JPS63258927A - Polyamideimide - Google Patents

Polyamideimide

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Publication number
JPS63258927A
JPS63258927A JP9209787A JP9209787A JPS63258927A JP S63258927 A JPS63258927 A JP S63258927A JP 9209787 A JP9209787 A JP 9209787A JP 9209787 A JP9209787 A JP 9209787A JP S63258927 A JPS63258927 A JP S63258927A
Authority
JP
Japan
Prior art keywords
acid
reaction
amide
diaminodiphenylsulfone
polyamideimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9209787A
Other languages
Japanese (ja)
Other versions
JPH0466895B2 (en
Inventor
Hiroo Inada
稲田 博夫
Shunichi Matsumura
俊一 松村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP9209787A priority Critical patent/JPS63258927A/en
Publication of JPS63258927A publication Critical patent/JPS63258927A/en
Publication of JPH0466895B2 publication Critical patent/JPH0466895B2/ja
Granted legal-status Critical Current

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  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE:To obtain a polyamideimide with specified intrinsic viscosity, capable of melt forming, outstanding in mechanical properties, heat and chemical resistances, etc., by reaction between an imidedicarboxylic acid (derivative) and diaminodiphenylsulfone (derivative). CONSTITUTION:The objective polyamideimide having >=50 (pref. >=60)mol.% of recurring unit of formula II with an intrinsic viscosity of >=0.3 (pref. >=0.4), can be obtained by reaction, pref. in the presence of catalyst and stabilizer, at 200-350 deg.C, between (A) an imidedicarboxylic acid of formula I (n is 2-12, pref. even number, esp. 6) and/or its amide-forming derivative (e.g., alkyl ester) and (B) diaminodiphenylsulfone and/or its amide-forming derivative (e.g., N,N'- diacyl diaminodiphenylsulfone) in such a ratio that the whole carboxylic acid equivalent be equal to the whole amine equivalent.

Description

【発明の詳細な説明】 島、産業上の利用分野 本発明は、新規なポリアミドイミドに関し、更に詳しく
は溶融成形が可能で、機械的特性。
DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a novel polyamideimide, more particularly one that is melt-formable and has excellent mechanical properties.

耐熱性、耐薬品性および寸法安定性等に優れ、エンジニ
アリングプラスチックスとして有用な新規なポリアミド
イミドに関するものである。
This invention relates to a novel polyamide-imide that has excellent heat resistance, chemical resistance, dimensional stability, etc., and is useful as engineering plastics.

b、従来技術 近年、溶融成形が可能で機械的特注、耐熱性等の優れた
樹脂としてポリエルチルイミド、ポリエーテルスルホン
、ポリエーテルケトン等のポリマーが開発されたが、こ
れら樹脂の中で成形寸法安定性の優れた非品性の樹脂は
他方の結晶性のものに比べ耐薬品性に於て問題があるこ
とが知られている。一般にポリマーの極性の高いもの程
耐薬品性は向上する傾向にあり、その目的からはポリア
ミド、ポリアミドイミド等が望ましい。特に耐熱性等の
面から無水トリメリット酸を原料として用いたポリアミ
ドイミドが好ましく、種々検討されているが、アミン成
分として芳香族のものを用いるとポリマーの融点が高く
なりすぎ、成形困難なものとなり、また脂肪族系のもの
を用いるとTgなどが低くなり、耐熱性に問題があり、
そこで溶融成形可能なものとして、芳香族と脂肪族のア
ミン成分を併用するヨウナ試みr U8P  4348
513(特公表56−501883 ))がなされてい
る。しかし本発明者等の検討によれば、かかる例はいず
れも脂肪族アミン成分がアミドのアミンとして反応しう
る系であり、この様な場合には得られたポリマーの耐熱
安定性、成形安定性が著しく低下して好ましくないこと
がわかった。
b. Prior art In recent years, polymers such as polyerthylimide, polyethersulfone, and polyetherketone have been developed as resins that can be melt-molded and have excellent mechanical customization and heat resistance. It is known that non-grade resins with excellent stability have a problem in chemical resistance compared to crystalline resins. Generally, the more polar the polymer, the better the chemical resistance tends to be, and for that purpose, polyamide, polyamideimide, etc. are preferable. In particular, polyamideimide using trimellitic anhydride as a raw material is preferable from the viewpoint of heat resistance, and various studies have been conducted, but if an aromatic one is used as the amine component, the melting point of the polymer becomes too high, making it difficult to mold. Also, if aliphatic materials are used, the Tg etc. will be low and there will be problems with heat resistance.
Therefore, Yona attempted to use a combination of aromatic and aliphatic amine components as a melt-moldable product U8P 4348
513 (Japanese Patent Publication No. 56-501883)). However, according to the studies of the present inventors, all of these examples are systems in which the aliphatic amine component can react as an amide amine, and in such cases, the heat resistance stability and molding stability of the obtained polymer may be affected. was found to be unfavorable as it was markedly reduced.

