JPS6325760Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a chip-shaped electronic component suction cup mechanism for sucking chip-shaped electronic components from a chip magazine storing chip-shaped electronic components in a stacked state and mounting them on a printed circuit board.

In the conventional chip-shaped electronic component suction cup mechanism of this type, the suction pin had no directionality, and the lower end surface of the suction pin was simply formed with a suction hole. For this reason, while chip-shaped electronic components are being transferred from a chip magazine containing stacked chip-shaped electronic components to a printed circuit board by suction and holding by vacuum suction force, the chip-shaped electronic components may rotate or shift, resulting in chip-shaped electronic components. There was a risk that the mounting accuracy of electronic components would deteriorate.

In view of the above points, the present invention has developed a chip that prevents the chip-like electronic components from rotating or shifting by giving the suction pins a directional structure that allows the chip-like electronic components to be picked up in a constant position at all times. The present invention aims to provide a suction cup mechanism for electronic components.

Embodiments of the chip-shaped electronic component suction cup mechanism according to the present invention will be described below with reference to the drawings.

1 to 4, a plurality of suction pins 2 are attached to a mounting plate 1 at positions corresponding to chip-shaped electronic component mounting patterns on a board. Here, the mounting plate 1 and the suction pin 2 have a fitting structure, so that the suction pin 2 can be attached and detached or the direction can be changed by 90 degrees as necessary. A suction hole 4 having a stepped portion 3 in the middle is formed in the suction pin 2, and a compression spring 6 is provided between the stepped portion 3 and a spring receiving plate 5 disposed above the mounting plate 1. There is. This compression spring 6 urges the suction pin 2 downward. Further, a vacuum chamber 7 is formed between the mounting plate 1 and the spring receiving plate 5, and the suction hole 4 communicates with the vacuum chamber 7. The mounting plate 1 and the spring receiving plate 5 are fixed to a mounting plate base 8, and the mounting plate base 8 is supported by a mechanism capable of vertically moving up and down as well as horizontally.

Now, a suction hole 4 is opened at the center of the lower end surface of the suction pin 2, and a convex portion 11A for regulating the posture of the chip-shaped electronic component 10 is provided at the periphery of the lower end surface.
11B are formed respectively. Here, the convex portion 11
A and 11B are provided at the four corners and face each other in parallel so as to restrict the longitudinal side surfaces of the chip-shaped electronic component 10. Note that instead of the through hole 4, a circular through hole 4A may be provided as shown by the dotted line in FIG.

On the other hand, a square head 20 is integrally formed at the upper end of the suction pin 2, and a mark 21 for indicating the mounting direction of the chip-shaped electronic component 10 is formed on the square head 20. Each suction pin 2 has its mark 21
Notches 22A and 22B indicate the reference plane of the mounting plate 1
placed so as to face either side. Partition plates 23 are arranged parallel to each other on the mounting plate 1 to regulate the position of the square head 20 in the rotational direction. A blind plug 24 is attached to the attachment hole portion of the attachment plate 1 where the suction pin 2 is not attached.

According to the above embodiment, the convex portion 11 on the lower end surface of the suction pin 2 regulates the position of the chip-shaped electronic component 10.
Since A and 11B are formed, chip-shaped electronic components can always be sucked and transferred in a constant posture.
Therefore, it is possible to prevent the chip-shaped electronic component from rotating or shifting, and improve the accuracy of the mounting position on the printed circuit board. In addition, chip-shaped electronic component 1
To change the mounting direction of 0, use the square head 20 of the suction pin 2.
It is extremely easy to attach it to the mounting plate 1 while rotating it by 90 degrees.

Further, since the square head 20 is provided with a mark 21 indicating the mounting direction of the chip-shaped electronic component, the mounting direction can be easily identified.

Incidentally, instead of the mark 21 as an indicator indicating the mounting direction of the chip-shaped electronic component, a recess, a notch, etc. may be provided in the square head 20.

As explained above, according to the present invention, the suction pins that suction and hold the chip-shaped electronic component have directionality, and the chip-shaped electronic component can be transferred without causing rotation or displacement of the chip-shaped electronic component. A suction cup mechanism can be obtained.

[Brief explanation of the drawing]

FIG. 1 is an embodiment of the chip-shaped electronic component suction cup mechanism according to the present invention, and is a longitudinal sectional view showing the overall configuration, and FIG. 2 is an enlarged sectional view showing the lower end of the suction pin.
FIG. 3 is a bottom view showing the lower end surface of the suction pin, and FIG. 4 is a perspective view showing the suction pin attached to the partition plate and the mounting plate. 1...Mounting plate, 2...Adsorption pin, 3...Step part,
4... Suction hole, 5... Spring receiving plate, 6... Compression spring, 7... Vacuum chamber, 8... Mounting plate base, 10...
...chip-shaped electronic component, 11A, 11B...protrusion,
20... Square head, 21... Mark, 22A, 22
B...notch, 23...partition plate, 24...blind stopper.

Claims (1)

[Scope of utility model registration request] In a chip-shaped electronic component suction cup mechanism in which a plurality of suction pins corresponding to chip-shaped electronic component mounting positions are attached to a mounting plate, a suction hole is provided at the center of the lower end surface of the suction pin, and a chip-shaped electronic component is attached to the periphery of the suction hole. A partition plate having a square head formed with protrusions for regulating the posture and having an indication indicating the mounting direction of the chip-shaped electronic component at the upper end thereof, and regulating the rotational direction position of the square head on the mounting plate. A chip-shaped electronic component suction cup mechanism characterized by being equipped with.