JPS63254419A - Reflection type liquid crystal display device - Google Patents

Reflection type liquid crystal display device

Info

Publication number
JPS63254419A
JPS63254419A JP9024287A JP9024287A JPS63254419A JP S63254419 A JPS63254419 A JP S63254419A JP 9024287 A JP9024287 A JP 9024287A JP 9024287 A JP9024287 A JP 9024287A JP S63254419 A JPS63254419 A JP S63254419A
Authority
JP
Japan
Prior art keywords
substrate
liquid crystal
crystal display
display panel
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9024287A
Other languages
Japanese (ja)
Inventor
Mamoru Takeda
守 竹田
Hiroshi Takahara
博司 高原
Yasuhiko Horio
泰彦 堀尾
Hitoshi Noda
均 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9024287A priority Critical patent/JPS63254419A/en
Publication of JPS63254419A publication Critical patent/JPS63254419A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To compactly with high reliability connect a conductor terminal layer and an input/output terminal part of a substrate, by providing the substrate provided with a driving IC, on the reverse side of a reflection type liquid crystal display panel, providing a projecting electrode on a conductor terminal part of the substrate, and providing an electrifiable adhesive layer thereon. CONSTITUTION:On a conductor terminal part of an FET array substrate 1 having a liquid crystal display part 16, a projecting electrode 3 is provided, and an electrifiable joining layer 4 is provided thereon. Also, on a second connecting substrate 7, the same projecting electrode 3 and joining layer 4 are provided. The FET array substrate 1 and a substrate 8 to which a driving IC 9 is installed are connected through the first and second connecting substrates 6, 7. In such a case, the joining part 4 of the substrate 1 and the electrode part of the connecting substrate 6 are opposed to each other, and also, the joining layer 4 of the connecting substrate 7 and an input/output terminal 10 of the substrate 8 are opposed to each other, and heated and connected. Moreover, a reflecting plate 15 and a polarizing plate 14 are provided between the substrate 8 and the substrate 1. In such a way, the input/output terminal 10 of the substrate 8, a gate scanning line 11 of the FET array, and a conductor terminal part 2 of a signal line 12 can be connected electrically on the reverse side of a display panel.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、表示パネルの導体端子部を、表示パネルの裏
面で駆動用ICが装備されている基板Fの端子電極群に
接続された構成で、しかも透過型パネルを利用し表示パ
ネルと前記ICが装備されている基板との間に反射板と
偏向板とを設けて表示する反射型液晶表示デバイスに関
するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention has a configuration in which a conductor terminal portion of a display panel is connected to a group of terminal electrodes of a substrate F equipped with a driving IC on the back surface of the display panel. Moreover, the present invention relates to a reflective liquid crystal display device that utilizes a transmissive panel and displays by providing a reflective plate and a polarizing plate between the display panel and the substrate on which the IC is mounted.

従来の技術 従来は、表示パネルの導体端子部を、駆動用ICが装備
されている基板上の端子電極群との接続には、ワイヤー
ボンドによる接続法、フレキシプル基板との間を導電性
ゴム介して熱圧着により接続する方法等が取られてきた
。また、特開昭53−59398号公報にみられるよう
に表示パネルを形成しているガラス基板上の導体端子部
に、接続用突起電極を形成したICチップを装着してい
る方法が提案されている。
Conventional technology Conventionally, the conductor terminals of the display panel were connected to the terminal electrode group on the board equipped with the driving IC using a wire bond connection method, and the connection method with the flexible board was conducted using conductive rubber. Methods such as thermocompression bonding have been used. Furthermore, as seen in Japanese Patent Application Laid-open No. 53-59398, a method has been proposed in which an IC chip with connection protruding electrodes is attached to a conductor terminal portion on a glass substrate forming a display panel. There is.

発明が解決しようとする問題点 しかしながら、第1の従来方法においては、接続端子数
が増加するとともに、端子間隔が微細になるにつれて、
導電性ゴムの微細化が困難になる。
Problems to be Solved by the Invention However, in the first conventional method, as the number of connection terminals increases and the terminal spacing becomes finer,
It becomes difficult to miniaturize conductive rubber.

