JPS6325525A - Semiconductor pressure sensor - Google Patents
Semiconductor pressure sensorInfo
- Publication number
- JPS6325525A JPS6325525A JP16888286A JP16888286A JPS6325525A JP S6325525 A JPS6325525 A JP S6325525A JP 16888286 A JP16888286 A JP 16888286A JP 16888286 A JP16888286 A JP 16888286A JP S6325525 A JPS6325525 A JP S6325525A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- resistance
- pressure
- pressure sensor
- trimming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000009966 trimming Methods 0.000 claims abstract description 18
- 230000003321 amplification Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 5
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の分野〕
本発明はダイヤフラム型の半導体圧力センサに関し、特
にその圧力に対する出力特性を均一にすることができる
半導体圧力センサに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a diaphragm type semiconductor pressure sensor, and more particularly to a semiconductor pressure sensor whose output characteristics with respect to pressure can be made uniform.
〔発明の概要]
本発明による半導体圧力センサは、感圧素子のダイヤフ
ラム上に形成されたブリ・ノジ抵抗回路に電流を供給し
てその両端の差動増幅出力によって電圧43号を得ると
共に、ブリッジ抵抗回路の駆動電流をトリミング抵抗に
よって調整し、ダイヤフラム型感圧素子自体に製造上の
ばらつきがあっても圧力に対応した一定の変換感度を得
るようにしたものである。[Summary of the Invention] A semiconductor pressure sensor according to the present invention supplies a current to a bridge-nodgy resistance circuit formed on a diaphragm of a pressure-sensitive element, obtains a voltage No. 43 from a differential amplified output at both ends, and The driving current of the resistance circuit is adjusted by a trimming resistor, and even if there are manufacturing variations in the diaphragm pressure-sensitive element itself, a constant conversion sensitivity corresponding to the pressure can be obtained.
(従来技術)
従来の半導体圧力センサは、第5図に示すようにシリコ
ンダイヤフラム上にブリッジ型に接続すれたブリッジ抵
抗回路RBを形成して感圧素子1とし、演算増幅器から
成る電流供給回路2よりブリッジ抵抗回路RBに一定の
電流を供給するようにしている。そして圧力に対応して
感圧素子1のシリコンダイヤフラムが湾曲し得るように
構成し、ブリッジ抵抗回路RBの両端より抵抗R1,R
2を介して帰還抵抗R3を有する演算増幅器3の人カ端
に接続するようにしている。そうすれば圧力変動により
ブリッジ抵抗回路RBの抵抗値が変動し、その変動が電
圧変化に変換され増幅されて外部に出力される。(Prior Art) As shown in FIG. 5, a conventional semiconductor pressure sensor has a pressure-sensitive element 1 formed by forming a bridge resistance circuit RB connected in a bridge shape on a silicon diaphragm, and a current supply circuit 2 consisting of an operational amplifier. A constant current is supplied to the bridge resistance circuit RB. The silicon diaphragm of the pressure sensitive element 1 is configured to be curved in response to the pressure, and resistors R1 and R are connected from both ends of the bridge resistor circuit RB.
2 to the input terminal of the operational amplifier 3 having a feedback resistor R3. Then, the resistance value of the bridge resistance circuit RB changes due to the pressure fluctuation, and the fluctuation is converted into a voltage change, amplified, and outputted to the outside.
(発明が解決しようとする問題点)
このような従来の半導体圧力センサでは、感圧素子1の
圧力−出力感度や電流供給回路2の電流値のばらつき、
演算増幅器3の入力オフセソト電圧のばらつきを一定に
することが困難であり、全体として圧力に対する出力特
性を一定にするために演算増幅器3の入力抵抗R1,R
2や帰還抵抗R3の値を調整する必要があった。そして
個々の半導体圧力センサ毎にこれらの抵抗値の調整を行
わなければならず、製造に非常な手間がかかり製造価格
を上昇させる原因となっていた。又演算増幅器3の帰還
抵抗や入力抵抗を調整した場合には演算増幅器のバラン
スが崩れ、温度変動や同相ノイズ、電圧変動等の影響が
大きくなるという問題点がある。従って一方の入力抵抗
を調整すれば他方の入力抵抗も同時に調整する必要があ
り、調整に手間がかかるという問題点があった。(Problems to be Solved by the Invention) In such a conventional semiconductor pressure sensor, variations in the pressure-output sensitivity of the pressure-sensitive element 1 and the current value of the current supply circuit 2,
It is difficult to make the variation in the input offset voltage of the operational amplifier 3 constant, and in order to make the output characteristics with respect to pressure constant as a whole, the input resistances R1 and R of the operational amplifier 3 are
2 and the value of the feedback resistor R3 had to be adjusted. These resistance values must be adjusted for each individual semiconductor pressure sensor, which takes a lot of time and effort to manufacture and causes an increase in manufacturing costs. Further, when the feedback resistance and input resistance of the operational amplifier 3 are adjusted, there is a problem that the balance of the operational amplifier is lost and the effects of temperature fluctuations, common mode noise, voltage fluctuations, etc. become greater. Therefore, when one input resistance is adjusted, it is necessary to adjust the other input resistance at the same time, which poses a problem in that the adjustment takes time and effort.
