JPS63256358A - Measuring device for dimension in grinding - Google Patents

Measuring device for dimension in grinding

Info

Publication number
JPS63256358A
JPS63256358A JP8820487A JP8820487A JPS63256358A JP S63256358 A JPS63256358 A JP S63256358A JP 8820487 A JP8820487 A JP 8820487A JP 8820487 A JP8820487 A JP 8820487A JP S63256358 A JPS63256358 A JP S63256358A
Authority
JP
Japan
Prior art keywords
stylus
grinding
measuring device
cover member
tracing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8820487A
Other languages
Japanese (ja)
Inventor
Noboru Goto
後藤 登
Katsunori Nishiguchi
勝規 西口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP8820487A priority Critical patent/JPS63256358A/en
Publication of JPS63256358A publication Critical patent/JPS63256358A/en
Pending legal-status Critical Current

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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To measure a dimension with high accuracy in the way of grinding by providing a cover member which is not brought in contact with the second tracing needle at least in the region of the outer circumference of the second tracing needle of the first tracing needle abutting to the upper surface of a table and the second tracing needle abutting to the upper surface of a work piece mounted on the table. CONSTITUTION:The second tracing needle 11 has a cover member 19 covering the whole region of the outer circumference thereof in such a way so as not to be in contact with the second tracing needle 11. In the way of grinding a work piece 13 with a grindstone 15 while supplying cooling water for grinding from a cooling pipe 18, the grinding is stopped once so that the first tracing needle 10 and the second tracing needle 11 are abutted to the upper surfaces of a table 12 and the work piece 13 respectively. The displacement of the second tracing needle 8 is measured as the thickness of the work piece 13. In this case, even if the temperature in the cooling wafer for grinding rises by the frictional heat of the grinding and then flows out as high temperature water, the flow is cut off by the cover member 19 so as not to be in contact with the second tracing needle 11. Therefore, the temperature of both tracing needles 10 and 11 are equal to each other so as to enable measurement with high accuracy while the rolling of the tracing needle 11 caused by the flow is eliminated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、テーブル上に載置された半導体ウェーハ、セ
ラミックス基板などの被加工物の上面を砥石で研削する
に際し、その研削途中における研削寸法を測定するため
の研削寸法測定装置に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to grinding dimensions during grinding when grinding the upper surface of a workpiece such as a semiconductor wafer or a ceramic substrate placed on a table with a grindstone. This invention relates to a grinding dimension measuring device for measuring.

(従来の技術〕 半導体ウェーハ、セラミックス基板などの被加工物の上
面を研削するに際しては、被加工物をテーブル上で回転
させると共に、上方から砥石を定寸送り降下させる。そ
して、その途中で研削寸法を測定し、所定量研削されて
いない場合5は、例えば再び砥石を定寸送り降下させ、
再研削するようにしている。
(Prior art) When grinding the upper surface of a workpiece such as a semiconductor wafer or a ceramic substrate, the workpiece is rotated on a table and a grindstone is fed down a fixed distance from above. Measure the dimensions, and if the predetermined amount has not been ground 5, for example, feed the grinding wheel a fixed amount again and lower it.
I'm trying to re-grind it.

研削寸法の測定は研削寸法測定装置により行われる。そ
して、これはテーブルの上面に当接する第1触針と、被
加工物の上面に当接する第2触針とを有し、第1触針を
基準とする第2触針の鉛直方向変位量で測定するよう構
成されている。研削途中では研削による摩擦熱が被加工
物に生じるため、この被加工物の上面に研削用冷却水な
どを供給し、被加工物を冷却するようにしている。
The measurement of the grinding dimension is performed by a grinding dimension measuring device. This has a first stylus that contacts the top surface of the table and a second stylus that contacts the top surface of the workpiece, and the amount of vertical displacement of the second stylus with respect to the first stylus. It is configured to measure. During grinding, frictional heat is generated in the workpiece due to grinding, so cooling water for grinding or the like is supplied to the upper surface of the workpiece to cool the workpiece.