またワイヤーボンディングにしても、接続処理時間が急
激に増すとともに、ボンディング可能な微細寸法も限界
が生じる問題点を有している。さらに、第2の従来方法
においては、表示パネル部、特に、アクティブ素子が形
成されている基板であれば、ICチップ装着するために
基板サイズを大きく取る必要が生じ、成膜時の基板枚数
を制限する問題を有している。しかも、表示パネル側の
信号線、走査線の導体端子部に断線が生じた時、新ため
て、反対側の導体端子部と接続を取る必要がある。
Wire bonding also has the problem that the connection processing time increases rapidly and that there is a limit to the fine dimensions that can be bonded. Furthermore, in the second conventional method, if the display panel part, especially the substrate on which active elements are formed, it is necessary to increase the size of the substrate in order to mount the IC chip, which reduces the number of substrates during film formation. It has a limiting problem. Furthermore, when a disconnection occurs in the conductor terminal portion of the signal line or scanning line on the display panel side, it is necessary to make a new connection with the conductor terminal portion on the opposite side.

本発明は上記の問題点にかんがみてなされたものであり
、その目的とする所は、微細かつ密に形成されている表
示デバイスの導体端子層と駆動用ICが装着されている
基板の入出力端子部とを、きわめてコンパクトにかつ信
転性良く電気的接続を行うことにある。
The present invention has been made in view of the above problems, and its purpose is to improve the conductor terminal layer of a display device, which is formed minutely and densely, and the input/output of a substrate on which a driving IC is mounted. The purpose is to make an extremely compact electrical connection with a terminal part with good reliability.

問題点を解決するための手段 上記の問題点を解決するために本発明の反射型表示デバ
イスは、駆動用ICを装備した基板を表示パネルの裏面
に設け、しかも接続を要する導体端子部の片側には突起
電極、および前記突起電極上に形成した導電性接合層か
ら形成することにより、反射型液晶表示パネルの入力導
体端子部と駆動用ICと接続し、しかも液晶表示パネル
と駆動用ICを装備した基板との間に反射板と偏向板と
を設けていることを特徴とするものである。
Means for Solving the Problems In order to solve the above problems, the reflective display device of the present invention is provided with a substrate equipped with a driving IC on the back side of the display panel, and one side of the conductor terminal portion that requires connection. By forming a protruding electrode and a conductive bonding layer formed on the protruding electrode, the input conductor terminal portion of the reflective liquid crystal display panel and the driving IC are connected, and the liquid crystal display panel and the driving IC are connected. The device is characterized in that a reflection plate and a deflection plate are provided between it and the equipped board.

作用 本発明は上記した構成により、表示パネルの裏面をすべ
て利用できるため、駆動用ICとの入出力端子部との接
続を、高密度かつ多数本に対し、接触抵抗が低く信頼性
の高い電気接続が可能となる。しかも、表示パネル基板
は、有効表示部以外の接続部の面積も極力小さくするこ
とも可能である。しかも、表示パネルの信号線、走査線
に断線が生じた場合にも、表示パネル両側に接続されて
いるため、救済措置としても作用する。
The present invention has the above-mentioned configuration, so that the entire rear surface of the display panel can be used. Therefore, the connection between the drive IC and the input/output terminal section can be made using a highly reliable electrical connection with low contact resistance for a high density and large number of connections. Connection is now possible. Moreover, in the display panel substrate, the area of the connecting portions other than the effective display portion can be made as small as possible. Furthermore, even if a disconnection occurs in the signal line or scanning line of the display panel, since they are connected to both sides of the display panel, it also acts as a relief measure.

、実施例 以下、本発明の一実施例の反射型液晶表示デバイスにつ
いて図面を参照しながら説明する。
EXAMPLE Hereinafter, a reflective liquid crystal display device according to an example of the present invention will be described with reference to the drawings.

第1図は、本発明の一実施例の反射型液晶表示デバイス
の断面図、第2図は、他の一実施例である。また第3図
は表示デバイスの表示パネルがTFTスイッチングアレ
イを用いた液晶パネルの場合のパネル平面図を示してい
る。
FIG. 1 is a sectional view of a reflective liquid crystal display device according to one embodiment of the present invention, and FIG. 2 is another embodiment. Further, FIG. 3 shows a panel plan view when the display panel of the display device is a liquid crystal panel using a TFT switching array.