本発明はこのような従来の半導体圧力センサの問題点に
鑑みてなされたものであって、増幅回路の調整を行うこ
となく圧力−出力特性を一定にすることを技術的課題と
する。The present invention has been made in view of the problems of the conventional semiconductor pressure sensor, and its technical objective is to make the pressure-output characteristics constant without adjusting the amplifier circuit.
[発明の構成と効果〕
(構成)
本発明はダイヤフラム上に構成されたブリッジ抵抗回路
を存する感圧素子と、感圧素子のブリッジ抵抗回路に電
流を供給する電流供給回路、及びブリッジ抵抗回路の両
端の電圧を増幅する増幅回路を有する半導体圧力センサ
であって、第1図に示すように、ブリッジ抵抗回路と電
流供給回路に直列にトリミング抵抗を接続し、該トリミ
ング抵抗を調整することによって所定の圧力−出力電圧
特性を得るように構成したことを特徴とするものである
。[Structure and Effect of the Invention] (Structure) The present invention provides a pressure sensitive element having a bridge resistance circuit configured on a diaphragm, a current supply circuit that supplies current to the bridge resistance circuit of the pressure sensitive element, and a bridge resistance circuit. This is a semiconductor pressure sensor that has an amplification circuit that amplifies the voltage at both ends, and as shown in FIG. The present invention is characterized in that it is configured to obtain a pressure-output voltage characteristic of .
(作用)
このような特徴を有する本発明によれば、感圧素子のシ
リコンダイヤフラム上に構成されたブリ・7ジ抵抗回路
に電流を供給し、その駆動電流をトリミング抵抗によっ
て変化させる。そして感圧素子自体のばらつきを均一に
するためトリミング抵抗によって圧力変化に対して出力
の変化が所定値となるように駆動電流を調整している。(Function) According to the present invention having such features, current is supplied to the bridge resistor circuit configured on the silicon diaphragm of the pressure sensitive element, and the drive current is changed by the trimming resistor. In order to equalize variations in the pressure sensitive element itself, the drive current is adjusted by a trimming resistor so that the change in output becomes a predetermined value in response to a change in pressure.
(効果)
そのため本発明によれば、増幅回路の増幅率はトリミン
グの前後で不変であるため、バランスをくずすことなく
怒度調整を行うことができる。又半導体圧力センサの温
度変動や電圧変動の特性は駆動電流に比例して大きくな
るが、本発明では増幅率が大きい半導体圧力センサにつ
いては駆動電流を少なくするように調整して圧力変化に
対する出力の変化を一定にしている。従って駆動電流を
減少させずに増幅器の増幅率を調整することによって所
定の出力変化を得るようにした従来の半導体圧力センサ
に比べて、温度特性や電圧特性を改善することができる
。(Effects) Therefore, according to the present invention, since the amplification factor of the amplifier circuit remains unchanged before and after trimming, it is possible to adjust the anger level without disturbing the balance. Furthermore, the temperature fluctuation and voltage fluctuation characteristics of semiconductor pressure sensors increase in proportion to the drive current, but in the present invention, for semiconductor pressure sensors with a large amplification factor, the drive current is adjusted to be small to reduce the output in response to pressure changes. Constant change. Therefore, the temperature characteristics and voltage characteristics can be improved compared to conventional semiconductor pressure sensors in which a predetermined output change is obtained by adjusting the amplification factor of the amplifier without reducing the drive current.