〔発明が解決しようとする問題点〕 ところで、研削用冷却水で被加工物を冷却すると、被加
工物の温度上昇はある程度抑えられるが、その反面、冷
却水が高温水となって流れ出し、これが第2触針に掛か
ると第2触針の温度はかなり上昇する。このため、第1
触針と第2触針との間に大きな温度差が生じることにな
り、両触針間には線膨張量差が生じる。すると、鉛直方
向変位量で測定するよう構成された研削寸法測定装置に
おいては、測定精度が微妙に悪化するという問題がある
。また、高温水による水圧が第2触針に加わると、この
第2触針が横撮れする原因ともなり、同様にして測定精
度が悪化することになるという問題がある。
[Problems to be solved by the invention] By the way, cooling the workpiece with cooling water for grinding can suppress the temperature rise of the workpiece to some extent, but on the other hand, the cooling water turns into high-temperature water and flows out. When applied to the second stylus, the temperature of the second stylus increases considerably. For this reason, the first
A large temperature difference will occur between the stylus and the second stylus, and a difference in linear expansion will occur between the stylus. Then, in a grinding dimension measuring device configured to measure the amount of displacement in the vertical direction, there is a problem in that the measurement accuracy is slightly deteriorated. Further, when water pressure due to high temperature water is applied to the second stylus, this may cause the second stylus to take a horizontal image, which similarly causes a problem in that measurement accuracy deteriorates.

そこで本発明は、研削途中における研削寸法の測定を精
度良く行うことのできる研削寸法測定装置を提供するこ
とを目的とする。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a grinding dimension measuring device that can accurately measure grinding dimensions during grinding.

〔問題点を解決するための手段〕[Means for solving problems]

本発明に係る研削寸法測定装置の第1の態様は、テーブ
ルの上面に当接する第1触針と、テーブル上に載置され
た被加工物の上面に当接する第2触針とのうちの、少な
くとも第2触針はその外周領域にこの第2触針と接触し
ないカバー部材を備えたことを特徴とする。
A first aspect of the grinding dimension measuring device according to the present invention is that the first stylus contacts the top surface of the table, and the second stylus contacts the top surface of the workpiece placed on the table. The present invention is characterized in that at least the second stylus is provided with a cover member in its outer peripheral region that does not come into contact with the second stylus.

また、本発明に係る研削寸法測定装置の第2の態様は、
テーブルの上面に当接する第1触針と、テーブル上に載
置された被加工物の上面に当接する第2触釘とのうちの
、少なくとも第2触針は、この第2触針に接触しないよ
うにしてその外周全領域を覆うカバー部材を有し、この
カバー部材の内には上から下へ向けて気体または液体を
流すよう構成したことを特徴とする。
Further, a second aspect of the grinding dimension measuring device according to the present invention is as follows:
Of the first stylus that contacts the top surface of the table and the second stylus that contacts the top surface of the workpiece placed on the table, at least the second stylus contacts the second stylus. The device is characterized in that it has a cover member that covers the entire outer periphery of the device, and is configured to allow gas or liquid to flow into the cover member from top to bottom.

〔作用〕[Effect]

本発明に係る研削寸法測定装置の第1の態様は、以上の
通り辷構成されるので、テーブル上で被加工物の上面を
研削するに際し、研削による摩擦熱によって研削用冷却
水の温度が上昇し、それが高温水となって流れ出しても
、この流れはカバー部材により遮断されて第2触針には
余り触れない。
The first aspect of the grinding dimension measuring device according to the present invention is configured as described above, so that when grinding the upper surface of the workpiece on the table, the temperature of the cooling water for grinding increases due to the frictional heat caused by the grinding. However, even if the high-temperature water flows out, this flow is blocked by the cover member and does not touch the second stylus.

従って、第1触針に比べて第2触針の温度が太きく上昇
するようなことはなく、水流によって第2触針が横振れ
することもない。
Therefore, the temperature of the second stylus does not rise significantly compared to the first stylus, and the second stylus does not oscillate laterally due to the water flow.

