JPS63263701A - Conductive paste for resistance element - Google Patents
Conductive paste for resistance elementInfo
- Publication number
- JPS63263701A JPS63263701A JP62099182A JP9918287A JPS63263701A JP S63263701 A JPS63263701 A JP S63263701A JP 62099182 A JP62099182 A JP 62099182A JP 9918287 A JP9918287 A JP 9918287A JP S63263701 A JPS63263701 A JP S63263701A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- conductive paste
- lead wire
- resistance
- resistance element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 51
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 12
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000005355 lead glass Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- KLKFAASOGCDTDT-UHFFFAOYSA-N ethoxymethoxyethane Chemical compound CCOCOCC KLKFAASOGCDTDT-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000968 intestinal effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば熱線流量計等の抵抗素子本体にリード
線を接合するのに好適に用いられる抵抗素子用導電性ペ
ーストに関し、特に、結晶化ガラスを添加することによ
って接合強度を向上できるようにした抵抗素子用導電性
ペーストに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive paste for a resistive element, which is suitably used for joining a lead wire to a resistive element body of a hot-wire flowmeter, in particular. The present invention relates to a conductive paste for resistive elements whose bonding strength can be improved by adding vitreous.
−ｍに、自動車用エンジン等にあっては、エンジン作動
時における吸入空気流量を燃料噴射パルスの演算ファク
タとして用いる゛ため、この吸入空気流量を熱！ａ流量
計等によって計測（検出）するようにしている。-m, in automobile engines, etc., the intake air flow rate during engine operation is used as a calculation factor for the fuel injection pulse, so this intake air flow rate is used as a heat source. a) It is measured (detected) using a flow meter or the like.
この種の熱線流量計は、例えば熱線抵抗と出力抵抗と温
度補償抵抗と流量調整抵抗とからなる°ブリッジ回路等
によって構成され、前記熱線抵抗を吸気通路の途中に配
設して、吸入空気と常時接触させることにより、前記出
力抵抗の両端電圧から吸入空気流量を検出するようにし
ている。そして、最近の傾向としては。This type of hot-wire flowmeter is configured with a bridge circuit, for example, consisting of a hot-wire resistance, an output resistance, a temperature compensation resistance, and a flow rate adjustment resistor. By constantly contacting the output resistor, the intake air flow rate is detected from the voltage across the output resistor. And as for the recent trends.
例えば特開昭５８−１４０２３号公報、特開昭５８−５
５７６２号公報等に記載された感温（発熟）抵抗体等の
抵抗素子を前記熱線抵抗として用いるようになっている
。For example, JP-A-58-14023, JP-A-58-5
A resistance element such as a temperature-sensitive (maturing) resistor described in Japanese Patent No. 5762 and the like is used as the hot wire resistor.
そこで、第２図に従来技術の熱線流量計用抵抗素子を示
す。Therefore, FIG. 2 shows a conventional resistance element for a hot wire flowmeter.
図において、１はアルミナ等のセラミック材料によって
円筒状に形成された抵抗素子本体としての筒体を示し、
該筒体ｌは、例えば長さが２ｍｍ程度受、外径が０．５
ｒａｍ 、内径が０．３ ａｍ程度に小径に形成され
、その軸方向両端側には後述の各リード線２が挿入され
、同君されるようになっている。In the figure, 1 indicates a cylindrical body as a resistance element body formed in a cylindrical shape from a ceramic material such as alumina,
The cylindrical body l has a length of about 2 mm and an outer diameter of 0.5 mm, for example.
The ram is formed to have a small inner diameter of about 0.3 am, and each lead wire 2, which will be described later, is inserted into both ends of the ram in the axial direction.
