JPS632617A - Dielectric fluid - Google Patents
Dielectric fluidInfo
- Publication number
- JPS632617A JPS632617A JP14366686A JP14366686A JPS632617A JP S632617 A JPS632617 A JP S632617A JP 14366686 A JP14366686 A JP 14366686A JP 14366686 A JP14366686 A JP 14366686A JP S632617 A JPS632617 A JP S632617A
- Authority
- JP
- Japan
- Prior art keywords
- water
- compound
- fluid
- shows
- dielectric fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 24
- 239000000126 substance Substances 0.000 claims abstract description 9
- 239000007864 aqueous solution Substances 0.000 claims abstract description 4
- -1 aliphatic organic compound Chemical class 0.000 claims abstract description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract 2
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract 2
- 239000001257 hydrogen Substances 0.000 claims abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 238000003754 machining Methods 0.000 abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000003456 ion exchange resin Substances 0.000 abstract description 5
- 229920003303 ion-exchange polymer Polymers 0.000 abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 2
- 239000002480 mineral oil Substances 0.000 description 2
- 235000010446 mineral oil Nutrition 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920001661 Chitosan Polymers 0.000 description 1
- 229920002907 Guar gum Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229940117913 acrylamide Drugs 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 235000010417 guar gum Nutrition 0.000 description 1
- 239000000665 guar gum Substances 0.000 description 1
- 229960002154 guar gum Drugs 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004260 weight control Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(発明の利用分野)
本発明は、電極と被工作物との間に断続的な放電を行な
わせて放電加工を行う際、電極と被加工物との間に介在
させるための電気加工液に関する。Detailed Description of the Invention (Field of Application of the Invention) The present invention is directed to an electric discharge machining process in which electrical discharge machining is performed by intermittent electric discharge between the electrode and the workpiece. The present invention relates to electroworking fluids for use in electrical processing.
(従来の技術)
放電加工は作業用電極と導電性被工作物との間の絶縁性
媒体内で断続的に火花放電させることにより、対象物に
形彫を施したり、孔を穿ったり、又は対象物を切断した
りする技術である。そしてこの技術は、対象物の硬度に
影雷されないこと。(Prior art) Electrical discharge machining is a method of carving, drilling, or drilling holes in a workpiece by intermittently discharging sparks within an insulating medium between a working electrode and a conductive workpiece. This is a technique for cutting objects. This technique is not affected by the hardness of the object.
表面粗さ±0.2)41又はそれ以下の鏡面仕上に近い
加工精度を期待できること等の特徴を買われて、今日各
科の金属加工に広く利用されている。Today, it is widely used in various types of metal processing due to its features such as the ability to achieve a surface roughness of ±0.2) 41 or less, which is close to mirror-finish processing accuracy.
従来では、上の絶縁性媒体として、主として鉱油(ケロ
シン)が使用されてきた。しかしこの鉱油には引火性が
あるため、無人的に連続加工を行なう場合には火災発生
の危険がある。そこで近来に至り純水の使用が試みられ
るようになった。しかしながら、水は加工速度が早い反
面、電極を消耗させるという欠点がある。そこで最近で
は、水中に種々の分子量制御物質を添加することが検討
され、例えばエチレングリコール、プロピレングリコー
ル、ポリエチレングリコール、ポリアルキルエーテルな
どのグリコール類若しくはそれらの誘導体又は高級アル
コール等の非イオン性物質2ポリアクリル酸、アクリル
アミド、グアーガム又はアルギン酸ナトリウム等のアニ
オン性物質或はキトサン、ポリアクリルアミド又はメタ
アクリル酸エステル等のカチオン性物質の添加が提案さ
れている(例えば特公昭59−4253号公報参照)。Traditionally, mineral oil (kerosene) has been primarily used as the above insulating medium. However, since this mineral oil is flammable, there is a risk of fire if continuous unmanned processing is performed. Therefore, in recent years, attempts have been made to use pure water. However, although water has a high processing speed, it has the disadvantage that it wears out the electrode. Therefore, recently, the addition of various molecular weight control substances to water has been considered, such as glycols such as ethylene glycol, propylene glycol, polyethylene glycol, and polyalkyl ether, or their derivatives, or nonionic substances such as higher alcohols. It has been proposed to add an anionic substance such as polyacrylic acid, acrylamide, guar gum or sodium alginate, or a cationic substance such as chitosan, polyacrylamide or methacrylic acid ester (see, for example, Japanese Patent Publication No. 59-4253).