また、本発明に係る研削寸法測定装置の第2の態様は、
以上の通りに構成されるので、上記第1の態様と同様に
して、高温水の流れはカバー部材により遮断される。さ
らに、カバー部材の内を上から下へ流される気体または
液体は、このカバー部材の下端縁と被加工物上面との間
隙から外へ流出し、この流れは高温水の流れを第2触針
がら遠ざけるように排斥すると共に、第2触釦の温度を
下げるように作用する。
Further, a second aspect of the grinding dimension measuring device according to the present invention is as follows:
Since the structure is as described above, the flow of high temperature water is blocked by the cover member in the same way as in the first aspect. Further, the gas or liquid flowing inside the cover member from top to bottom flows out through the gap between the lower edge of the cover member and the upper surface of the workpiece, and this flow directs the flow of high-temperature water to the second stylus. The second touch button acts to lower the temperature of the second touch button.

〔実施例〕〔Example〕

以下、添附図面を参照して本発明の詳細な説明する。な
お、図面の説明において同一要素には同一符号を付し、
重複する説明を省略する。
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, in the explanation of the drawings, the same elements are given the same reference numerals,
Omit duplicate explanations.

第1図は実施例に係る研削寸法測定装置の斜視図である
。図示の通り、この研削寸法測定装置1は基台2と、こ
の基台2に立設された支柱3と、この支柱3に上下動自
在に外嵌された可動部材4と、この可動部材4に連結部
材5を介して固着された測定装置本体6と、この測定装
置本体6に鉛直方向への変位可能に連結された第1アー
ム7および第2アーム8と、これら第1アーム7、第2
アーム8の先端部に各々固着された第1触針10゜第2
触針11とを有している。そして、第2の触針11力バ
一部材19によって囲まれている。ここで、測定装置本
体6には第1アーム7、第2アーム8を鉛直方向へ変位
可能に支持する支持機構(図示しない。)と、それらの
変位量を電気的に変換Uて出力する検出器(図示しない
。)とが内蔵されている。
FIG. 1 is a perspective view of a grinding dimension measuring device according to an embodiment. As shown in the figure, this grinding dimension measuring device 1 includes a base 2, a support 3 erected on the base 2, a movable member 4 externally fitted on the support 3 so as to be able to move vertically, and the movable member 4. A measuring device main body 6 is fixed to the measuring device main body 6 via a connecting member 5, a first arm 7 and a second arm 8 are connected to the measuring device main body 6 so as to be movable in the vertical direction, and the first arm 7, the second arm 8, and 2
The first stylus 10° and the second stylus are respectively fixed to the tip of the arm 8.
It has a stylus 11. The second stylus 11 is surrounded by a force bar member 19. Here, the measuring device main body 6 includes a support mechanism (not shown) that supports the first arm 7 and the second arm 8 such that they can be displaced in the vertical direction, and a detection device that electrically converts and outputs the amount of displacement U. A container (not shown) is built-in.

研削寸法を測定するに際しては、第1触針10の先端を
テーブル12の上面に当接させ、第2触針11の先端を
テーブル12上に載置された被加工物13(例えば、半
導体ウェーハ、セラミック基板等)の上面に当接させて
行う。一方、被加工物13の上面を研削するに際しては
、被加工物13をテーブル12上で回転させ、砥石15
を上方より奔降軸16を介して定寸送り降下させて行う
。これにより、被加工物13の上面全域が研削されるこ
とになるが、その間は常に冷却管18より被加工物13
の上面に研削用の冷却水が供給されている。
When measuring the grinding dimension, the tip of the first stylus 10 is brought into contact with the top surface of the table 12, and the tip of the second stylus 11 is placed on the workpiece 13 (for example, a semiconductor wafer) placed on the table 12. , ceramic substrate, etc.). On the other hand, when grinding the upper surface of the workpiece 13, the workpiece 13 is rotated on the table 12, and the grinding wheel 15
This is carried out by feeding and lowering a fixed amount from above via the descending shaft 16. As a result, the entire upper surface of the workpiece 13 is ground, but during this time, the cooling pipe 18 is always used to grind the workpiece 13.
Cooling water for grinding is supplied to the top surface of the machine.