２．２は該筒体ｌの軸方向両端側から該筒体１内に挿入
された一対のリード線を示し、該各リード＆１２は、例
えば鉄、ニッケルまたはこれらの合金等の表面に白金を
クラッドすることにより細長い線状体として形成され、
その先端側は、例えば０．７５腸層程度の挿入長さをも
って筒体ｌ内に挿入されている。2.2 shows a pair of lead wires inserted into the cylindrical body 1 from both ends in the axial direction of the cylindrical body 1, and each lead &12 is made of, for example, iron, nickel, or an alloy thereof, and the surface thereof is coated with platinum. By cladding, it is formed as an elongated linear body,
The distal end thereof is inserted into the cylindrical body l with an insertion length of, for example, about 0.75 intestinal layers.
３．３は各リード線２の先端側を筒体１内に接合した導
電性ペーストを示し、該各ペースト３は筒体ｌの両端か
ら該筒体ｌの内周面と各リード線２との間を埋めるに十
分な量だけ筒体１内に注入した後、乾燥焼成されて、各
リード線２の先端側を筒体１に接合同君するようになっ
ている。ここで、該各ペースト３は、例えば金・白金ま
たは白金等の貴金属パウダ（重量比３０−４０％）と、
接着用のガラスフリット（重量比６０〜７０％）とに溶
剤を混合することにより予め所要の粘度をもって形成さ
れ、この溶剤には酢酸セルロース系、ポリビニルエチラ
ール等のポリマにシンナが含まれている。そして、前記
ガラスフリットとしては、例えば銅、ニッケル、ビスマ
ス等の金属酸化物（重量比７５〜８０％）とガラス材（
重量比１５〜２０％）とからなるミックスポンドタイプ
或いはガラス材のみからなるガラスポンドタイプが用い
られ、各ガラス材はそれぞれ硼珪酸系鉛ガラス等の非晶
質ガラスによって構成されている。3.3 shows a conductive paste in which the tip end side of each lead wire 2 is joined inside the cylinder 1, and each paste 3 connects the inner peripheral surface of the cylinder l and each lead wire 2 from both ends of the cylinder l. After injecting a sufficient amount into the cylindrical body 1 to fill the gaps, it is dried and fired, so that the tip end of each lead wire 2 is joined to the cylindrical body 1. Here, each paste 3 includes, for example, noble metal powder such as gold, platinum, or platinum (30-40% by weight),
It is formed in advance to the required viscosity by mixing a solvent with glass frit for adhesion (60-70% by weight), and this solvent contains thinner in polymers such as cellulose acetate and polyvinyl ethylal. . As the glass frit, for example, metal oxides such as copper, nickel, and bismuth (75 to 80% by weight) and a glass material (
A mixed pond type consisting of 15 to 20% weight ratio) or a glass pond type consisting only of glass materials are used, and each glass material is made of amorphous glass such as borosilicate lead glass.
４は各リード線２間を接続するように、筒体１の外周側
に形成された抵抗体としての抵抗被膜を示し、該抵抗液
ＷＪ４は温度変化に敏感に反応してその抵抗値が変化す
る感温性抵抗体材料、例えば白金等を筒体ｌの外周面等
に真空蒸着、スパッタリングすることにより、ｌＯ〜２
０ＩＬ箇程度の厚み全程度て形成されている。そして、
該抵抗液１１５Ｉ４は前記白金層を真空蒸着またはスパ
ッタリングした後、レーザトリミング等の手段を用いて
螺旋状にカー／ ）され、このときに形成される螺旋状
のカフ）部５により、筒体１の外周を螺旋状に伸びて、
長尺の抵抗体として形成されるようになっている。なお
、第２図中では該抵抗被膜４を部分的に点線で示すこと
によって、螺旋状に伸びることを明示するようにしてい
る。また、該抵抗被膜４の両端４Ａ 、４Ａ側は各リー
ド線２の外周面まで伸びて、これに接続されている。4 indicates a resistance coating as a resistor formed on the outer circumferential side of the cylinder 1 so as to connect between each lead wire 2, and the resistance liquid WJ4 sensitively reacts to temperature changes and its resistance value changes. By vacuum-depositing and sputtering a temperature-sensitive resistor material such as platinum on the outer peripheral surface of the cylinder l,
The entire thickness is approximately 0IL. and,
After the platinum layer is vacuum-deposited or sputtered, the resistive liquid 115I4 is curled into a spiral shape using means such as laser trimming, and the spiral cuff 5 formed at this time causes the cylindrical body 1 Extending in a spiral around the outer circumference of
It is designed to be formed as a long resistor. In addition, in FIG. 2, the resistive coating 4 is partially indicated by dotted lines to clearly indicate that it extends in a spiral shape. Further, both ends 4A and 4A side of the resistive coating 4 extend to the outer peripheral surface of each lead wire 2 and are connected thereto.