しかしこのようにしても、電極消耗比は精々3%程度ま
でしか低下しない(上記公報2図参照)、シかるに形彫
り加工や孔明は加工において、充分な加工精度を得るた
めには、電極消耗率が精々1%未満であることが絶対条
件となるため、公知の水性加工液は、実用性の点でいづ
れも不満である。However, even with this method, the electrode consumption ratio will only decrease to about 3% at most (see Figure 2 of the above publication).In die-sinking and drilling, however, in order to obtain sufficient machining accuracy, the electrode Since it is an absolute requirement that the consumption rate be at most less than 1%, all known aqueous machining fluids are unsatisfactory in terms of practicality.
(発明の目的)
本発明は、電極消耗率が画期的に低く、長時間に亘り連
続使用しても、鎖車を精々1%又はそれ未満に保つこと
ができる水性電気加工液を提供するのを目的とする。(Objective of the Invention) The present invention provides an aqueous electrical machining fluid that has an extremely low electrode consumption rate and can maintain the chain wheel at 1% or less even when used continuously for a long period of time. The purpose is to
(目的達成のための手段)
本発明者は、多数の新規及び公知の非イオン性高分子物
質について精力的な研究を行なった結果、
(1)化学式。(Means for Achieving the Object) As a result of intensive research on a large number of new and known nonionic polymer substances, the present inventor has found (1) Chemical formula.
で示される水溶性のビス(ポリオキシアルキレン)化合
物(以下、[化合物(I)」という)が、水性電気加工
液の成分として極めて好適であることを見出した。It has been found that the water-soluble bis(polyoxyalkylene) compound represented by (hereinafter referred to as "compound (I)") is extremely suitable as a component of an aqueous electroworking fluid.
ここに化合物(I)の主鎖を構成するのは炭素数3以上
の二価脂肪族有機化合物の残基でありて、具体的には例
えば以下の基を言う。What constitutes the main chain of compound (I) here is the residue of a divalent aliphatic organic compound having 3 or more carbon atoms, and specifically refers to the following groups, for example.
C,I3 (p)−7エニレン。C, I3 (p)-7 enylene.
以下、化合物CI)に属する代表的な高分子化合物類を
例示する。Typical polymer compounds belonging to compound CI) are illustrated below.
OH3
HO(CH2CH20) s −C)12 C−CH2
0(CH2CH20) 5−)1OH3
HO(CHC:ToO)2(CH2CH20)5−CH
2CH2(CH2CH20)5−C)I3
− (C)120HO) 2 )I
2H5
HO(C)12cH20)ucHGHzO(CH2CH
20boH2I5
HO(CH2H20)l (GHzCH20)+o−
C:>−0(OH2C)I2Q)+o−2I5
− (GHz CHO) + H
HO(CI2CH20)+o−0−0(OH2C)12
0)+oHHO(CH2CH20)15 G’H2C
ミCGH20(C)I2GHz)+5Mなお、本発明に
おいては1以上化合物(I)に屈する各化合物を、必要
に応じ単独で又は組合せて使用することができる。OH3 HO(CH2CH20) s -C)12 C-CH2
0(CH2CH20) 5-)1OH3 HO(CHC:ToO)2(CH2CH20)5-CH
2CH2(CH2CH20)5-C)I3-(C)120HO)2)I2H5HO(C)12cH20)ucHGHzO(CH2CH
20boH2I5 HO(CH2H20)l (GHzCH20)+o-
C:>-0(OH2C)I2Q)+o-2I5-(GHz CHO)+H HO(CI2CH20)+o-0-0(OH2C)12
0)+oHHO(CH2CH20)15 G'H2C
Note that in the present invention, one or more compounds that are compatible with compound (I) can be used alone or in combination as necessary.