第2図は本発明による研削寸法測定装置の、第1の態様
の要部を示す斜視図である。
FIG. 2 is a perspective view showing a main part of the first embodiment of the grinding dimension measuring device according to the present invention.

同図(a>に図示の通り、第2触針11は、この第2触
針11に接触しないようにしてその外周の全領域を覆う
カバー部材19を有している。このカバー部材19は例
えば円筒状のセラミックパイプから成っている。また、
第2図(b)如く、−側に長手方向開口部20を有する
円筒状のセラミックパイプとしてもよく、同図(C)の
如く横断面が略V字状に折り曲げられたセラミック板と
してもよい。なお、第3図(b)、(C)のものにあっ
ては、開口側が研削用冷却水の流れの下流に配置される
As illustrated in FIG. For example, it consists of a cylindrical ceramic pipe.
As shown in FIG. 2(b), it may be a cylindrical ceramic pipe with a longitudinal opening 20 on the negative side, or it may be a ceramic plate with a cross section bent into a substantially V-shape as shown in FIG. 2(C). . In addition, in the case of FIGS. 3(b) and 3(C), the opening side is arranged downstream of the flow of cooling water for grinding.

次に、上記実施例に係る研削寸法測定装置の作用を説明
する。
Next, the operation of the grinding dimension measuring device according to the above embodiment will be explained.

冷却管18より研削用冷却水を供給しながら砥石15で
被加工物13を研削している途中において、一旦研削を
停止させ、第1触針10および第2触針11を各々テー
ブル12、被加工物13の上面に当接させる。第1アー
ム7、第2アーム8は各々鉛直方向へ変位可能に支持さ
れているので、第2アーム8は被加工物13の厚さ分だ
け上方へ変位し、この変位量で既に研削した寸法が測定
装置本体6を介して測定される。所定量研削されていな
い場合には、例えば砥石15を下方へ定寸送り降下させ
て再研削する。
While grinding the workpiece 13 with the grindstone 15 while supplying cooling water for grinding from the cooling pipe 18, the grinding is temporarily stopped and the first stylus 10 and the second stylus 11 are moved to the table 12 and the workpiece, respectively. It is brought into contact with the upper surface of the workpiece 13. Since the first arm 7 and the second arm 8 are each supported so as to be displaceable in the vertical direction, the second arm 8 is displaced upward by the thickness of the workpiece 13, and with this amount of displacement, the dimension already ground is is measured via the measuring device main body 6. When the predetermined amount of grinding is not completed, for example, the grindstone 15 is sent downward by a fixed distance to perform re-grinding.

研削時において、被加工物13の温度は摩擦熱により上
昇し、この熱により研削用冷却水は熱つせられ高温水と
なって流れ出す。しかしながら本実施例によれば、高温
水の流れはカバー部材19により遮断されて第2触針1
1に直接触れることはなく、第1触針10と第2触針1
1の温度はほぼ等しい状態に保たれ、従って両独針の線
部@量は等しくなり精度の良い測定が可能になる。
During grinding, the temperature of the workpiece 13 rises due to frictional heat, and the grinding cooling water is heated by this heat and flows out as high-temperature water. However, according to this embodiment, the flow of high temperature water is blocked by the cover member 19 and the second stylus 1
1 without directly touching the first stylus 10 and the second stylus 1.
1 is maintained at approximately the same temperature, and therefore the line portions of both hands are equal, making it possible to measure with high precision.

第3図は本発明による研削寸法測定装置の、第2の態様
の構成と作用を示す要部の断面図である。
FIG. 3 is a sectional view of essential parts showing the configuration and operation of the second embodiment of the grinding dimension measuring device according to the present invention.

図示の通り、このカバー部材19の内には、矢印Aで示
すように上から下へ向けて気体または液体を流すよう構
成している。ここで、気体または液体としては一定温度
かつ低い温度のものが適し、冷水は好適である。
As shown in the figure, gas or liquid is configured to flow into the cover member 19 from top to bottom as shown by arrow A. Here, as the gas or liquid, one having a constant temperature and a low temperature is suitable, and cold water is suitable.