さらに、６は抵抗液１５ｇ４の周囲を被覆した保護膜を
示し、該保護膜６は耐熱性を有するガラス等の絶縁性材
料によって形成され、抵抗液＠４の両端４Ａ 、４Ａ間
を全長に亘って覆うようになっている。そして、該保護
膜６は螺旋状のカット部５内を埋め、抵抗被膜４が該カ
ット部５の前、後で導通したりするのを防止すると共に
、該抵抗被膜４が経時変化したりするのを防止するよう
になっている。Furthermore, 6 indicates a protective film covering the periphery of the resistive liquid 15g4, and the protective film 6 is formed of an insulating material such as heat-resistant glass, and extends over the entire length between both ends 4A and 4A of the resistive liquid @4. It has to be covered. The protective film 6 fills the inside of the spiral cut portion 5 and prevents the resistive film 4 from becoming conductive before or after the cut portion 5, and also prevents the resistive film 4 from changing over time. It is designed to prevent
従来技術による熱ｋＱ流量計用抵抗素子は上述の如き構
成を有するもので、この抵抗素子は出力抵抗、温度補償
抵抗および流量調整抵抗（いずれも図示せず）と共にブ
リッジ回路を構成し、エンジン等の吸気通路途中に配設
される。そして、筒体ｌの外周側に設けられた抵抗被膜
４は両端４Ａ。A resistance element for a thermal kQ flowmeter according to the prior art has the above-mentioned configuration, and this resistance element forms a bridge circuit together with an output resistance, a temperature compensation resistance, and a flow rate adjustment resistance (all not shown), and is connected to an engine, etc. installed in the middle of the intake passage. The resistance coating 4 provided on the outer peripheral side of the cylinder l has both ends 4A.
４Ａ側で各リード線２と接続され、かつ螺旋状のカット
部５によって筒体ｌの外周を螺旋状に伸び、長尺の抵抗
体として形成されているから、各リード線２間に導通さ
れる電流により発熱体となって、所定の高温状態に常時
おかれる。Since it is connected to each lead wire 2 on the 4A side and extends spirally around the outer periphery of the cylinder l by the spiral cut portion 5, and is formed as a long resistor, conduction is established between each lead wire 2. The electric current causes it to become a heating element, and is constantly kept at a predetermined high temperature.
ここで、該抵抗被膜４は吸気通路内で吸入空気と保−１
膜６を介して常時接触して冷却されるから、吸入空気流
量の増減に応じてその冷却量も増減し、該抵抗被膜４の
抵抗値は変化しようとするが、このときに差動増幅器や
パワートランジスタ（いずれも図示せず）ｋ４によって
前記ブリッジ回路への供給電流を増減させ、該抵抗液［
４の発熱賃を前記冷却量に対応して増減させる。この結
果、該抵抗液ＩＮ！２４は所定の高温状態におかれて、
その抵抗値は一定に保たれる。そして、前記ブリッジ回
路中の出力抵抗は供給電流の増減に応じて両端電圧が変
化し、これは吸入空気流量の増減に対応して変化するか
ら、この両端電圧によって吸入空気流量は計測（検出）
可能となる。Here, the resistance coating 4 is used to maintain the intake air and the -1 in the intake passage.