C1発明の目的 そこで本発明の目的は、通常の溶融成形が可能でかつ機
械的特性1寸法安定性、耐熱性、耐薬品性等に浸れた新
規なポリアミドイミドを提供することにある。
C1 Object of the Invention Therefore, the object of the present invention is to provide a novel polyamide-imide that can be melt-molded in the usual manner and has excellent mechanical properties such as dimensional stability, heat resistance, and chemical resistance.

d0発明の構成および効果 本発明の目的は、本発明によれば下記式(I)・・・・
・・・・・・・・(I) 〔だだし、式中nは2〜12の整数である。〕で表わさ
れる繰り返し単位を主たる繰り返し単位とし、かつ固有
粘度0.3以上のポリアミドイミドによって達成される
d0 Structure and effect of the invention According to the invention, the object of the invention is the following formula (I)...
・・・・・・・・・(I) [In the formula, n is an integer from 2 to 12. ] is the main repeating unit, and the polyamide-imide has an intrinsic viscosity of 0.3 or more.

本発明のポリアミドイミドは上記式(I)で表わされる
単位を全繰り返し単位の少なくとも50モルチ、より好
ましくは少なくとも60モルチ含有する。くり返し単位
中 −N■r−CF”C2>+− の部分構造は、当然のことながら、左右が逆に結合した
単位も本発明のくり返し単位中て包含されるものとする
The polyamide-imide of the present invention contains at least 50 moles of the total repeating units, more preferably at least 60 moles of units represented by the above formula (I). Of course, the partial structure of -Nr-CF''C2>+- in the repeating unit also includes units in which the left and right sides are reversely bonded in the repeating unit of the present invention.

上記式に於てnは偶数であることが好ましく、就中n 
= 6のものが好ましい。
In the above formula, n is preferably an even number, especially n
= 6 is preferred.

50モルチ以下、より好ましくは60モル係以下の割合
で下記式(II) および、下記式(m) −oc−♂−CONH−R’−NH−・・・・・・・・
・・・・・・・(m)〔ただし、R3,R4は夫々前記
W、ぜと同義)および、下記式(IV) および、下記式(v) −QC−R6−NH−・・・・・・・・・・・・・・・
・・・・・・・・・・・・(V)で衣わされる繰り返し
単位が含有されていてもよい。
The following formula (II) and the following formula (m) -oc-♂-CONH-R'-NH- in a ratio of 50 molar or less, more preferably 60 molar or less
...... (m) [However, R3 and R4 are synonymous with the above-mentioned W and Ze, respectively) and the following formula (IV) and the following formula (v) -QC-R6-NH-...・・・・・・・・・・・・
・・・・・・・・・・・・A repeating unit coated with (V) may be contained.

上記炭素数2〜12のアルキレン基そC1〜+n〔ただ
し、れは2〜12の整数である〕とじては、  2,2
.4− )リメチルへキサメチレン。
The above alkylene group having 2 to 12 carbon atoms C1 to +n (wherein is an integer of 2 to 12) is 2,2
.. 4-) Limethylhexamethylene.