本発明加工液を調製するには、予め水をイオン交換樹脂
で処理してその比抵抗が104Ω・Cm以上となる如く
処理した後、これに化合物(I)の適量を添加し、撹拌
、溶解させる。好ましい濃度は05〜65%であるが、
この際要すれば少量の防錆剤を添加してもよい、なお、
以上の調製操作に際し、イオン交換樹脂処理を最後に行
なうこともできる。To prepare the processing fluid of the present invention, water is treated in advance with an ion exchange resin so that its specific resistance becomes 104Ω・Cm or more, and then an appropriate amount of compound (I) is added thereto, stirred, and dissolved. let The preferred concentration is 05-65%,
At this time, a small amount of rust preventive agent may be added if necessary.
In the above preparation operations, ion exchange resin treatment can also be carried out at the end.
(実施例)
以下、実施例により発明実施の態様を説明するが、例示
が直接発明思想の内包・外延を限るものでないことは当
然である。(Examples) Hereinafter, embodiments of the invention will be explained using examples, but it goes without saying that the examples do not directly limit the connotation and extension of the inventive idea.
実施例1
[加工液の調製]
前掲化合物群1〜4に属する化合物を水に溶解後、イオ
ン交換樹脂を通して2X10SΩ・cmの比抵抗値を示
すように調製して試験用加工液とした。Example 1 [Preparation of processing liquid] Compounds belonging to the above-mentioned compound groups 1 to 4 were dissolved in water, and then passed through an ion exchange resin to prepare a specific resistance value of 2×10 SΩ·cm to prepare a test processing liquid.
[使用化合物] 下表−1として示す。[Compound used] It is shown in Table 1 below.
(以下余白) 表1 [実験条件] 下表−2に示す。(Margin below) Table 1 [Experimental conditions] It is shown in Table 2 below.
表−2
[結果]
第1図乃至第3図の曲線Aが示す通り、表−1の化合物
群中、化合物(I)に属するA−1乃至A−4の各化合
物を用いた加工液は、加工速度、電極消耗率及び耐久性
のいづれにおいても、対照化合物C−1及びC−2を使
用した対照加工液に比し卓越した#、!aを示している
事実が窺知される。Table 2 [Results] As shown by curves A in Figures 1 to 3, the processing fluids using compounds A-1 to A-4 belonging to compound (I) in the compound group in Table 1 were #, which is superior to the control processing liquid using control compounds C-1 and C-2 in terms of processing speed, electrode wear rate, and durability. The fact that indicates a is evident.
実施例2
表−1の化合物を、予めイオン交換樹脂を用いて脱塩さ
れた純水に溶かした水溶液を加工液とし、以下の条件に
てワイヤカット加工を実施した。Example 2 Using an aqueous solution prepared by dissolving the compounds shown in Table 1 in pure water that had been previously desalinated using an ion exchange resin as a working liquid, wire cutting was carried out under the following conditions.
使用機種:ソディック社製 330−W加工電極:ワイ
ヤFKHφ0.2mm
被加工物:5KD−1120Am厚
加工条件:
ワイヤ送り速度 5m/分
加工液抵抗値 3 X 104Ω・C11電圧
35V
電流 10A
結果は第4図に示される0図示の如く、表−1の化合物
群中、化合物(I)に属するA−1乃至A−4の各化合
物を用いた加工液は、対照化合物C−1及びC−2を用
いた対照液に比し卓越した加工速度を示すことが分る。Model used: Sodick 330-W Processing electrode: Wire FKHφ0.2mm Workpiece: 5KD-1120Am thickness Processing conditions: Wire feed speed 5m/min Processing fluid resistance value 3 x 104Ω・C11 voltage
35V Current 10A The results are shown in Figure 4. As shown in Figure 4, the processing fluids using each of the compounds A-1 to A-4 belonging to compound (I) in Table 1 were compared to the control compound C. It can be seen that the processing speed is excellent compared to the control solutions using -1 and C-2.