第1図において1はTFTアレイ基板、2はゲート走査
線1)と信号線12をまとめてあられした導体端子部、
3は突起電極、4は導電性接合層、9は駆動用IC,1
0はICの入出力端子部である。14は偏向板、15は
反射板、そして16は液晶である。なお、表示は液晶表
示パネルと駆動用ICを設けた基板との間の反射板で入
射光が反射されるものとする。
In FIG. 1, 1 is a TFT array substrate, 2 is a conductor terminal section in which a gate scanning line 1) and a signal line 12 are assembled together;
3 is a protruding electrode, 4 is a conductive bonding layer, 9 is a driving IC, 1
0 is an input/output terminal section of the IC. 14 is a polarizing plate, 15 is a reflecting plate, and 16 is a liquid crystal. It is assumed that incident light is reflected by a reflection plate between a liquid crystal display panel and a substrate provided with a driving IC for display.

本発明の実施例では、第4図に示すように、液晶表示部
16を有したTFTアレイ基板基板環体端子部2にメッ
キ技術、またはネイルヘッドボンディングの技術を用い
て30ミクロンから100ミクロンの高さのAuからな
る突起電極3を形成する0次いで、TFTアレイ基板l
の突起電極3に数10ミクロンの導電性接合N4を設け
る。この接合層4は、接着材としてエポキシ系、フェノ
ール系等を主剤とし、Ag、Au、Ni、C。
In the embodiment of the present invention, as shown in FIG. 4, the TFT array substrate ring terminal portion 2 having the liquid crystal display portion 16 is coated with a thickness of 30 microns to 100 microns using plating technology or nail head bonding technology. Next, a TFT array substrate l is formed to form protruding electrodes 3 made of Au with a height of
A conductive junction N4 of several tens of microns is provided on the protruding electrode 3. This bonding layer 4 mainly uses epoxy, phenol, etc. as an adhesive, and includes Ag, Au, Ni, and C.

S n O2などのフレークを混ぜた物であり、転写等
で、前記突起電1ft3上に形成する。また第二接続基
板7上にも同様の突起電極とR電性接合層をもうけてお
く、上記導電性接合層4を形成した液晶表示用TFTア
レイ1と駆動用IC9を装着した基板8を第1図に示す
ように、第−及び第二接vt基板を介して接続する。こ
のときT F ’rアレイ基板1の4電性接合部4と第
一接続基板6の電極部とを対向させ、または第二接続基
板7の上記導電性接合層4と基板8の入出力端子部lO
と対向させ位置合せ後、電気オーブン、ヒートコラム等
を用いて加熱接着法により接続する。この時、入出力端
子部10側にはAu、Ni、ITO,Cu。
It is a mixture of flakes such as SnO2, and is formed on 1ft3 of the protruding electrodes by transfer or the like. Further, similar protruding electrodes and R conductive bonding layers are provided on the second connection substrate 7, and the substrate 8 on which the liquid crystal display TFT array 1 on which the conductive bonding layer 4 is formed and the driving IC 9 is mounted is placed on the second connection substrate 7. As shown in Figure 1, the connection is made through the first and second VT boards. At this time, the four-electroconductive bonding portion 4 of the T F'r array substrate 1 and the electrode portion of the first connection substrate 6 are made to face each other, or the above-mentioned conductive bonding layer 4 of the second connection substrate 7 and the input/output terminal of the substrate 8 are made to face each other. Part lO
After positioning and facing each other, they are connected by heat bonding using an electric oven, heat column, etc. At this time, Au, Ni, ITO, and Cu are placed on the input/output terminal section 10 side.

Cr、Ti等を形成しておく。また入出力端子部lO側
に/lが形成されている場合には、上記導電性接合71
4としてI nSnを用いAIと合金接続をおこなう。
Cr, Ti, etc. are formed in advance. In addition, when /l is formed on the input/output terminal portion lO side, the conductive junction 71
4, InSn is used to connect the alloy to AI.