2.4.4− )リメテルへキサメチレン等が炭素数7
〜15のアラールキレン基としては ”% C)−an、−等が炭素数6〜15のシクロアル
キレン基としては、<→、 テモc2にγ等が、また、
炭素数6〜15のアリーレン基としてはC穐 −o−,−5o2−、−s−、−co−、−c賜−等で
ある)が例示される。
2.4.4-) Rimeterhexamethylene etc. has 7 carbon atoms
~15 aralkylene groups include "% C) -an, -, etc. as cycloalkylene groups having 6 to 15 carbon atoms, <→, temo c2 with γ, etc.
Examples of the arylene group having 6 to 15 carbon atoms include C-o-, -5o2-, -s-, -co-, -c-, and the like.

本発明のポリアミドイミドは固有粘度0.3以上である
ことが必要であり、0.3に満たない場合には機械的性
質が悪く好ましくない。より好ましくは0.4以上であ
る。
The polyamide-imide of the present invention needs to have an intrinsic viscosity of 0.3 or more, and if it is less than 0.3, the mechanical properties are poor and undesirable. More preferably it is 0.4 or more.

本発明の上記ポリアミドイミドは、下記式(VI)「こ
こで、nは2〜12の整数である。〕で表わされるイミ
ドジカルボン酸および/またはそのアミド形成性誘導体
、例えばアルキルエステル、アリールエステル酸ハロゲ
ン化物等(7)ジカルボン酸成分とジアミノジフェニル
スルホンおよび/またはそのアミド形成性誘導体、例え
ばN、N’−ジアシルジアミノジフェニルスルホンとを
反応せしめることによって製造することができる。
The polyamide-imide of the present invention is an imidodicarboxylic acid represented by the following formula (VI) "where n is an integer of 2 to 12" and/or an amide-forming derivative thereof, such as an alkyl ester or an aryl ester acid. It can be produced by reacting the dicarboxylic acid component (7) such as a halide with diaminodiphenylsulfone and/or its amide-forming derivative, such as N,N'-diacyldiaminodiphenylsulfone.

上記式(IV)で表わされるイミドジカルボン酸に於て
特に好ましいものはnが偶数の化合物であり、就中nが
6のものが好ましい。かかるイミドジカルボン酸は例え
ば、トリメリット酸無水物と対応するジアミンCN1’
b+CHt+ N%)とを従来公知のイミド化反応に付
すことによって極めて容易に製造することができる。
Among the imidodicarboxylic acids represented by the above formula (IV), particularly preferred are compounds in which n is an even number, particularly those in which n is 6. Such imidodicarboxylic acids include, for example, trimellitic anhydride and the corresponding diamine CN1'
b+CHt+N%) can be produced extremely easily by subjecting it to a conventionally known imidization reaction.

本発明のポリアミドイミドを製造する際には上記式(V
T)で表わされるイミドジカルボン酸を用いるのが最も
好ましいが、該イミドジカルボン酸のアミド形成性誘導
体も用いることができ、かかる誘導体としてはメチル、
エチル等の低級アルキルエステル及びフェニル、トリル
等のアリールエステルが例示される。
When producing the polyamideimide of the present invention, the above formula (V
It is most preferred to use imidodicarboxylic acids represented by T), but amide-forming derivatives of said imidodicarboxylic acids can also be used, such derivatives include methyl,
Examples include lower alkyl esters such as ethyl, and aryl esters such as phenyl and tolyl.

本発明に於て上記イミドジカルボン酸および/またはそ
のアミド形成性誘導体の一部(例えば30モルチ以下、
より好ましくは20モルチ以下の割合で他種ジカルボン
酸または/およびアミノカルボン酸および/またはこれ
らのアミド形成性誘導体で置きかえることもできる。か
かるカルボン酸としては例えばテレフタル酸。
In the present invention, a part of the imidodicarboxylic acid and/or its amide-forming derivative (for example, 30 mol or less,
More preferably, it can be replaced with other dicarboxylic acids or/and aminocarboxylic acids and/or amide-forming derivatives thereof in a proportion of 20 molar or less. Such carboxylic acids include, for example, terephthalic acid.