第1図は本発明による半導体圧力センサの一実施例を示
す回路図である。本図において従来例と同一部分は同一
符号を付している。本実施例においても感圧素子1のシ
リコンダイヤフラム上に形成されたブリッジ抵抗回路R
Bに演算増幅器からなる電流供給回路2より電流を供給
し、ブリッジ抵抗回路RBの両端の電圧変化を抵抗R1
,R2を介して演算増幅器3の反転入力端と非反転入力
端間に与えるようにしている。演算増幅器3には出力端
と反転入力端子間に帰還抵抗R3を接続し、入力端子4
より抵抗R4を介して演算増幅器3の非反転入力端に直
流バイアス電圧Voを与えるように構成することは前述
した従来例と同様である。FIG. 1 is a circuit diagram showing an embodiment of a semiconductor pressure sensor according to the present invention. In this figure, the same parts as in the conventional example are given the same reference numerals. Also in this embodiment, the bridge resistance circuit R formed on the silicon diaphragm of the pressure sensitive element 1
A current is supplied to B from a current supply circuit 2 consisting of an operational amplifier, and the voltage change across the bridge resistance circuit RB is controlled by a resistor R1.
, R2 between the inverting input terminal and the non-inverting input terminal of the operational amplifier 3. A feedback resistor R3 is connected between the output terminal and the inverting input terminal of the operational amplifier 3, and the input terminal 4
The configuration in which the DC bias voltage Vo is applied to the non-inverting input terminal of the operational amplifier 3 via the resistor R4 is similar to the conventional example described above.
さて本実施例ではブリッジ抵抗回路RBの一端に接続さ
れる抵抗R5をトリミングの可能な抵抗とする。トリミ
ング抵抗R5は例えば角板型チップ固定抵抗器を用い、
レーザトリミングが可能なように構成する。In this embodiment, the resistor R5 connected to one end of the bridge resistor circuit RB is a resistor that can be trimmed. For example, a square plate type fixed chip resistor is used as the trimming resistor R5.
Configure to enable laser trimming.
そしてこの半導体圧力センサの出力特性をトリミング抵
抗R5によって調整する。ここで第2図に示すように印
加圧力P。、Plに対する基準となる半導体圧力センサ
Aの出力特性は直vAaで示されるものとし、本実施例
による半導体圧力センサBの製造後の出力特性は直線す
。と示されるものとする。そして半導体圧力センサBの
出力特性を半導体圧力センサAの出力特性に一致させる
ように調整する場合には、まずトリミング抵抗R5をト
リミングすることによって抵抗値を調整しブリッジ抵抗
回路RBに流れる電流を調整する。即ちトリミングによ
ってトリミング抵抗R5の抵抗値を大きくするとブリッ
ジ抵抗回路RBの駆動電流が減少するため、その電圧変
化分を減少させることができる。従って直bi aの電
圧変化分ΔVaと直線す。の電圧変化分Δvbとが一敗
するようにブリッジ抵抗回路RBの駆動電流を調整する
。そうすれば第3図に示すようにその特性は直線a、l
)。The output characteristics of this semiconductor pressure sensor are adjusted by a trimming resistor R5. Here, as shown in FIG. 2, the applied pressure P. , Pl, the output characteristic of the semiconductor pressure sensor A is expressed as a straight line vAa, and the output characteristic of the semiconductor pressure sensor B according to this embodiment after manufacturing is a straight line. shall be shown as When adjusting the output characteristics of the semiconductor pressure sensor B to match the output characteristics of the semiconductor pressure sensor A, first trimming the trimming resistor R5 adjusts the resistance value and adjusts the current flowing through the bridge resistance circuit RB. do. That is, when the resistance value of the trimming resistor R5 is increased by trimming, the drive current of the bridge resistor circuit RB decreases, so that the amount of voltage change can be reduced. Therefore, it is a straight line with the voltage change ΔVa of bia. The drive current of the bridge resistor circuit RB is adjusted so that the voltage change Δvb of Then, as shown in Figure 3, its characteristics will be expressed by straight lines a and l.
).
となり夫々の変化分が等しく互いに平行な直線とするこ
とができる。その後入力端子4に与える直流バイアス電
圧Voを調整することによって第4図に示すように直線
b2を直線aに一致させることができる。Therefore, the respective changes can be made into straight lines that are equal and parallel to each other. Thereafter, by adjusting the DC bias voltage Vo applied to the input terminal 4, the straight line b2 can be made to coincide with the straight line a, as shown in FIG.