以上のようにして、導電性接合層4を備えた駆動用IC
9を装着した基板8の入出力端子部lOと、表示部をそ
なえたTFTアレイのゲート走査線1)および信号線1
2の導体端子部2とを表示パネルの裏面で電気的に接続
できる。尚、実施例では、導電性接合N4の形成部位を
TFTFTアレイ突起電極3上面としたが、その形成部
位は突起電極上に限定されるものではなく、ICが実装
された基板9の入出力端子部lO上にあるいは第一接続
基板6の導体端子部上にもうけてもさしつかえない、ま
た基板lについては、単純ドツトマトリクス型液晶パネ
ル、二端子素子付アクティブマトリクス型液晶パネル、
EL表示パネル、プラズマ表示パネルでも、共通して使
用可能な構成である。また、Icを装着した基板9は、
ガラス、セラミック、ガラスエポキシ等の基板でも差支
えない、第二の一実施例では、第2図に示すように液晶
表示パネルのTFTアレイ基板基板対向基板5の裏面を
利用しているため、第一の実施例の第一の接続基板6が
不必要になるため構成も簡単になる。しかも反射板15
、偏向板16は基板10と基板lとの間に設ける。
As described above, the driving IC provided with the conductive bonding layer 4
The input/output terminal section 10 of the substrate 8 equipped with 9, the gate scanning line 1) of the TFT array equipped with the display section and the signal line 1
2 can be electrically connected to the conductor terminal portion 2 on the back surface of the display panel. In the embodiment, the conductive junction N4 was formed on the top surface of the TFTFT array protruding electrode 3, but the formation site is not limited to the protruding electrode, but can be formed on the input/output terminal of the substrate 9 on which the IC is mounted. It may be placed on the conductor terminal part of the first connection board 6 or on the conductor terminal part of the first connection board 6.For the board l, a simple dot matrix type liquid crystal panel, an active matrix type liquid crystal panel with two terminal elements,
The structure can be used in common with EL display panels and plasma display panels. In addition, the board 9 on which the IC is mounted is
In the second embodiment, which may be a substrate made of glass, ceramic, glass epoxy, etc., as shown in FIG. Since the first connection board 6 of the embodiment described above is no longer necessary, the configuration is also simplified. Moreover, the reflector plate 15
, the deflection plate 16 is provided between the substrate 10 and the substrate l.

発明の詳細 な説明したように、本発明の反射型液晶表示パネルの導
電性端子の接続構造によれば、表示パネルをチップの接
続と同様の取り扱いが可能になるので、表示パネルの高
密度、多数本の導体端子部を、駆動用ICに容易に接続
できる。しがち、表示パネル側の基板サイズ極力小さく
できるため、TFTアレイのような薄膜の微細加工を必
要とする基板が一枚の基板から数多くとれてアクティブ
基板のコストダウンになり実用上極めて価値が高い、さ
らにTFTアレイの導体端子部は表示パネルの両側から
信号が入力されるため(8号線、走査線の配線にパネル
内部で断線が生じても自動的に救済され、パネルの歩留
りが著しく向上する。
As described in detail, according to the connection structure of the conductive terminals of the reflective liquid crystal display panel of the present invention, it is possible to handle the display panel in the same manner as connecting chips, so that it is possible to handle the display panel with high density, A large number of conductor terminals can be easily connected to a driving IC. However, because the size of the substrate on the display panel side can be made as small as possible, many substrates that require fine processing of thin films, such as TFT arrays, can be obtained from one substrate, reducing the cost of active substrates, which is extremely valuable in practical terms. Furthermore, since signals are input to the conductor terminals of the TFT array from both sides of the display panel (line 8 or scanning line), even if a break occurs inside the panel, it is automatically repaired, significantly improving the yield of the panel. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の反射型液晶表示デバイスの
断面図、第2図は他の一実施例の反射型液晶表示デバイ
スの断面図、第3図は表示デバイスの表示パネルがTF
Tスイ7チングアレイを用いた液晶パネルの平面図、第
4図は液晶パネルを有するTFTアレイの導体端子部に
突起電極と接合層を形成した断面図である。 1・・・・・・TFTアレイ基板、2・・・・・・導体
端子部、3・・・・・・突起電極、4・・・・・・導電
性接合層、5・・・・・・対向電極、6・・・・・・第
−接Vt基板、7・・・・・・第二接続基板、8・・・
・・・ICを装着した基板、9・・・・・・駆動用IC
,10・・・・・・ICの信号入力端子、1)・・・・
・・ゲート走査線、12・・・・・・信号線、13・・
・・・・TFT。 14・・・・・・偏向板、15・・・・・・反射板、1
6・・・・・・液晶。 第3図 ff−−−デー1Ll柊 12−−−イτすj笈 73−−−7F丁 ’3.’:) 4図
FIG. 1 is a cross-sectional view of a reflective liquid crystal display device according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of a reflective liquid crystal display device according to another embodiment, and FIG. 3 is a sectional view of a reflective liquid crystal display device according to an embodiment of the present invention.
FIG. 4 is a plan view of a liquid crystal panel using a T-switching array, and a cross-sectional view of a TFT array having a liquid crystal panel with protruding electrodes and a bonding layer formed on the conductor terminal portion. DESCRIPTION OF SYMBOLS 1... TFT array substrate, 2... Conductor terminal portion, 3... Projection electrode, 4... Conductive bonding layer, 5...・Counter electrode, 6... 1st connection board, 7... 2nd connection board, 8...
... Board with IC installed, 9... Drive IC
,10...IC signal input terminal, 1)...
...Gate scanning line, 12...Signal line, 13...
...TFT. 14... Deflector plate, 15... Reflector plate, 1
6...LCD. Figure 3 ff---day 1Ll hiiragi 12---ii τsuj笈73---7F d'3. ':) Figure 4