インフタル酸、ジフェニルエーテルジカルボン酸r シ
フェニルスルホンシカルrHンf9 、 :I ハク酸
、アジピン酸、セパチン酸、シクロヘキサンジカルボン
酸等が挙けられる。
Inphthalic acid, diphenyl ether dicarboxylic acid, cyphenylsulfonic acid, :I succinic acid, adipic acid, cepatic acid, cyclohexanedicarboxylic acid, and the like.

下記式(■) 〔ただし、式中R1は前記と同じである。〕で示される
ジカルボン酸、アミノ安息香酸。
The following formula (■) [However, R1 in the formula is the same as above. ] dicarboxylic acid, aminobenzoic acid.

下記式(VW) 〔ただし、tは前記と同じである。〕 で示されるアミノカルボン酸等が例示される。The following formula (VW) [However, t is the same as above. ] Examples include aminocarboxylic acids represented by the following.

本発明のポリアミドイミドは上記イミドジカルボン酸(
VI)を主たる成分とするカルボン酸成分および/また
はそのアミド形成性誘導体とジアミノジフェニルスルホ
ン酸および/またはそのアミド形成性誘導体とを反応せ
しめるととべよって得られるが、本発明ではジアミノジ
フェニルスルホンおよび/またはそのアミド形成性誘導
体の一部を例えば、50モルチ以下、より好ましくは3
0モルチ以下の割合で他種ジアミンおよび/またはその
アミド形成性誘導体で置き換えてもよい。
The polyamideimide of the present invention is the imidodicarboxylic acid (
It can be obtained by reacting a carboxylic acid component containing VI) as a main component and/or its amide-forming derivative with diaminodiphenylsulfonic acid and/or its amide-forming derivative. or a part of the amide-forming derivative thereof, for example, 50 molt or less, more preferably 3 molt.
Other diamines and/or amide-forming derivatives thereof may be substituted in a proportion of 0 molar or less.

かかるジアミンとしてはm−及びP−フエニ。Such diamines include m- and p-phenylene.

レンジアミン、ジアミノジフェニルエーテル。Diamine, diaminodiphenyl ether.

ジアミノジフェニルメタン、ジアミノベンゾフェノン、
2.4−ジアミノトルエン等芳香族ジアミンが例示され
る。かくして上記イミドジカルボン酸および/またはそ
のアミド形成性誘導体を主たる成分とするカルボン酸成
分とジアミノジフェニルスルホンおよび/またはそのア
ミド形成性誘導体を主たる成分とするアミン成分とを縮
合反応せしめることによって本発明のポリアミドイミド
は、製造されるか、該縮合反応は通常カルボン酸成分と
アミン成分とを全カルボン酸当量と全アミン当量が実質
的に等量になる割合で実施される。この際触媒、安定剤
等を用いるのが好ましい。触媒としては、各種リン化合
物、ホウ素化合物、ヘテロポリ酸等が挙げられ具体的に
はトリメチルホスファイト、トリエチルホスファイト、
トリフェニルホスファイト。
Diaminodiphenylmethane, Diaminobenzophenone,
Aromatic diamines such as 2.4-diaminotoluene are exemplified. Thus, the present invention can be achieved by condensing a carboxylic acid component containing the imidodicarboxylic acid and/or its amide-forming derivative as a main component with an amine component containing diaminodiphenylsulfone and/or its amide-forming derivative as a main component. The polyamide-imide is produced or the condensation reaction is usually carried out using a carboxylic acid component and an amine component in a ratio such that the total carboxylic acid equivalents and the total amine equivalents are substantially equal. At this time, it is preferable to use a catalyst, a stabilizer, etc. Examples of the catalyst include various phosphorus compounds, boron compounds, heteropolyacids, etc. Specifically, trimethyl phosphite, triethyl phosphite,
Triphenylphosphite.

トリフェニルホスフィン、リン酸、ホウ酸等が挙げられ
る。安定剤としては前記リン化合物の他に例、tばヒン
ダードフェノール系酸化安定剤等が挙げられる。安定剤
としては前記リン化合物の他K例えばヒンダード、フェ
ノール系酸化安定剤等が挙げられる。
Examples include triphenylphosphine, phosphoric acid, boric acid, and the like. In addition to the above-mentioned phosphorus compounds, examples of stabilizers include hindered phenol oxidation stabilizers and the like. In addition to the above-mentioned phosphorus compounds, examples of stabilizers include hindered and phenolic oxidation stabilizers.