Since it is constantly in contact with and cooled through the membrane 6, the amount of cooling increases or decreases according to the increase or decrease of the intake air flow rate, and the resistance value of the resistive film 4 tends to change, but at this time, the differential amplifier or A power transistor (none of which is shown) k4 increases or decreases the current supplied to the bridge circuit, and the resistance liquid [
4, the heat generation rate is increased or decreased in accordance with the cooling amount. As a result, the resistance liquid IN! 24 is placed in a predetermined high temperature state,
Its resistance value remains constant. The voltage at both ends of the output resistance in the bridge circuit changes in response to an increase or decrease in the supply current, and this changes in response to an increase or decrease in the intake air flow rate, so the intake air flow rate is measured (detected) based on this voltage across the bridge circuit.
It becomes possible.
然るに、上述した従来技術では、前記貴金属パウダ、ガ
ラスフリット等の組成物からなる導電性ペースト３を用
いて筒体ｌに各リード線２を接合しているから、該各リ
ード線２の引抜き強度が弱く、例えば５００〜８００ｇ
程度の引張力を各リード線２間に加えると、該各リード
線２が筒体ｌから脱落してしまい、製造時や実装時にお
ける信頼性を向上できないという欠点がある。However, in the prior art described above, each lead wire 2 is bonded to the cylindrical body l using the conductive paste 3 made of a composition such as the noble metal powder and glass frit, so that the pull-out strength of each lead wire 2 is low. is weak, e.g. 500-800g
If a certain amount of tensile force is applied between the lead wires 2, the lead wires 2 will fall off from the cylindrical body l, resulting in a drawback that reliability cannot be improved during manufacturing or mounting.
本発明は上述した従来技術の欠点に鑑みなされたもので
、本発明は従来技術で用いている導電性ペーストに対し
て所定量の結晶化ガラスを添加することにより、接合強
度、即ちリード線の引抜き強度を確実に向上できるよう
にした抵抗素子用導電性ペーストを提供するものである
。The present invention was made in view of the above-mentioned drawbacks of the prior art.The present invention improves the bonding strength, that is, the lead wire strength by adding a predetermined amount of crystallized glass to the conductive paste used in the prior art. An object of the present invention is to provide a conductive paste for a resistive element that can reliably improve the drawing strength.
上述した問題点を解決するために本発明は、抵抗素子本
体にリード線を接合するため、貴金属パウダと、少なく
とも非晶質ガラスを含んだ接着用のガラスフリットと、
溶剤とからなる抵抗素子用導電性ペーストにおいて、前
記貴金属パウダとガラスフリットとの合計重量に対し、
所定重量比の結晶化ガラスを添加してなる構成を採用し
ている。In order to solve the above-mentioned problems, the present invention includes a noble metal powder and an adhesive glass frit containing at least amorphous glass, in order to bond a lead wire to a resistance element main body.
In the conductive paste for resistive elements consisting of a solvent, the total weight of the noble metal powder and glass frit is
A structure in which a predetermined weight ratio of crystallized glass is added is adopted.
ここで、前記結晶化ガラスとしては硼珪酸系の結晶化ガ
ラスが用いられ、その重量比は１〜５０％程度に選定さ
れる。Here, borosilicate-based crystallized glass is used as the crystallized glass, and its weight ratio is selected to be about 1 to 50%.
貴金属パウダとガラスフリットとの合計重量に対し、所
定重量比の結晶化ガラスを添加したから、ガラスフリッ
トの非晶質ガラスと結晶化ガラスとが混合するようにな
り、焼成時にこれらが結晶化して、結合強度を高めるこ
とができる。Since a predetermined weight ratio of crystallized glass is added to the total weight of the noble metal powder and glass frit, the amorphous glass and crystallized glass of the glass frit will be mixed, and they will crystallize during firing. , the bond strength can be increased.
以下、本発明の実施例を第１図に基づいて説明する。な
お、実施例では前述した第２図に示す従来技術と同一の
構成要素に同一の符号を付し、その説明を省略するもの
とする。Embodiments of the present invention will be described below with reference to FIG. In this embodiment, the same components as those of the prior art shown in FIG. 2 described above are denoted by the same reference numerals, and their explanations will be omitted.