Claims (5)

【特許請求の範囲】[Claims] (1)アクティブスイッチング素子が各表示画素形成さ
れている反射型液晶表示パネルにおいて、駆動用ICを
表示パネルの裏面に装備されていることを特徴とする反
射型液晶表示デバイス。
(1) A reflective liquid crystal display device in which an active switching element is formed in each display pixel, and a driving IC is provided on the back surface of the display panel.
(2)液晶のTNモードあるいはゲストホストモードを
利用し、しかも表示パネル基板とICを装着している基
板との間に反射板と偏向板をもうけていることを特徴と
する特許請求の範囲第(1)項記載の反射型液晶表示デ
バイス。
(2) Claim 1, which utilizes the TN mode or guest-host mode of the liquid crystal, and further includes a reflecting plate and a deflecting plate between the display panel substrate and the substrate on which the IC is mounted. The reflective liquid crystal display device according to item (1).
(3)アクティブ素子が、2端子素子あるいはTFT素
子で形成されていることを特徴とする特許請求の範囲第
(1)項記載の反射型液晶表示デバイス。
(3) A reflective liquid crystal display device according to claim (1), wherein the active element is formed of a two-terminal element or a TFT element.
(4)駆動用ICをアクティブ素子が形成されている基
板あるいは対向基板の裏面に装備されていることを特徴
とする特許請求の範囲第(1)項記載の反射型液晶表示
デバイス。
(4) A reflective liquid crystal display device according to claim (1), wherein the driving IC is provided on the back surface of the substrate on which the active elements are formed or the counter substrate.
(5)駆動用ICを装備している基板の導体端子部に突
起電極および前記突起電極上に導電性接合層が形成され
ており、反射型液晶表示パネルの信号入力用導体端子部
と接続されていることを特徴とする特許請求の範囲第(
2)項記載の反射型液晶表示デバイス。
(5) A protruding electrode is formed on the conductor terminal portion of the substrate equipped with the driving IC, and a conductive bonding layer is formed on the protrusion electrode, and is connected to the signal input conductor terminal portion of the reflective liquid crystal display panel. Claim No. 1 (
2) The reflective liquid crystal display device described in item 2).
JP9024287A 1987-04-13 1987-04-13 Reflection type liquid crystal display device Pending JPS63254419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9024287A JPS63254419A (en) 1987-04-13 1987-04-13 Reflection type liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9024287A JPS63254419A (en) 1987-04-13 1987-04-13 Reflection type liquid crystal display device

Publications (1)

Publication Number Publication Date
JPS63254419A true JPS63254419A (en) 1988-10-21

Family

ID=13993027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9024287A Pending JPS63254419A (en) 1987-04-13 1987-04-13 Reflection type liquid crystal display device

Country Status (1)

Country Link
JP (1) JPS63254419A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497258A (en) * 1994-05-27 1996-03-05 The Regents Of The University Of Colorado Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning
WO2015136411A1 (en) * 2014-03-12 2015-09-17 株式会社半導体エネルギー研究所 Electronic apparatus

Citations (6)

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US5497258A (en) * 1994-05-27 1996-03-05 The Regents Of The University Of Colorado Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning
WO2015136411A1 (en) * 2014-03-12 2015-09-17 株式会社半導体エネルギー研究所 Electronic apparatus
US10228729B2 (en) 2014-03-12 2019-03-12 Semiconductor Energy Laboratory Co., Ltd. Electronic device

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