(効果)
以上説明した如く、本発明に係る電気加工液は、電極消
耗率のみならず、加工速度及び耐久性において公知の水
性加工液に優越するので、金属加工技術の発展に大きく
寄与しうる。(Effects) As explained above, the electroworking fluid according to the present invention is superior to known aqueous working fluids not only in terms of electrode wear rate but also in machining speed and durability, so it can greatly contribute to the development of metalworking technology. .
第1図乃至第3図は、形彫加工について本発明加工液と
公知加工液を加工速度及び′心極消j(率について対比
したグラフ、第4図は、ワイヤカット加工について本発
明加工液と公知加工液を加工速度について対比したグラ
フである。なお、図中A(−0−)で示される曲線は本
願化合物使用の場合を、またC(−φ−)で示される曲
線は対照化合物使用の場合を示す。
特許出願人 株式会社 ソディ ツク同 第−工業
製薬株式会社
集3 図
服工gf用時間(Hr s)
fABa物水溶液瀝度%
・W 冒 郭 凹 モ 富Figures 1 to 3 are graphs comparing the machining fluid of the present invention and the known machining fluid for die-sinking machining in terms of machining speed and center pole extinction rate. This is a graph comparing the machining speed with known machining fluid.In the figure, the curve indicated by A(-0-) is for the case of using the compound of the present application, and the curve indicated by C(-φ-) is for the case of using the control compound. Cases of use are shown. Patent applicant: Sodiktsu Co., Ltd. No. 3 - Kogyo Seiyaku Co., Ltd. Collection 3 Time for gf (Hrs) % purity of fABa aqueous solution
Claims (2)
。(1) Chemical formulas, ▲ Numerical formulas, chemical formulas, tables, etc. ▼------- (I) [However, the meaning of each symbol in the above formula is as follows: - R_1: Hydrogen or methyl group or ethyl group. R_2: Residue of a divalent aliphatic organic compound having 3 or more carbon atoms. n: an integer of 1 or more (average value)] An electroworking fluid containing a water-soluble compound shown as an essential component.
である特許請求の範囲第1項記載の電気加工液。(2) The electroworking fluid according to claim 1, which is an aqueous solution containing 0.5 to 65% of compound (I).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14366686A JPS632617A (en) | 1986-06-18 | 1986-06-18 | Dielectric fluid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14366686A JPS632617A (en) | 1986-06-18 | 1986-06-18 | Dielectric fluid |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS632617A true JPS632617A (en) | 1988-01-07 |
Family
ID=15344109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14366686A Pending JPS632617A (en) | 1986-06-18 | 1986-06-18 | Dielectric fluid |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS632617A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5081333A (en) * | 1989-03-17 | 1992-01-14 | Mitsubishi Denki Kabushiki Kaisha | Electric discharge machining fluid with a fatty acid amide additive for rust inhibition |
US7510103B2 (en) | 2001-06-16 | 2009-03-31 | Musashi Engineering, Inc. | Device for delivering fixed quantity of liquid |
-
1986
- 1986-06-18 JP JP14366686A patent/JPS632617A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5081333A (en) * | 1989-03-17 | 1992-01-14 | Mitsubishi Denki Kabushiki Kaisha | Electric discharge machining fluid with a fatty acid amide additive for rust inhibition |
US7510103B2 (en) | 2001-06-16 | 2009-03-31 | Musashi Engineering, Inc. | Device for delivering fixed quantity of liquid |
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