図中、１１．１１は筒体１の両端側に各リード線２を接
合した導電性ペーストを示し、該各ペースト１１は従来
技術で述べた各ペースト３とほぼ同様に形成され、筒体
１内に注入した後に乾燥焼成されて、各リード線２の先
端側を筒体ｌに接合固着するようになっている。然るに
、該各ペースト１１は従来技術で用いている金・白金ま
たは白金等の貴金属パウダと硼珪酸系鉛ガラス等の非晶
質ガラスを含んだ接着用のガラスフリットとポリマ等の
溶剤とからなる導電性ペースト３に対して、所定量の結
晶化ガラス、例えば硼珪酸系の結晶化ガラス等を添加す
ることによって構成されている。In the figure, reference numerals 11 and 11 indicate conductive pastes in which lead wires 2 are bonded to both ends of the cylindrical body 1. Each paste 11 is formed in substantially the same manner as each paste 3 described in the prior art, and the cylindrical body 1 After being injected into the cylindrical body 1, the lead wires 2 are dried and fired so that the tip end of each lead wire 2 is bonded and fixed to the cylindrical body 1. However, each paste 11 is made of a noble metal powder such as gold, platinum or platinum used in the prior art, a glass frit for adhesion containing amorphous glass such as borosilicate lead glass, and a solvent such as a polymer. It is constructed by adding a predetermined amount of crystallized glass, such as borosilicate-based crystallized glass, to the conductive paste 3.
ここで、硼珪酸系の結晶化ガラスの添加量としては前記
貴金属パウダとガラスフリットとの合計重量に対し、そ
の重量比が１〜５０％程度の範囲内となるように適宜に
選定される。そして、下記の表にも示す通り、添加する
硼珪酸系結晶化ガラスの重量比を９％とした場合には、
該各ペースト１１の接合強度、即ち各リード線２の引抜
き強度は１３００〜１６００ｇとなり、その重量比を１
７％または３４％とした場合には前記引抜き強度はそれ
ぞれ１６００〜１７００ｇまたは９００〜１４００ｇと
なることが確認された。また、前記ガラスフリットを硼
珪酸系鉛ガラス等の非晶質ガラスに替えて、硼珪酸系の
結晶化ガラスによって構成した場合には、導電性ペース
トの漏れ性が著しく悪くなる上に、貴金属パウダの焼結
温度とガラスの作業温度（焼結温度）とがほとんど等し
くなって、貴金属パウダの焼結が損なわれ、引抜き強度
は逆に低下することが確認された。Here, the amount of the borosilicate-based crystallized glass added is appropriately selected so that its weight ratio is within the range of about 1 to 50% with respect to the total weight of the noble metal powder and glass frit. As shown in the table below, when the weight ratio of the borosilicate crystallized glass to be added is 9%,
The bonding strength of each paste 11, that is, the pull-out strength of each lead wire 2 is 1300 to 1600 g, and the weight ratio is 1
It was confirmed that when it was set to 7% or 34%, the above-mentioned pull-out strength was 1600 to 1700 g or 900 to 1400 g, respectively. In addition, when the glass frit is made of borosilicate-based crystallized glass instead of an amorphous glass such as borosilicate-based lead glass, the leakage of the conductive paste becomes significantly worse, and the precious metal powder It was confirmed that the sintering temperature of the glass and the working temperature (sintering temperature) of the glass became almost equal, impairing the sintering of the precious metal powder and conversely reducing the drawing strength.
なお、第１図中では省略しているが、筒体ｌの外周側等
には従来技術と同様に抵抗被膜４が形成され、該抵抗被
膜４に螺旋状のカット部５を形成し起抜、その上から保
護膜６が形成され、熱線流量計用の抵抗素子として製造
される。Although not shown in FIG. 1, a resistive coating 4 is formed on the outer circumferential side of the cylindrical body l, etc., as in the prior art, and a spiral cut portion 5 is formed in the resistive coating 4 to form an upholstery. A protective film 6 is formed thereon, and a resistive element for a hot wire flowmeter is manufactured.