反応は通常200〜350℃、好ましくは250〜33
0℃で反応によって生成する。例えば、水、酢酸、フェ
ノール等を系外に留去させながら行う。その際の反応雰
囲気は常圧、加圧、減圧のいずれでもよい。常圧または
加圧反応の場合、窒素ガス、アルゴンガス等の如き不活
性ガスの雰囲気下で行うのが好ましい。
The reaction is usually carried out at 200 to 350°C, preferably 250 to 33°C.
It is produced by reaction at 0°C. For example, water, acetic acid, phenol, etc. are distilled out of the system. The reaction atmosphere at that time may be normal pressure, increased pressure, or reduced pressure. In the case of normal pressure or pressurized reaction, it is preferable to carry out the reaction under an atmosphere of an inert gas such as nitrogen gas or argon gas.

本発明のポリアミドイミドを製造する最本好ましい方法
としては下記方法を挙げることができる。すなわち、ト
リメリット酸無水物と該トリメリット酸無水物1モルに
対し0.4〜0.6モル、より好ましくは0.4〜0.
5モルの式Nx(CH2)TINH! (式中、nは2
〜12の整数である)で表わされるジアミンを場合によ
っては溶媒として非反応性の低分子化合物、好ましくは
フェノール、クレゾール等の芳香族ヒドロキシ化合物の
存在下、例えば100〜220℃に加熱し、生成する水
を系外に留出しつつ、イミド化反応せしめ、次いで該反
応物を前記ジアミンとの和が前記トリメリット酸無水物
と実質的に当量となる量、即ちトリメリット酸無水物1
モルに対し、0.6〜0.4モルよシ好ましくは0.5
〜0.4モルのジアミノジフェニルスルホンおよび/マ
たはそのアミド形成性誘導体とを好ましくは触媒の存在
下で先に示した条件下で加熱縮合せしめることを特徴と
する方法である。
The most preferred method for producing the polyamideimide of the present invention is the following method. That is, 0.4 to 0.6 mol, more preferably 0.4 to 0.6 mol, and more preferably 0.4 to 0.6 mol per mol of trimellitic anhydride and trimellitic anhydride.
5 moles of the formula Nx(CH2)TINH! (In the formula, n is 2
An integer of ~12) is heated to, for example, 100 to 220°C in the presence of a non-reactive low-molecular-weight compound, preferably an aromatic hydroxy compound such as phenol or cresol, as a solvent in some cases to form a diamine. While distilling water out of the system, the imidization reaction is carried out, and then the reactant is added to the diamine in an amount such that the sum of the diamine is substantially equivalent to the trimellitic anhydride, that is, trimellitic anhydride 1
0.6 to 0.4 mol, preferably 0.5 to mol
The method is characterized in that ~0.4 mol of diaminodiphenylsulfone and/or its amide-forming derivative are thermally condensed under the conditions indicated above, preferably in the presence of a catalyst.

との縮合反応の際、前記イミド化反応で生成する前記一
般式(Vl)で示されるジカルボン酸が全酸成分の70
モルチ以上、より好ましくは80モル係以上となる割合
で前記他種ジカルボン酸。
During the condensation reaction with the dicarboxylic acid represented by the general formula (Vl) generated in the imidization reaction, 70% of the total acid component
The aforementioned other dicarboxylic acids in a proportion of at least 80 mol, more preferably at least 80 mol.

アミノカルボン酸を添加してよく、また、前記ジアミノ
ジフェニルスルホンの一部、例えば50モルチ以下、よ
シ好ましくは30モルチ以下の割合で前記他種芳香族ジ
アミンで置きかえてもよい。尚、これらの場合、酸成分
とアミン成分とは実質的に線状ポリマーを形成し得る程
度に当量用いることが必要なのはいうまでもない。
Aminocarboxylic acids may be added and a portion of the diaminodiphenylsulfone may be replaced by the other aromatic diamines, for example in a proportion of up to 50 molar, more preferably up to 30 molar. In these cases, it goes without saying that the acid component and the amine component must be used in equivalent amounts to the extent that a substantially linear polymer can be formed.