第1図は本発明による半導体圧力センサの一実施例を示
す回路図、第2図は基準となる半導体圧力センサAと本
実施例による半導体圧力センサBの調整前の印加圧力に
対する出力電圧の変化を示すグラフ、第3図は本実施例
による抵抗R5をトリミングにより調整した後の二つの
半導体圧力センサA、Bの出力特性を示すグラフ、第4
図は本実施例の半導体圧力センサBに与える直流バイア
ス電圧Voを調整した後の二つの半導体圧力センサA、
Bの出力特性を示すグラフ、第5図は従来の半導体圧
力センサの一例を示す回路図である。
1・−−−一−−感圧素子 2−・・・−電流供給回
路 3−一演算増幅器 4−−−−一入力端子
5−・−出力端子 R1〜R4−m−−−−・抵抗
R5−・−・−トリミング抵抗 RB−一一−−−
−ブリッジ抵抗回路特許出願人 立石電機株式会社
代理人 弁理士 岡本宜喜(他1名)
第1図
1−−−−−−−う瓜木モ
2−−−−−−−t;先伝給回終
3−−−−−−−實’1t=幅益
R5−−−−−)−’ノミン7゛キか戒RB−−−−−
7’−・7:、;本打を口釧象第4図
印り口1已h
羽q−田≦ 0
+1只−H≦ OFIG. 1 is a circuit diagram showing an embodiment of a semiconductor pressure sensor according to the present invention, and FIG. 2 is a change in output voltage with respect to applied pressure before adjustment of a semiconductor pressure sensor A serving as a reference and a semiconductor pressure sensor B according to this embodiment. FIG. 3 is a graph showing the output characteristics of the two semiconductor pressure sensors A and B after adjusting the resistor R5 by trimming according to this embodiment.
The figure shows two semiconductor pressure sensors A after adjusting the DC bias voltage Vo applied to the semiconductor pressure sensor B of this embodiment.
A graph showing the output characteristics of B, and FIG. 5 is a circuit diagram showing an example of a conventional semiconductor pressure sensor. 1.---1---Pressure sensing element 2----Current supply circuit 3-1 Operational amplifier 4----1 Input terminal
5-・-Output terminal R1~R4-m---Resistance
R5---Trimming resistor RB-11--
-Bridge resistance circuit patent applicant Tateishi Electric Co., Ltd. agent Patent attorney Yoshiki Okamoto (and one other person) Payroll end 3---------Actually'1t=margin R5-----)-'Nomin 7゛Kikakai RB----
7'-・7:,; This is the final blow.
Claims (1)
有する感圧素子と、前記感圧素子のブリッジ抵抗回路に
電流を供給する電流供給回路、及びブリッジ抵抗回路の
両端の電圧を増幅する増幅回路を有する半導体圧力セン
サにおいて、 前記ブリッジ抵抗回路と電流供給回路に直列にトリミン
グ抵抗を接続し、該トリミング抵抗を調整することによ
って所定の圧力−出力電圧特性を得るように構成したこ
とを特徴とする半導体圧力センサ。(1) A pressure sensitive element having a bridge resistance circuit configured on a diaphragm, a current supply circuit that supplies current to the bridge resistance circuit of the pressure sensitive element, and an amplifier circuit that amplifies the voltage across the bridge resistance circuit. A semiconductor pressure sensor comprising: a trimming resistor connected in series with the bridge resistance circuit and the current supply circuit, and configured to obtain a predetermined pressure-output voltage characteristic by adjusting the trimming resistor. pressure sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16888286A JPS6325525A (en) | 1986-07-17 | 1986-07-17 | Semiconductor pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16888286A JPS6325525A (en) | 1986-07-17 | 1986-07-17 | Semiconductor pressure sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6325525A true JPS6325525A (en) | 1988-02-03 |
Family
ID=15876310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16888286A Pending JPS6325525A (en) | 1986-07-17 | 1986-07-17 | Semiconductor pressure sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6325525A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002063265A1 (en) * | 2001-02-08 | 2002-08-15 | Tgk Co., Ltd. | Method for adjusting pressure sensor |
-
1986
- 1986-07-17 JP JP16888286A patent/JPS6325525A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002063265A1 (en) * | 2001-02-08 | 2002-08-15 | Tgk Co., Ltd. | Method for adjusting pressure sensor |
EP1286148A1 (en) * | 2001-02-08 | 2003-02-26 | TGK CO., Ltd. | Method for adjusting pressure sensor |
US6889554B2 (en) | 2001-02-08 | 2005-05-10 | Tgk Co., Ltd. | Method of adjusting pressure sensor |
EP1286148A4 (en) * | 2001-02-08 | 2008-05-07 | Tgk Co Ltd | Method for adjusting pressure sensor |
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