次に、上述の如く構晟される本実施例の作用について下
記の表を参照しつつ説明する。なお、この表に示す試験
結果は、各リード線２の両端側を引張試験機等で矢示Ａ
、Ａ方向に順次所定の荷重で引張ることによって、該各
リード線２が筒体ｌから引抜かれたときの荷重量を引抜
き強度として示している。そして、添加量は従来技術で
用いているペースト３の貴金属パウダとガラスフリット
との合計重量に対し、添加される硼珪酸系結晶化ガラス
の重量比を示している。また、試験自体は室温状態で行
われたもので、従来技術のものは引抜き強度のみを示す
ものとする。Next, the operation of this embodiment constructed as described above will be explained with reference to the table below. In addition, the test results shown in this table are based on the results of testing both ends of each lead wire 2 using a tensile tester, etc., as indicated by the arrow A.
, the amount of load when each lead wire 2 is pulled out from the cylindrical body l by sequentially pulling it in the A direction with a predetermined load is shown as the pull-out strength. The amount added indicates the weight ratio of the borosilicate-based crystallized glass added to the total weight of the noble metal powder and glass frit of the paste 3 used in the prior art. Further, the test itself was conducted at room temperature, and the conventional test shows only the pull-out strength.
表 試験結果
ト記表からも明らかなように、本実施例によれば、例え
ば１７％！ＩＩ量比の硼珪酸系結晶化ガラスを従来技術
で用いているペースト３に添加して導電性ペース）１１
を形成し、該ペースト１１によって各リード線２を筒体
ｌに接合固着することにより、該各リード＆１２の引抜
き強度を１６００〜１７００ｇまで高めることができ、
この引抜き強度を従来技術のものと比較して２倍以上向
上できることが確認された。As is clear from the table showing the test results, according to this example, for example, 17%! A conductive paste (conductive paste) 11 is obtained by adding borosilicate-based crystallized glass in an amount ratio of II to the paste 3 used in the conventional technology.
By forming and fixing each lead wire 2 to the cylindrical body l using the paste 11, the pull-out strength of each lead &12 can be increased to 1600 to 1700 g,
It was confirmed that this pull-out strength could be improved by more than twice as compared to that of the prior art.
さらに、第１図に示した状態のものを、例えば５００度
の高温中において同様の引張試験を行った結果、従来技
術のものは５０〜１００ｇまで低下するのに対し、本実
施例のものは上記表と同等の結果が得られることが確認
された。これは、ガラスフリットの非晶質ガラス中に結
晶化ガラスを混合することにより、筒体１やリード＠２
に対する導電性ペースト１１の漏れ性や貴金属パウダの
焼結作用を向上できるばかりでなく、ガラスが結晶化す
ることにより、ガラス自体の高温状態における接着強度
が向上し、接合強度、引抜き強度を高めるように作用す
ることが理由として挙げられる。Furthermore, as a result of conducting a similar tensile test on the product in the state shown in FIG. It was confirmed that results equivalent to those in the above table could be obtained. This is achieved by mixing crystallized glass into the amorphous glass of the glass frit.
Not only can the leakage of the conductive paste 11 and the sintering effect of the noble metal powder be improved, but also the crystallization of the glass improves the adhesive strength of the glass itself at high temperatures, increasing the bonding strength and the pull-out strength. The reason for this is that it acts on
なお、前記実施例では、筒体ｌの両端側に導電性ペース
）１１を用いて各リード線２を接合した後、筒体ｌの外
周側等に抵抗液＠４を形成するものとして述べたが、こ
れに替えて、予め抵抗被膜４を形成した後に、筒体１の
両端側に導電性ペースト１１を用いて各リード線２を接
合するようにしてもよい、また、前述した抵抗素子は熱
線抵抗以外に温度補償抵抗等にも使用可能である。In the above embodiment, after each lead wire 2 is joined to both ends of the cylinder l using conductive paste 11, the resistance liquid @4 is formed on the outer peripheral side of the cylinder l. However, instead of this, each lead wire 2 may be bonded to both ends of the cylindrical body 1 using conductive paste 11 after forming the resistive film 4 in advance. In addition to hot wire resistance, it can also be used for temperature compensation resistance, etc.