本発明のポリアミドイミドは溶融成形が可能であり、得
られたポリマーは非品性である。例えば一般式(I)に
於て、n=6でジアミノジフェニルスルホン成分の代り
に4,4′−ジアミノジフェニルメタン1414’−ジ
アミノジフェニルエーテル等を用いたポリマーはいずれ
も結晶性で融点が350℃以上と高く、溶融成形できな
い。
The polyamideimide of the present invention can be melt-molded and the resulting polymer is of poor quality. For example, in general formula (I), any polymer in which n=6 and 4,4'-diaminodiphenylmethane 1414'-diaminodiphenyl ether etc. is used instead of the diaminodiphenylsulfone component is crystalline and has a melting point of 350°C or higher. It is expensive and cannot be melt-molded.

本発明のポリアミドイミドには必要に応じ、紫外線吸収
剤2着色剤、顔料、滑剤、各種充填剤、フィラー等を配
合してもよい。
If necessary, the polyamide-imide of the present invention may be blended with an ultraviolet absorber, a coloring agent, a pigment, a lubricant, various fillers, fillers, and the like.

実  施  例 以下、実施例を挙げて本発明を説明する。実施例中「部
」はrt量置部を意味し、固有粘度はN−メチルピロリ
ドン中35℃、C=0.59/diで測定した。また、
ポリマーの二次転移点(Tg)は、DSCを用い昇温速
度lO℃/分で測定した。
EXAMPLES The present invention will be explained below with reference to Examples. In the examples, "part" means the rt measured part, and the intrinsic viscosity was measured in N-methylpyrrolidone at 35 DEG C. and C=0.59/di. Also,
The secondary transition point (Tg) of the polymer was measured using DSC at a heating rate of 10° C./min.

実施例1 攪拌機および真空ライン、窒素導入口を備えた留出系を
有する反応器に無水トリメリット酸384部、ヘキサメ
チレンジアミン116部。
Example 1 384 parts of trimellitic anhydride and 116 parts of hexamethylene diamine were placed in a reactor having a distillation system equipped with a stirrer, a vacuum line, and a nitrogen inlet.

フェノール1100部を仕込み窒素気流中140〜20
0℃で2時間反応せしめ、生成する水を系外Vζ留去さ
せた。次いで該反応物に4.4’−ジアミノジフェニル
スルホン248部。
Prepare 1100 parts of phenol and heat to 140 to 20 parts in a nitrogen stream.
The reaction was carried out at 0° C. for 2 hours, and the produced water was distilled off from the system. Next, 248 parts of 4,4'-diaminodiphenylsulfone was added to the reaction product.

トリフェニルホスファイト1.2部を添加し、300℃
に加熱した。加熱後1o分で反応混合物は均一になり、
水が留出しはじめた。同温度で更に1時間反応させた後
、反応温度を310’CK6げ、かつ系内を徐々に減圧
とし、約15分テ1101IIIu、更K 15 分テ
約1 ln11g+7)減圧トL、その条件で20分間
反応を続けた。
Add 1.2 parts of triphenyl phosphite and heat at 300°C.
heated to. The reaction mixture became homogeneous 1 minute after heating,
Water began to distill out. After reacting for another hour at the same temperature, the reaction temperature was increased to 310'CK6, and the pressure in the system was gradually reduced to 1101IIIu for about 15 minutes. The reaction continued for 20 minutes.

得られたポリマーは非品性透明で固有粘度0.44 、
 ’rg 219℃であった。また、このポリマーはア
セトン、トリクレンキシレン等の溶剤に浸透して本変化
なく安定であった。
The obtained polymer was transparent and had an intrinsic viscosity of 0.44.
'rg was 219°C. Moreover, this polymer permeated into solvents such as acetone and triclene xylene and was stable without any major change.