次に、この第2の態様の作用を説明する。Next, the operation of this second aspect will be explained.

第3図に図示の通り、カバー部材19の内を上から下へ
流される気体または液体の流れ(矢印A)は、高温水の
流れ(矢印B)を輌2触針11から遠ざけるよう排斥し
、かつこの流れ(矢印A)は第2触針11の温度を下げ
る。従って、両独針の線膨張量は等しくなり、−II精
度の良い測定が可能になる。
As shown in FIG. 3, the flow of gas or liquid flowing from top to bottom within the cover member 19 (arrow A) repels the flow of high temperature water (arrow B) away from the stylus 11. , and this flow (arrow A) lowers the temperature of the second stylus 11. Therefore, the amount of linear expansion of both hands becomes equal, and it is possible to measure with -II accuracy.

本発明は上記実施例のものに限定されることなく、種々
の変形が可能である。
The present invention is not limited to the above-mentioned embodiments, and various modifications are possible.

例えば、カバー部材19は第2触針11の外周部に設け
るだけでなく、第1触針10の外周部にも設けることが
可能である。これによれば、熱せられた高温水の流れが
第1触針10の位置をも流れるような場合に特に効果的
である。
For example, the cover member 19 can be provided not only on the outer periphery of the second stylus 11 but also on the outer periphery of the first stylus 10. This is particularly effective when the heated high-temperature water flows also at the position of the first stylus 10.

〔発明の効果〕〔Effect of the invention〕

以上、詳細に説明した通り、本発明に係る研削寸法測定
装置によれば、両触針のうち少なくとも第2触針は熱せ
られた高温水の流れから遮断され、この第2触針には余
り高温水が掛からなくなる。
As explained above in detail, according to the grinding dimension measuring device according to the present invention, at least the second stylus of both stylus is cut off from the flow of heated high-temperature water, and this second stylus has no excess water. No more high temperature water.

このため、第1触針と第2触針とに線膨張量の差が殆ど
生じることはなく、精度の良い測定が可能となる等の効
果がある。
Therefore, there is almost no difference in the amount of linear expansion between the first stylus and the second stylus, and there are effects such as enabling highly accurate measurement.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る研削1法測定装置の実施例を示す
斜視図、第2図(a)〜(C)はカバー部材の斜視図、
第3図は本発明に係る研削寸法測定装置の第2態様の要
部を示す断面図である。 1、・・・研削寸法測定装置、6・・・測定装置本体、
7・・・第1アーム、8・・・第2アーム、10・・・
第1触針、11・・・第2触針、12・・・テーブル、
13・・・被加工物、15・・・砥石、19・・・カバ
ー部材。 第  1  図 (a)       (b)      (c)実施例
のカバー部材 第2図 実施例の要部 第  3  図
FIG. 1 is a perspective view showing an embodiment of a grinding method measuring device according to the present invention, FIGS. 2(a) to (C) are perspective views of a cover member,
FIG. 3 is a sectional view showing a main part of a second embodiment of the grinding dimension measuring device according to the present invention. 1.... Grinding dimension measuring device, 6... Measuring device main body,
7...First arm, 8...Second arm, 10...
First stylus, 11... Second stylus, 12... Table,
13...Workpiece, 15...Whetstone, 19...Cover member. Fig. 1 (a) (b) (c) Cover member of the embodiment Fig. 2 Main part of the embodiment Fig. 3

Claims (1)