以上詳述した通り、本発明によれば、従来技術で用いて
いる導電性ペーストに対して所定重量比の結晶化ガラス
を添加したから、非晶質ガラスに結晶化ガラスが混合し
て、当該ペーストの乾燥焼成時にこれらのガラスが結晶
化するようになり、接着強度が向上し、接合強度、即ち
リード線の引抜き強度を確実に向上させることができ、
抵抗素子の製造時や実装時等における信頼性を高めるこ
とができる等、種々の効果を奏することができる。As detailed above, according to the present invention, since a predetermined weight ratio of crystallized glass is added to the conductive paste used in the prior art, the crystallized glass is mixed with the amorphous glass. When the paste is dried and fired, these glasses crystallize, improving the adhesive strength and reliably improving the bonding strength, that is, the pull-out strength of the lead wire.
Various effects can be achieved, such as improving reliability during manufacturing and mounting of the resistance element.
第１図は本発明の実施例によるペーストを用いて筒体に
リード線を接合した状態を示す縦断面図、第２図は従来
技術の抵抗素子を示す縦断面図である。
１・・・筒体（抵抗素子本体）、２・・・リード線。
１１・・・導電性ペースト。FIG. 1 is a longitudinal sectional view showing a state in which a lead wire is joined to a cylinder using a paste according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a conventional resistance element. 1... Cylindrical body (resistance element body), 2... Lead wire. 11... Conductive paste.
Claims (3)
パウダと、少なくとも非晶質ガラスを含んだ接着用のガ
ラスフリットと、溶剤とからなる抵抗素子用導電性ペー
ストにおいて、前記貴金属パウダとガラスフリットとの
合計重量に対し、所定重量比の結晶化ガラスを添加した
ことを特徴とする抵抗素子用導電性ペースト。(1) In order to bond a lead wire to a resistor element body, a conductive paste for a resistor element is composed of a noble metal powder, a glass frit for adhesion containing at least amorphous glass, and a solvent. A conductive paste for a resistance element, characterized in that a predetermined weight ratio of crystallized glass is added to the total weight of the paste and the frit.
る特許請求の範囲（１）項記載の抵抗素子用導電性ペー
スト。(2) The conductive paste for a resistance element according to claim (1), wherein the crystallized glass is a borosilicate-based crystallized glass.
許請求の範囲（１）項記載の抵抗素子用導電性ペースト
。(3) The conductive paste for a resistance element according to claim (1), wherein the weight ratio of the crystallized glass is 1 to 50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62099182A JPS63263701A (en) | 1987-04-22 | 1987-04-22 | Conductive paste for resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62099182A JPS63263701A (en) | 1987-04-22 | 1987-04-22 | Conductive paste for resistance element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63263701A true JPS63263701A (en) | 1988-10-31 |
| JPH0573321B2 JPH0573321B2 (en) | 1993-10-14 |
Family
ID=14240512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62099182A Granted JPS63263701A (en) | 1987-04-22 | 1987-04-22 | Conductive paste for resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63263701A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153415A (en) * | 1994-11-29 | 1996-06-11 | Futaba Corp | Conductive paste |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298985U (en) * | 1985-12-05 | 1987-06-24 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5883073A (en) * | 1981-11-11 | 1983-05-18 | Shoei Kagaku Kogyo Kk | Electrically conductive paint |
-
1987
- 1987-04-22 JP JP62099182A patent/JPS63263701A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298985U (en) * | 1985-12-05 | 1987-06-24 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153415A (en) * | 1994-11-29 | 1996-06-11 | Futaba Corp | Conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0573321B2 (en) | 1993-10-14 |
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