実施例2 実施例1に於いてヘキサメチレンジアミンを104.4
 部、4.4’ −ジアミノフェニルスルホンを272
.8部とする以外は全く同様に反応ぜしめポリマーを得
た。得られたポリマーは固有粘窒0.40 、非晶性で
あシ、Tgは224℃であった。
Example 2 In Example 1, hexamethylene diamine was 104.4
272 parts, 4,4'-diaminophenyl sulfone
.. A reacted polymer was obtained in exactly the same manner except that the amount was changed to 8 parts. The obtained polymer had an intrinsic viscosity of 0.40, was amorphous, and had a Tg of 224°C.

実施例3 実施例1と同様の反応器にN、N’−へキサメチレンビ
ス−トリメリットイミド185.6 部、3.3′−ジ
アミノジフェニルエーテル99.2部、トリフェニルホ
スフェート0.5部ヲ仕込ミ、300℃に加熱した。あ
とは実施例1と同様の条件で縮合せしめポリマーを得た
。得られたポリマーは固有粘txO,43、非品性で、
’rgは197℃であった。
Example 3 In a reactor similar to Example 1, 185.6 parts of N,N'-hexamethylenebis-trimellitimide, 99.2 parts of 3,3'-diaminodiphenyl ether, and 0.5 parts of triphenyl phosphate were added. During preparation, the mixture was heated to 300°C. The rest was condensed under the same conditions as in Example 1 to obtain a polymer. The obtained polymer had an intrinsic viscosity of txO, 43, and was of poor quality.
'rg was 197°C.

実施例4 実施例1と同様の反応器にN、N’−ドデカメチレンビ
ストリメリットイミドジフェニルエステル280部、4
.4’−ジアミノジフェニルスルホン99.2部、トリ
フェニルホスフィン0.3部ヲ仕込み300℃に加熱し
た。あとは約1 mm11gでの減圧反応時間を110
分とする以外は実施例1と同様に反応せしめ、固有粘度
0.45、非品性で、7g164℃のポリマーを得た。
Example 4 Into the same reactor as in Example 1, 280 parts of N,N'-dodecamethylene bistrimeritimid diphenyl ester, 4
.. 99.2 parts of 4'-diaminodiphenylsulfone and 0.3 parts of triphenylphosphine were charged and heated to 300°C. The only thing left to do is to set the vacuum reaction time at about 1 mm and 11 g to 110
The reaction was carried out in the same manner as in Example 1, except that the reaction time was changed to 7 g, 164° C., with an intrinsic viscosity of 0.45 and a poor quality.

また、このポリマーはアセトン、トリクレン、キシレン
等の活剤に浸透しても変化なく安定であった。
Furthermore, this polymer remained stable even when permeated with active agents such as acetone, trichlene, and xylene without any change.

Claims (1)

【特許請求の範囲】 下記式( I ) ▲数式、化学式、表等があります▼………( I ) 〔ただし、式中nは2〜12の整数である。〕で示され
る単位を主たる繰り返し単位とし、かつ固有粘度0.3
以上のポリアミドイミド。
[Claims] The following formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼……(I) [However, in the formula, n is an integer from 2 to 12. ] is the main repeating unit, and the intrinsic viscosity is 0.3
or more polyamideimide.
JP9209787A 1987-04-16 1987-04-16 Polyamideimide Granted JPS63258927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9209787A JPS63258927A (en) 1987-04-16 1987-04-16 Polyamideimide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9209787A JPS63258927A (en) 1987-04-16 1987-04-16 Polyamideimide

Publications (2)

Publication Number Publication Date
JPS63258927A true JPS63258927A (en) 1988-10-26
JPH0466895B2 JPH0466895B2 (en) 1992-10-26

Family

ID=14044944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9209787A Granted JPS63258927A (en) 1987-04-16 1987-04-16 Polyamideimide

Country Status (1)

Country Link
JP (1) JPS63258927A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521276A (en) * 1993-07-05 1996-05-28 Korea Research Institute Of Chemical Technology Polyamideimide resins containing isophorone diamine structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521276A (en) * 1993-07-05 1996-05-28 Korea Research Institute Of Chemical Technology Polyamideimide resins containing isophorone diamine structures

Also Published As

Publication number Publication date
JPH0466895B2 (en) 1992-10-26

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