【特許請求の範囲】 1、テーブルの上面に当接する第1触針と、前記テーブ
ル上に載置された被加工物の上面に当接する第2触針と
を有し、前記第1触針を基準とする前記第2触針の鉛直
方向変位量に基づき前記テーブル上で研削された前記被
加工物の研削寸法を測定する研削寸法測定装置において
、 前記両触針のうち少なくとも前記第2触針は、その外周
領域にこの第2触針と接触しないカバー部材を備えたこ
とを特徴とする研削寸法測定装置。 2、前記カバー部材は円筒状のセラミックスパイプであ
る特許請求の範囲第1項記載の研削寸法測定装置。 3、前記カバー部材は一側に長手方向開口部を有する円
筒状のセラミックスパイプである特許請求の範囲第1項
記載の研削寸法測定装置。 4、前記カバー部材は断面が略V字状に折り曲げられた
セラミックス板である特許請求の範囲第1項記載の研削
寸法測定装置。 5、テーブルの上面に当接する第1触針と、前記テーブ
ル上に載置された被加工物の上面に当接する第2触針と
を有し、前記第1触針を基準とする前記第2触針の鉛直
方向変位量に基づき前記テーブル上で研削された前記被
加工物の研削寸法を測定する研削寸法測定装置において
、 前記両触針のうち少なくとも前記第2触針は、この第2
触針に接触しないようにしてその外周全領域を覆うカバ
ー部材を有し、このカバー部材の内には上から下へ向け
て気体または液体を流すよう構成したことを特徴とする
研削寸法測定装置。
[Scope of Claims] 1. A first stylus that comes into contact with the top surface of a table, and a second stylus that comes into contact with the top surface of a workpiece placed on the table, the first stylus In the grinding dimension measuring device that measures the grinding dimension of the workpiece ground on the table based on the amount of vertical displacement of the second stylus with reference to A grinding dimension measuring device characterized in that the needle is provided with a cover member in its outer peripheral region that does not come into contact with the second stylus. 2. The grinding dimension measuring device according to claim 1, wherein the cover member is a cylindrical ceramic pipe. 3. The grinding dimension measuring device according to claim 1, wherein the cover member is a cylindrical ceramic pipe having a longitudinal opening on one side. 4. The grinding dimension measuring device according to claim 1, wherein the cover member is a ceramic plate bent into a substantially V-shaped cross section. 5. The first stylus contacts the top surface of the table, and the second stylus contacts the top surface of the workpiece placed on the table, and the first stylus contacts the first stylus as a reference. In the grinding dimension measuring device that measures the grinding dimension of the workpiece ground on the table based on the amount of vertical displacement of two stylus, at least the second stylus among the two stylus
A grinding dimension measuring device comprising a cover member that covers the entire outer circumference of the stylus without contacting the stylus, and is configured to allow gas or liquid to flow from top to bottom within the cover member. .
JP8820487A 1987-04-10 1987-04-10 Measuring device for dimension in grinding Pending JPS63256358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8820487A JPS63256358A (en) 1987-04-10 1987-04-10 Measuring device for dimension in grinding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8820487A JPS63256358A (en) 1987-04-10 1987-04-10 Measuring device for dimension in grinding

Publications (1)

Publication Number Publication Date
JPS63256358A true JPS63256358A (en) 1988-10-24

Family

ID=13936373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8820487A Pending JPS63256358A (en) 1987-04-10 1987-04-10 Measuring device for dimension in grinding

Country Status (1)

Country Link
JP (1) JPS63256358A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103302752A (en) * 2012-03-09 2013-09-18 株式会社迪思科 Cutting method
CN103600294A (en) * 2013-11-01 2014-02-26 苏州恩斯克轴承有限公司 Grinding quantity measuring device for tapered roller bearing outer ring end face
CN103722494A (en) * 2012-10-16 2014-04-16 株式会社迪思科 Grinding apparatus
JP2015098074A (en) * 2013-11-20 2015-05-28 株式会社ディスコ Grinder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103302752A (en) * 2012-03-09 2013-09-18 株式会社迪思科 Cutting method
CN103722494A (en) * 2012-10-16 2014-04-16 株式会社迪思科 Grinding apparatus
JP2014079838A (en) * 2012-10-16 2014-05-08 Disco Abrasive Syst Ltd Grinder
CN103600294A (en) * 2013-11-01 2014-02-26 苏州恩斯克轴承有限公司 Grinding quantity measuring device for tapered roller bearing outer ring end face
JP2015098074A (en) * 2013-11-20 2015-05-28 株式会社ディスコ Grinder

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