴より被覆形成したことを特徴とするリードフレーム。(1) A lead frame in which a copper plating layer is formed on the surface of a lead frame material made of copper, copper alloy, iron or iron alloy, characterized in that the copper plating layer is formed in a copper borofluoride plating bath. lead frame.
ドフレーム材料の表面に銅めつき層を被覆形成したリー
ドフレームにおいて、銅めつき層をホウフッ化銅めつき
浴より被覆形成した後、ベンゾトリアゾール０．００３
〜０．５ｇ／ｌ又はイミダゾール０．３〜２．０ｇ／ｌ
もしくは両者を含有する溶液への浸漬により、上記銅め
つき層上に保護皮膜を形成したことを特徴とするリード
フレーム。(2) In a lead frame in which a copper plating layer is formed on the surface of a lead frame material made of copper, copper alloy, iron or iron alloy, after the copper plating layer is formed in a copper borofluoride plating bath, benzene Triazole 0.003
~0.5g/l or imidazole 0.3-2.0g/l
Alternatively, a lead frame characterized in that a protective film is formed on the copper plating layer by immersion in a solution containing both.
の範囲第（２）項記載のリードフレーム。(3) The lead frame according to claim (2), wherein the solution is an aqueous solution with a pH of 6 to 12.
求の範囲第（２）項記載のリードフレーム。(4) The lead frame according to claim (2), wherein the lead frame is immersed in the solution for at least 20 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10527887A JPS63271962A (en) | 1987-04-28 | 1987-04-28 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10527887A JPS63271962A (en) | 1987-04-28 | 1987-04-28 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63271962A true JPS63271962A (en) | 1988-11-09 |
Family
ID=14403204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10527887A Pending JPS63271962A (en) | 1987-04-28 | 1987-04-28 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63271962A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386723A (en) * | 1991-01-24 | 1995-02-07 | Siemens Aktiengesellschaft | Device for detecting faulty firing in an internal-combustion engine |
| CN113604846A (en) * | 2021-03-29 | 2021-11-05 | 宁波德洲精密电子有限公司 | Surface treatment process for integrated circuit lead frame |
-
1987
- 1987-04-28 JP JP10527887A patent/JPS63271962A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386723A (en) * | 1991-01-24 | 1995-02-07 | Siemens Aktiengesellschaft | Device for detecting faulty firing in an internal-combustion engine |
| CN113604846A (en) * | 2021-03-29 | 2021-11-05 | 宁波德洲精密电子有限公司 | Surface treatment process for integrated circuit lead frame |
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